CN102261960A - Temperature sensing device of storage battery and manufacture method thereof - Google Patents
Temperature sensing device of storage battery and manufacture method thereof Download PDFInfo
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- CN102261960A CN102261960A CN2011101044520A CN201110104452A CN102261960A CN 102261960 A CN102261960 A CN 102261960A CN 2011101044520 A CN2011101044520 A CN 2011101044520A CN 201110104452 A CN201110104452 A CN 201110104452A CN 102261960 A CN102261960 A CN 102261960A
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- temperature sensing
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Abstract
The invention relates to a temperature sensing device of a storage battery, which is characterized by comprising a shell (3), a sealing cover (4), a lead (5) and a sensing chip (1); the sensing chip (1) is located at the bottom of the shell (3), the upper end of the sensing chip (1) is provided with a chip pin, and the chip pin and the lead (5) form a welding part (2) of the chip pin and the lead in a welding manner; one part of the lead (5) passes through the temperature sensing device, and the part passing through the temperature sensing device is provided with a shrinkable tube (7); and the shell (3) is internally provided with an encapsulating material (6). The temperature sensing device solves the problem of low accuracy of the current temperature sensing device of the storage battery, and can be widely used in temperature test for acid containing liquid, wherein a temperature test range is from -55 DEG C to +125 DEG C; and in addition, the digital temperature sensing device needs no signal processing circuit, and the output signals can be shared by a plurality of control devices.
Description
Technical field
The present invention relates to the preparation of device and device, specifically, relate to the preparation of temperature sensing device and device.
Background technology
Be subjected to electric energy power in order to improve under the accumulator low temperature, automatically accumulators is heated at low temperatures, realize the automatic control that accumulator is heated, the domestic temperature sensing device that is adapted at working the acid solution of just developing from the eighties in last century, temperature sensing device adopts the bimetallic strip encapsulation, the bimetallic strip principle of work, when temperature drops to the design load of connection, the bimetallic strip closure; When temperature was raised to the design load of disconnection, bimetallic strip disconnected; The degree of accuracy of bimetallic strip depends on the ratio of bimetallic strip different metal material in manufacture process fully.Ageing of metal takes place in the temperature sensing device of bimetallic strip encapsulation easily, problems such as ablations, and the output signal accuracy is low, be prone to short circuit, the phenomenon of opening a way.
Along with the progress of automatic control technology, the accumulator temperature sensing device that adopts the PT100 encapsulation is arranged also.The temperature sensing device cost height of platinum resistance encapsulation, control circuit need if the distance of temperature sensing device and opertaing device is distant, also need to carry out temperature compensation to the signal condition of gathering.Even the precision of temperature sensing device itself is very high, but because intermediate link is more, cumulative errors is also bigger.Need a kind of simple and convenient and temperature sensing device that precision is high to replace present accumulator temperature sensing device.
Summary of the invention
The objective of the invention is to above-mentioned defective at the prior art existence, a kind of accumulator temperature sensing device is provided, solved the low problem of present battery temp temperature sensing device control accuracy, can be widely used in the temperature test of acidic liquid, temperature-measuring range :-55 ℃～+ 125 ℃, the signal processing circuit that simultaneously should the numeral temperature sensing device need not, the signal of output can be shared for a plurality of opertaing devices.
Another object of the present invention is to provide a kind of preparation method of accumulator temperature sensing device.
A kind of accumulator temperature sensing device provided by the invention, its improvements are to comprise housing, capping, lead and sensing chip; Described sensing chip is positioned at the bottom of housing, and is provided with chip pin on the sensing chip, and chip pin constitutes chip pin and wire bonds place by welding and lead; The part of described lead is passed temperature sensing device, and the part of passing temperature sensing device is provided with heat-shrink tube; Be provided with Embedding Material in the described housing.
The provided by the invention first preferred accumulator temperature sensing device, described temperature sensing device bottom is a right cylinder, the top is six prisms.
The provided by the invention second preferred accumulator temperature sensing device, described housing adopt PVC Polyvinylchloride engineering plastics.
The provided by the invention the 3rd preferred accumulator temperature sensing device, described sensing chip is the DS18B20 digital temperature sensor.
The provided by the invention the 4th preferred accumulator temperature sensing device, described Embedding Material comprises epoxy resin, hardening agent, Heat Conduction Material and filling agent.
The provided by the invention the 5th preferred accumulator temperature sensing device, described epoxy resin is epoxy resin 618; Described hardening agent comprises polyamide 6 51 and T31 epoxy curing agent, and the two quality proportioning is 3: 1; Described Heat Conduction Material is the potpourri of epoxy resin and aluminium powder, and wherein the mass percent of aluminium powder is 70-90%; Described filling agent is the higfh-tension ceramics powder.
The provided by the invention the 6th preferred accumulator temperature sensing device, the quality proportioning of epoxy resin and hardening agent is 7: 3 or 3: 2 or 6: 5.
The preparation method of a kind of accumulator temperature sensing device provided by the invention, its improvements are may further comprise the steps:
1) chip pin with sensing chip welds with lead overlap joint back respectively;
2) chip pin and welding portion adopt silica gel to realize insulation processing; Then the digital temperature chip side is stood in housing bottom, then epoxy resin is mixed in proportion with aluminium powder, mix in the back adding temperature sensing device and solidify, after the curing, add epoxy resin and filling agent gradually and carry out embedding;
3) lead is drawn housing, with capping housing is sealed then, lead passes housing parts and wraps up with heat-shrink tube.
The preparation method of the provided by the invention first preferred accumulator temperature sensing device, described epoxy resin is epoxy resin 618, the potpourri of described epoxy resin and filling agent, its two quality proportioning is 7: 3.
The temperature test chip is DS18B20, digital signal output, chip signal output is the precision height not only, and has characteristics such as volume is little, in light weight, reliability height, can solidify rapidly after the embedding, good heat conductivity, housing is the PVC material, good corrosion resistance, can long period of soaking in acid solution, and outside surface is firm, and is durable; The higfh-tension ceramics powder can prevent effectively that the simple ring epoxy resins from shrinking naturally.Silica gel is the 1598E silicone rubber sealant, has anti-lubricating oil, resistant to chemical media, and weather resistance, and insulating property are good.
Description of drawings
Fig. 1 is: the structural representation of a kind of accumulator temperature sensing device provided by the invention.
Among the figure: 1, sensing chip; 2, chip pin and wire bonds place; 3, housing; 4, capping; 5, lead; 6, Embedding Material.
Embodiment
Below by drawings and the specific embodiments a kind of accumulator temperature sensing device provided by the invention and preparation method thereof is done further more detailed description.
The accumulator temperature sensing device of present embodiment comprises housing 3, capping 4, lead 5 and sensing chip 1; Sensing chip 1 is positioned at the bottom of housing 3, and sensing chip 1 upper end is provided with chip pin, and chip pin constitutes chip pin and wire bonds places 2 by welding and lead 5; The part of lead 5 is passed temperature sensing device, and the part of passing temperature sensing device is provided with heat-shrink tube 7; Be provided with Embedding Material 6 in the housing 3.
The temperature sensing device bottom is a right cylinder, and the top is six prisms, and housing 3 adopts PVC Polyvinylchloride engineering plastics.
The quality proportioning of epoxy resin and hardening agent is 7: 3, and epoxy resin is epoxy resin 618; Hardening agent comprises polyamide 6 51 and T31 epoxy curing agent, and the two quality proportioning is 3: 1; Heat Conduction Material is the potpourri of epoxy resin and aluminium powder, and wherein the mass percent of aluminium powder is 70%; Filling agent is the higfh-tension ceramics powder.
The preparation method of accumulator temperature sensing device may further comprise the steps:
1) chip pin with sensing chip 1 welds with lead overlap joint back respectively;
2) chip pin and welding portion adopt silica gel to realize insulation processing; Then that the DS18B20 digital temperature sensor is edge-on in housing 3 bottoms, then epoxy resin is mixed in proportion with aluminium powder, mix in the back adding temperature sensing device and solidify, after the curing, the potpourri that adds epoxy resin and filling agent gradually carries out embedding, epoxy resin is epoxy resin 618, the potpourri of epoxy resin and filling agent, and its two quality proportioning is 7: 3;
3) lead is drawn housing 3, with capping housing is sealed then, lead passes housing parts and wraps up with heat-shrink tube.
Temperature sensing device is fixed in the storage battery filling acid hole, the DS18B20 digital temperature sensor is encapsulated in the housing that adopts the making of PVC Polyvinylchloride engineering plastic materials, and the temperature sensing device bottom is a right cylinder, and the top is six prisms, be convenient to dismounting, six prisms face is drawn lead at the top; Extension line is vertical with this face, line length 500mm, extension line quantity is 3, it is red, black, blue that color is respectively, respective signal be power supply,, signal, the bottom is a right cylinder, there is the standard thread of M24 right cylinder upper end, is used for fixing with accumulator.
Wherein, DS18B20 digital temperature sensing chip, temperature measurement range is-55 ℃～+ 125 ℃, and thermometric resolution can reach 0.0625 ℃, and dut temperature is exported with 16 bit digital quantity mode serials of sign extended; The chip pin of DS18B20 digital temperature sensing chip welds with the lead overlap joint back of 0.5 square millimeter of sectional area respectively, and overlap distance 10mm guarantees welding reliability; Chip pin and welding portion adopt silica gel to realize insulation processing, then the digital temperature chip side are stood in housing bottom, use epoxy resin, hardening agent and Heat Conduction Material embedding then, lead is drawn housing, with capping housing is sealed then, lead passes housing parts and protects with heat-shrink tube; Housing is a PVC Polyvinylchloride engineering plastic materials, and PVC material acid resistance is good, can long period of soaking in acid solution.
The working power of DS18B20 digital temperature sensing chip both can be introduced at far-end, also can adopt the parasite power mode to produce; A plurality of temperature-sensitive chips can be parallel on 3 or 2 lines, and outside conditioning electricity is simple, has reduced the cost of temperature sensing device and controller.
The accumulator temperature sensing device of present embodiment comprises housing 3, capping 4, lead 5 and sensing chip 1; Sensing chip 1 is positioned at the bottom of housing 3, and sensing chip 1 upper end is provided with chip pin, and chip pin constitutes chip pin and wire bonds places 2 by welding and lead 5; The part of lead 5 is passed temperature sensing device, and the part of passing temperature sensing device is provided with heat-shrink tube 7; Be provided with Embedding Material 6 in the housing 3.
The temperature sensing device bottom is a right cylinder, and the top is six prisms, and housing 3 adopts PVC Polyvinylchloride engineering plastics.
The quality proportioning of epoxy resin and hardening agent is 3: 2, and epoxy resin is epoxy resin 618; Hardening agent comprises polyamide 6 51 and T31 epoxy curing agent, and the two quality proportioning is 3: 1; Heat Conduction Material is the potpourri of epoxy resin and aluminium powder, and wherein the mass percent of aluminium powder is 90%; Filling agent is the higfh-tension ceramics powder, adopts micron granularity, and addition is 30% of an epoxy resin 618, can prevent effectively that the simple ring epoxy resins from shrinking naturally.
The preparation method of accumulator temperature sensing device may further comprise the steps:
1) chip pin with sensing chip 1 welds with lead overlap joint back respectively;
2) chip pin and welding portion adopt silica gel to realize insulation processing; Then the digital temperature chip side is stood in housing bottom, then epoxy resin is mixed in proportion with aluminium powder, mix in the back adding temperature sensing device and solidify, after the curing, the potpourri that adds epoxy resin and filling agent gradually carries out embedding;
3) lead is drawn housing, with capping housing is sealed then, lead passes housing parts and wraps up with heat-shrink tube.
Epoxy resin is epoxy resin 618, the potpourri of epoxy resin and filling agent, and its two quality proportioning is 7: 3, wherein, epoxy resin is epoxy resin 618.
Temperature sensing device is fixed in the storage battery filling acid hole, and digital temperature-sensitive Chip Packaging is in the housing of making of PVC.The temperature sensing device bottom is a right cylinder, and the top is six right cylinders, is convenient to dismounting, and six cylindrical faces are drawn lead at the top; Extension line is vertical with this face, line length 500mm, extension line quantity is 3, it is red, black, blue that color is respectively, respective signal be power supply,, signal, the bottom is a right cylinder, there is the standard thread of M24 right cylinder upper end, is used for fixing with accumulator.
DS18B20 digital temperature sensing chip, temperature measurement range are-55 ℃～+ 125 ℃, and thermometric resolution can reach 0.0625 ℃, and dut temperature is exported with 16 bit digital quantity mode serials of sign extended; Chip pin welds with the lead overlap joint back of 0.5 square millimeter of sectional area respectively, and overlap distance 10mm guarantees welding reliability.
Chip pin and welding portion adopt silica gel to realize insulation processing, and silica gel is the 1598E silicone rubber sealant, and this glue has anti-lubricating oil, resistant to chemical media, and weather resistance, and insulating property are good; Then the digital temperature chip side is stood in housing bottom, use epoxy resin, hardening agent and Heat Conduction Material embedding then, lead is drawn housing, with capping housing is sealed then.Lead passes housing parts and protects with heat-shrink tube, and housing is a PVC Polyvinylchloride engineering plastic materials, and PVC Polyvinylchloride engineering plastic materials acid resistance is good, can long period of soaking in acid solution.
In addition, after chip is sealed 1598 silica gel outward, and form a cushion between the epoxy tree, can make original paper increase impact resistance.
The working power of DS18B20 digital temperature sensing chip both can be introduced at far-end, also can adopt the parasite power mode to produce; A plurality of temperature-sensitive chips can be parallel on 3 lines, and outside conditioning electricity is simple, have reduced the cost of temperature sensing device and controller.
The accumulator temperature sensing device of present embodiment comprises housing 3, capping 4, lead 5 and sensing chip 1; Sensing chip 1 is positioned at the bottom of housing 3, and sensing chip 1 upper end is provided with chip pin, and chip pin constitutes chip pin and wire bonds places 2 by welding and lead 5; The part of lead 5 is passed temperature sensing device, and the part of passing temperature sensing device is provided with heat-shrink tube 7; Be provided with Embedding Material 6 in the housing 3.
The temperature sensing device bottom is a right cylinder, and the top is six prisms, and housing 3 adopts PVC Polyvinylchloride engineering plastics.
The quality proportioning of epoxy resin and hardening agent is 6: 5, and epoxy resin is epoxy resin 618; Hardening agent comprises polyamide 6 51 and T31 epoxy curing agent, and the two quality proportioning is 3: 1; Heat Conduction Material is the potpourri of epoxy resin and aluminium powder, and wherein the mass percent of aluminium powder is 80%; Filling agent is the higfh-tension ceramics powder.
The preparation method of accumulator temperature sensing device may further comprise the steps:
1) chip pin with sensing chip 1 welds with lead overlap joint back respectively;
2) chip pin and welding portion adopt silica gel to realize insulation processing; Then the digital temperature chip side is stood in housing bottom, then epoxy resin is mixed in proportion with aluminium powder, mix in the back adding temperature sensing device and solidify, after the curing, the potpourri that adds epoxy resin and filling agent gradually carries out embedding, and wherein, epoxy resin is epoxy resin 618;
3) lead is drawn housing, with capping housing is sealed then, lead passes housing parts and wraps up with heat-shrink tube.
In addition, after chip is sealed 1598 silica gel outward, and form a cushion between the epoxy tree, can make original paper increase impact resistance.
Epoxy resin is epoxy resin 618, the potpourri of epoxy resin and filling agent, and its two quality proportioning is 7: 3.
Temperature sensing device is fixed in the storage battery filling acid hole, and digital temperature-sensitive Chip Packaging is in the housing of making of PVC, and the temperature sensing device bottom is a right cylinder, and the top is six prisms, is convenient to dismounting, and six cylindrical faces are drawn lead at the top; Extension line is vertical with this face, line length 550mm, extension line quantity is 3, it is red, black, blue that color is respectively, respective signal be power supply,, signal, the bottom is a right cylinder, there is the standard thread of M24 right cylinder upper end, is used for fixing with accumulator.
DS18B20 digital temperature sensing chip, temperature measurement range are-55 ℃～+ 125 ℃, and thermometric resolution can reach 0.0625 ℃, and dut temperature is exported with 16 bit digital quantity mode serials of sign extended; Chip pin welds with the lead overlap joint back of 0.6 square millimeter of sectional area respectively, and overlap distance 8mm guarantees welding reliability.Chip pin and welding portion adopt silica gel to realize insulation processing, then the digital temperature chip side are stood in housing bottom, use epoxy resin, hardening agent and Heat Conduction Material embedding then, and lead is drawn housing, with capping housing are sealed then.Lead passes housing parts with heat-shrink tube 7 protection, and housing is the PVC material, and PVC material acid resistance is good, can long period of soaking in acid solution.
The working power of DS18B20 digital temperature sensing chip both can be introduced at far-end, also can adopt the parasite power mode to produce; A plurality of temperature-sensitive chips can be parallel on 2 lines, and outside conditioning electricity is simple, have reduced the cost of temperature sensing device and controller.
Above embodiment is only in order to illustrate that technical scheme of the present invention is not intended to limit; after although those skilled in the art reads the application; with reference to the foregoing description the present invention is carried out various modifications or change; but these modifications or change are all within the claimed scope of right application of the present invention is awaited the reply in application.
Claims (9)
1. an accumulator temperature sensing device is characterized in that comprising housing (3), capping (4), lead (5) and sensing chip (1); Described sensing chip (1) is positioned at the bottom of housing (3), and is provided with chip pin on the sensing chip (1), and chip pin constitutes chip pin and wire bonds place (2) by welding and lead (5); The part of described lead (5) is passed temperature sensing device, and the part of passing temperature sensing device is provided with heat-shrink tube (7); Be provided with Embedding Material (6) in the described housing (3).
2. accumulator temperature sensing device according to claim 1 is characterized in that described temperature sensing device bottom is right cylinder, and the top is six prisms.
3. accumulator temperature sensing device according to claim 1 is characterized in that described housing (3) adopts PVC Polyvinylchloride engineering plastics.
4. accumulator temperature sensing device according to claim 1 is characterized in that described sensing chip (1) is the DS18B20 digital temperature sensor.
5. accumulator temperature sensing device according to claim 1 is characterized in that described Embedding Material comprises epoxy resin, hardening agent, Heat Conduction Material and filling agent.
6. accumulator temperature sensing device according to claim 5 is characterized in that described epoxy resin is epoxy resin 618; Described hardening agent comprises polyamide 6 51 and T31 epoxy curing agent, and the two quality proportioning is 3: 1; Described Heat Conduction Material is the potpourri of epoxy resin and aluminium powder, and wherein the mass percent of aluminium powder is 70-90%; Described filling agent is the higfh-tension ceramics powder.
7. accumulator temperature sensing device according to claim 5, the quality proportioning that it is characterized in that epoxy resin and hardening agent are 7: 3 or 3: 2 or 6: 5.
8. the preparation method of an accumulator temperature sensing device according to claim 1 is characterized in that may further comprise the steps:
1) chip pin with sensing chip welds with lead overlap joint back respectively;
2) chip pin and welding portion adopt silica gel to realize insulation processing; Then the digital temperature chip side is stood in housing bottom, then epoxy resin is mixed in proportion with aluminium powder, mix in the back adding temperature sensing device and solidify, after the curing, the potpourri that adds epoxy resin and filling agent gradually carries out embedding;
3) lead is drawn housing, with capping housing is sealed then, lead passes housing parts and wraps up with heat-shrink tube.
9. the preparation method of accumulator temperature sensing device according to claim 8 is characterized in that described epoxy resin is epoxy resin 618, the potpourri of described epoxy resin and filling agent, and its two quality proportioning is 7: 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110104452.0A CN102261960B (en) | 2011-04-26 | 2011-04-26 | Temperature sensing device of storage battery and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110104452.0A CN102261960B (en) | 2011-04-26 | 2011-04-26 | Temperature sensing device of storage battery and manufacture method thereof |
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| Publication Number | Publication Date |
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| CN102261960A true CN102261960A (en) | 2011-11-30 |
| CN102261960B CN102261960B (en) | 2014-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110104452.0A Expired - Fee Related CN102261960B (en) | 2011-04-26 | 2011-04-26 | Temperature sensing device of storage battery and manufacture method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105181161A (en) * | 2015-08-07 | 2015-12-23 | 航天东方红卫星有限公司 | Line temperature measurement component lead overlapping and installation method |
| CN107219009A (en) * | 2017-08-02 | 2017-09-29 | 武汉优斯特汽车传感器科技有限公司 | A kind of temperature sensor |
| RU2673779C1 (en) * | 2014-12-03 | 2018-11-29 | Грундфос Холдинг А/С | Sensor system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2052123U (en) * | 1989-05-06 | 1990-01-31 | 陈和 | End-face platinum resistance thermometer |
| CN2718539Y (en) * | 2004-06-23 | 2005-08-17 | 王继勋 | High-pressure temperature sensor |
| JP2011027619A (en) * | 2009-07-28 | 2011-02-10 | Toyama Sangyo Kk | Temperature measurement system and temperature measuring method, temperature control system of elution tester using the same, and temperature control method |
-
2011
- 2011-04-26 CN CN201110104452.0A patent/CN102261960B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2052123U (en) * | 1989-05-06 | 1990-01-31 | 陈和 | End-face platinum resistance thermometer |
| CN2718539Y (en) * | 2004-06-23 | 2005-08-17 | 王继勋 | High-pressure temperature sensor |
| JP2011027619A (en) * | 2009-07-28 | 2011-02-10 | Toyama Sangyo Kk | Temperature measurement system and temperature measuring method, temperature control system of elution tester using the same, and temperature control method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2673779C1 (en) * | 2014-12-03 | 2018-11-29 | Грундфос Холдинг А/С | Sensor system |
| US10184812B2 (en) | 2014-12-03 | 2019-01-22 | Grundfos Holding A/S | Sensor assembly |
| CN105181161A (en) * | 2015-08-07 | 2015-12-23 | 航天东方红卫星有限公司 | Line temperature measurement component lead overlapping and installation method |
| CN107219009A (en) * | 2017-08-02 | 2017-09-29 | 武汉优斯特汽车传感器科技有限公司 | A kind of temperature sensor |
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| Publication number | Publication date |
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| CN102261960B (en) | 2014-05-07 |
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Granted publication date: 20140507 Termination date: 20190426 |