CN102261960B - Temperature sensing device of storage battery and manufacture method thereof - Google Patents
Temperature sensing device of storage battery and manufacture method thereof Download PDFInfo
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- CN102261960B CN102261960B CN201110104452.0A CN201110104452A CN102261960B CN 102261960 B CN102261960 B CN 102261960B CN 201110104452 A CN201110104452 A CN 201110104452A CN 102261960 B CN102261960 B CN 102261960B
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- temperature sensing
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Abstract
The invention relates to a temperature sensing device of a storage battery, which is characterized by comprising a shell (3), a sealing cover (4), a lead (5) and a sensing chip (1); the sensing chip (1) is located at the bottom of the shell (3), the upper end of the sensing chip (1) is provided with a chip pin, and the chip pin and the lead (5) form a welding part (2) of the chip pin and the lead in a welding manner; one part of the lead (5) passes through the temperature sensing device, and the part passing through the temperature sensing device is provided with a shrinkable tube (7); and the shell (3) is internally provided with an encapsulating material (6). The temperature sensing device solves the problem of low accuracy of the current temperature sensing device of the storage battery, and can be widely used in temperature test for acid containing liquid, wherein a temperature test range is from -55 DEG C to +125 DEG C; and in addition, the digital temperature sensing device needs no signal processing circuit, and the output signals can be shared by a plurality of control devices.
Description
Technical field
The present invention relates to the preparation of device and device, specifically, relate to the preparation of temperature sensing device and device.
Background technology
In order to improve the power that is subject under accumulator low temperature, automatically accumulators is heated at low temperatures, realize the automatic control that accumulator is heated, the domestic temperature sensing device that is adapted at working acid solution of just developing from the eighties in last century, temperature sensing device adopts bimetallic strip encapsulation, bimetallic strip principle of work, when temperature drops to the design load of connection, bimetallic strip closure; When temperature is raised to the design load of disconnection, bimetallic strip disconnects; The degree of accuracy of bimetallic strip depends on the ratio of bimetallic strip different metal material in manufacture process completely.Easily there is the problems such as ageing of metal, ablation in the temperature sensing device of bimetallic strip encapsulation, output signal accuracy is low, be prone to short circuit, open circuit phenomenon.
Along with the progress of automatic control technology, also there is the accumulator temperature sensing device that adopts PT100 encapsulation.The temperature sensing device cost of platinum resistance encapsulation is high, and control circuit need to, to the signal condition gathering, if the distance of temperature sensing device and opertaing device is distant, also need to carry out temperature compensation.Even if the precision of temperature sensing device itself is very high, but because intermediate link is more, cumulative errors is also larger.Need a kind of temperature sensing device simple and convenient and that precision is high to replace current accumulator temperature sensing device.
Summary of the invention
The object of the invention is in view of the foregoing defects the prior art has, a kind of accumulator temperature sensing device is provided, solved the low problem of current battery temp temperature sensing device control accuracy, can be widely used in the temperature test of acidic liquid, temperature-measuring range :-55 ℃～+ 125 ℃, simultaneously this numeral temperature sensing device without signal processing circuit, the signal of output can for multiple opertaing devices share.
Another object of the present invention is to provide a kind of preparation method of accumulator temperature sensing device.
A kind of accumulator temperature sensing device provided by the invention, its improvements are to comprise housing, capping, wire and sensing chip; Described sensing chip is positioned at the bottom of housing, and sensing chip upper end is provided with chip pin, and chip pin forms chip pin and wire bonds place by welding and wire; A part for described wire is passed temperature sensing device, and is provided with heat-shrink tube through the part of temperature sensing device; In described housing, be provided with Embedding Material.
The provided by the invention first preferred accumulator temperature sensing device, described temperature sensing device bottom is right cylinder, top is six prisms.
The provided by the invention second preferred accumulator temperature sensing device, described housing adopts PVC Polyvinylchloride engineering plastics.
The provided by the invention the 3rd preferred accumulator temperature sensing device, described sensing chip is DS18B20 digital temperature sensor.
The provided by the invention the 4th preferred accumulator temperature sensing device, described Embedding Material comprises epoxy resin, hardening agent, Heat Conduction Material and filling agent.
The provided by the invention the 5th preferred accumulator temperature sensing device, described epoxy resin is epoxy resin 618; Described hardening agent comprises polyamide 6 51 and T31 epoxy curing agent, and the two quality proportioning is 3: 1; Described Heat Conduction Material is the potpourri of epoxy resin and aluminium powder, and wherein the mass percent of aluminium powder is 70-90%; Described filling agent is higfh-tension ceramics powder.
The provided by the invention the 6th preferred accumulator temperature sensing device, the quality proportioning of epoxy resin and hardening agent is 7: 3 or 3: 2 or 6: 5.
The preparation method of a kind of accumulator temperature sensing device provided by the invention, its improvements are to comprise the following steps:
1) chip pin of sensing chip is welded respectively with after wire overlap joint;
2) chip pin and welding portion, adopts silica gel to realize insulation processing; Then digital temperature chip side is stood in to housing bottom, then epoxy resin is mixed in proportion with aluminium powder, after mixing, add in temperature sensing device and solidify, after solidifying, add gradually epoxy resin and filling agent to carry out embedding;
3) wire is drawn to housing, then with capping, housing is sealed, wire passes housing parts heat-shrink tube and wraps up.
The preparation method of the provided by the invention first preferred accumulator temperature sensing device, described epoxy resin is epoxy resin 618, the potpourri of described epoxy resin and filling agent, its two quality proportioning is 7: 3.
Temperature test chip is DS18B20, digital signal output, chip signal output not only precision is high, and has that volume is little, lightweight, reliability high, after embedding, can solidify rapidly, good heat conductivity, housing is PVC material, good corrosion resistance, can long period of soaking in acid solution, and outside surface is firm, durable; Higfh-tension ceramics powder can effectively prevent simple ring epoxy resins natural shrinking.Silica gel is 1598E silicone rubber sealant, has resistance to lubricating oil, resistant to chemical media, and weather resistance, and insulating property are good.
Accompanying drawing explanation
Fig. 1 is: the structural representation of a kind of accumulator temperature sensing device provided by the invention.
In figure: 1, sensing chip; 2, chip pin and wire bonds place; 3, housing; 4, capping; 5, wire; 6, Embedding Material.
Embodiment
By drawings and the specific embodiments, a kind of accumulator temperature sensing device provided by the invention and preparation method thereof is done to further more detailed description below.
Embodiment 1
The accumulator temperature sensing device of the present embodiment, comprises housing 3, capping 4, wire 5 and sensing chip 1; Sensing chip 1 is positioned at the bottom of housing 3, and sensing chip 1 upper end is provided with chip pin, and chip pin forms chip pin and wire bonds place 2 by welding and wire 5; A part for wire 5 is passed temperature sensing device, and is provided with heat-shrink tube 7 through the part of temperature sensing device; In housing 3, be provided with Embedding Material 6.
Temperature sensing device bottom is right cylinder, and top is six prisms, and housing 3 adopts PVC Polyvinylchloride engineering plastics.
Sensing chip 1 is DS18B20 digital temperature sensor, and Embedding Material comprises epoxy resin, hardening agent, Heat Conduction Material and filling agent.
The quality proportioning of epoxy resin and hardening agent is 7: 3, and epoxy resin is epoxy resin 618; Hardening agent comprises polyamide 6 51 and T31 epoxy curing agent, and the two quality proportioning is 3: 1; Heat Conduction Material is the potpourri of epoxy resin and aluminium powder, and wherein the mass percent of aluminium powder is 70%; Filling agent is higfh-tension ceramics powder.
The preparation method of accumulator temperature sensing device, comprises the following steps:
1) chip pin of sensing chip 1 is welded respectively with after wire overlap joint;
2) chip pin and welding portion, adopts silica gel to realize insulation processing; Then by edge-on DS18B20 digital temperature sensor in housing 3 bottoms, then epoxy resin is mixed in proportion with aluminium powder, after mixing, add in temperature sensing device and solidify, after solidifying, add gradually the potpourri of epoxy resin and filling agent to carry out embedding, epoxy resin is epoxy resin 618, the potpourri of epoxy resin and filling agent, and its two quality proportioning is 7: 3;
3) wire is drawn to housing 3, then with capping, housing is sealed, wire passes housing parts heat-shrink tube and wraps up.
Temperature sensing device is fixed in injecting acid into storage battery hole, DS18B20 digital temperature sensor is encapsulated in the housing that adopts the making of PVC Polyvinylchloride engineering plastic materials, and temperature sensing device bottom is right cylinder, and top is six prisms, be convenient to dismounting, at a face of top six prisms, draw wire; Extension line is vertical with this face, line length 500mm, extension line quantity is 3, it is red, black, blue that color is respectively, respective signal be power supply,, signal, bottom is right cylinder, there is the standard thread of M24 right cylinder upper end, fixing for accumulator.
Wherein, DS18B20 digital temperature sensing chip, temperature measurement range is-55 ℃～+ 125 ℃, 0.0625 ℃ of thermometric resolution, 16 bit digital quantity mode serial outputs of sign extended for dut temperature; Welding after the chip pin of DS18B20 digital temperature sensing chip overlaps with the wire of 0.5 square millimeter of sectional area respectively, overlap distance 10mm, guarantees the reliability of welding; Chip pin and welding portion, adopt silica gel to realize insulation processing, then digital temperature chip side stood in to housing bottom, then use epoxy resin, hardening agent and Heat Conduction Material embedding, wire is drawn to housing, then with capping, housing is sealed, wire passes housing parts heat-shrink tube and protects; Housing is PVC Polyvinylchloride engineering plastic materials, and PVC material acid resistance is good, can long period of soaking in acid solution.
The working power of DS18B20 digital temperature sensing chip both can be introduced at far-end, also can adopt parasite power mode to produce; Multiple temperature-sensitive chips can be parallel on 3 or 2 lines, and outside conditioning electricity is simple, have reduced the cost of temperature sensing device and controller.
Embodiment 2
The accumulator temperature sensing device of the present embodiment, comprises housing 3, capping 4, wire 5 and sensing chip 1; Sensing chip 1 is positioned at the bottom of housing 3, and sensing chip 1 upper end is provided with chip pin, and chip pin forms chip pin and wire bonds place 2 by welding and wire 5; A part for wire 5 is passed temperature sensing device, and is provided with heat-shrink tube 7 through the part of temperature sensing device; In housing 3, be provided with Embedding Material 6.
Temperature sensing device bottom is right cylinder, and top is six prisms, and housing 3 adopts PVC Polyvinylchloride engineering plastics.
Sensing chip 1 is DS18B20 digital temperature sensor, and Embedding Material comprises epoxy resin, hardening agent, Heat Conduction Material and filling agent.
The quality proportioning of epoxy resin and hardening agent is 3: 2, and epoxy resin is epoxy resin 618; Hardening agent comprises polyamide 6 51 and T31 epoxy curing agent, and the two quality proportioning is 3: 1; Heat Conduction Material is the potpourri of epoxy resin and aluminium powder, and wherein the mass percent of aluminium powder is 90%; Filling agent is higfh-tension ceramics powder, adopts micron granularity, and addition is 30% of epoxy resin 618, can effectively prevent simple ring epoxy resins natural shrinking.
The preparation method of accumulator temperature sensing device, comprises the following steps:
1) chip pin of sensing chip 1 is welded respectively with after wire overlap joint;
2) chip pin and welding portion, adopts silica gel to realize insulation processing; Then digital temperature chip side is stood in to housing bottom, then epoxy resin is mixed in proportion with aluminium powder, after mixing, add in temperature sensing device and solidify, after solidifying, add gradually the potpourri of epoxy resin and filling agent to carry out embedding;
3) wire is drawn to housing, then with capping, housing is sealed, wire passes housing parts heat-shrink tube and wraps up.
Epoxy resin is epoxy resin 618, the potpourri of epoxy resin and filling agent, and its two quality proportioning is 7: 3, wherein, epoxy resin is epoxy resin 618.
Temperature sensing device is fixed in injecting acid into storage battery hole, and digital temperature-sensitive chip package is in the housing of making of PVC.Temperature sensing device bottom is right cylinder, and top is six right cylinders, is convenient to dismounting, and at top, six cylindrical faces are drawn wire; Extension line is vertical with this face, line length 500mm, extension line quantity is 3, it is red, black, blue that color is respectively, respective signal be power supply,, signal, bottom is right cylinder, there is the standard thread of M24 right cylinder upper end, fixing for accumulator.
DS18B20 digital temperature sensing chip, temperature measurement range is-55 ℃～+ 125 ℃, 0.0625 ℃ of thermometric resolution, 16 bit digital quantity mode serial outputs of sign extended for dut temperature; Welding after chip pin overlaps with the wire of 0.5 square millimeter of sectional area respectively, overlap distance 10mm, guarantees the reliability of welding.
Chip pin and welding portion, adopt silica gel to realize insulation processing, and silica gel is 1598E silicone rubber sealant, and this glue has resistance to lubricating oil, resistant to chemical media, and weather resistance, and insulating property are good; Then digital temperature chip side is stood in to housing bottom, then use epoxy resin, hardening agent and Heat Conduction Material embedding, wire is drawn to housing, then with capping, housing is sealed.Wire passes housing parts heat-shrink tube and protects, and housing is PVC Polyvinylchloride engineering plastic materials, and PVC Polyvinylchloride engineering plastic materials acid resistance is good, can long period of soaking in acid solution.
In addition, after chip outer encapsulating 1598 silica gel, and form a cushion between epoxy tree, can make original paper increase impact resistance.
The working power of DS18B20 digital temperature sensing chip both can be introduced at far-end, also can adopt parasite power mode to produce; Multiple temperature-sensitive chips can be parallel on 3 lines, and outside conditioning electricity is simple, have reduced the cost of temperature sensing device and controller.
Embodiment 3
The accumulator temperature sensing device of the present embodiment, comprises housing 3, capping 4, wire 5 and sensing chip 1; Sensing chip 1 is positioned at the bottom of housing 3, and sensing chip 1 upper end is provided with chip pin, and chip pin forms chip pin and wire bonds place 2 by welding and wire 5; A part for wire 5 is passed temperature sensing device, and is provided with heat-shrink tube 7 through the part of temperature sensing device; In housing 3, be provided with Embedding Material 6.
Temperature sensing device bottom is right cylinder, and top is six prisms, and housing 3 adopts PVC Polyvinylchloride engineering plastics.
Sensing chip 1 is DS18B20 digital temperature sensor, and Embedding Material comprises epoxy resin, hardening agent, Heat Conduction Material and filling agent.
The quality proportioning of epoxy resin and hardening agent is 6: 5, and epoxy resin is epoxy resin 618; Hardening agent comprises polyamide 6 51 and T31 epoxy curing agent, and the two quality proportioning is 3: 1; Heat Conduction Material is the potpourri of epoxy resin and aluminium powder, and wherein the mass percent of aluminium powder is 80%; Filling agent is higfh-tension ceramics powder.
The preparation method of accumulator temperature sensing device, comprises the following steps:
1) chip pin of sensing chip 1 is welded respectively with after wire overlap joint;
2) chip pin and welding portion, adopts silica gel to realize insulation processing; Then digital temperature chip side is stood in to housing bottom, then epoxy resin is mixed in proportion with aluminium powder, after mixing, add in temperature sensing device and solidify, after solidifying, add gradually the potpourri of epoxy resin and filling agent to carry out embedding, wherein, epoxy resin is epoxy resin 618;
3) wire is drawn to housing, then with capping, housing is sealed, wire passes housing parts heat-shrink tube and wraps up.
In addition, after chip outer encapsulating 1598 silica gel, and form a cushion between epoxy tree, can make original paper increase impact resistance.
Epoxy resin is epoxy resin 618, the potpourri of epoxy resin and filling agent, and its two quality proportioning is 7: 3.
Temperature sensing device is fixed in injecting acid into storage battery hole, and digital temperature-sensitive chip package is in the housing of making of PVC, and temperature sensing device bottom is right cylinder, and top is six prisms, is convenient to dismounting, and at top, six cylindrical faces are drawn wire; Extension line is vertical with this face, line length 550mm, extension line quantity is 3, it is red, black, blue that color is respectively, respective signal be power supply,, signal, bottom is right cylinder, there is the standard thread of M24 right cylinder upper end, fixing for accumulator.
DS18B20 digital temperature sensing chip, temperature measurement range is-55 ℃～+ 125 ℃, 0.0625 ℃ of thermometric resolution, 16 bit digital quantity mode serial outputs of sign extended for dut temperature; Welding after chip pin overlaps with the wire of 0.6 square millimeter of sectional area respectively, overlap distance 8mm, guarantees the reliability of welding.Chip pin and welding portion, adopt silica gel to realize insulation processing, then digital temperature chip side stood in to housing bottom, then uses epoxy resin, hardening agent and Heat Conduction Material embedding, and wire is drawn to housing, then with capping, housing sealed.Wire passes housing parts heat-shrink tube 7 and protects, and housing is PVC material, and PVC material acid resistance is good, can long period of soaking in acid solution.
The working power of DS18B20 digital temperature sensing chip both can be introduced at far-end, also can adopt parasite power mode to produce; Multiple temperature-sensitive chips can be parallel on 2 lines, and outside conditioning electricity is simple, have reduced the cost of temperature sensing device and controller.
Above embodiment is only in order to illustrate that technical scheme of the present invention is not intended to limit; although those skilled in the art reads after the application; with reference to above-described embodiment, the present invention is carried out to various modifications or change; but these modifications or change, all within right application requirement protection domain of the present invention is awaited the reply in application.
Claims (5)
1. an accumulator temperature sensing device, is characterized in that comprising housing (3), capping (4), wire (5) and sensing chip (1); Described sensing chip (1) is positioned at the bottom of housing (3), and sensing chip (1) upper end is provided with chip pin, chip pin forms chip pin and wire bonds place (2) by welding and wire (5); A part for described wire (5) is passed temperature sensing device, and is provided with heat-shrink tube (7) through the part of temperature sensing device; In described housing (3), be provided with Embedding Material (6); Described housing (3) adopts PVC Polyvinylchloride engineering plastics; Described sensing chip (1) is DS18B20 digital temperature sensor; Described Embedding Material comprises epoxy resin, hardening agent, Heat Conduction Material and filling agent; Described epoxy resin is epoxy resin 618; Described hardening agent comprises polyamide 6 51 and T31 epoxy curing agent, and the two quality proportioning is 3: 1; Described Heat Conduction Material is the potpourri of epoxy resin and aluminium powder, and wherein the mass percent of aluminium powder is 70-90%; Described filling agent is higfh-tension ceramics powder.
2. accumulator temperature sensing device according to claim 1, is characterized in that described temperature sensing device bottom is right cylinder, and top is six prisms.
3. accumulator temperature sensing device according to claim 1, the quality proportioning that it is characterized in that epoxy resin and hardening agent is 7: 3 or 3: 2 or 6: 5.
4. a preparation method for accumulator temperature sensing device according to claim 1, is characterized in that comprising the following steps:
1) chip pin of sensing chip is welded respectively with after wire overlap joint;
2) chip pin and welding portion, adopts silica gel to realize insulation processing; Then by edge-on described sensing chip at housing bottom, then epoxy resin is mixed in proportion with aluminium powder, after mixing, add in temperature sensing device and to solidify, after solidifying, add gradually the potpourri of epoxy resin and filling agent to carry out embedding;
3) wire is drawn to housing, then with capping, housing is sealed, wire passes housing parts heat-shrink tube and wraps up.
5. the preparation method of accumulator temperature sensing device according to claim 4, is characterized in that described epoxy resin is epoxy resin 618, the potpourri of described epoxy resin and filling agent, and its two quality proportioning is 7: 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110104452.0A CN102261960B (en) | 2011-04-26 | 2011-04-26 | Temperature sensing device of storage battery and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110104452.0A CN102261960B (en) | 2011-04-26 | 2011-04-26 | Temperature sensing device of storage battery and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102261960A CN102261960A (en) | 2011-11-30 |
| CN102261960B true CN102261960B (en) | 2014-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110104452.0A Expired - Fee Related CN102261960B (en) | 2011-04-26 | 2011-04-26 | Temperature sensing device of storage battery and manufacture method thereof |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016087063A1 (en) | 2014-12-03 | 2016-06-09 | Grundfos Holding A/S | Sensor assembly |
| CN105181161A (en) * | 2015-08-07 | 2015-12-23 | 航天东方红卫星有限公司 | Line temperature measurement component lead overlapping and installation method |
| CN107219009A (en) * | 2017-08-02 | 2017-09-29 | 武汉优斯特汽车传感器科技有限公司 | A kind of temperature sensor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2052123U (en) * | 1989-05-06 | 1990-01-31 | 陈和 | End-face platinum resistance thermometer |
| CN2718539Y (en) * | 2004-06-23 | 2005-08-17 | 王继勋 | High-pressure temperature sensor |
| JP2011027619A (en) * | 2009-07-28 | 2011-02-10 | Toyama Sangyo Kk | Temperature measurement system and temperature measuring method, temperature control system of elution tester using the same, and temperature control method |
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- 2011-04-26 CN CN201110104452.0A patent/CN102261960B/en not_active Expired - Fee Related
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Granted publication date: 20140507 Termination date: 20190426 |