CN108215442A - A kind of full-automatic full fitting module production method - Google Patents
A kind of full-automatic full fitting module production method Download PDFInfo
- Publication number
- CN108215442A CN108215442A CN201711382797.6A CN201711382797A CN108215442A CN 108215442 A CN108215442 A CN 108215442A CN 201711382797 A CN201711382797 A CN 201711382797A CN 108215442 A CN108215442 A CN 108215442A
- Authority
- CN
- China
- Prior art keywords
- full
- automatic
- detection
- production method
- module production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The present invention provides a kind of full-automatic full fitting module production method, the present invention is bonded assembling optical sources detection by feeding patch COG and FOG microscopy gluing and checks a series of flows such as packaging, ground and cleaned is included wherein in feeding step and terminal cleans；Gluing includes plaing a line glue and dispensing；Fitting includes the following steps, cleans the TP of OCA and checks LCD upper polaroids；Dyestripping；Full fitting；It produces；Full process automation processing, and flow is accurately simplified as possible, it realizes optimal quality, is suitable for the production operation of various full fitting modules.
Description
Technical field
The present invention relates to full applying methods, belong to touch module and are bonded process and assemble technical field entirely, and in particular to one
Full fitting OCA (Optical Clear Adhesive) optical cement design processing method of kind and touch module (TP), display module
Assembly method more particularly to a kind of full-automatic full fitting module production method are bonded with casing.
Background technology
It is more and more ripe with smart electronics product touching technique, used in people's life about the product being bonded entirely
Also more and more, the application of full coating technique is also more and more extensive, and the requirement of full coating technique is also increasingly higher, the stream of production
Journey also requires shorter and shorter, therefore existing technology needs to improve and possesses complete production method and system.
Invention content
The present invention provides a kind of new full-automatic full fitting module production method.
To solve the above problems, technical solution provided by the invention is as follows：A kind of full-automatic full fitting module production method,
Its flow and method is：
1) feeding
2) patch
3) COG and FOG
4) microscopy
5) gluing
6)FOF
7) it is bonded
8) assembling optical sources
9) it detects
10) packaging is checked.
Preferred technical solution, the gluing include plaing a line glue and dispensing.
Preferred technical solution, ground and cleaned is included in the feeding step and terminal cleans.
Preferred technical solution, the detection include functional detection, and appearance detection and auxiliary material are pasted；
Preferred technical solution, the functional detection detect after including electrical property connecting detection and each process operation.
Preferred technical solution, the inspection include the following steps that appearance detection, QA is detected and packaging.
Preferred technical solution, the fitting include the following steps, clean the TP of OCA and check LCD upper polaroids；It tears
Film；Full fitting；It produces.
Preferred technical solution, the dyestripping paste diagonal dyestripping for four sides.
Preferred technical solution when the detection includes detection failure, discards current material, removes repairing, detects again
Step.
Preferred technical solution before each operational motion, further includes contraposition process.
Be relative to the advantageous effect of the prior art, using the above scheme, the present invention by feeding-patch-COG and
The a series of flow such as FOG- microscopies-gluing-fitting-assembling backlight and welding backlight-detection-inspection packaging, is accurately simplified
Realize the production operation of full fitting module, the technique system for being suitable for a series of full fitting modules such as mobile phone plane plate
It produces.
Description of the drawings
Illustrate embodiment or technical solution of the prior art in order to clearer, it below will be to embodiment or the prior art
The required attached drawing used is briefly described in description, it is clear that, the accompanying drawings in the following description is only some realities invented
Example is applied, it for those of ordinary skill in the art, without creative efforts, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 is one embodiment of the invention structure diagram.
Specific embodiment
For the ease of understanding the present invention, in the following with reference to the drawings and specific embodiments, the present invention will be described in more detail.
The preferred embodiment of the present invention is given in attached drawing.But the present invention can in many different forms realize, and unlimited
In this specification described embodiment.On the contrary, the purpose for providing these embodiments makes to the disclosure
Understand more thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term used in this specification " fixation ", " integrated molding ",
For illustrative purposes only, the similar unit of structure is to identical label in the figure for "left", "right" and similar statement
Mark.
Unless otherwise defined, technical and scientific term all used in this specification is led with belonging to the technology of the present invention
The normally understood meaning of technical staff in domain is identical.Used term is only in the description of the invention in this specification
The purpose of description specific embodiment is not intended to the limitation present invention.
As shown in Figure 1, one embodiment of the present of invention is：A kind of full-automatic full fitting module production method, flow side
Method is：Feeding-patch-COG and FOG- microscopies-gluing-fitting-assembling optical sources-detection-inspection packaging and other steps；It is wherein described
Include ground and cleaned in feeding step and terminal cleans；The gluing includes plaing a line glue and dispensing；The fitting includes following
Step cleans the TP of OCA and checks LCD upper polaroids；Dyestripping；Full fitting；It produces；The dyestripping is pasted for four sides diagonally to be torn
Film；The detection includes functional detection, and appearance detection and auxiliary material are pasted；The functional detection includes electrical property connecting detection
It is detected after being operated with each process；The inspection includes the following steps that appearance detection, QA is detected and packaging；The detection packet
When including detection failure, current material is discarded, repairing is removed, detects again, before each operational motion, further includes contraposition work
Sequence.
A kind of full-automatic full fitting module production method includes：Feeding-patch-COG and FOG- microscopy-gluing-fittings-
Assembling optical sources-detection-inspection packaging, are suitable for various different process and are bonded the making of module entirely, while also be adapted for various sizes
Full fitting module manufacturing process；Each step is further illustrated below.
Before fitting module operation entirely, in order to ensure the normal operation of ordered operation and equipment, and then production production is ensured
Quality needs the operation level to personnel to give training, and then promotes operational capacity and judgement, and the equipment is equipped with mirror
Power operation and self detection test；Combination and random code authentication of the authentication operations for a variety of authentications；Such as, power-supply device connects
Logical, when device power-up, needs code authentication, and the equipment carries out warm-up operation, is carried out at the same time dry run trial operation, formally grasping
It is that operating personnel's random code is needed to authenticate to make operation；The authentication modes such as fingerprint, password or recognition of face during booting are set, are being grasped
The modes such as cipher random code, fingerprint, writing signature are used when making.For another example, dual authentication and double trial operation cross-over controls are provided with
Mode, such as opens equipment operation by once authenticating, and equipment carries out default setting parameter operation first；And then secondary authentication, two
Equipment enters arrange parameter testing results after secondary authentication.For another example, it in order to ensure the normal operation of equipment, carries out segmentation and authenticates and divide
Section detection operation, equipment is by first section authentication mode normal operation, and first section process carries out trial operation while equipment is according to setting
It illustrates and carries out self-test, second segment authentication and second segment test are carried out after the completion of detection, and then survey comprising third section authentication, third section
Examination and the 4th section of authentication, the 4th section of test；For another example, device authentication and test exception are gradually shut down automatically, antisitic defect operation.Again
Such as, it authenticates and is gradually shut down in setting time after testing abnormal alarm, booting is similary every time carries out the processes such as self-test operations.
Such as feeding：The feeding further includes the inspection of Rough Inspection before feeding, i.e. treating material, for treating material reality
Now rough inspection avoids the material of major defect from entering production line, realizes Rough Inspection；For another example, inclination angle optical illumination inspection
It is damaged, crackle；The thickness and color and luster of glass are for another example all detected by illumination and light transmission；For another example, the treating material is whole folded
Designated position is placed on, treating material is automatically sent to the preceding designated position of inspection body, has mechanical arm to be taken automatically by sucker
Treating material is sequentially placed into the position specified, and realizes automatic tested in sequence, the inspection of the different type or project according to
Secondary progress；Rough Inspection is for another example omitted, people realize that often folded quantity and approximate location placement are treated with device parameter requirement as desired
Handle material.The feeding includes ground and cleaned and terminal cleans；The ground and cleaned realizes that glass positive and negative cleans up, and grinds
Cleaning agent is ground using DI source waters in factory, is used after filter element filtering, when treating material reaches designated position, manipulator is inhaled
Disk draws treating material and is placed into designated position, automatically begins to grind after being then delivered to grinding plate, completes one side and grinds
Afterwards, another side is overturn to grinding plate automatic grinding by overturning arm；Ground product is placed into transmission shaft automatically by suction nozzle
On, and clamped through upper and lower roller bearing, it is sprayed in roller transfer to spraying box, enters back into air knife position progress high pressure blow-gas and do
It is dry, water mark is avoided to remain；After air knife drying, product is transmitted at positioning through roller bearing and positions, then prepare to be transmitted to patch process.Again
Such as；When treating material reaches designated position, manipulator sucker draws treating material and is placed into designated position, treating material
It arranges, when being aligned to certain quantity, is then delivered in high frequency cleaning storehouse, the high frequency according to certain order and mode
It is N in cleaning storehouse2Inert gases are waited, is cleared up by dry type high frequency and removes Superficial Foreign Body or bur；Turn after cleaning through mechanical arm
Designated position is moved on to, then prepares to be transmitted to patch process.For another example, when treating material reaches designated position, manipulator sucker is inhaled
Treating material is taken to be placed into designated position, after by grinding, garbage dust absorption processing is carried out after grinding, is rushed subsequently into clear water
It washes, the product rinsed is placed on transmission shaft automatically by suction nozzle, and is clamped through upper and lower roller bearing, is sprayed in roller transfer to spraying box
Leaching is rinsed, and is entered back into air knife position and is carried out high pressure blow-gas drying, water mark is avoided to remain；After air knife drying, product is transmitted through roller bearing
It is positioned at positioning, then prepares to be transmitted to patch process.For another example, when treating material reaches designated position, manipulator sucker is inhaled
Treating material is taken to be placed into designated position, when arranging certain quantity according to certain order and mode, is then delivered to height
It is N in frequency cleaning storehouse, in the high frequency cleaning storehouse2Inert gases are waited, is cleared up by dry type high frequency and removes Superficial Foreign Body or adherency
Object；Designated position is transferred to through mechanical arm after cleaning, then prepares to be transmitted to patch process.
In order to ensure the quality of product and the quick coherency operation of production, quadratic search is equipped with before the patch, passes through light
The thickness and size of product are detected according to the mode of projection, realizes the completely the same of structure；For another example, using be clamped mensuration measure,
When product runs to designated position, automatically into in fixed structure, automatic measurement is realized, orbiting after measurement enters
Downstream process；For another example, CCD camera comparison of taking pictures is realized the detection of structure and is compared by quality testing and realizes thickness and size
Unanimously.After quadratic search, the product reaches designated position automatically.
For another example patch, product reach designated position automatically, and manipulator extraction product is placed into fixed position, while check production
Product towards and direction, the designated position fixed point benchmark contraposition is realized, simultaneously by self-adjusting apparatus Auto-ID center point
One folded polaroid glue surface is placed into piece folder by polaroid feeding upward；Suction nozzle is drawn monolithic polaroid and is placed on platform, and
It is aligned and adjusted by automatic contraposition device automatic identification；Suction nozzle draws polaroid to type film location is torn off after contraposition, is passed after dyestripping
It send below polaroid to product platform, the product is glass, prepares and glass attaches；Glass after ground and cleaned and quadratic search
After glass is reached at positioning, patch process suction nozzle automatic absorbing is at patch process positioning, glass absorption platform automatic absorbing glass,
Lower section automatic aligning identification device automatic aligning, then glass absorption platform is moved to above polaroid and polaroid overlaps, and
Move back completes polarizer sheet sticking to initial position；Glass is moved on to down polaroid attaching by overturning platform after upper polaroid attaches OK
Platform, it is the same that step is same as above polarizer sheet sticking, glass absorption platform is moved to above polaroid and polaroid overlap it is inclined under completing
Mating plate attaches；Suction nozzle is carried after the completion of patch product absorption is placed into platform of blanking blank panel automatically, inhaled after whole disk is piled
Mouth stacks whole disk glass.The automatic aligning identification device is CCD para-position device；Or uvw aligns bit platform, xxy
Platform and the combination of ccd visual-alignment systems.For another example, uvw to bit platform, xxy to bit platform and ccd visual-alignments system also
Contain automatic fine tuning system.For another example, in order to preferably ensure to tear the integrality of release film, such as diagonal paste tears release film,
The angle steel joint of polaroid is viscous first to take release film, release film and viscose glue integrally glue and, platform rotates certain angle automatically, makes to tear
Release film is more convenient；For another example, in order to save viscose glue, empty viscose glue in diamond shape can be used, viscous four sides for taking release film are diagonally torn
From, both ensure that tear off type film edge stickup intensity, also save material.For another example, the damaged automatic removal device of release film is torn,
Meeting residual film bits, polaroid removal are placed into artificial detection platform above after release film breakage.
In order to ensure the quality of COG and FOG, that is, the terminal of feeding process is needed to clean, the cleaning is to be used in
The PAD faces for overlaying IC and FPC clean up；Such as wheeled roll is cleaned, and the wiping bodies such as non-dust cloth are equipped on cleaning roller bearing,
The polishing solutions such as automatic sucking alcohol on wiping body, roller bearing, which rolls, carries out opposite end sub- cleaning；For another example contact cleans, the machinery
Hand is equipped with contact body, and cleaning solution is equipped on the contact body, and wiping body is equipped on contact body, wiping
Body is wiped by rotating contact or back and forth movement.For another example oxide clean first passes through the cleaning of the solution such as soda acid point type,
Then at it clean cleaning is realized by alcohol washes；It is for another example cleaned multiple times, according to terminal surfaces contact and the situation of spot
Specified repeatedly corresponding flow operations.
The COG is that IC is bundled in corresponding position on PAD faces, and the product after transferring arm cleans terminal is automatically sent to
On COG conveyer belts, PAD is face-up, and equipment carries out ACF attachings, IC precompressed, the full-automatic binding of the main pressures of IC automatically.Main pressure is completed
Afterwards, product is automatically sent to be ready for FOG on FOG conveyer belts to overlay by transferring arm；The FOG is that main FPC is bundled in PAD
Corresponding position on face；After equipment normal operation, product is transferred to FOG processes, and the automatic ACF in PAD faces after the completion of COG is attached；
Manipulator is taken FPC, and is put on main flattening bench, is comforted by vacuum levelling pressure, is smoothed FPC, equipment automatic aligning overlays；It ties up
The product determined is transported from FOG equipment conveyer belts, flows to next post；For another example in binding procedure, there is automatic aligning and micro-
Adjusting system realizes automatic aligning；For another example dual automatic decimal alignment system for the first time aligns whole plate, realizes the verification of whole plate position；
The corresponding binding area's automatic aligning of second of contraposition, further fine tuning, which aligns, reduces bit errors, realizes that high-precision aligns.For another example,
In operation, there are process alarm count and each process to count comparison system, realize the scrappage and accuracy of each process
Verification.
The microscopy is in order to which management and control COG/FOG overlays effect, avoids burst batch abnormal, prevents bad outflow；It is described
COG/FOG treated products in pallet automatic running to appointed place；Then manipulator places product to the place specified
Detection；During detection, X_RAY scannings, artificial observation can be divided into, people do not have to start, it is only necessary to observe, occur
During bad products, respective keys are clicked, are transferred to corresponding process, carry out quadratic search and judgement, quadratic search judges to repair simultaneously
It answers or scraps processing；For another example flow scanography method, the detection installation watchful inspection of simple function, automatic identification are asked accordingly
Topic, problem board produce downstream process, and classification and Detection overlays effect into reinspection program, such as flow scanography method,
Explosion degree and dissolvent residual etc., the reference value and parameter different to the requirement setting of different processes with detection.For another example from turn
Sequence is taken pictures method of comparison, automatic to store for problem board automatic camera problem points in detection process, forms corresponding number, product
Automatically it produces.
After microscopy, steam enters FOG pressing areas and protection PAD faces in order to prevent, prevents ITO from corroding.By making a call to one
Line glue protects PAD faces simultaneously with face glue, increase FPC pressure is beaten.The face glue of beating can be drop glue, glue spraying and brush coating, drip glue pair
In device, there is certain gradient on higher and periphery, and dirty conducive to glue forms good bonding force；Glue spraying is in order to uniform
Cover and avoid difference of height excessive；It is larger and smooth for area, it is suitable for brush coating.For another example playing face glue has secondary gluing, for
The face glue problem once is beaten, is repaired, syringe needle gluing, injecting glue is simultaneously with dripping glue, the combination of glue spraying and brush coating in hole；Again
Such as third time gluing, for underproof gluing, by the pin type cleaning device on mechanical arm by wiping cotton swab and dustless benefit
It is viscous to take cleaning glue, and then handle gluing again；For another example the 4th gluing is detected for multiple gluing part, does not meet
It is required that produce, reach artificial detection part, carry out repairing gluing manually.
Described plays a line glue to prevent steam from entering FOG pressing areas, increases FPC pressure.A line glue is played according to glue
Body frame carries out gluing, makes a call to the shape of a line colloid frame as needed, the full glue of filling in framework；A line is for another example played as required
The demand of colloid frame makes path line, according to path line brush coating；It is for another example glued using framework and takes glue, framework is with brief introduction on product
A line glue is played in face, realization.
Different demands and full fitting module are made, it may be necessary to secondary COG and FOG, realize in equipment FOG and
The automatic attaching of ACF, while also produce secondary microscopy and secondary make a call to and plays face glue at a line glue plays a line glue and beats reality after the glue of face
Existing UV curings.
Include electrical measurement image flow before the FOF, the electrical measurement picture is checks whether product has display defect, if not
It is aobvious, aobvious it is different, lack draw, bright color spot etc., prevent bad outflow.
It is described to be detected as automatic detection, it detects according to classification single stream journey, simple functionization detection；For example, producing
Corresponding detection device on line is set, has corresponding detection for each project；As display and brightness detection, product are placed on
In designated position, manipulator places pin to the position specified, and product is shown that luminance detection device is watchful to be detected whether
In the range specified；Flower detection is for another example wiped, product in the production line place by designated position, and photographic device or controller are clapped
According to comparison, it is detected；In another example product is placed in the designated position in the production line, in corresponding appropriate position, setting is each
Kind detection device, the testing result directly displays on a display screen, while can store problem corresponding with voice broadcast automatically,
Problem board by manipulator is directly taken out and is placed on corresponding production line.
The test of electrical measurement image flow is to reach fixture bayonet position with suctorial manipulator transfer FPC bayonets first, and
Fixed point is placed, and fixture bayonet engages according to the setting requirements time, while the detection devices such as power supply are connected, image comparison device and survey
Attempt, as being compared, in specified indication range, then to remove product with suctorial manipulator and be placed on certified products flowing water
Line, defective products do mark and are put into defective work assembly line, handled by artificial detection；For another example it is equipped with secondary electrical measurement image flow, institute
It states defective products and again goes into detection picture process in unqualified assembly line, secondary detection enters people for underproof product
Work detection process, avoid the problem that FPC bayonets engage with fixture bayonet it is irregular occur picture show it is bad.
The FOF is Touch FPC and main FPC by hot pressing connects, and the product by electrical measurement image flow is taken
It has been transferred to FOF flows, has reached the product for attaching out ACF, after checking OK, be placed on FOF and overlay and positioned on machine platform；By aobvious
Show that Mark points and edge golden finger carry out coincidence contraposition on device observation FOG FPC and second of FOG FPC, it is real after aligning OK
Existing hot pressing after the completion of hot pressing, aligns whether there is deviation after checking hot pressing by display, product is removed from platform, is put in flowing water
Line is transferred to lower process.
The purpose of product after the FOF further includes visual examination before fitting, the visual examination is to check display screen half
Finished surface is bad, piece is bad, glue is bad, FPC components etc. are bad, prevents bad outflow；Check respectively for whether display screen has
Angle is broken, crackle, face glue, a line glue etc. are bad.Check polarizer sheet sticking whether have foreign matter, scuffing, it is crooked, scald it is bad.It checks
Whether FPC has that folding line, scuffing, fracture, component comes off, connector is dirty, solder crack and viscose glue are bad.Non-defective unit is put into plastic sucking disc
In, do not allow product overlapping, FPC bending phenomenons, defective products mark clearly treats IPQC determination processings.
The fitting is that the TP (or Lens) for having attached OCA glue is allowed to be bonded entirely by equipment with display screen.The patch
It further includes TP cleanings, TP dyestrippings, positioning, fitting and TP in conjunction to produce, the TP cleanings clean TP (or Lens) table for positive and negative
Dust and dust are removed in face；The dyestripping of TP dyestrippings and polaroid is roughly the same, is checked after TP dyestrippings, according to the result after inspection
Carry out classification processing, according to specified mode and towards designated position is shipped to automatically after dyestripping, then manipulator passes through automatic
Alignment system aligns and captures TP (or Lens) and then on the platform that has been shipped to TP, while by polarisation on the display screen for checking OK
Piece upward and is close to locating piece and is positioned on platform, and the fine tuning alignment system on platform carries out contraposition adjustment in real time；Platform adjusts
Process or flow in, further include display screen protection film remove and surface cleaning；During fitting, in order to preferably arrange
Gas and facilitate fitting, display screen and TP (or Lens) need certain angle.
The assembling optical sources are divided into the assembling in OLED self light emitting display panels and LCD backlight source.It is complete in assembling optical sources
Into later, the assembling of leading portion automatic integratedization and detection are completed, and downstream process is packed for inspection and inspection, and the detection includes automatic
Into plate and functional test, the functionality is detected as electrical property detection and conduction detection；The visual examination is pacified including attachment
Dress, appearance detection, the spraying of sequence number and various codings, the printing of all kinds of certificates envelope shelves, packaging are put in storage.It is described to check packaging
Babinet, and mating presence accurately are fallen into specified place for various certificates and specification, when certain certificate or explanation
Book lacks the operation for being automatic alarm and stopping babinet.It is described automatically into plate for preceding process automatically into transhipment channel, along channel
Designated position is entered, operating platform is transported to by mechanically actuated in designated position, carries out functional survey on the operational platform
Examination, operator power on, and mounted module powers on, and have been made whether that aobvious different, corner lamp is not shown secretly, or not without backlight, backlight
Unevenness, screen flash, short circuit, open circuit, high current, twill, uneven thickness, crosstalk, Bian Lan, edge margin, shows deep or light, lousiness, group at light leakage
The sequentially inspection of the defects of dirty in dress, various dotted lines, sequentially middle detection device and the limitation sample that wherein sets in each detection
Whether the limiting value of plate is compared, and then be respectively certified products.For another example in detection process, equipped with grade separation system, inspection
Result classification display is surveyed, whole testing result is shown when reaching final, is carried out at the same time the classification processing of whole module.For another example examine
It observes and predicts alarm to give up processing, automatic alarm when detecting defective products, while positions sealing of hole or catch point processing, while transport process,
Various aspects avoid defective products from flowing out.The appearance is detected as subarea-scanning detection, and the module is divided into multiple regions, and module is flat
It is rotated under the drive of platform, realizes the conversion in region, scanning detecting result is shown on detection display screen, while also x_ray shines
Scanning is penetrated, similary subarea-scanning is realized and each solder joint and pad contraposition are checked.
In above operation, each process further includes data statistics step, for counting qualified quantity and/or not conforming to
Lattice quantity and accuracy etc..Preferably, in the data statistics step, including processing time and processing quantity, for example, output
The processing time of product and processing quantity；For another example, the total processing time of a collection of product and total processing quantity are exported；For another example, it exports
The total processing time of a collection of product always handle quantity, average treatment quantity and average handling time etc..
In feeding-patch-COG and FOG- microscopies-gluing-fitting-assembling backlight and welding backlight-detection-inspection packaging
Etc. in a series of flow, each defective work detected is transferred to secondary detection flow automatically, when secondary detection get along well it is qualified
When, artificial detection flow is transferred to, by manual repair or is scrapped；It is unified after the repairing that can be repaired to detect again, form time conjunction
Lattice product, it is impossible to which processing is then scrapped in repair.
Embodiment,
For the explanation of more convenient and quicker, following explanation is now carried out by taking the fitting flow of LCD as an example.
The first step understands device parameter, while checks mechanical equipment；Supplied materials manually is carried out Rough Inspection simultaneously to stack whole disk
LCD be put at stock shelf, PAD faces are unified outside, and after setting parameter, material reaches designated position automatically, and suction nozzle is inhaled automatically
A disk is taken to placement platform, then suction nozzle automatic sucking Single panel LCD is positioned at positioning, it is complete on whole disk LCD after suction nozzle inhale automatically
Blank panel is taken to be placed into blank panel lay down location.
Second step cleans up the mono- glass positive and negatives of LCD.
1) ground and cleaned agent is DI water in factory using water source, is used after filter element filtering.
2) LCD having good positioning through feeding automatically begins to grind after being transmitted to grinding plate, after completing one side grinding, by overturning
Arm overturns another side to grinding plate automatic grinding.
3) ground product is placed on transmission shaft automatically by suction nozzle, and is clamped through upper and lower roller bearing, roller transfer to spray
It drenches in case and is sprayed, enter back into air knife position and carry out high pressure blow-gas drying, water mark is avoided to remain.
4) after air knife drying, product is transmitted at positioning through roller bearing and positions, then prepare to be transmitted to patch process.
Third walks, will be on polarizer sheet sticking to the mono- glass of LCD.
1) a folded polaroid glue surface is placed into upward in piece folder, and often folds and be no more than 500pcs.
2) suction nozzle is drawn monolithic polaroid and is placed on platform, and passes through the contraposition adjustment of CCD automatic identifications.
3) suction nozzle draws polaroid to type film location is torn off after aligning, and transmits below polaroid to LCD platforms, puts down after dyestripping
Platform prepares after jacking up 5 ° and LCD is attached.
4) after the LCD after grinding is reached at positioning, at patch process positioning, LCD inhales patch process suction nozzle automatic absorbing
Attached platform automatic absorbing LCD, the identification of lower section CCD automatic alignings, then LCD absorption platforms are moved to above POL and POL is overlapped,
And move back is completed POL to initial position and is attached.
5) LCD is moved on to lower POL attachings platform by overturning platform after POL attaches OK on, and step is same as above POL and attaches the same, LCD
Absorption platform is moved to above POL and POL overlaps POL under completing and attaches.
6) suction nozzle is carried after the completion of patch to be automatically placed into product absorption in the track pallet of platform of blanking, and be transported to
Subsequent processing.
4th step, whether product is non-defective unit after checking patch process.
1) detection process is scanned inspection, and while automatic check, hand inspection confirms quality, and head inspections confirm patch
Product afterwards whether have piece tiltedly, bubble etc. it is bad, without after bad just can a large amount of operations, it is problematic to notify at relevant unit in time
Reason.
The LCD for posting polaroid is placed into the upper discharge position of terminal cleaning equipment by the 5th step.LCD is prepared to press
The PAD faces of patch IC and FPC clean up.
1) LCD for posting polaroid is placed by CF up and faces same direction per flake products PAD and put arrival and referred to
Positioning is put, and then direction is placed in equipment upper discharge position to plastic sucking disc as required, and equipment starts automatic sucking product to conveyer belt
On, carry out lower procedures.
2) Special reel non-dust cloth is installed on wheel, alcohol adds in the spirit solvent bottle of equipment inside
3) machine power is opened, and carries out parameter setting.
4) product is sent into terminal cleaner by conveyer belt and carries out automation washing and cleaning operation.
5) cleaning performance head detecting methods：Product PAD faces with oil pike are smeared completely, microexamination PAD faces are used after cleaning
Oil pike print whether wiped clean.
6) it is dried by the spark energy of equipment in the PAD faces after cleaning.
IC is bundled on LCD PAD faces corresponding position and main FPC is bundled in corresponding positions on LCD PAD faces by the 6th step
It puts.
1) product after transferring arm cleans terminal is automatically sent on COG conveyer belts, and LCD PAD are face-up, and equipment is certainly
It is dynamic to carry out ACF attachings, IC precompressed, the full-automatic binding of the main pressures of IC.
2) after the completion of main pressure, product is automatically sent to be ready for FOG on FOG conveyer belts to overlay by transferring arm.
3) product is transferred to FOG processes, and the automatic ACF in PAD faces is carried out to the LCD after the completion of COG and is attached.
4) manually take FPC from material plastic sucking disc, and is put on main flattening bench, presses vacuum key, is comforted FPC with finger
After smooth, equipment automatic aligning overlays.
5) product bound is transported from FOG equipment conveyer belts, flows to next post.
7th, management and control COG/FOG overlays effect, avoids burst batch abnormal, prevents bad outflow.
1) product detected is needed to reach designated position, being divided into repeated detection in detection completes, and being taken out in designated position needs
The product of microscopy is wanted to be placed on microscope slide platform.
2) adjustment microscope multiplying power flows to next hilllock to overlaying effect inspection, non-defective unit with 5X-10X times of camera lens from producing line line
Position, defective products are put into given disc.
3) particle explosion need to check particle explosion degree using 20X times of camera lens, and non-defective unit flows to next post from producing line line, bad
Product are put into given disc.
4) the producing line such as product for finding to have dissolvent residual need to all be chosen, and non-defective unit flows to next post from producing line line, bad
Product are put into given disc.
8th step prevents steam from entering FOG pressing areas, increases FPC pressure by playing a line glue；It is protected by playing face glue
ITO corrosion is placed in PAD faces.
Product is transferred to full automatic point glue process from FOG processes, and equipment starts automatic coated side glue.
Detection device has detected whether that gluing is bad automatically, if having the more glue, leak adhesive, disconnected glue, crawling, bubble etc. bad
It need to choose.
Secondary gluing, the secondary gluing to substandard product.
Detection device has detected whether that gluing is bad automatically, if having the more glue, leak adhesive, disconnected glue, crawling, bubble etc. bad
It need to choose, be transported to manual board, dip in alcohol wipe with cotton swab or non-dust cloth and fall gluing again.
5) equipment puts a line glue automatically after the completion of the coating of face glue.
6) after the completion of dispensing, product, which is carried to, to be spontaneously dried on platform, and detection platform is carried to successively according to sequencing.
7) detection device has detected whether that gluing is bad automatically, if having more glue, leak adhesive, disconnected glue, crawling, bubble etc. no
It is good to choose, manual board is transported to, alcohol wipe is dipped in cotton swab or non-dust cloth and falls gluing again.
9th step, by the Touch FPC bonding of On cell or In cell on CF glass.
1) after equipment normal operation, FOG ACF are attached automatically in equipment.
2) manually FPC Synchronous Radios to be overlayed are overlayed in main pressing equipments on stage automatic aligning.
3) product bound transports in conveyor out of FOG equipment and flows to next post.
Tenth step, checks whether product has display defect, it is such as not aobvious, aobvious it is different, lack stroke, bright color spot etc., prevent bad outflow.
1) power supply box, ammeter and clamp for electrical measurement conducting wire are connected and sets parameter.
2) it takes and treats electrical measurement semi-finished product, FPC bayonets are engaged with fixture bayonet.
3) semi-finished product contraposition is placed into clamp for electrical measurement backlight, turns on the power switch and start to detect.
4) by electric detecting technology standard detection test pictures.
5) after picture has detected, fixture power switch is closed, removes product.Non-defective unit is put into assembly line, and defective products identifies.
The Touch FPC of On cell or In cell and the main FPC of LCD are passed through hot pressing connects by the 11st step.
1) it takes and the product of ACF is attached at FOF, be placed on FOF and overlay and positioned on machine platform.
2) Mark points and edge golden finger on FOG1FPC and FOG2FPC are observed by display and carries out coincidence contraposition.
3) after overlapping contraposition, hot-pressing processing.
4) after the completion of hot pressing, align whether there is deviation after checking hot pressing by display.
5) product is removed from platform, assembly line is put in and is transferred to lower process.
12nd step allows the TP (or Lens) for having attached OCA glue to be bonded entirely by equipment with LCD.
1) TP (or Lens) of OCA is posted, along transhipment track and in orbit by wiping positive and negative on non-dust cloth.
2) transferred equipment is transferred on dyestripping machine, removes the OCA protective films on TP (or Lens), then by TP (or
Lens) glue surface is lain in upward on TP feeding platforms.
4) the LCD upper polaroids for checking OK upward and are close to locating piece and are positioned on platform.
5) equipment carries out LCD protective films and removes and after surface cleaning, be automatically performed the complete of TP (or Lens) and LCD automatically
Fitting.
7) product being bonded goes to LCD feeding ports, and is transferred to subsequent processing.
13rd step, LCD and backlight are combined, and LCD with backlight is connect, LCD is made normally to show.
1) it is calibrated in equipment automatic sucking backlight to conveyer belt, then is transmitted to dyestripping on dyestripping platform.
2) after backlight dyestripping, backlight placement platform is transferred to LCD and backlight precompressed position.
3) LCD Manual feedings are moved to calibrating position and carry out calibration positioning, and self-test whether there is screen angle and breaks.
4) LCD is transported to dyestripping platform by manipulator, and after automatic film tearing, LCD is handled by a robotic arm assembling precompressed position.
5) LCD and backlight carry out automatic assembling procedure after CCD para-position.
6) after being completed, platform rotation, LCM goes to position of platform to be transmitted.
8) the LCM products being completed by manipulator crawl are transferred to subsequent processing to conveyer belt is produced
9) according to different FPC structures, different welding manners are selected.When TP covers backlight pad, adhesive tape to be buffered is used
Vertical position welding formula fixture；When TP does not cover backlight pad, using downhand welding formula welding method, and one layer of antistatic skin of side's pad under a pad.
10) backlight golden finger and LCD pads are welded automatically.
11) welding effect is checked under desk lamp type magnifying glass, check for that short circuit, rosin joint, tin is high, scruff is residual after having welded
Stay, that component is fallen etc. is bad, OK product flow into subsequent processing.
Whether the 14th step, detection module are functional bad.
1) it takes and treats electrical measurement product, be packed on finished product fixture and carry out comprehensive functional test.
2) according to test stone and limit model, check module whether have it is aobvious it is different, corner lamp is dark, it is not aobvious, without backlight, backlight not
, light leakage, screen flash, short circuit, open circuit, high current, twill, box thickness ununiformity, crosstalk, Bian Lan, edge margin, the deep or light, lousiness of display, assembling
Interior dirty, various line defects etc., beyond standard and are judged as bad.
3) it after being completed, first closes fixture and removes product again, OK product flow into subsequent processing, and defective products identifies.
15th step manually sticks on the auxiliary materials such as dyestripping handle on module.
16th step, detection open defect are bad.Visual examination, scope of examination packet are carried out to module under scanning device
It includes：
1)TP：Surface whether have dirty, bubble, foreign matter, it is broken, crackle, cut, fall paint, whether TP sockets have defect, member
Whether device is intact, whether IR protective films leak patch etc..
2) it assembles：Whether have assembling in place, deviation, dirty, card (slotting) mouth whether in place etc..
3) it welds：Whether there is company's tin, tin are high, lack tin, scald, component to glue tin etc..
4) backlight：Whether deformation, pin injured, leakage patch conductive fabric, double faced adhesive tape, protective film etc. are had.
5)FPC：Whether have fold, contraposition deflection, folding line, scratch, cut off, few component, bayonet connector it is dirty, damaged
Deng.
6) coding：Check whether that content intact, clear writing, position are correct etc..
7) non-defective unit is put into shipment finished disk, and defective products mark clearly waits to reprocess or IPQC determination processings.
17th step, it is automatic to pack.
It should be noted that above-mentioned each technical characteristic continues to be combined with each other, the various embodiments not being enumerated above are formed,
It is accordingly to be regarded as the range of description of the invention record；Also, for those of ordinary skills, it can add according to the above description
To improve or convert, and all these modifications and variations should all belong to the protection domain of appended claims of the present invention.
Claims (10)
1. a kind of full-automatic full fitting module production method, it is characterised in that flow and method is：
1) feeding
2) patch
3) COG and FOG
4) microscopy
5) gluing
6)FOF
7) it is bonded
8) assembling optical sources
9) it detects
10) packaging is checked.
2. a kind of full-automatic full fitting module production method according to claim 1, which is characterized in that the gluing includes
Play a line glue and dispensing.
A kind of 3. full-automatic full fitting module production method according to claim 1, which is characterized in that the feeding step
It is upper to include ground and cleaned and terminal cleaning.
4. a kind of full-automatic full fitting module production method according to claim 1, which is characterized in that the detection includes
Functionality detection, appearance detection and auxiliary material are pasted.
A kind of 5. full-automatic full fitting module production method according to claim 4, which is characterized in that the functional inspection
Survey detects after including electrical property connecting detection and each process operation.
6. a kind of full-automatic full fitting module production method according to claim 1, which is characterized in that described to check packaging
Include the following steps, appearance detection, QA detections and packaging.
7. a kind of full-automatic full fitting module production method according to claim 1, which is characterized in that the fitting includes
Following steps clean the TP of OCA and check LCD upper polaroids；Dyestripping；Full fitting；It produces.
8. a kind of full-automatic full fitting module production method according to claim 7, which is characterized in that the dyestripping is four
Paste diagonal dyestripping in side.
9. a kind of full-automatic full fitting module production method according to claim 1, which is characterized in that the detection includes
During detection failure, current material is discarded, repairing is removed, is detecting.
10. a kind of full-automatic full fitting module production method according to claim 1, which is characterized in that dynamic in each operation
Before work, contraposition process is further included.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711382797.6A CN108215442A (en) | 2017-12-20 | 2017-12-20 | A kind of full-automatic full fitting module production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711382797.6A CN108215442A (en) | 2017-12-20 | 2017-12-20 | A kind of full-automatic full fitting module production method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108215442A true CN108215442A (en) | 2018-06-29 |
Family
ID=62649976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711382797.6A Pending CN108215442A (en) | 2017-12-20 | 2017-12-20 | A kind of full-automatic full fitting module production method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108215442A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108874230A (en) * | 2018-07-04 | 2018-11-23 | 苏州元顿传感科技有限公司 | Based on can precorrection touch control film process equipment processing method |
| CN110126428A (en) * | 2019-06-11 | 2019-08-16 | 深圳市深科达智能装备股份有限公司 | A kind of bonding structure for liquid crystal display and touch screen |
| CN110126261A (en) * | 2019-06-11 | 2019-08-16 | 深圳市深科达智能装备股份有限公司 | Display or touch module 3D printing glue-line method |
| CN116874194A (en) * | 2023-07-21 | 2023-10-13 | 东莞市友辉光电科技有限公司 | Automatic coating and strengthening equipment for ultrathin flexible glass and coating method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105388643A (en) * | 2015-11-27 | 2016-03-09 | 江西合力泰科技有限公司 | Manufacturing method of LCD screen module |
| CN105405784A (en) * | 2015-10-31 | 2016-03-16 | 芜湖宏景电子股份有限公司 | Manufacturing technology of active equalization module |
| CN205539817U (en) * | 2016-01-27 | 2016-08-31 | 宇龙计算机通信科技(深圳)有限公司 | LCD and flexible circuit board that is arranged in LCD |
| CN206450923U (en) * | 2017-02-24 | 2017-08-29 | 江西合力泰科技有限公司 | One kind touches aobvious one on cell modules |
-
2017
- 2017-12-20 CN CN201711382797.6A patent/CN108215442A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105405784A (en) * | 2015-10-31 | 2016-03-16 | 芜湖宏景电子股份有限公司 | Manufacturing technology of active equalization module |
| CN105388643A (en) * | 2015-11-27 | 2016-03-09 | 江西合力泰科技有限公司 | Manufacturing method of LCD screen module |
| CN205539817U (en) * | 2016-01-27 | 2016-08-31 | 宇龙计算机通信科技(深圳)有限公司 | LCD and flexible circuit board that is arranged in LCD |
| CN206450923U (en) * | 2017-02-24 | 2017-08-29 | 江西合力泰科技有限公司 | One kind touches aobvious one on cell modules |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108874230A (en) * | 2018-07-04 | 2018-11-23 | 苏州元顿传感科技有限公司 | Based on can precorrection touch control film process equipment processing method |
| CN110126428A (en) * | 2019-06-11 | 2019-08-16 | 深圳市深科达智能装备股份有限公司 | A kind of bonding structure for liquid crystal display and touch screen |
| CN110126261A (en) * | 2019-06-11 | 2019-08-16 | 深圳市深科达智能装备股份有限公司 | Display or touch module 3D printing glue-line method |
| CN110126261B (en) * | 2019-06-11 | 2021-04-13 | 深圳市深科达智能装备股份有限公司 | Method for 3D printing of adhesive layer by display or touch module |
| CN116874194A (en) * | 2023-07-21 | 2023-10-13 | 东莞市友辉光电科技有限公司 | Automatic coating and strengthening equipment for ultrathin flexible glass and coating method thereof |
| CN116874194B (en) * | 2023-07-21 | 2024-01-23 | 东莞市友辉光电科技有限公司 | Automatic equipment for coating and strengthening flexible ultrathin glass and coating method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108287625A (en) | A kind of full fitting module production method | |
| CN108215442A (en) | A kind of full-automatic full fitting module production method | |
| CN105629909B (en) | Automated detection method | |
| CN204256323U (en) | Aulomatizeted Detect board | |
| TW201419073A (en) | Manufacture method of touch and display device | |
| CN107801369A (en) | A kind of power supply automatic production process | |
| CN112731695A (en) | Laminating machine and laminating method | |
| CN107262380A (en) | A kind of cell phone back light source vision automatic checkout equipment and detection method | |
| CN108319043A (en) | A kind of method for sticking and covering based on COG techniques touch panel and liquid crystal display panel | |
| KR102126982B1 (en) | Multi processing robot unit and cover glass bonding apparatus including the same | |
| KR20170099100A (en) | The system to CNC grinding for a glass reinforced | |
| CN208922003U (en) | Full-automatic COG binds machine | |
| KR20210020349A (en) | Cover glass bonding apparatus having articulated robot | |
| CN105775647A (en) | Online inspection and cleaning device of batteries | |
| CN106597708A (en) | Substrate detection device | |
| CN108287626A (en) | A kind of intelligence is bonded module production method entirely | |
| CN108196385A (en) | A kind of LCM modules production method | |
| CN110335559A (en) | A kind of detection system | |
| CN108363225A (en) | A kind of LCD method for sticking and covering based on COG techniques | |
| CN107124818A (en) | FPC attaching process based on steel disc make-up machine | |
| KR20230160756A (en) | Apparatus and method for bonding panels | |
| CN207602529U (en) | A kind of sorting machine | |
| CN108594500A (en) | The production method of LCD assemblings | |
| CN208721008U (en) | A kind of rotating disc type CCD vision-based detection automation equipment | |
| CN109696437B (en) | Leveling device and method for semiconductor material sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 518119 BYD Industrial Park, Yanan Road, Kwai Chung street, Dapeng District, Shenzhen, Guangdong Applicant after: Shenzhen helitai photoelectric Co., Ltd Address before: 518119 BYD Industrial Park, Yanan Road, Kwai Chung street, Dapeng District, Shenzhen, Guangdong Applicant before: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180629 |
|
| WD01 | Invention patent application deemed withdrawn after publication |