CN108195492A - Utilize the hypersensitive strain gauge of two-dimentional phase transformation material preparation - Google Patents

Utilize the hypersensitive strain gauge of two-dimentional phase transformation material preparation Download PDF

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Publication number
CN108195492A
CN108195492A CN201810053262.2A CN201810053262A CN108195492A CN 108195492 A CN108195492 A CN 108195492A CN 201810053262 A CN201810053262 A CN 201810053262A CN 108195492 A CN108195492 A CN 108195492A
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CN
China
Prior art keywords
dimentional
layer
change material
dimentional phase
phase transformation
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Pending
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CN201810053262.2A
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Chinese (zh)
Inventor
汤乃云
杜琛
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Shanghai University of Electric Power
University of Shanghai for Science and Technology
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Shanghai University of Electric Power
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Priority to CN201810053262.2A priority Critical patent/CN108195492A/en
Publication of CN108195492A publication Critical patent/CN108195492A/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/20Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges

Abstract

The present invention relates to a kind of hypersensitive strain gauges using two-dimentional phase transformation material preparation, including silicon substrate, layer of silicon dioxide dielectric layer are deposited on the silicon substrate, the thickness of silica dioxide medium layer is in 20 100nm;A recessed table top is made on the silica dioxide medium layer;The two-dimentional phase change material film of one layer of transfer covering on the concave station face of the silica dioxide medium layer, one metal electrode of each growth in both ends of the two dimension phase change material film.When molecular material is touched on two-dimentional phase change material film surface, film is bent by the effect of molecular material, lead to its internal generation stress, promote two-dimensional material that semiconductor-- metal phase change occurs, electric current measured by the metal electrode of film both ends is caused to change, and then the quality of binding molecule can be measured.The sensor that the present invention is prepared has the sensitivity that production method is easy, stability is good, is easily integrated, and has superelevation, and application prospect is extensive.

Description

Utilize the hypersensitive strain gauge of two-dimentional phase transformation material preparation
Technical field
The present invention relates to a kind of strain gauge more particularly to a kind of hypersensitive stress using two-dimentional phase transformation material preparation Sensor.
Background technology
Strain gauge is widely used in integrated circuit, due to integrated circuit increasingly miniaturized design standard increasingly Height, industry also increase the size and sensitivity requirement of strain gauge therewith, should using two-dimentional phase transformation material preparation hypersensitive Force snesor becomes a new way.Two-dimentional two telluride molybdenum of phase-change material belongs to stratiform Transition-metal dichalcogenide, has two The layer structure of dimension.Every layer is made of sandwich structure Te-Mo-Te, is covalent bond between the Mo atoms and Te atoms in layer, and three Te-Mo-Te the individual layers of Mingzhi's structure are highly stable, stable electrochemical property.And two telluride molybdenums are efficient with homojunction Characteristic is 10-50 times of silicon, and electronics can move rapidly wherein, thus it has very high electric conductivity.
Two telluride molybdenums have high elastic modulus, are referred to as elastic material, when two telluride molybdenum of individual layer is by machineries such as molecular pressures When stress bends, two telluride molybdenum of individual layer will generate the phase transformation that 1T is converted to by 2H, that is, mutually be changed to by semiconductor form Metal phase.Two telluride molybdenum film material of individual layer is by semiconductor mutually to after the phase transformation of metal phase, and resistance changes, two end electrodes On the electric current measured can also change therewith.By measuring the variation of electric current in two end electrodes, individual layer two can be calculated The number and quality of the molecule adsorbed on telluride molybdenum.
Invention content
In view of the advantages of two dimension phase-change material described above, it is an object of the invention to propose a kind of two-dimentional phase transformation material of utilization Expect the hypersensitive strain gauge prepared, electronics moves rapidly in two telluride molybdenums, the fast response time of sensor;Two telluriums simultaneously Change molybdenum to presser sensor, therefore the sensitivity of sensor is very high;In addition, due to the two-dimensional characteristics of two telluride molybdenum materials, so device Integrated level is high, good portability.
In order to achieve the above objectives, the technical scheme is that:A kind of hypersensitive using two-dimentional phase transformation material preparation should Force snesor including silicon substrate, deposits layer of silicon dioxide dielectric layer on the silicon substrate, the thickness of silica dioxide medium layer exists 20-100nm;A recessed table top is made on the silica dioxide medium layer;The concave station of the silica dioxide medium layer The two-dimentional phase change material film of one layer of transfer covering on face, one metal electricity of each growth in both ends of the two dimension phase change material film Pole.
The recessed depth of recessed table top on the silica dioxide medium layer is between 10-20nm.
Recessed table top is made using chemical corrosion method on the silica dioxide medium layer.
The two-dimentional phase-change material of the two-dimentional phase change material film is two telluride molybdenum of individual layer, and thickness is within 1nm.
When touching molecular material on two-dimentional phase change material film surface, the two dimension phase change material film is by molecule The pressure of material and bend, cause to generate stress inside two-dimentional phase change material film, two-dimentional phase change material film occur from Phase transformation of the semiconductor to metal, the two-dimentional phase transformation material resistance of two-dimentional phase change material film change, and lead to two-dimentional phase transformation material The electric current that material both ends metal electrode is surveyed changes, so as to calculate the molecular mass adsorbed in environment space.
Compared with strain gauge general at present, the invention has the advantages that:
(1)The two telluride molybdenum of two-dimentional phase-change material used in the present invention, homojunction is efficient, movement of the electronics in two telluride molybdenums Rate is fast, and the response of sensor is fast.
(2)The two telluride molybdenum film of two-dimentional phase-change material used in the present invention is when by the pressure of molecular level material The phase transformation by semiconductor to metal is generated, causes the variation of electric electrode current, sensor has the sensitivity of superelevation.
(3)The two telluride molybdenum of two-dimentional phase-change material used in the present invention has unique two-dimension plane structure, can be with the modern times High-tech micro-nano technology technology is mutually connected, and the High Density Integration of sensor can be well realized, and improves the portable of device Property.
Description of the drawings
Fig. 1 is the texture edge schematic diagram of the hypersensitive strain gauge using two-dimentional phase transformation material preparation of the present invention;
Fig. 2 is that the two-dimensional material of the hypersensitive strain gauge using two-dimentional phase transformation material preparation of the present invention bends strain When texture edge schematic diagram;
Figure label explanation:1- silicon substrates, 2-silica dioxide medium layer, 3-two dimension phase change material film, 4-metal electrode A, 5-metal electrode B.
Specific embodiment
Below in conjunction with the embodiment that particular instance illustrates, embodiment and various features and related details herein will refer to The non-limiting example of middle detailed description is illustrated and be described below in attached drawing and is explained more fully.It omits well-known The description of component and treatment technology, in order to avoid the unnecessary embodiment indigestion made herein.It, can be with when making the structure Use traditional handicraft well-known in semiconductor technology.Example used herein understands implementation herein just for the sake of help The mode and further such that those skilled in the art can implement embodiment herein that example can be carried out.Thus, should not Example herein is interpreted as limiting to the range of embodiment herein.
It should be noted that the diagram provided in the present embodiment only illustrates the basic conception of the present invention in a schematic way, Then component count, shape and size when schema is only shown with related component in the present invention rather than according to actual implementation are drawn, The kenel of each component, quantity and ratio can be a kind of random change, and its assembly layout kenel may also during its actual implementation It is increasingly complex.
As shown in Figure 1, the present invention using two-dimentional phase transformation material preparation hypersensitive strain gauge, including silicon substrate 1, Silica dioxide medium layer 2 is grown on silicon substrate 1, the table top of a recessed W is made on silica dioxide medium layer 2, in titanium dioxide The two-dimentional phase change material film 3 of one layer of transfer covering on the table top of the recessed W of silicon dielectric layer.In two-dimentional phase change material film 3-two Telluride molybdenum both ends grow a metal electrode A4, metal electrode B5 respectively.When there is molecular material contact two dimension phase-change material, two Dimension phase change material film 3, which is under pressure, to bend, and inside generates stress, and the phase transformation from semiconductor to metal, two-dimensional phase occurs The resistance for becoming material film 3 changes, and the electric current that two-dimentional 3 two end electrodes of phase transformation material film are surveyed is caused to change.
As shown in Fig. 2, the operation principle of the present invention is as follows:When molecular material touches two-dimentional 3 surface of phase change material film When upper, two-dimentional phase change material film 3 is bent by the effect of molecular material.Since shape change leads to its internal generation Phase transformation from from semiconductor to metal occurs for stress, two-dimentional phase-change material, and the resistance of two-dimentional phase change material film 3 changes, leads The electric current that two dimension phase change material film 3 both ends metal electrode A4 and metal electrode B5 are surveyed is caused to change, from the variation of electric current Calculate the molecular mass of two-dimentional phase-change material absorption.
Embodiment one:It is a kind of to utilize two-dimentional phase transformation material preparation hypersensitive strain gauge
First, using silicon as substrate material, and substrate is cleaned.
Layer of silicon dioxide dielectric layer is deposited on silicon substrate, to increase the adhesiveness between two-dimentional phase-change material and substrate. Silica dioxide medium layer thickness is 70nm.
Later, corrode a concave station face using anhydrous hydrofluoric acid directly etching method in silica dioxide medium layer surface center; Then one layer of two-dimentional phase-change material is covered by the method for transfer on the concave station face of dielectric layer, the two dimension phase-change material is single Layer, the two-dimentional phase-change material be two telluride molybdenums, thickness 1nm;Mechanical stripping method can be used and prepare the layer, later by turning Technique transfers are moved to be covered on the silica dioxide medium layer.
The crome metal film of one layer of 100nm thickness is deposited by electron beam evaporation again, metal is then made by stripping technology and is formed Two electrode layers.
Embodiment two:It is a kind of to utilize two-dimentional phase transformation material preparation hypersensitive strain gauge
First, using silicon as substrate material, and substrate is cleaned.
Layer of silicon dioxide dielectric layer is deposited on silicon substrate, to increase the adhesiveness between two-dimentional phase-change material and substrate. Silica dioxide medium layer thickness is 80nm.
Later, in silica dioxide medium layer surface center by one concave station face of ion etching;Positivity is filled in concave station face Then photoresist carries out uv-exposure processing to photoresist;One layer of two-dimentional phase-change material is grown by CVD methods and is covered in concave station On face, it is described two dimension phase-change material be individual layer, the two-dimentional phase-change material be two telluride molybdenums, thickness 1nm;Developer solution is used again Photoetching positive photoresist after exposure is dissolved.
Vacuum coating equipment is utilized in one layer of 100nm of surface deposition of two telluride molybdenum of two-dimensional material by template of copper mask again Then thick metal golden film forms two electrode layers by stripping technology.
The above is only presently preferred embodiments of the present invention, and any type of limitation is not done to the present invention.Although The present invention is disclosed above with preferred embodiments, however is not limited to the present invention.Any person skilled in the art, It does not depart from the range of technical solution of the present invention, when making a little change using method and technique content described above or repair The equivalent embodiment for equivalent variations is adornd, as long as being the content without departing from the technology of the present invention incidence of criminal offenses, technology according to the present invention is real Any simple modification, equivalent change and modification that confrontation above example is done, in the range of still falling within technical solution of the present invention.

Claims (5)

1. a kind of hypersensitive strain gauge using two-dimentional phase transformation material preparation, including silicon substrate, it is characterised in that:The silicon Layer of silicon dioxide dielectric layer is deposited on substrate, the thickness of silica dioxide medium layer is in 20-100nm;The silica is situated between A recessed table top is made on matter layer;The two-dimentional phase transformation material of one layer of transfer covering on the concave station face of the silica dioxide medium layer Expect film, the both ends of the two dimension phase change material film respectively grow a metal electrode.
2. the hypersensitive strain gauge according to claim 1 using two-dimentional phase transformation material preparation, it is characterised in that:Institute The recessed depth of the recessed table top on silica dioxide medium layer is stated between 10-20nm.
3. the hypersensitive strain gauge according to claim 1 using two-dimentional phase transformation material preparation, which is characterized in that institute It states and recessed table top is made using chemical corrosion method on silica dioxide medium layer.
4. the method according to claim 1 using two-dimentional phase transformation material preparation hypersensitive strain gauge, feature exists In:The two-dimentional phase-change material of the two-dimentional phase change material film is two telluride molybdenum of individual layer, and thickness is within 1nm.
5. according to any hypersensitive strain gauges using two-dimentional phase transformation material preparation of claim 1-4, feature It is:When touching molecular material on two-dimentional phase change material film surface, the two dimension phase change material film is by molecule material The pressure of material and bend, cause to generate stress inside two-dimentional phase change material film, two-dimentional phase change material film occurs from half Phase transformation of the conductor to metal, the two-dimentional phase transformation material resistance of two-dimentional phase change material film change, and lead to two-dimentional phase-change material The electric current that both ends metal electrode is surveyed changes, so as to calculate the molecular mass adsorbed in environment space.
CN201810053262.2A 2018-01-19 2018-01-19 Utilize the hypersensitive strain gauge of two-dimentional phase transformation material preparation Pending CN108195492A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109282930A (en) * 2018-09-30 2019-01-29 深圳大学 Stress detection device and stress detection matrix system
CN109727846A (en) * 2018-12-19 2019-05-07 北京大学 The method and application of hetero-junctions in the two-dimentional telluride molybdenum face that large area preparation metal phase is in contact with semiconductor
CN109799014A (en) * 2019-03-01 2019-05-24 西安交通大学 A kind of flexible pressure-sensitive sensor and preparation method thereof
CN109855775A (en) * 2019-01-25 2019-06-07 上海电力学院 A kind of preparation method of microstress sensor
WO2020062215A1 (en) * 2018-09-30 2020-04-02 深圳大学 Stress detection device and stress detection matrix system

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101131335A (en) * 2007-09-07 2008-02-27 南京航空航天大学 Two-dimension force transducer with small measuring range
US20140089623A1 (en) * 2012-09-26 2014-03-27 Chang W. Ha Column address decoding
CN104596683A (en) * 2015-02-12 2015-05-06 南京大学 Pressure sensor based on stratified materials and piezoelectric effect measuring system
CN104867876A (en) * 2014-02-24 2015-08-26 清华大学 Preparation method of film transistor array
CN104979464A (en) * 2015-06-11 2015-10-14 上海电力学院 Graphene heterojunction based flexible thermoelectric converter
CN105470303A (en) * 2014-09-30 2016-04-06 台湾积体电路制造股份有限公司 Semiconductor device and channel structure thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101131335A (en) * 2007-09-07 2008-02-27 南京航空航天大学 Two-dimension force transducer with small measuring range
US20140089623A1 (en) * 2012-09-26 2014-03-27 Chang W. Ha Column address decoding
CN104867876A (en) * 2014-02-24 2015-08-26 清华大学 Preparation method of film transistor array
CN105470303A (en) * 2014-09-30 2016-04-06 台湾积体电路制造股份有限公司 Semiconductor device and channel structure thereof
CN104596683A (en) * 2015-02-12 2015-05-06 南京大学 Pressure sensor based on stratified materials and piezoelectric effect measuring system
CN104979464A (en) * 2015-06-11 2015-10-14 上海电力学院 Graphene heterojunction based flexible thermoelectric converter

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
中国国防科技信息中心: "《世界武器装备与军事技术年度发展报告 2015》", 30 September 2016, 国防工业出版社 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109282930A (en) * 2018-09-30 2019-01-29 深圳大学 Stress detection device and stress detection matrix system
WO2020062215A1 (en) * 2018-09-30 2020-04-02 深圳大学 Stress detection device and stress detection matrix system
CN109727846A (en) * 2018-12-19 2019-05-07 北京大学 The method and application of hetero-junctions in the two-dimentional telluride molybdenum face that large area preparation metal phase is in contact with semiconductor
CN109855775A (en) * 2019-01-25 2019-06-07 上海电力学院 A kind of preparation method of microstress sensor
CN109799014A (en) * 2019-03-01 2019-05-24 西安交通大学 A kind of flexible pressure-sensitive sensor and preparation method thereof

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Application publication date: 20180622