CN108181010A - The armouring encapsulating structure and packaging method of a kind of microminiature temperature-sensing element - Google Patents
The armouring encapsulating structure and packaging method of a kind of microminiature temperature-sensing element Download PDFInfo
- Publication number
- CN108181010A CN108181010A CN201711325441.9A CN201711325441A CN108181010A CN 108181010 A CN108181010 A CN 108181010A CN 201711325441 A CN201711325441 A CN 201711325441A CN 108181010 A CN108181010 A CN 108181010A
- Authority
- CN
- China
- Prior art keywords
- temperature
- sensing element
- armouring
- shell
- shrinkable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
- G01K1/12—Protective devices, e.g. casings for preventing damage due to heat overloading
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Thermistors And Varistors (AREA)
Abstract
The present invention relates to a kind of armouring encapsulating structures of microminiature temperature-sensing element, it is made of end cap (1), temperature-sensing element (2), shell (3), conducting wire (4), heat-shrinkable T bush (5) and high-temp glue (6), armouring is carried out to temperature-sensing element (2) by end cap (1) and shell (3), temperature-sensing element (2) is drawn by conducting wire (4), exit is cased with heat-shrinkable T bush (5), the interior filled high-temperature glue (6) of shell (3), and heat-shrinkable T bush (5) is crimped.The invention further relates to a kind of armouring packaging methods of microminiature temperature-sensing element.Invention significantly improves the reliability of temperature-sensing element, and encapsulation operation mode is simple.
Description
Technical field
The present invention relates to a kind of armouring packaged types more particularly to a kind of for improving microminiature temperature-sensing element reliability
Armouring packaging method belongs to temperature sensor applied technical field.
Background technology
The temperature-sensing element of traditional thermal resistance temperature sensor is broadly divided into wire wrap platinum resistance and film platinum resistor two is big
Class.In 0.02mm~0.03mm silk materials, brittle failure is easier to when being collided generally using outer diameter for wire wrap platinum resistance；Film platinum electricity
Resistance element generally by forming film layer on a ceramic substrate by platinum layer attachment, in addition lead is fabricated, when being collided,
Ceramic substrate and lead are fragile.Two class temperature-sensing elements are both needed to, by armouring packaged type, improve its structural reliability.
Armouring temperature-sensing element currently on the market is mainly made of end cap (1), temperature-sensing element (2) and casing (3), lead with
Conducting wire welds, and refills dielectric or adhesive encapsulates to be formed, as shown in Figure 1.Chinese utility model patent CN87203026U
It discloses " novel full Sheathed metal thermal resistance " and Chinese utility model patent CN2055254L discloses " armouring standard platinum resistance
Thermometer " describes a kind of armouring packaged type of multistage filling, and temperature-sensing element lead is welded with conducting wire, at temperature-sensing element end
Fill dielectric (MgO powder etc.), conducting wire other end filling curing agent (J-11 glue etc.).The armouring encapsulation side of multistage filling
Formula, due to ensureing that each packing material fills real, leading to temperature-sensing element, whole longer (glue temperature-sensing element a kind of than embedding is at least
Long 20mm), while in conducting wire stress, lead is even broken with conducting wire weld easy damaged, and reliability is low.Chinese utility model
Patent CN205785572U discloses " a kind of armoured thermal resistance sensor ", describes a kind of temperature-sensing element lead and capillary pressure
It connects, dielectric (MgO powder etc.) is filled between extracapillary and stainless steel tube.This kind of armouring packaged type, weight after encapsulation
It dramatically increases, while temperature-sensing element lead is a weak spot in itself, lead can damage after crimping, in capillary stress, even
The place of connecing can be broken, and reliability is low.Chinese invention patent CN101465478A discloses " crimping structure and compression bonding method ", describes
A kind of wire termination compression bonding method, it is best to reach electrical characteristic and mechanical property since this method crimps completely by end, it should
Class crimping mode often damages conducting wire at crimping, and in conducting wire stress, conducting wire is easy to wear at crimping or even is broken, reliability
It is low.
Therefore currently on the market armouring encapsulation temperature-sensing element generally existing reliability it is low, it is complicated and encapsulation after weight
The problems such as dramatically increasing.
Invention content
The purpose of the present invention is：For reliability of the existing technology it is low, it is complicated and encapsulation after weight significantly increase
The problems such as adding, the present invention are provided a kind of reliability and significantly improve, is simple, ingenious being protected using curing materials self character at necking
Weight only increases the temperature-sensing element armouring packaged type of 1g after card tension intensity, encapsulation.
In view of the above problem of the prior art, according to one side disclosed by the invention, the present invention uses following technology
Scheme：
A kind of armouring encapsulating structure of microminiature temperature-sensing element, by end cap (1), temperature-sensing element (2), shell (3), conducting wire
(4), heat-shrinkable T bush (5) and high-temp glue (6) composition carry out temperature-sensing element (2) armouring, temperature-sensitive member by end cap (1) and shell (3)
Part (2) is drawn by conducting wire (4), and exit is cased with heat-shrinkable T bush (5), the interior filled high-temperature glue (6) of shell (3), to heat-shrinkable T bush
(5) it is crimped.
A kind of armouring packaging method of microminiature temperature-sensing element, includes the following steps：
Step 1：The lead of temperature-sensing element (2) is welded with conducting wire (4), in an end cap pyrocondensation of shell (3) extraction wire (4)
Casing (5) is protected；
Step 2：End cap (1) and shell (3) are welded in the other end of shell (3)；
Step 3：By the interior filled high-temperature glue (6) of shell (3)；
Step 4：Temperature-sensing element (2) is inserted into shell (3), ensures that high-temp glue (6) is overflowed, and wipes the high-temp glue of spilling
(6)；
Step 5：Heat-shrinkable T bush (5) is crimped, size is crimped by control during crimping, ensures conducting wire (4) without abrasion
And insulation is normal；
Step 6：Cure high-temp glue (6) in high-temperature cabinet, complete the armouring encapsulation of microminiature temperature-sensing element.
It is characterized in that, shell (3) length is longer 8mm than temperature-sensing element (2), reduce the weight of armouring encapsulating structure.
Advantageous effect：
1st, since high-temp glue is with crimping deformation curing, stress greatly reduces mainly in high-temp glue with crimping at necking
Lead and stress at conducting wire solder joint, solve the problems such as open circuit, significantly improve reliability at solder joint；2nd, due to uncured in glue
Under the conditions of crimping control size it is larger (relatively disclose patent of invention CN101465478A such completely by crimping ensure electrical characteristic with
Mechanical property is best), heat-shrinkable T bush protection is in addition covered at conductor compression jointing, ensures that conducting wire is not easy to wear.
It is of the invention main using the curing characteristics of high-temp glue, encapsulation sequence and crimping size Control, by high-temp glue and necking
Locate stress, be greatly reduced the damage at solder joint and at crimping, design a kind of armour for improving microminiature temperature-sensing element reliability
Packaged type is filled, invention significantly improves temperature-sensing element reliability, and mode of operation is simple.
Description of the drawings
Fig. 1 is the structure diagram of traditional temperature-sensing element armouring encapsulation；
Fig. 2 is temperature-sensing element armouring encapsulating structure schematic diagram of the present invention.
Specific embodiment
The present invention is described in further detail, but the implementation of the present invention is not limited to this with reference to embodiment.
If Fig. 2 is a kind of armouring encapsulating structure of microminiature temperature-sensing element, armouring encapsulating structure is by end cap (1), temperature-sensitive
Element (2), shell (3), conducting wire (4), heat-shrinkable T bush (5) and high-temp glue (6) composition, by end cap (1) and shell (3) to temperature-sensitive member
Part (2) carries out armouring, and temperature-sensing element (2) is drawn by conducting wire (4), and exit is cased with heat-shrinkable T bush (5), is filled in shell (3)
High-temp glue (6) crimps heat-shrinkable T bush (5).
The specific packaging method of the armouring encapsulating structure of microminiature temperature-sensing element is：
Step 1：The lead of temperature-sensing element (2) is welded with conducting wire (4), in an end cap pyrocondensation of shell (3) extraction wire (4)
Casing (5) is protected；
Step 2：End cap (1) and shell (3) are welded in the other end of shell (3)；
Step 3：By the interior filled high-temperature glue (6) of shell (3)；
Step 4：Temperature-sensing element (2) is inserted into shell (3), ensures that high-temp glue (6) is overflowed, and wipes the high-temp glue of spilling
(6)；
Step 5：Heat-shrinkable T bush (5) is crimped, size is crimped by control during crimping, ensures conducting wire (4) without abrasion
And insulation is normal；
Step 6：Cure high-temp glue (6) in high-temperature cabinet, complete the armouring encapsulation of microminiature temperature-sensing element.
Shell (3) length only need it is longer 8mm than temperature-sensing element (2), so as to reduce the loading of high-temp glue (6), and then
Entirety reduces the weight of armouring encapsulating structure.
The armouring temperature-sensing element of the present invention can other be normal by pull test, high-temperature vibrating experiment and temperature shock test etc.
Verification experimental verification is advised, is satisfied the use demand.The armouring temperature-sensing element performance meets claimed below：Temperature-measuring range：- 60 DEG C~280
℃；Temperature measurement accuracy：±0.8℃；Insulation resistance：100MΩ(500V)；Time constant：0 DEG C of timeconstantτ for changing to 100 DEG C
0.632≤1.5s；Lead-out wire tension intensity：It (is tested not less than 35N by GJB360B prescriptive procedures).
Claims (3)
1. a kind of armouring encapsulating structure of microminiature temperature-sensing element, by end cap (1), temperature-sensing element (2), shell (3), conducting wire (4),
Heat-shrinkable T bush (5) and high-temp glue (6) composition, armouring, temperature-sensing element are carried out by end cap (1) and shell (3) to temperature-sensing element (2)
(2) it is drawn by conducting wire (4), exit is cased with heat-shrinkable T bush (5), the interior filled high-temperature glue (6) of shell (3), and to heat-shrinkable T bush
(5) it is crimped.
2. the armouring packaging method that a kind of armouring encapsulating structure of pair microminiature temperature-sensing element as described in claim 1 carries out,
Include the following steps：
Step 1：The lead of temperature-sensing element (2) is welded with conducting wire (4), in an end cap heat-shrinkable T bush of shell (3) extraction wire (4)
(5) it protects；
Step 2：End cap (1) and shell (3) are welded in the other end of shell (3)；
Step 3：By the interior filled high-temperature glue (6) of shell (3)；
Step 4：Temperature-sensing element (2) is inserted into shell (3), ensures that high-temp glue (6) is overflowed, and wipes the high-temp glue (6) of spilling；
Step 5：Heat-shrinkable T bush (5) is crimped, size is crimped by control during crimping, ensures conducting wire (4) without abrasion and absolutely
Edge is normal；
Step 6：Cure high-temp glue (6) in high-temperature cabinet, complete the armouring encapsulation of microminiature temperature-sensing element.
3. method as claimed in claim 2, which is characterized in that the length of shell (3) is longer 8mm than temperature-sensing element (2), reduces
The weight of armouring encapsulating structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711325441.9A CN108181010A (en) | 2017-12-13 | 2017-12-13 | The armouring encapsulating structure and packaging method of a kind of microminiature temperature-sensing element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711325441.9A CN108181010A (en) | 2017-12-13 | 2017-12-13 | The armouring encapsulating structure and packaging method of a kind of microminiature temperature-sensing element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108181010A true CN108181010A (en) | 2018-06-19 |
Family
ID=62546196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711325441.9A Pending CN108181010A (en) | 2017-12-13 | 2017-12-13 | The armouring encapsulating structure and packaging method of a kind of microminiature temperature-sensing element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108181010A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111537095A (en) * | 2020-05-11 | 2020-08-14 | 曲阜天博汽车零部件制造有限公司 | Temperature sensor and manufacturing process thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2718539Y (en) * | 2004-06-23 | 2005-08-17 | 王继勋 | High-pressure temperature sensor |
| WO2010063682A1 (en) * | 2008-12-02 | 2010-06-10 | Temperaturmesstechnik Geraberg Gmbh | Temperature sensor, in particular for turbochargers |
| CN102840923A (en) * | 2012-09-06 | 2012-12-26 | 沈阳仪表科学研究院 | Temperature measurement probe hole shrinkage encapsulation structure and machining method thereof |
-
2017
- 2017-12-13 CN CN201711325441.9A patent/CN108181010A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2718539Y (en) * | 2004-06-23 | 2005-08-17 | 王继勋 | High-pressure temperature sensor |
| WO2010063682A1 (en) * | 2008-12-02 | 2010-06-10 | Temperaturmesstechnik Geraberg Gmbh | Temperature sensor, in particular for turbochargers |
| CN102840923A (en) * | 2012-09-06 | 2012-12-26 | 沈阳仪表科学研究院 | Temperature measurement probe hole shrinkage encapsulation structure and machining method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111537095A (en) * | 2020-05-11 | 2020-08-14 | 曲阜天博汽车零部件制造有限公司 | Temperature sensor and manufacturing process thereof |
| CN111537095B (en) * | 2020-05-11 | 2022-02-08 | 曲阜天博汽车零部件制造有限公司 | Temperature sensor and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7997795B2 (en) | Temperature sensors and methods of manufacture thereof | |
| CN206670840U (en) | A kind of small-sized silicon piezoresistance type gas pressure sensor structure | |
| EP3115759A1 (en) | Temperature sensor and temperature sensor manufacturing method | |
| CN107806947A (en) | High temperature pressure temperature one compound sensor | |
| CN108181010A (en) | The armouring encapsulating structure and packaging method of a kind of microminiature temperature-sensing element | |
| CN105185482B (en) | A kind of preparation method with the outer cable by structure of waterproof | |
| CN106679835A (en) | Armored thermocouple sensor | |
| EP3842775B1 (en) | Temperature sensor, temperature sensor element, and method for manufacturing temperature sensor | |
| US11293807B2 (en) | Sheathed thermocouple and method for manufacturing sheathed thermocouple | |
| CN106225945B (en) | A kind of waterproof and dampproof temperature sensor and preparation method thereof | |
| CN105606247B (en) | A kind of thermistor and its manufactured temperature sensor of high temperature resistant quick response | |
| CN106644238A (en) | Thin film differential pressure core | |
| CN105424210B (en) | A kind of highly sensitive fluid temperature sensor and preparation method thereof | |
| CN205333208U (en) | A high low temperature connective bar for automobile engine temperature sensor | |
| CN110987218A (en) | High-temperature-resistant and quick-response thin film platinum resistance sensitive element and manufacturing method thereof | |
| CN105651414B (en) | A kind of temperature sensor enhancing tensile strength | |
| CN103968722B (en) | A kind of explosive valve igniter | |
| CN207335907U (en) | A kind of electric oven temperature sensor | |
| CN207197694U (en) | A kind of thrust-type temp probe | |
| CN209559358U (en) | A kind of temperature sensor with high-tensile | |
| CN209513084U (en) | A kind of temperature sensor of the tensile strength with enhancing | |
| CN112798132A (en) | High-water-resistance high-oil-resistance temperature sensor for narrow space and preparation thereof | |
| CN211350243U (en) | Insulation breakdown-resistant thermistor for electric meter | |
| EP3901598A1 (en) | Temperature sensor for rotating electric machine and method of manufacturing the same | |
| CN206627399U (en) | Particulate matter sensors |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180619 |
|
| RJ01 | Rejection of invention patent application after publication |