CN202101773U - Double layer waterproof packaging structure used in temperature sensor - Google Patents

Double layer waterproof packaging structure used in temperature sensor Download PDF

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Publication number
CN202101773U
CN202101773U CN2011201517074U CN201120151707U CN202101773U CN 202101773 U CN202101773 U CN 202101773U CN 2011201517074 U CN2011201517074 U CN 2011201517074U CN 201120151707 U CN201120151707 U CN 201120151707U CN 202101773 U CN202101773 U CN 202101773U
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CN
China
Prior art keywords
temperature sensor
bus
packaging
layer
encapsulated layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2011201517074U
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Chinese (zh)
Inventor
王万忠
章长松
高世轩
乔坚强
王小清
寇利
孙婉
魏静
杨树彪
孙俊杰
袁良英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHANGHAI INSTITUTE OF GEOLOGICAL ENGINEERING EXPLORATION
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SHANGHAI INSTITUTE OF GEOLOGICAL ENGINEERING EXPLORATION
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Priority to CN2011201517074U priority Critical patent/CN202101773U/en
Application granted granted Critical
Publication of CN202101773U publication Critical patent/CN202101773U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to a waterproof packaging structure of an electronic component, especially relates to a double layer waterproof packaging structure used in a temperature sensor, comprising a bus, a leg wire connected with the bus, a temperature sensing element arranged at the end part of the leg wire and a first packaging layer sealedly packaging the leg wire, the temperature sensing element and the bus and connected with a part of the leg wire. The double layer waterproof packaging structure used in the temperature sensor is characterized in that the outside of the first packaging layer is equipped with a second packaging layer sealedly connected with the first packaging layer, and the bus penetrates the second packaging layer from the two ends extended from the first packaging layer and are extended out. The advantages of the utility model are that a waterproof problem of a digital deep water sensor under a large pressure is solved, the double layer waterproof packaging structure used in the temperature sensor possesses good reliability, and the survival rate of the temperature sensor under a monitoring well is guaranteed.

Description

The double-deck waterproof encapsulation structure that is used for temperature sensor
Technical field
The utility model relates to a kind of waterproof encapsulation structure of electronic devices and components, particularly a kind of double-deck waterproof encapsulation structure that is used for temperature sensor.
Background technology
Temperature sensor is one of senser element the most commonly used in modern industry and the daily life, because the difference of application, also there is very big-difference in the various request for utilizations to temperature sensor in the practical application.A lot of common thermometric occasions; Only need temperature sensor probe directly be placed under the test environment and get final product; And some application scenario is if any the facilities such as ground temperature monitoring system of the chemicals warehouse of high fire protection requirement, high waterproof requirement; Its electrical insulation properties and water resistance to temperature sensor probe all has very high requirement, at this moment must encapsulate temperature sensor comprehensively, it is become meet the version that Environmental security requires.
For the underground temperature field monitoring system; The short circuit problem that leaks appears when some is debugged at the scene after the existing sensors encapsulation; After the long-time running short circuit problem that leaks appears perhaps; Sensor of bus type temperature monitoring system short circuit occurs and may cause the total system can't the normal data collecting work, has lost valuable data.
Summary of the invention
The purpose of the utility model is the weak point according to above-mentioned prior art, and a kind of double-deck waterproof encapsulation structure that is used for temperature sensor is provided, and this temperature sensor encapsulating structure has been realized the water-tight under the deep water hyperbaric environment through two-layer encapsulated layer is set.
The utility model purpose realizes being accomplished by following technical scheme:
A kind of double-deck waterproof encapsulation structure that is used for temperature sensor; First encapsulated layer that comprises the part that bus, the payment to a porter that is connected with said bus, the temperature-sensing element of being located at said payment to a porter end, the said payment to a porter of sealed envelope, temperature-sensing element and bus and payment to a porter are joined; It is characterized in that: said first encapsulated layer outside is provided with second encapsulated layer that joins with its sealing, and said bus is passed through said second encapsulated layer from the extended two ends of said first encapsulated layer and stretched out.
Said second encapsulated layer is the epoxy encapsulation layer.
Said first encapsulated layer is the epoxy encapsulation layer.
The utility model has the advantages that: solve the waterproof problem of digital deep water sensor under big pressure, have good reliability, guaranteed the survival rate of temperature sensor under monitor well.
Description of drawings
Accompanying drawing 1 is the structural representation of the utility model.
Embodiment
Through embodiment the utility model characteristic and other correlated characteristic are done further explain below in conjunction with accompanying drawing, so that technician's of the same trade understanding:
As shown in Figure 1, mark 1-5 is not among the figure: bus 1, payment to a porter 2, temperature-sensing element 3, first encapsulated layer 4, second encapsulated layer 5.
Temperature sensor system is mainly used in the underground temperature field monitoring system in the utility model; At first in monitoring holes, arrange protection tube and water filling during use, use bus to connect some temperature sensors then, require temperature sensor is arranged in the monitoring holes according to each stratum temperature monitoring; Modular converter is arranged in each aperture; Connect each orifice module through the CAN bussing technique, bus links to each other with data acquisition and disposal system, thereby realizes the in real time concentrated on-line monitoring of field data.
Referring to Fig. 1, temperature sensor mainly comprises bus 1, the lead 2 that is connected with said bus 1, the temperature-sensing element 3 of being located at lead 2 ends in the present embodiment.What wherein temperature-sensing element 3 adopted is 1-wire digital temperature sensor (claiming a line device again), and concrete model is DS18B20, and this sensor temperature measurement accuracy and resolution are higher, and the resolution that can realize programming is 0.1625 ℃.And 1-wire digital temperature sensor has the multiple spot networking function, and promptly a plurality of DS18B20 can be connected in parallel on the bus 1, can realize multi-point temperature measurement.Bus 1 has three lines, respectively the pin of corresponding DS18B20: GND (voltage ground), DQ (forms data bus), VDD (supply voltage).2 each pins that are connected to temperature-sensing element 3 respectively from bus 1 of payment to a porter.
For realizing the water-tight of temperature sensor; Temperature sensor also has first encapsulated layer 4 of the part that the said payment to a porter of one deck sealed envelope 2, temperature-sensing element 3 and bus 1 and payment to a porter 2 join; Said first encapsulation 4 outsides are provided with second encapsulated layer 5 that joins with its sealing, and said bus 1 is passed through said second encapsulated layer 5 from said first encapsulated layer 4 extended two ends and stretched out.Wherein, first encapsulated layer 4, second encapsulated layer, 5 materials all adopt epoxy resin, and first encapsulated layer 4 is with the junction waterproof between bus 1, payment to a porter 2 and the temperature-sensing element 3; Second encapsulated layer 5 is to be used for bus 1 waterproof outer,, two-layer encapsulation guarantees the waterproof of sensor and transmission line.
Though below specify, those skilled in the art will realize that under the precondition that does not break away from the claim limited range with reference to the design and the embodiment of accompanying drawing to the utility model purpose; Still can make various improvement and conversion to the utility model; Like the Material Selection mentioned among the embodiment, also can adopt other good heat conductivity and have the material of low conductivity, like the heat-conducting resin material for first encapsulated layer 4, second encapsulated layer 5; The heat conductive silica gel material; Special heat-conductive coating, stupalith etc. are not being given unnecessary details at this.

Claims (3)

1. double-deck waterproof encapsulation structure that is used for temperature sensor; First encapsulated layer that comprises the part that bus, the payment to a porter that is connected with said bus, the temperature-sensing element of being located at said payment to a porter end, the said payment to a porter of sealed envelope, temperature-sensing element and bus and payment to a porter are joined; It is characterized in that: said first encapsulated layer outside is provided with second encapsulated layer that joins with its sealing, and said bus is passed through said second encapsulated layer from the extended two ends of said first encapsulated layer and stretched out.
2. a kind of double-deck waterproof encapsulation structure that is used for temperature sensor according to claim 1, it is characterized in that: said second encapsulated layer is the epoxy encapsulation layer.
3. a kind of double-deck waterproof encapsulation structure that is used for temperature sensor according to claim 1, it is characterized in that: said first encapsulated layer is the epoxy encapsulation layer.
CN2011201517074U 2011-05-13 2011-05-13 Double layer waterproof packaging structure used in temperature sensor Expired - Lifetime CN202101773U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011201517074U CN202101773U (en) 2011-05-13 2011-05-13 Double layer waterproof packaging structure used in temperature sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011201517074U CN202101773U (en) 2011-05-13 2011-05-13 Double layer waterproof packaging structure used in temperature sensor

Publications (1)

Publication Number Publication Date
CN202101773U true CN202101773U (en) 2012-01-04

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011201517074U Expired - Lifetime CN202101773U (en) 2011-05-13 2011-05-13 Double layer waterproof packaging structure used in temperature sensor

Country Status (1)

Country Link
CN (1) CN202101773U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104948922A (en) * 2015-06-30 2015-09-30 徐月苗 Waterproof vehicle electric torch
CN110088587A (en) * 2016-12-20 2019-08-02 株式会社电装 Semiconductor device and its manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104948922A (en) * 2015-06-30 2015-09-30 徐月苗 Waterproof vehicle electric torch
CN110088587A (en) * 2016-12-20 2019-08-02 株式会社电装 Semiconductor device and its manufacturing method
US11127702B2 (en) 2016-12-20 2021-09-21 Denso Corporation Semiconductor device and method for manufacturing same

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Granted publication date: 20120104