CN2718539Y - High-pressure temperature sensor - Google Patents
High-pressure temperature sensor Download PDFInfo
- Publication number
- CN2718539Y CN2718539Y CN 200420032229 CN200420032229U CN2718539Y CN 2718539 Y CN2718539 Y CN 2718539Y CN 200420032229 CN200420032229 CN 200420032229 CN 200420032229 U CN200420032229 U CN 200420032229U CN 2718539 Y CN2718539 Y CN 2718539Y
- Authority
- CN
- China
- Prior art keywords
- pressure
- chip
- temperature sensor
- temperature
- jacket tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003292 glue Substances 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000004804 winding Methods 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 230000002633 protecting effect Effects 0.000 abstract 1
- 230000007847 structural defect Effects 0.000 abstract 1
- 238000001514 detection method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000010412 perfusion Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The utility model discloses a high-pressure temperature sensor. In a high-pressure electrical machine or a high-pressure transformer, in order to make the coil winding not damaged by the work high temperature, the high-pressure temperature sensor is arranged in the winding of the high-pressure electrical machine or the high-pressure transformer to detect the work temperature and complete the protecting action of the high temperature in an auxiliary mode. The utility mode aims to overcome the low ability of the high-pressure resistance and the long time of the temperature response caused by the existing high-pressure temperature sensor because of the structural defect. The high-pressure temperature sensor is characterized in that a temperature sensing chip (1) which is electrically connected with a cable core is arranged in a blind hole (20) of a jacket tube of the chip and is sealed and fixed by a heat conductive adhesive. The connection end (30) of the cable and the chip is inserted in the jacket tube opening (21) of the jacket tube of the chip and tightly matched and fixed with the jacket tube opening. The high-pressure temperature sensor has the advantages of fixed and reliable structure, simple integral structure, good high-pressure resistance performance and short time of the temperature response.
Description
Technical field
The utility model relates to the temperature detection of finishing the work in high-voltage motor or the high-tension transformer winding, the auxiliary improvement technology of implementing the temperature detection sensing head part of high temperature protection of being embedded in.
Background technology
For guaranteeing said temperature sensor reliably working in high voltage environment, it is indispensable making it have the structural design of resisting effluve, preventing the discharge breakdown effect, thereby the sensing chip of existing high pressure temperature sensor be arranged at have high thermal conductivity, in the blind hole of high pressure resistant material bushing, and the perfusion heat-conducting glue is fixed, between the high pressure resistant cable sheath of sensing chip stube cable and the chip sleeve pipe with the docking mode fixed engagement, for improving the intensity of bonding station, it is wrapped with high pressure resistant material guards.There is more technology disadvantage in this structure: the connected structure that docks of sleeve pipe and cable sheath, its physical strength is very poor, very easily transportation, install and work in fracture, can reduce its high-voltage resistance capability and functional reliability greatly; In addition, because high voltage performance requires at interface sheath to be set,, just make the sensing head part not have fully, comprehensively to contact with detected winding because this sheath material is thicker, thereby having prolonged the thermoinduction response time, the reliability that temperature detects in real time reduces greatly.
The utility model content
For strengthening the physical strength of junction between sensing chip sleeve pipe and the chip cable; guarantee that it has reliable high voltage performance; shorten the sensing response time; the utility model provides a kind of technical scheme of novel high pressure temperature sensor; the major technique content of the technical program is: this high pressure temperature sensor includes the temperature sensing chip; chip sleeve pipe and sensing chip realize that with the main body holding circuit cable that the loop is electrically connected constitutes; the temperature sensing chip that is electrically connected with cable core is arranged in the blind hole of chip sleeve pipe and is fixing by the heat-conducting glue sealing, is tightly fixed with pipe socket in the pipe socket of the link insertion chip sleeve pipe of cable and chip.
The high pressure temperature sensor technical scheme that the utility model provides, in its structural design, the chip casing pipe sleeve mouth of pipe is extended and parcel, the fixing cable end of sensing chip, this structure constitutes had both saved the sheath setting, formation simplifies the structure, and directly utilize the chip sleeve pipe mouth of pipe to wrap the cut cable of sensing chip, this fixed sturcture has excellent mechanical intensity and high voltage performance, make the line link more firm and reliable, and this structure can make sensing head contact with the comprehensive sensing of detected work winding, thereby overcome long technology disadvantage of existing sensor senses response time, make its temperature detection have good real-time and accuracy.
Description of drawings
Accompanying drawing is that the structure of the utility model high pressure temperature sensor constitutes cut-open view.
Embodiment
As shown in the figure, high pressure temperature sensor of the present utility model is the Temperature probe of temperature protective device, and it mainly realizes burying underground the temperature detection work at position with sensing chip 1.This sensing chip 1 is arranged in the blind hole 20 of chip sleeve pipe 2, the fixing link of sensing chip 1 and chip 1 and cable core 10 of perfusion heat-conducting glue sealing is tightly fixed in the sleeve opening 21 of the chip link 30 insertion chip sleeve pipes 2 of cable 3 and with it in the blind hole 20.
Claims (1)
1, a kind of high pressure temperature sensor; include temperature sensing chip (1), chip sleeve pipe (2) and sensing chip and realize that with the main body holding circuit cable (3) that the loop is electrically connected constitutes; the temperature sensing chip (1) that is electrically connected with cable core is arranged in the blind hole (20) of chip sleeve pipe and is fixing by the heat-conducting glue sealing, it is characterized in that being tightly fixed with pipe socket in the pipe box (21) of link (30) insertion chip sleeve pipe of cable and chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420032229 CN2718539Y (en) | 2004-06-23 | 2004-06-23 | High-pressure temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420032229 CN2718539Y (en) | 2004-06-23 | 2004-06-23 | High-pressure temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2718539Y true CN2718539Y (en) | 2005-08-17 |
Family
ID=34892958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420032229 Expired - Fee Related CN2718539Y (en) | 2004-06-23 | 2004-06-23 | High-pressure temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2718539Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102261960A (en) * | 2011-04-26 | 2011-11-30 | 中国北方车辆研究所 | Temperature sensing device of storage battery and manufacture method thereof |
| CN108181010A (en) * | 2017-12-13 | 2018-06-19 | 苏州长风航空电子有限公司 | The armouring encapsulating structure and packaging method of a kind of microminiature temperature-sensing element |
-
2004
- 2004-06-23 CN CN 200420032229 patent/CN2718539Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102261960A (en) * | 2011-04-26 | 2011-11-30 | 中国北方车辆研究所 | Temperature sensing device of storage battery and manufacture method thereof |
| CN108181010A (en) * | 2017-12-13 | 2018-06-19 | 苏州长风航空电子有限公司 | The armouring encapsulating structure and packaging method of a kind of microminiature temperature-sensing element |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: DANDONG KELIANG ELECTRIC CO., LTD. Free format text: FORMER OWNER: WANG JIXUN Effective date: 20070330 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20070330 Address after: 118009 33 section, Kimcheon Industrial Zone, Frontier Cooperation Zone, Liaoning, Dandong Patentee after: Dandong Keliang Electron Co., Ltd. Address before: 118000 room 41, building 202, E District, Yanjiang Development Zone, Dandong, Liaoning Patentee before: Wang Jixun |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050817 Termination date: 20110623 |