CN108206145B - 一种实现相邻晶圆对转的腐蚀装置及腐蚀方法 - Google Patents
一种实现相邻晶圆对转的腐蚀装置及腐蚀方法 Download PDFInfo
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- CN108206145B CN108206145B CN201611190890.2A CN201611190890A CN108206145B CN 108206145 B CN108206145 B CN 108206145B CN 201611190890 A CN201611190890 A CN 201611190890A CN 108206145 B CN108206145 B CN 108206145B
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- carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02019—Chemical etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201611190890.2A CN108206145B (zh) | 2016-12-20 | 2016-12-20 | 一种实现相邻晶圆对转的腐蚀装置及腐蚀方法 |
Applications Claiming Priority (1)
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CN201611190890.2A CN108206145B (zh) | 2016-12-20 | 2016-12-20 | 一种实现相邻晶圆对转的腐蚀装置及腐蚀方法 |
Publications (2)
Publication Number | Publication Date |
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CN108206145A CN108206145A (zh) | 2018-06-26 |
CN108206145B true CN108206145B (zh) | 2020-05-19 |
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CN201611190890.2A Active CN108206145B (zh) | 2016-12-20 | 2016-12-20 | 一种实现相邻晶圆对转的腐蚀装置及腐蚀方法 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20200006093A1 (en) * | 2018-06-29 | 2020-01-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wet bench structure |
CN110176428A (zh) * | 2019-06-04 | 2019-08-27 | 德淮半导体有限公司 | 一种晶圆夹具以及使用所述夹具的晶圆刻蚀方法 |
CN110620066A (zh) * | 2019-09-06 | 2019-12-27 | 上海华力集成电路制造有限公司 | 槽式湿法刻蚀机台及利用其进行湿法刻蚀的方法 |
CN110931401B (zh) * | 2020-01-02 | 2022-06-03 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 晶圆片盒旋转装置及片盒旋转升降设备 |
CN111508873A (zh) * | 2020-04-24 | 2020-08-07 | 江苏芯梦半导体设备有限公司 | 晶圆片腐蚀清洗笼 |
CN112768347A (zh) * | 2021-01-07 | 2021-05-07 | 天津中环领先材料技术有限公司 | 一种降低晶圆片损伤层厚度偏差值的腐蚀工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1192579A (zh) * | 1997-02-04 | 1998-09-09 | 佳能株式会社 | 晶片处理装置、晶片处理方法和绝缘体上硅晶片制造方法 |
CN101275287A (zh) * | 2008-01-02 | 2008-10-01 | 株洲南车时代电气股份有限公司 | 大面积硅片的旋转腐蚀系统和方法 |
CN102610486A (zh) * | 2011-01-24 | 2012-07-25 | 均豪精密工业股份有限公司 | 连续式半导体蚀刻设备及蚀刻方法 |
CN105336649A (zh) * | 2015-11-27 | 2016-02-17 | 上海广奕电子科技股份有限公司 | 一种晶圆腐蚀装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10189522A (ja) * | 1996-12-24 | 1998-07-21 | Dainippon Screen Mfg Co Ltd | 基板処理槽および基板処理装置 |
JP2011243814A (ja) * | 2010-05-19 | 2011-12-01 | Sharp Corp | 基板搬送用キャリアおよび電子回路基板の製造方法 |
-
2016
- 2016-12-20 CN CN201611190890.2A patent/CN108206145B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1192579A (zh) * | 1997-02-04 | 1998-09-09 | 佳能株式会社 | 晶片处理装置、晶片处理方法和绝缘体上硅晶片制造方法 |
CN101275287A (zh) * | 2008-01-02 | 2008-10-01 | 株洲南车时代电气股份有限公司 | 大面积硅片的旋转腐蚀系统和方法 |
CN102610486A (zh) * | 2011-01-24 | 2012-07-25 | 均豪精密工业股份有限公司 | 连续式半导体蚀刻设备及蚀刻方法 |
CN105336649A (zh) * | 2015-11-27 | 2016-02-17 | 上海广奕电子科技股份有限公司 | 一种晶圆腐蚀装置 |
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Address after: 101300 south side of Shuanghe Road, Linhe Industrial Development Zone, Shunyi District, Beijing Patentee after: Youyan semiconductor silicon materials Co.,Ltd. Address before: 101300 south side of Shuanghe Road, Linhe Industrial Development Zone, Shunyi District, Beijing Patentee before: GRINM SEMICONDUCTOR MATERIALS Co.,Ltd. |
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Effective date of registration: 20210630 Address after: 253012 room 921, block a, No. 6596, Dongfanghong East Road, Yuanqiao Town, Dezhou Economic and Technological Development Zone, Shandong Province Patentee after: Shandong Youyan semiconductor materials Co.,Ltd. Address before: 101300 south side of Shuanghe Road, Linhe Industrial Development Zone, Shunyi District, Beijing Patentee before: Youyan semiconductor silicon materials Co.,Ltd. |
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