CN108174521A - A kind of electronic circuit board manufacture craft for antenna and transmission line - Google Patents
A kind of electronic circuit board manufacture craft for antenna and transmission line Download PDFInfo
- Publication number
- CN108174521A CN108174521A CN201711436854.4A CN201711436854A CN108174521A CN 108174521 A CN108174521 A CN 108174521A CN 201711436854 A CN201711436854 A CN 201711436854A CN 108174521 A CN108174521 A CN 108174521A
- Authority
- CN
- China
- Prior art keywords
- electronic circuit
- circuit board
- region
- antenna
- transmission line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
Abstract
The invention belongs to electronic circuit board manufacture technology fields, disclose a kind of electronic circuit board manufacture craft for antenna and transmission line, it is included in the surface fitting photosensitive material layer of non-conductive substrate, it is exposed and developed, the region for needing to make circuit is completely exposed outside, and bore micropore in the region, sputtering vacuum deposition technology is recycled in photosensitive material layer, circuit makes deposition compact metal layer in region and micropore, metal layer with alkaline solution dissolving removal photosensitive material layer and its above again, increase plated deposition in circuit making region and the thickness of micropore inner metal layer finally by being electroplated or changing depositing process.The electronic circuit flush edge that the present invention obtains, avoid subtractive process impedance uniformity problem caused by circuit lateral erosion, and the metal layer of sputtering vacuum deposition technology deposition and the binding force of non-conductive substrate are better than traditional depositing process, while the environmental problems such as pollutant emission in avoiding plating production.
Description
Technical field
The invention belongs to electronic circuit board manufacture technology fields, are related to a kind of for antenna and the electronic circuit board of transmission line
Manufacture craft specifically accumulates metal layer, then pass through plating using sputtering technology on the surface of non-conductive substrate and inner hole deposition
Or change the making that depositing process completes circuit and via hole simultaneously.
Background technology
At present, electronic circuit board is prepared mainly with subtractive process technique, and subtractive process is the electronic circuit board system more early occurred
It still uses so far for technique and largely and more mature manufacturing process, main technological process is to cover copper
On non-conductive substrate plate brush one layer of liquid photopolymerizable etch-resistant material or fitting one layer of dry film material, then successively through exposure and development,
The processes such as etching and striping, have the copper below the region of dry film covering to be retained, and the copper of no dry film protection is etched,
The making of electronic circuit is just completed at this time.But the shortcomings that main there are two subtractive process techniques：First shortcoming is line layer side
The problem of edge lateral erosion, not only has the process etched downwards in circuit etching process, also exists simultaneously the process to side etching,
This can cause the accurate control of circuit line width/impedance to become very difficult, so that being smaller than the line of 50um in line width and line
Road can not be manufactured by subtractive process technique again；Second shortcoming is a subtractive to method, and there are copper product consumption height, and production procedure is tediously long,
The problems such as high energy consumption, waste liquid discharging amount is big, and environmental protection pressure is big, country increasingly payes attention to environmental protection now, energy saving to subtract
Row is the theme of industrial production and development, and various discharge index requirements are more and more harsh.Electronic circuit high density, the skill to become more meticulous
Art trend and more and more harsh environmental requirement so that adopt new technology and solved in above-mentioned subtractive process technique two significant drawbacks
Through becoming very urgent.
Electronic circuit, which is prepared, using addition method has many technology explorations, but be all not mature enough.Addition process is that do not having
Have and conductive pattern is made with the methods of silk-screen printing, change plating plating on the non-conductive substrate for cover copper；The problem of the method is maximum be
Conducting wire and the binding force of non-conductive substrate are weaker, standard requirement are not achieved, in addition, method for printing screen there is no legal system at present
Standby fine-line and the circuit of high impedance required precision.
Invention content
The present invention provides a kind of electronic circuit board manufacture craft for antenna and transmission line, to solve existing addition process work
The problem of conductive layer and weaker base material binding force are encountered in skill, while solve line side erosion, copper material in subtractive process technique
Consumption greatly and not environmentally the problems such as.
Technical scheme is as follows：
A kind of electronic circuit board manufacture craft for antenna and transmission line includes the following steps：
(1) select non-conductive substrate, and deoiled to its surface and cleaning treatment, after drying, on it and/or under
Surface is bonded photosensitive material layer, and the photosensitive material layer is photoresist；
(2) non-conductive substrate is needed the region for making circuit to be completely exposed outside, so by exposed and developed step successively
Micropore is bored in the region afterwards, and carries out desmearing operation；
(3) deposited metal layer in region and micropore is made in photosensitive material layer, circuit using sputtering vacuum deposition technology, then
Removal photosensitive material layer and the metal layer being deposited on above photosensitive material layer are dissolved, and retain and be deposited on circuit system with alkaline solution
Make the metal layer in region and micropore；
(4) thickness for increasing plated deposition by being electroplated or changing depositing process and making in circuit region and micropore inner metal layer, i.e., it is complete
It is made into electronic circuit board.
Preferably, (1)~(4) that repeat the above steps are further included, the making of multilayer electronic wiring board is completed after laminated.
Preferably, the photosensitive material layer be liquid photosensitive material or dry film material, including Changxing UD-900 series or
Hitachi HY-920, Hitachi RD1200 series, but it is not limited to above-mentioned photosensitive material.
Preferably, the non-conductive substrate be FR4 class stiff board materials, BT classes, ABF class wrapper material for substrate, PI classes,
One kind in PTFE classes and liquid crystal polymer soft board material or inorganic non-metallic material.
Preferably, the step of exposure uses 355nm or 405nm wavelength UV light.
Preferably, the development step uses the Na of 1.0~5.0wt% concentration2CO3Developer solution, development temperature 30~50
℃。
Preferably, in the region holes drilled through and/or drilling blind hole for needing making circuit.
Preferably, the metal layer is one kind in copper, silver, nickel or gold.
Preferably, the alkaline solution is the sodium hydroxide solution of 2.0~10.0wt% concentration, solution temperature for 50~
60 DEG C, the striping time be generally 50~100s.
Compared with prior art, beneficial effects of the present invention are as follows：
A kind of electronic circuit board manufacture craft for antenna and transmission line of the present invention is needing to make electric wire first
The nonconductive matrix plate surface fitting photosensitive material layer on road, photosensitive material layer will need the region for making circuit complete through exposure and development
The external world is exposed to entirely, then using the metal layer of sputtering vacuum deposition technology deposition compact, then removal is dissolved by aqueous slkali and is felt
Optical material layer and the metal layer being deposited on above photosensitive material layer, and retain the metal being deposited in circuit making region and micropore
Layer increases plated deposition in circuit making region and the thickness of micropore inner metal layer, therefore, this hair finally by being electroplated or changing depositing process
It is bright dexterously to be exposed, after development using photosensitive material layer, make the region that make circuit on non-conductive substrate and make micro-
The region in hole is exposed to outer simultaneously, and by follow-up sputtering sedimentation metal, plating or changes plating metal flow, at the same complete circuit and
The making of via hole, substantially reduces technological process；It sinks in addition, this electronic circuit board manufacture craft takes full advantage of vacuum sputtering
The process advantage of product technology, i.e. metallic atom in target is pounded to deposit on base material by high energy ion beam, due to pounding
The momentum of the metallic atom come is larger, and after hitting base material, the metal film of formation is finer and close and electric conductivity is excellent, so, vacuum
The metal layer of sputter-deposition technology deposition and the binding force of non-conductive substrate are better than traditional depositing process.To sum up, it is made using this
The electronic circuit flush edge that standby technique obtains, avoids traditional subtractive process impedance uniformity problem caused by circuit lateral erosion,
The environmental problems such as pollutant emission in the production of avoiding plating simultaneously, available for antenna radiator, data line, radio frequency transmission
The making of the electronic circuit boards such as line.
Description of the drawings
Fig. 1 is the structure diagram that embodiment 1 is bonded photosensitive material layer in non-conductive substrate；
Fig. 2 is that Fig. 1 will need the region for making circuit that structure diagram outside is completely exposed after exposure imaging；
Fig. 3 is Fig. 2 in the structure diagram for making land brill micropore；
Fig. 4 makes deposited metal in region and micropore using sputtering vacuum deposition technology for Fig. 3 in photosensitive material layer, circuit
The structure diagram of layer；
Fig. 5 is Fig. 4 alkaline solutions dissolving removal photosensitive material layer and the metal layer being deposited on above photosensitive material layer
Structure diagram；
Fig. 6 is that Fig. 5 is shown by changing structure of the depositing process increasing plated deposition in circuit making region and micropore inner metal layer thickness
It is intended to.
Specific embodiment
With reference to specific embodiment, the present invention is further explained.It should be understood that these embodiments are merely to illustrate this hair
Bright rather than restriction protection scope of the present invention.Those skilled in the art change according to what the present invention made in practical applications
Into and adjustment, still fall within protection scope of the present invention.
Embodiment 1
Size be 250mm*305mm*50um liquid crystal polymer (LCP) base material through deoil, clean and baking step after, in
Yellow light room is bonded 30 microns thick of dry film material in the upper and lower surface of base material, as shown in Figure 1；Then in the purple of 355nm wavelength
It is 30 DEG C, 1.0wt%Na with temperature after outer light exposure2CO3After developing liquid developing, it will need to make circuit and conducting on base material
The region in hole is exposed, as shown in Figure 2；The through-hole of 150um diameters is bored with power auger in the region again, as shown in figure 3, then
By desmearing process, to clean out the glue residue in hole and dry base material；Hole-drilled base material is put into magnetron sputtered vacuum
Room is evacuated down to 1*10-4More than Pa, target are copper target, and working gas is inert gas Ar gas, and survey penetrates power as 80W, during sputtering
Between for 50s, accumulate the metal copper layer of one layer of 30-40nm thickness in substrate surface and inner hole deposition, as shown in Figure 4；Photosensitive material and thereon
The copper atom of deposition is dissolved removal in the alkaline solution of sodium hydroxide for the 3.0wt% that temperature is 60 DEG C, and retains and be deposited on
Circuit makes the metal layer in region and micropore, as shown in Figure 5；Finally, with changing depositing process by the metal layer of copper in circuit and hole
Thickness increasing is plated to 20-25um, that is, completes the making of double-side electronic wiring board, as shown in Figure 6.
Embodiment 2
Size be 250mm*305mm*25um PI base materials through deoil, clean and baking step after, in yellow light room in base material
Upper and lower surface be bonded 12 microns thick of dry film material；Then after the ultraviolet photoetching of 355nm wavelength, with temperature for 40 DEG C,
5.0wt%Na2CO3Developing liquid developing will need the region for making circuit and via hole exposed on base material；Zai Gai areas
The domain through-hole of UV laser 50um diameters, then passes through desmearing process, to clean out the glue residue in hole and dry base
Material；Hole-drilled base material is put into magnetron sputtering vacuum chamber, is evacuated down to 1*10-4More than Pa, target are copper target, and working gas is
Inert gas Ar gas, survey penetrate power as 80W, sputtering time 40s, thick in substrate surface and one layer of 25-35nm of inner hole deposition product
Metal copper layer；Photosensitive material and the copper atom that deposits thereon are in the alkaline solution of sodium hydroxide for the 8.0wt% that temperature is 50 DEG C
Removal is dissolved, and retains the metal layer being deposited in circuit making region and micropore；Finally, with changing depositing process by circuit and hole
The thickness increasing of interior layers of copper is plated to 15-20um, completes the making of double-side electronic wiring board.
Embodiment 3
Size be 250mm*305mm*60um Panasonic's MEGTRON6 base materials through deoil, clean and baking step after, in Huang
Light room is bonded 30 microns thick of dry film material in the upper and lower surface of base material；Then after the ultraviolet photoetching of 355nm wavelength, with temperature
It spends for 50 DEG C, 3.0wt%Na2CO3Developing liquid developing will need the region for making circuit and via hole exposed on base material；
In region CO2The through-hole of laser 100um diameters, then passes through desmearing process, to clean out the glue residue in hole
And dry base material；Hole-drilled base material is put into magnetron sputtering vacuum chamber, is evacuated down to 1X10-4More than Pa, target are copper target, work
Make gas as inert gas Ar gas, survey penetrates power as 80W, sputtering time 60s, and one layer of 40- is accumulated in substrate surface and inner hole deposition
The metal copper layer of 55nm thickness；Photosensitive material and the copper atom that deposits thereon are in the sodium hydroxide alkali for the 10.0wt% that temperature is 55 DEG C
Property solution in be dissolved removal, and retain and be deposited on circuit and make metal layer in region and micropore；Finally, existed with change depositing process
The thickness increasing of layers of copper in circuit and hole is plated to 20-25um, completes the making of double-side electronic wiring board.
Present invention disclosed above preferred embodiment is only intended to help to illustrate the present invention.There is no detailed for preferred embodiment
All details are described, are not limited the invention to the specific embodiments described.Obviously, according to the content of this specification,
It can make many modifications and variations.This specification is chosen and specifically describes these embodiments, is in order to preferably explain the present invention
Principle and practical application, so as to which skilled artisan be enable to be best understood by and utilize the present invention.The present invention is only
It is limited by claims and its four corner and equivalent.
Claims (9)
1. a kind of electronic circuit board manufacture craft for antenna and transmission line, which is characterized in that include the following steps：
(1) non-conductive substrate is selected, and is deoiled to its surface and cleaning treatment, after drying, on it and/or lower surface
Photosensitive material layer is bonded, the photosensitive material layer is photoresist；
(2) non-conductive substrate is needed the region for making circuit to be completely exposed outside, Ran Hou by exposed and developed step successively
Micropore is bored in the region, and carries out desmearing operation；
(3) deposition compact metal layer in region and micropore is made in photosensitive material layer, circuit using sputtering vacuum deposition technology, then
Removal photosensitive material layer and the metal layer being deposited on above photosensitive material layer are dissolved, and retain and be deposited on circuit system with alkaline solution
Make the metal layer in region and micropore；
(4) increase plated deposition in circuit making region and the thickness of micropore inner metal layer, i.e. completion electricity by being electroplated or changing depositing process
Sub- wiring board makes.
2. the electronic circuit board manufacture craft according to claim 1 for antenna and transmission line, which is characterized in that also wrap
Repetition step (1)~(4) are included, the making of multilayer electronic wiring board is completed after laminated.
3. the electronic circuit board manufacture craft according to claim 1 for antenna and transmission line, which is characterized in that described
Photosensitive material layer for liquid photosensitive material or dry film material, including Changxing UD-900 series or Hitachi HY-920, Hitachi
RD1200 series.
4. the electronic circuit board manufacture craft according to claim 1 for antenna and transmission line, which is characterized in that described
Non-conductive substrate for FR4 class stiff board materials, BT classes, ABF class wrapper material for substrate, PI classes, PTFE classes and liquid crystal polymer
One kind in soft board material or inorganic non-metallic material.
5. the electronic circuit board manufacture craft according to claim 1 for antenna and transmission line, which is characterized in that described
Step of exposure use 355nm or 405nm wavelength UV light.
6. the electronic circuit board manufacture craft according to claim 1 for antenna and transmission line, which is characterized in that described
Development step use 1.0~5.0wt% concentration Na2CO3Developer solution, 30~50 DEG C of development temperature.
7. the electronic circuit board manufacture craft according to claim 1 for antenna and transmission line, which is characterized in that needing
Make the region holes drilled through and/or drilling blind hole of circuit.
8. the electronic circuit board manufacture craft according to claim 1 for antenna and transmission line, which is characterized in that described
Metal layer be one kind in copper, silver, nickel or gold.
9. the electronic circuit board manufacture craft according to claim 1 for antenna and transmission line, which is characterized in that described
Alkaline solution be 2.0~10.0wt% concentration sodium hydroxide solution, solution temperature is 50~60 DEG C, the striping time is generally
50~100s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711436854.4A CN108174521A (en) | 2017-12-26 | 2017-12-26 | A kind of electronic circuit board manufacture craft for antenna and transmission line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711436854.4A CN108174521A (en) | 2017-12-26 | 2017-12-26 | A kind of electronic circuit board manufacture craft for antenna and transmission line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108174521A true CN108174521A (en) | 2018-06-15 |
Family
ID=62521386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711436854.4A Pending CN108174521A (en) | 2017-12-26 | 2017-12-26 | A kind of electronic circuit board manufacture craft for antenna and transmission line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108174521A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1198873A (en) * | 1996-08-09 | 1998-11-11 | 松下电工株式会社 | Method for plating independent conductor circuit |
| CN1335743A (en) * | 2000-07-26 | 2002-02-13 | 赵远涛 | Technological process of making printed circuit board |
| US6820332B2 (en) * | 2001-09-05 | 2004-11-23 | International Business Machines Corporation | Laminate circuit structure and method of fabricating |
-
2017
- 2017-12-26 CN CN201711436854.4A patent/CN108174521A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1198873A (en) * | 1996-08-09 | 1998-11-11 | 松下电工株式会社 | Method for plating independent conductor circuit |
| CN1335743A (en) * | 2000-07-26 | 2002-02-13 | 赵远涛 | Technological process of making printed circuit board |
| US6820332B2 (en) * | 2001-09-05 | 2004-11-23 | International Business Machines Corporation | Laminate circuit structure and method of fabricating |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103079350B (en) | Method for processing patterns in blind slot of printed circuit board | |
| CN104105361B (en) | A kind of method of circuit board selective electroplating conductive hole | |
| KR101183376B1 (en) | Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method | |
| CN109688719A (en) | The production method that thick golden plate is plated in part | |
| CN104349589B (en) | The preparation method of printed circuit board (PCB) and printed circuit board (PCB) and its disk mesopore | |
| CN102364999A (en) | Manufacturing method of mechanical conduction hole circuit board without holes on surface | |
| CN102510671A (en) | Method for producing anti-corrosion pattern in production of printed circuit board | |
| CN103491728A (en) | Method for processing blind holes and fine lines of printed circuit board | |
| KR101203965B1 (en) | Printed circuit board and manufacturing method of the same | |
| CN112020237B (en) | High-power thick copper circuit board anti-welding manufacturing process method | |
| CN111770638A (en) | Manufacturing process of printed circuit board with steps and printed circuit board | |
| CN109413881B (en) | Manufacturing method of carbon oil circuit board and solder-mask windowing | |
| CN113068328A (en) | Processing technology of polytetrafluoroethylene PCB | |
| CN108882558A (en) | The gold plating method and golden finger circuit board of golden finger | |
| KR20040075595A (en) | Method for manufacturing double side a flexible printed circuit board | |
| CN105142353A (en) | Selective electroless gold plating process for printed circuit boards | |
| CN110430697A (en) | A kind of production method of novel multi-layer fine-line plate | |
| CN108174521A (en) | A kind of electronic circuit board manufacture craft for antenna and transmission line | |
| CN104105354A (en) | Method of manufacturing high-aperture ratio fine printed circuit board | |
| CN103582306B (en) | The manufacture method of printed circuit board (PCB) | |
| CN101594750B (en) | Structure and manufacturing method of high-density substrate | |
| KR20040061410A (en) | PCB with the plated through holes filled with copper with copper and the fabricating method thereof | |
| CN111565514A (en) | Production method of 5G power amplifier circuit board | |
| CN102413639A (en) | Manufacturing method of circuit board | |
| CN103298251B (en) | A kind of printed circuit board (PCB) and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180615 |
|
| RJ01 | Rejection of invention patent application after publication |