CN108207086A - A kind of method of glue more than solution communication IC Metal Substrate support plates - Google Patents
A kind of method of glue more than solution communication IC Metal Substrate support plates Download PDFInfo
- Publication number
- CN108207086A CN108207086A CN201611186282.4A CN201611186282A CN108207086A CN 108207086 A CN108207086 A CN 108207086A CN 201611186282 A CN201611186282 A CN 201611186282A CN 108207086 A CN108207086 A CN 108207086A
- Authority
- CN
- China
- Prior art keywords
- ink
- inner plating
- glue
- gasket
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
Abstract
Method of the communication with glue more than IC Metal Substrate support plates is solved the invention discloses a kind of, is included the following steps：First, to the whole print photosensitive-ink of the first inner plating；Then to the ink of slot area being needed to be exposed on first inner plating；Then development removal ink is carried out to the ink for not being exposed region on first inner plating；And the region after development is carried out to stack PP, gasket then is placed to the region for not carrying out stacking PP；Then the second inner plating is placed in the upper surface of the PP and the gasket, and carries out high-temperature laminating；Then it uncaps to the second inner plating after pressing, and takes out the gasket；Then it after the gasket is taken out, takes off except ink.This method to the first inner plating by carrying out ink protection, and glue is fully fallen on ink more than the PP powder and PP in entire lamination, bonding processes, it is only necessary to ink fade away, glue naturally disappears more than PP powder and PP, without hand sand.
Description
Technical field
The present invention relates to communication IC Metal Substrate support plate processing technique fields, particularly, are related to a kind of solution communication IC
The method of glue more than Metal Substrate support plate.
Background technology
Advanced semiconductor communication is that optical transmission signal is mutually converted with electrical transmission signal in optical communication net with highly dense IC support plates
Important component, the product is since technical difficulty is big, the reasons such as technological level is high, by American-European and day within a very long time
The high-end support plate factory monopolization such as this, the price is very expensive；This product high-power heat-dissipation uses Metal Substrate, this technique is in process
It needs to increase gasket, it is unavoidable to generate many dust in entire the problem of overlapping in kind due to environment and PP characteristics
It falls in the bottom of the steps, these dust are cured to react and left behind with remaining glue after pressing, at present, with manual in industry
Method removal bottom PP dust and the remaining glue of polishing, still, the method needs a large amount of manpower, and ineffective, especially platform
The remaining glue at rank edge is inconvenient to rank, causes waste product very high.
Invention content
Present invention aims at provide it is a kind of solve method of the communication with glue more than IC Metal Substrate support plates, to solve the prior art
The technical issues of in middle industry with the method for hand sand removal bottom PP dust and remaining glue.
To achieve the above object, the present invention provide it is a kind of solve method of the communication with glue more than IC Metal Substrate support plates, including with
Lower step：
A, to the whole print photosensitive-ink of the first inner plating；
B, to the ink of slot area being needed to be exposed on first inner plating；
C, to the ink for not being exposed region on first inner plating carry out development removal ink, and to development after
Region carries out stacking PP；
D, gasket is placed to the region for not carrying out stacking PP in step c；
E, the second inner plating is placed in the upper surface of the PP and the gasket, and carries out high-temperature laminating；
F, it uncaps, and take out the gasket to the second inner plating after being pressed in step e；
G, it after the gasket is taken out, takes off except ink.
Further, to the ink of slot area being needed to be exposed on first inner plating in the step b so that
Light reaction occurs for ink.
Further, develop in the step c to the ink for not being exposed region on first inner plating, lead to
Cross generation chemical reaction removal ink.
Further, second inner plating for the gasket top being removed in the step f carries out operation of uncapping.
Further, it in the step g after the gasket is taken out, is taken off by chemical reaction except ink.
The invention has the advantages that：The method of glue more than a kind of solution communication IC Metal Substrate support plates of the present invention,
This method, then by the method for exposure imaging, leaves behind step groove area by carrying out ink Global Macros to the first inner plating
The ink in domain, the ink of other positions all fall by development, and glue is whole more than the PP powder and PP in this way in entire lamination, bonding processes
It falls on ink, after the completion of pressing, uncaps after taking out gasket, it is only necessary to ink fade away, glue is natural more than PP powder and PP
It disappears, without hand sand, solves the problems, such as more than step groove bottom corner glue except not cleaning, effectively reduce rejection rate.
Description of the drawings
Below with reference to figure, the present invention is described in further detail.The attached drawing for forming the part of the application is used for
A further understanding of the present invention is provided, the illustrative embodiments of the present invention and their descriptions are used to explain the present invention, does not form
Inappropriate limitation of the present invention.In the accompanying drawings：
Fig. 1 is the flow chart of the preferred embodiment of the present invention.
Specific embodiment
The embodiment of the present invention is described in detail below in conjunction with attached drawing.
Referring to Fig. 1, the preferred embodiment of the present invention provide it is a kind of solve communication IC Metal Substrate support plates more than glue side
Method includes the following steps：Then to the ink of slot area being needed to be exposed on first inner plating so that ink occurs
Light reaction；Then the ink for not being exposed region on first inner plating is carried out being developed by that chemical reaction occurs
Except ink, the ink of unexposed area is removed, and the region after development is carried out to stack PP by chemical reaction so that pressing
The PP powder generated in the process is fallen on ink；Then gasket is placed in the region for not carrying out stacking PP, is pressed in the second inner plating
It plays a supportive role in the process；Then the second inner plating is placed in the upper surface of the PP and the gasket, and carries out high-temperature laminating,
Fall the PP powder curing on ink, and glue more than trough rim generation；Then the gasket upper strata is removed to the second inner plating after pressing
Part is uncapped, and second inner plating not with PP pressings is removed, and take out the gasket；Then institute is being taken out
It after stating gasket, is taken off by chemical reaction except ink, because of PP powder, glue on ink, therefore can be removed all clean with more than.
It can be seen from the above description that the above embodiments of the present invention realize following technique effect：This method is led to
It crosses and ink Global Macros is carried out to the first inner plating, then by the method for exposure imaging, leave behind the ink in step groove region,
The ink of other positions all fall by development, and glue fully falls in ink more than the PP powder and PP in this way in entire lamination, bonding processes
On, it after the completion of pressing, uncaps after taking out gasket, it is only necessary to ink fade away, glue naturally disappears more than PP powder and PP, nothing
Hand sand is needed, glue is solved the problems, such as more than step groove bottom corner except not cleaning, effectively reduces rejection rate.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention；For the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, that is made any repaiies
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (5)
1. a kind of method of glue more than solution communication IC Metal Substrate support plates, which is characterized in that include the following steps：
A, to the whole print photosensitive-ink of the first inner plating；
B, to the ink of slot area being needed to be exposed on first inner plating；
C, development removal ink is carried out to the ink for not being exposed region on first inner plating, and to the region after development
It carries out stacking PP；
D, gasket is placed to the region for not carrying out stacking PP in step c；
E, the second inner plating is placed in the upper surface of the PP and the gasket, and carries out high-temperature laminating；
F, it uncaps, and take out the gasket to the second inner plating after being pressed in step e；
G, it after the gasket is taken out, takes off except ink.
2. the method for glue more than a kind of solution communication IC Metal Substrate support plates according to claim 1, it is characterised in that：It is described
To the ink of slot area being needed to be exposed on first inner plating in step b so that light reaction occurs for ink.
3. the method for glue more than a kind of solution communication IC Metal Substrate support plates according to claim 1, it is characterised in that：It is described
Develop in step c to the ink for not being exposed region on first inner plating, oil removing is gone by the way that chemical reaction occurs
Ink.
4. the method for glue more than a kind of solution communication IC Metal Substrate support plates according to claim 1, it is characterised in that：It is described
Second inner plating that the gasket top is removed in step f carries out operation of uncapping.
5. the method for glue more than a kind of solution communication IC Metal Substrate support plates according to claim 1, it is characterised in that：It is described
In step g after the gasket is taken out, taken off by chemical reaction except ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611186282.4A CN108207086A (en) | 2016-12-20 | 2016-12-20 | A kind of method of glue more than solution communication IC Metal Substrate support plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611186282.4A CN108207086A (en) | 2016-12-20 | 2016-12-20 | A kind of method of glue more than solution communication IC Metal Substrate support plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108207086A true CN108207086A (en) | 2018-06-26 |
Family
ID=62603447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611186282.4A Pending CN108207086A (en) | 2016-12-20 | 2016-12-20 | A kind of method of glue more than solution communication IC Metal Substrate support plates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108207086A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008034515A (en) * | 2006-07-27 | 2008-02-14 | Toshiba Corp | Electronic apparatus and package |
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN101765298A (en) * | 2010-01-04 | 2010-06-30 | 深南电路有限公司 | Processing technology of printed circuit board |
| CN102361542A (en) * | 2011-09-30 | 2012-02-22 | 东莞市五株电子科技有限公司 | Manufacturing process of printed circuit board with steps |
-
2016
- 2016-12-20 CN CN201611186282.4A patent/CN108207086A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008034515A (en) * | 2006-07-27 | 2008-02-14 | Toshiba Corp | Electronic apparatus and package |
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN101765298A (en) * | 2010-01-04 | 2010-06-30 | 深南电路有限公司 | Processing technology of printed circuit board |
| CN102361542A (en) * | 2011-09-30 | 2012-02-22 | 东莞市五株电子科技有限公司 | Manufacturing process of printed circuit board with steps |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180626 |