CN108226228A - Substrate to be detected, the method and apparatus for detecting glass breakage - Google Patents
Substrate to be detected, the method and apparatus for detecting glass breakage Download PDFInfo
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- CN108226228A CN108226228A CN201810085375.0A CN201810085375A CN108226228A CN 108226228 A CN108226228 A CN 108226228A CN 201810085375 A CN201810085375 A CN 201810085375A CN 108226228 A CN108226228 A CN 108226228A
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- 239000000758 substrate Substances 0.000 title claims abstract description 156
- 239000011521 glass Substances 0.000 title claims abstract description 105
- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000001514 detection method Methods 0.000 claims abstract description 35
- 238000003708 edge detection Methods 0.000 claims description 24
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical group O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 2
- 238000007689 inspection Methods 0.000 claims 1
- 230000008859 change Effects 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 16
- 101001024685 Pandinus imperator Pandinin-2 Proteins 0.000 description 9
- 101001128814 Pandinus imperator Pandinin-1 Proteins 0.000 description 6
- 238000013467 fragmentation Methods 0.000 description 5
- 238000006062 fragmentation reaction Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- -1 ITO) Chemical compound 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- GRPQBOKWXNIQMF-UHFFFAOYSA-N indium(3+) oxygen(2-) tin(4+) Chemical compound [Sn+4].[O-2].[In+3] GRPQBOKWXNIQMF-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
- C03C17/245—Oxides by deposition from the vapour phase
- C03C17/2453—Coating containing SnO2
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/20—Investigating the presence of flaws
- G01N27/205—Investigating the presence of flaws in insulating materials
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/21—Oxides
- C03C2217/23—Mixtures
- C03C2217/231—In2O3/SnO2
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/152—Deposition methods from the vapour phase by cvd
- C03C2218/153—Deposition methods from the vapour phase by cvd by plasma-enhanced cvd
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/154—Deposition methods from the vapour phase by sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
The method and apparatus that the disclosure provides a kind of substrate to be detected, detects glass breakage, belongs to display technology field.The substrate to be detected includes：Glass substrate and the one layer of conductive film layer formed at the edge of glass substrate.The disclosure at the edge of glass substrate by forming one layer of conductive film layer first, then edge input predetermined current thereto, current detecting reaction resistance situation of change is carried out to edge, to judge the integrality of glass substrate edge and periphery slight crack situation, this detection mode can find the breakage of glass substrate in time, it reduces since technique caused by substrate damage, slight crack is bad, is further reduced the waste of time and substance caused by subsequent technique.
Description
Technical field
This disclosure relates to display technology field, in particular to a kind of substrate to be detected, the method for detecting glass breakage
And equipment.
Background technology
Thin glass is to show a new development trend of industry at present, but in preparation process, due to glass thickness
Degree is too thin, and the risk for leading to its fragmentation is also higher.
It is existing in the art, glass shards or artificial can only be detected by equipment base station vacuum suction abnormal alarm
Naked eyes find glass shards.Whether in transmit process or during apparatus and process, glass shards all there are great risk,
Not only because fragmentation leads to the loss of cost in itself, but also may be certain caused by fragmentation is to equipment damage, such as scratch
Base station scratches contraposition needle (aligning Pin).
Therefore, technical solution of the prior art also exists for detecting whether glass has breakage in time and needs to be changed
Into part.
It should be noted that information is only used for strengthening the reason to the background of the disclosure disclosed in above-mentioned background technology part
Solution, therefore can include not forming the information to the prior art known to persons of ordinary skill in the art.
Invention content
The disclosure is designed to provide a kind of substrate to be detected, the method and apparatus for detecting glass breakage, and then at least
Overcome the problems, such as to fail to detect whether glass has breakage in time due to the relevant technologies to a certain extent.
Other characteristics and advantages of the disclosure will be by the following detailed description apparent from or partially by this public affairs
The practice opened and acquistion.
According to the disclosure in a first aspect, provide a kind of substrate to be detected, including：
Glass substrate；And
In one layer of conductive film layer that the edge of glass substrate is formed.
In a kind of exemplary embodiment of the disclosure, the conductive film layer is tin indium oxide.
In a kind of exemplary embodiment of the disclosure, the width of the conductive film layer is 10mm.
According to the second aspect of the disclosure, a kind of equipment for detecting glass breakage is also provided, including：
Equipment base station, for carrying substrate to be detected, wherein the above-described substrate to be detected of the substrate to be detected；
Multiple contraposition needles, mounted on the periphery of the equipment base station, for being aligned to the substrate to be detected；And
Multiple conductive contacts, mounted on the top of the contraposition needle, for being inputted to the edge of the substrate to be detected
Electric current or detection electric current.
In a kind of exemplary embodiment of the disclosure, further include：
Active connection part, for being connected between the conductive contact and the contraposition needle, when to the base to be detected
When plate is detected, the active connection part is pressed status, and the conductive contact and the conductive film layer are in electrical contact；When
When the substrate detection to be detected is completed, the active connection part is increasing state, the conductive contact and the conductive film
Layer does not contact.
In a kind of exemplary embodiment of the disclosure, the multiple conductive contact is distributed in the substrate to be detected
Four edges, and the conductive contact input predetermined current at the first edge in the substrate to be detected, are treated in described
Detect the conductive contact ground connection of the third edge of substrate, second edge and the 4th edge in the substrate to be detected
Conductive contact coupling ammeter.
According to the third aspect of the disclosure, a kind of method for detecting glass breakage is also provided, including：
One layer of conductive film layer is formed in the edge of glass substrate, obtains substrate to be detected；
Predetermined current is inputted in the first edge of the substrate to be detected and on the opposite third side of the first edge
Edge is grounded；
Second edge and the 4th edge on the substrate to be detected between the first edge and third edge
The current value of output is detected, and judges whether the edge of the glass substrate has breakage according to the current value.
In a kind of exemplary embodiment of the disclosure, obtain further including after substrate to be detected：
It is aligned by multiple contrapositions on equipment base station for the substrate to be detected, the multiple contraposition needle distribution
At four edges of the substrate to be detected.
In a kind of exemplary embodiment of the disclosure, it is located at each of the substrate to be detected in the multiple contraposition needle
Conductive contact is additionally provided at the top of at least one contraposition needle in edge, for being inputted to the edge of the substrate to be detected
Electric current or detection electric current.
In a kind of exemplary embodiment of the disclosure, according to the current value judge the glass substrate edge whether
There is breakage to include：
When the current value of the second edge and the 4th edge detection is the preset ratio of the predetermined current, institute is judged
The edge for stating glass substrate is intact；
Wherein described preset ratio is 1/2.
In a kind of exemplary embodiment of the disclosure, according to the current value judge the glass substrate edge whether
There is breakage to include：
When the current value of the second edge and the 4th edge detection is not up to the preset ratio of the predetermined current, such as
The current value that second edge described in fruit detects is 0, and the current value of the 4th edge detection is equal to the predetermined current, then judges
The glass substrate has breakage at the second edge；If the current value of the 4th edge detection is 0, second side
The current value of edge detection is equal to the predetermined current, then judges that the glass substrate has breakage in the 4th edge；If
The current value of the second edge and the 4th edge detection be 0, then judge the glass substrate the first edge and/
Or there is breakage in the 4th edge.
The substrate to be detected of some embodiments offer of the disclosure, the method and apparatus for detecting glass breakage, by glass
The edge of glass substrate forms one layer of conductive film layer, predetermined current is inputted by an edge thereto when detecting, on other sides
Edge detects electric current, and the breakage of glass substrate is judged according to the current value of detection, on the one hand, by carrying out electric current to edge
Reaction resistance situation of change is detected, to judge the integrality of glass substrate edge and periphery slight crack situation, this detection mode
The breakage of glass substrate can be found in time, reduced since technique caused by substrate damage, slight crack is bad, be further reduced
The waste of time and substance caused by subsequent technique；In another aspect, due to noting abnormalities in time, it being capable of timely arrestment
Next step operation, avoid due to substrate damage the mechanical wounding caused by equipment, moreover it is possible to shorten technique dwell time, raising is set
Standby mobility.
It should be understood that above general description and following detailed description are only exemplary and explanatory, not
The disclosure can be limited.
Description of the drawings
Attached drawing herein is incorporated into specification and forms the part of this specification, shows the implementation for meeting the disclosure
Example, and for explaining the principle of the disclosure together with specification.It should be evident that the accompanying drawings in the following description is only the disclosure
Some embodiments, for those of ordinary skill in the art, without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 shows a kind of flow chart of the method for detection glass breakage that the embodiment of the present disclosure provides.
The flow chart of the method for the detection glass breakage of a specific example is combined Fig. 2 shows the embodiment of the present disclosure.
Fig. 3 shows the schematic diagram of a substrate to be detected in the embodiment of the present disclosure.
Fig. 4 shows that conductive contact is off lower one kind for aligning needle and conductive contact in the embodiment of the present disclosure
Structure diagram.
Fig. 5 shows that conductive contact is under contact condition the one kind for aligning needle and conductive contact in the embodiment of the present disclosure
Structure diagram.
Fig. 6 shows the schematic diagram when not placing substrate to be detected on equipment base station in the embodiment of the present disclosure.
Fig. 7 shows the schematic diagram when edge of glass substrate in the embodiment of the present disclosure is intact.
Fig. 8 shows the schematic diagram during damages on the edges of glass substrate in the embodiment of the present disclosure.
Fig. 9 shows the schematic diagram of the equipment of a kind of detection glass breakage provided in another embodiment of the disclosure.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to example set forth herein；On the contrary, these embodiments are provided so that the disclosure will more
Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.Attached drawing is only the disclosure
Schematic illustrations, be not necessarily drawn to scale.Identical reference numeral represents same or similar part in figure, thus
Repetition thereof will be omitted.
In addition, described feature, structure or characteristic can be incorporated in one or more implementations in any suitable manner
In mode.In the following description, many details are provided to fully understand embodiment of the present disclosure so as to provide.So
And it will be appreciated by persons skilled in the art that one in the specific detail can be omitted with technical solution of the disclosure
Or more or may be used other methods, constituent element, device, step etc..In other cases, it is not shown in detail or describes
Known features, method, apparatus, realization, material or operation are to avoid a presumptuous guest usurps the role of the host and all aspects of this disclosure is caused to become mould
Paste.
Herein, " inside ", " outside " directional terminology refer respectively to towards the side of liquid crystal layer and away from liquid crystal layer
Side, for example, referring to one layer towards liquid crystal layer of underlay substrate on the inside of underlay substrate.In addition, " on ", " under ", " left side " with
And the directional terminologies such as " right side " are defined relative to the orientation that display device signal is put in attached drawing.It is it is to be understood that above-mentioned
Directional terminology is opposite concept, they be used for relative to description and clarification, can be placed according to display device
The variation in orientation and correspondingly change.
In the related embodiment of the disclosure, the edge of glass has no any coating.Glass is in transmission and apparatus and process
The middle risk that fragmentation occurs is very high, such as：Contraposition action is carried out during cleaning machine transmits glass or in equipment base station
When or in equipment base station vacuum suction glass or equipment base station support needle (supporting Pin) act when or
When manipulator transports glass, it may all lead to glass shards.If fragmentation cannot detected automatically by equipment in time, have very much
Damage to a certain extent may be caused to equipment in subsequent technique, such as scratches base station, scratches contraposition Pin etc., it is therefore desirable to
Detect whether glass has breakage in time.
Based on the above problem, the disclosure provides a kind of method that can detect whether substrate edges breakage occur in time and sets
It is standby.
Fig. 1 shows a kind of flow chart of the method for detection glass breakage that the embodiment of the present disclosure provides, for respectively setting
Standby and slight crack detection damaged to the edge progress of supplied materials substrate (such as glass substrate) before carrying out technique.
As shown in Figure 1, in step s 11, one layer of conductive film layer is formed in the edge of glass substrate, obtains base to be detected
Plate.
As shown in Figure 1, in step s 12, predetermined current is inputted and on the first side in the first edge of substrate to be detected
The opposite third edge ground connection of edge.
As shown in Figure 1, in step s 13, on substrate to be detected between first edge and third edge second
Edge and the current value of the 4th edge detection output, and judge whether the edge of glass substrate has breakage according to current value.
The method of detection glass breakage based on the embodiment of the present invention, by forming one layer at the edge of glass substrate
Conductive film layer inputs predetermined current, in other edge detection electric currents, and according to detection by an edge thereto when detecting
Current value judge the breakage of glass substrate, detection method is quickly timely, and simple easily realizes.
A kind of substrate to be detected is provided in the embodiments of the present disclosure, including：Glass substrate and stripping substrate edge
The one layer of conductive film layer formed.
In one embodiment of the disclosure, conductive film layer can be tin indium oxide (Indium tin oxide, i.e. ITO), wide
Degree can be 10mm.
Detailed explanation is carried out to the method for above-mentioned detection glass breakage and is said hereinafter, Fig. 2 will combine a specific example
It is bright.
As shown in Fig. 2, in the step s 21, one layer of conductive film layer is formed in the edge of glass substrate, obtains base to be detected
Plate.
Fig. 3 shows the schematic diagram of a substrate to be detected in the embodiment of the present disclosure, and substrate 30 to be detected includes glass substrate 31
In itself and it is the conductive film layer 32 for being formed in 31 edge of glass substrate.The material of conductive film layer 32 therein can be indium oxide
Tin (Indium tin oxide, i.e. ITO), the characteristic of ITO is that conductive and high temperature resistant, subsequent baking process will not be to film layer sheets
Body impacts.
In a kind of exemplary embodiment of the disclosure, conductive film layer (i.e. ito film layer) can be in encapsulation (Encap) or TSP
The glass of (Touch Screen Panel, touch screen panel) uses sputtering (Sputter), PECVD (Plasma during making
Enhanced Chemical Vapor Deposition, the vapor deposition of plasma enhanced chemical) etc. techniques handled,
Width, caliper uniformity of ito film layer etc. can be monitored by check machine in the production process, to ensure ito film layer
Conductive stability.In addition, the ito film layer formed when component can also be made with viewing area on glass substrate of the ito film layer
It is carried out at the same time, technique number can't be increased.
In a kind of exemplary embodiment of the disclosure, ito film layer position is at Glass edges, such as the width of conductive film layer
It can be 10mm, can be removed, showpiece characteristic will not be produced using ito film layer as Dummy items in subsequent handling cutting technique
It is raw to influence；Or can not also be removed in subsequent technique, the characteristic of subsequent technique and product will not be had an impact.
In a kind of exemplary embodiment of the disclosure, step S11 obtains further including after substrate to be detected：
As shown in Fig. 2, in step S22, aligned by multiple contrapositions on equipment base station for substrate to be detected.
In a kind of exemplary embodiment of the disclosure, multiple contraposition needles are distributed in four edges of substrate to be detected, and
And be located in multiple contraposition needles at the top of at least one contraposition needle in each edge of substrate to be detected and be additionally provided with conductive contact,
Wherein conductive contact is used for edge input current or coupling ammeter to substrate to be detected to detect electric current.
At least one contraposition needle of each edge of substrate to be detected, 2 in four contraposition needles at four edges
A contraposition needle set has conducting system (being provided with conductive contact), ammeter is coupled inside 2 contraposition needles, to carry out electric current
Detection.
Fig. 4 and Fig. 5 shows contraposition needle and a kind of structure diagram of conductive contact, and wherein Fig. 4 is at conductive contact
In schematic diagram when it is disconnected, Fig. 5 is the schematic diagram that conductive contact is under contact condition.As shown in Figure 4 and Figure 5, it leads
It being attached between electrical pickoff P2 and contraposition needle P1 by active connection part so that conductive contact P2 can move up and down,
When active connection part rises in Fig. 4, conductive contact is in off-state, and when will not be to apparatus and process or manipulator fetches and delivers glass base
Interference is generated during plate, active connection part declines in Fig. 5, and conductive contact P2 is in connect with the conductive film layer on substrate edges to be detected
The state of touching.In figures 4 and 5, active connection part includes three sections, i.e. first part L1, second part L2 and Part III L3,
Middle first part L1 is connect with second part L2 in the first tie point D1 with articulated form, wherein second part L2 and Part III
L3 is connected in the second tie point D2 with articulated form, and the first tie point D1 and the second tie point D2 are rotatable.
It should be noted that the active connection part in Fig. 4 and Fig. 5 of the embodiment of the present disclosure is said for hinged
It is bright, it can also be formed, be not especially limited in the form of other any flexible connections in the other embodiment of the disclosure.
As shown in Fig. 2, in step S23, predetermined current is inputted and on the first side in the first edge of substrate to be detected
The opposite third edge ground connection of edge.
Fig. 6 is shown when without placing substrate to be detected, (wherein substrate to be detected is is placed in dotted line frame region on equipment base station
Region) when schematic diagram, as shown in fig. 6, on equipment base station without place substrate to be detected when, contraposition needle be in open shape
State, at this time conductive contact be also at opening state.The bottom for aligning needle is can to move, and can be moved horizontally, conductive contact
Point can move up and down, and the normally open for aligning needle is opening state, i.e., the edge of each contraposition needle does not contact substrate to be detected, schemes
Shown in 6 is exactly the opening state aligned when needle is acted without contraposition, at this point, the conducting system inside contraposition needle is also not phase
Logical, conducting system therein can be connected and be controlled by controllers such as PLC.
The embodiment of the present disclosure and Fig. 6 are to set (the top setting of one of contraposition needle of 2 contraposition needles with each edge
Have conductive contact, another is not provided with conductive contact), i.e. four edges illustrate for sharing 8 contraposition needles.
As shown in fig. 6, the contraposition needle for being provided with conductive contact is respectively：The contraposition needle Pin1 of first edge, second edge
The contraposition needle Pin4 of needle Pin2, the contraposition needle Pin3 at third edge and the 4th edge are aligned, between connected two contraposition needles
The contraposition needle for being not provided with conductive contact for one.
In disclosure other embodiment, the number and position that align needle are adjusted, for example, if on equipment base station
Substrate to be detected size it is small, can only be set at each edge 1 contraposition needle, if the substrate to be detected on equipment base station
Size it is big, can only be set at each edge 2 or more (such as 3) align needle.
It should also be noted that, conductive contact is set on contraposition needle there are one each edges in the embodiment of the present disclosure,
It can substantially judge that breakage occurs in which edge of substrate to be detected, it, can also be not only in disclosure other embodiment
It is aligned at one on needle and conductive contact is set, it is more fine so as to can determine when glass substrate breakage is judged.
As shown in Fig. 2, in step s 24, on substrate to be detected between first edge and third edge second
Edge and the current value of the 4th edge detection output, and judge whether the edge of glass substrate has breakage according to current value.
Whether the edge for judging glass substrate according to current value in step S24 has breakage to specifically include：
1) when the current value of second edge and the 4th edge detection is the preset ratio of predetermined current, judge glass substrate
Edge it is intact, wherein preset ratio be 1/2.
In the other embodiment of the disclosure, which can also be set as needed as other ratios within 0~1
Example, it is specific to need to be determined according to the size of substrate to be detected and the installation position of contraposition needle, it is not especially limited herein.
Fig. 7 shows the above situation 1) edge of glass substrate it is intact when schematic diagram, as shown in fig. 7, on equipment base station
Place substrate to be detected, 8 contraposition needles are in off state from opening state change, carry out contraposition action, i.e., inner edges with it is to be checked
The EDGE CONTACT of substrate is surveyed, completes contraposition, and 4 contraposition needle Pin1, Pin2, Pin3 and Pin4 with conducting system also connect
It is logical, i.e. the contraposition needle Pin1 input predetermined current I0 of first edge, the contraposition needle Pin3 ground connection at third edge, pair of second edge
Position needle Pin2 and the contraposition needle Pin4 at the 4th edge couple ammeter.
In the figure 7, the conductive contact at contraposition needle Pin1, Pin2, Pin3 and Pin4 with substrate edges to be detected
Conductive film layer 32 is in electrical contact, and galvanic circle is connected if glass substrate is intact, and the ammeter registration in Pin2, Pin4 should
Equal, i.e. an electrically point ratio for conductive contact in four pilot pins is：
Pin1 input predetermined current I0, Pin2 coupling ammeters, display detection second edge align the electric current at needle Pin2
It is grounded, i.e., is grounded predetermined current I0 for I0/2, Pin3, Pin4 coupling ammeters, display detection second edge contraposition needle Pin2
The electric current at place is I0/2.
2) it is specific to wrap when the current value of second edge and the 4th edge detection is not up to the preset ratio of predetermined current
It includes：
1. if the current value of second edge detection is 0, the current value of the 4th edge detection is equal to predetermined current, then judges
Glass substrate has breakage at second edge；
If 2. the current value of the 4th edge detection is 0, the current value of second edge detection is equal to predetermined current, then judges
Glass substrate has breakage in the 4th edge；
3. if the current value of second edge and the 4th edge detection is 0, judge glass substrate in first edge and/or
There is breakage in 4th edge.
Fig. 8 show the above situation 2. the damages on the edges of glass substrate when schematic diagram, as shown in figure 8, glass substrate
Edge is damaged to occurring between Pin4 in pilot pin Pin1, the circuit between the two is caused to be not turned on, therefore the electricity of Pin4
It is 0 to flow reading, but the sum of current indication of Pin2 and Pin4 is I0.
Similarly, there are other breakages in the edge of glass substrate, and corresponding current indication also will appear exception, herein not
It enumerates again, i.e., can detect whether the edge of glass substrate has breakage in time by current indication, to break in time
Piece removes, in order to avoid equipment is damaged.
In conclusion the method for detection glass breakage that the embodiment of the present disclosure provides, passes through the edge shape in glass substrate
Into one layer of conductive film layer, predetermined current is inputted by an edge thereto when detecting, in other edge detection electric currents, and root
The breakage of glass substrate is judged according to the current value of detection, on the one hand, by carrying out current detecting reaction resistance change to edge
Change situation, to judge that the integrality of glass substrate edge and periphery slight crack situation, this detection mode can find glass in time
The breakage of glass substrate reduces since technique caused by substrate damage, slight crack is bad, is further reduced and subsequent technique is caused
Time and substance waste；In another aspect, due to noting abnormalities in time, it is capable of the next step operation of arrestment in time,
Avoid due to substrate damage the mechanical wounding caused by equipment, moreover it is possible to shorten technique dwell time, improve the mobility of equipment.
Based on above-mentioned, on the other hand the disclosure also provides a kind of equipment for detecting glass breakage, and Fig. 9 shows the detection glass
The schematic diagram of damaged equipment, as shown in figure 9, equipment 90 includes：Equipment base station 91, multiple contraposition needles 92 and multiple conductions connect
Contact 93.
Equipment base station 91 is for carrying substrate to be detected, wherein substrate to be detected is to form one layer in the edge of glass substrate
Conductive film layer obtains；Multiple contraposition needles 92 are mounted on the periphery of equipment base station, for being aligned to substrate to be detected；It is multiple to lead
Electrical pickoff 93 be mounted on contraposition needle top, for the edge input current of substrate to be detected or detection electric current.
In a kind of exemplary embodiment of the disclosure, further included in the equipment：Active connection part (is not shown) in Fig. 9,
A kind of structure diagram of active connection part referring to above-mentioned Fig. 4 or Fig. 5, active connection part for be connected to conductive contact P2 with
Between aligning needle P1, active connection part can include three sections, i.e. first part L1, second part L2 and Part III L3, wherein
First part L1 is connect with second part L2 in the first tie point D1 with articulated form, wherein second part L2 and Part III L3
It is connected in the second tie point D2 with articulated form, the first tie point D1 and the second tie point D2 are rotatable.When to be checked
When survey substrate is detected, active connection part is pressed status, and conductive contact P2 and conductive film layer are in electrical contact；When to be detected
When substrate detection is completed, active connection part is increasing state, and conductive contact P2 is not contacted with conductive film layer.
In a kind of exemplary embodiment of the disclosure, multiple conductive contacts are distributed in four sides of substrate to be detected
Edge, as is seen in fig. 6 or fig. 7.Conductive contact input predetermined current at first edge in substrate to be detected, in be checked
Survey the conductive contact ground connection of the third edge of substrate, the conduction of second edge and the 4th edge in substrate to be detected
Contact point couples ammeter.
In a kind of exemplary embodiment of the disclosure, the bottom for aligning needle is can to move, and can be moved horizontally, conductive
Contact point can move up and down, and the normally open for aligning needle is opening state, i.e., the edge of each contraposition needle does not contact base to be detected
Plate, shown in Fig. 6 is exactly the opening state aligned when needle is acted without contraposition, at this point, the conducting system inside contraposition needle
It is not communicated with, conducting system therein can be connected and be controlled by controllers such as PLC.
It should be noted that the disclosure is not specifically limited contraposition needle and the number of conductive contact, Fig. 6 be with
Each edge sets 2 contraposition needles (to be provided with conductive contact at the top of one of contraposition needle, another is not provided with leading
Electrical pickoff), i.e. four edges illustrate for sharing 8 contraposition needles.It, can be according to need in disclosure other embodiment
The number and position for aligning needle are adjusted, for example, if the size of the substrate to be detected on equipment base station is small, Ke Yi
Each edge only sets 1 contraposition needle, if the size of the substrate to be detected on equipment base station is big, can only be set at each edge
It puts 2 or more (such as 3) and aligns needle.
In conclusion the equipment for the detection glass breakage that the embodiment of the present disclosure provides can be realized and be broken with above-mentioned detection glass
The identical technique effect of the method for damage, details are not described herein again.
It will be clearly understood that the present disclosure describes how to be formed and using particular example, but the principle of the disclosure is not limited to
These exemplary any details.On the contrary, the introduction based on disclosure disclosure, these principles can be applied to many other
Embodiment.
It is particularly shown and described the illustrative embodiments of the disclosure above.It should be appreciated that the disclosure is unlimited
In detailed construction described herein, set-up mode or implementation method；On the contrary, disclosure intention covers included in appended claims
Spirit and scope in various modifications and equivalence setting.
Claims (10)
1. a kind of substrate to be detected, which is characterized in that including：
Glass substrate；And
In one layer of conductive film layer that the edge of the glass substrate is formed.
2. substrate to be detected according to claim 1, which is characterized in that the conductive film layer is tin indium oxide.
3. substrate to be detected according to claim 1, which is characterized in that the width of the conductive film layer is 10mm.
4. a kind of equipment for detecting glass breakage, which is characterized in that including：
Equipment base station, for carrying substrate to be detected, wherein the substrate to be detected is described in any one of claims 1 to 3
Substrate to be detected；
Multiple contraposition needles, mounted on the periphery of the equipment base station, for being aligned to the substrate to be detected；And
Multiple conductive contacts, mounted on the top of the contraposition needle, for the edge input current of the substrate to be detected
Or detection electric current.
5. the equipment of detection glass breakage according to claim 4, which is characterized in that further include：
Active connection part, for be connected to the conductive contact and it is described contraposition needle between, when to the substrate to be detected into
During row detection, the active connection part is pressed status, and the conductive contact and the conductive film layer are in electrical contact；When described
When substrate detection to be detected is completed, the active connection part is increasing state, and the conductive contact and the conductive film layer are not
Contact.
6. the equipment of detection glass breakage according to claim 4, which is characterized in that the multiple conductive contact distribution
At four edges of the substrate to be detected, and the conductive contact input at the first edge in the substrate to be detected is pre-
If electric current, conductive contact in the third edge of the substrate to be detected ground connection, the in the substrate to be detected
The conductive contact of two edges and the 4th edge couples ammeter.
A kind of 7. method for detecting glass breakage, which is characterized in that including：
One layer of conductive film layer is formed in the edge of glass substrate, obtains substrate to be detected；
Predetermined current is inputted in the first edge of the substrate to be detected and is connect at the opposite third edge of the first edge
Ground；
Second edge and the 4th edge detection on the substrate to be detected between the first edge and third edge
The current value of output, and judge whether the edge of the glass substrate has breakage according to the current value.
8. the method for detection glass breakage according to claim 7, which is characterized in that obtain also wrapping after substrate to be detected
It includes：
It is aligned by multiple contrapositions on equipment base station for the substrate to be detected, the multiple contraposition needle is distributed in institute
State four edges of substrate to be detected；
It is located at the top of at least one contraposition needle in each edge of the substrate to be detected in wherein the multiple contraposition needle
Be additionally provided with conductive contact, for the edge input current of the substrate to be detected or detection electric current.
9. the method for detection glass breakage according to claim 7, which is characterized in that according to judging the current value
Whether the edge of glass substrate has breakage to include：
When the current value of the second edge and the 4th edge detection is the preset ratio of the predetermined current, the glass is judged
The edge of glass substrate is intact；
Wherein described preset ratio is 1/2.
10. the method for detection glass breakage according to claim 9, which is characterized in that institute is judged according to the current value
Whether the edge for stating glass substrate has breakage to include：
When the current value of the second edge and the 4th edge detection is not up to the preset ratio of the predetermined current, if institute
The current value for stating second edge detection is 0, and the current value of the 4th edge detection is equal to the predetermined current, then described in judgement
Glass substrate has breakage at the second edge；If the current value of the 4th edge detection is 0, the second edge inspection
The current value of survey is equal to the predetermined current, then judges that the glass substrate has breakage in the 4th edge；It is if described
The current value of second edge and the 4th edge detection is 0, then judges the glass substrate in the first edge and/or institute
Stating the 4th edge has breakage.
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| CN201810085375.0A CN108226228B (en) | 2018-01-29 | 2018-01-29 | Substrate to be detected, method and equipment for detecting glass breakage |
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| CN201810085375.0A CN108226228B (en) | 2018-01-29 | 2018-01-29 | Substrate to be detected, method and equipment for detecting glass breakage |
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| CN103984201A (en) * | 2014-05-05 | 2014-08-13 | 京东方科技集团股份有限公司 | Masking plate, and manufacturing method and crack detection apparatus for masking plate |
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| DE3118060A1 (en) * | 1981-05-07 | 1982-11-25 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Method and arrangement for monitoring a nominally gastight hollow body |
| JP2005156539A (en) * | 2003-11-21 | 2005-06-16 | Brooks Automation Asia Ltd | Apparatus for detecting breakage of edge part of glass substrate and its method |
| JP2006258746A (en) * | 2005-03-18 | 2006-09-28 | Fujitsu Hitachi Plasma Display Ltd | Damage detection method for glass substrate |
| CN2840065Y (en) * | 2005-11-11 | 2006-11-22 | 孙自玉 | Power circuit resultant fault detector |
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| CN108226228B (en) | 2021-02-05 |
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