CN108172691B - A kind of flexible thermal with micro-structure releases the preparation method of electric sensitive thin film - Google Patents
A kind of flexible thermal with micro-structure releases the preparation method of electric sensitive thin film Download PDFInfo
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- CN108172691B CN108172691B CN201711427055.0A CN201711427055A CN108172691B CN 108172691 B CN108172691 B CN 108172691B CN 201711427055 A CN201711427055 A CN 201711427055A CN 108172691 B CN108172691 B CN 108172691B
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- 239000010409 thin film Substances 0.000 title claims abstract description 21
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000010408 film Substances 0.000 claims abstract description 37
- 238000007650 screen-printing Methods 0.000 claims abstract description 33
- 230000005616 pyroelectricity Effects 0.000 claims abstract description 22
- 229920000642 polymer Polymers 0.000 claims abstract description 21
- 238000007766 curtain coating Methods 0.000 claims abstract description 20
- 239000002904 solvent Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 13
- 230000007480 spreading Effects 0.000 claims description 3
- 238000003892 spreading Methods 0.000 claims description 3
- 238000005266 casting Methods 0.000 abstract description 9
- 230000028161 membrane depolarization Effects 0.000 abstract description 4
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 239000012528 membrane Substances 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 31
- 239000003292 glue Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 5
- 239000002033 PVDF binder Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 5
- 239000008236 heating water Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Moulding By Coating Moulds (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses the preparation methods that a kind of flexible thermal with micro-structure releases electric sensitive thin film, first configuration pyroelectricity polymer solution；The solution is cast to for the first time on curtain coating plate again, forms film after solvent volatilization；Then the solution is carried out second on the membrane using silk screen print method to be cast, forms film microstructure after solvent volatilization；Silk-screen printing web plate is finally removed, obtains that there is the flexible thermal of micro-structure to release electric sensitive thin film；Preparation method of the invention is easy to operate, low to environmental requirement, does not need to increase temperature during casting film-forming twice, will not generate depolarization phenomenon.
Description
Technical field
The present invention relates to infrared sensor technology fields, and in particular to it is thin that a kind of flexible thermal with micro-structure releases electrically susceptible sense
The preparation method of film.
Background technique
Electronic component flexibility is a main trend of future electronic technology development, is especially produced to emerging Intelligent hardware
Industry has liberated us to product form using flexible screen, flexible printed circuit board as the flexible electronic component of representative
Imagination has overturned the form and experience mode of existing product.For field of infrared sensors, flexible infrared sensor is also weight
The development trend wanted.Current flexible infrared sensor is mainly based upon the flexible pyroelectric infrared sensor of piezopolymer.
Infra-red radiation is electromagnetic wave of the wavelength between visible light and microwave, and human eye is detectable.Infrared sensor is
The infrared radiation signal of object to be measured is transformed into electric signal output, to realize the detection to target.Based on different detections
Mechanism, the infrared sensor being widely used at present have pyroelectricity, thermistor, thermoelectric pile, height to come battery, photoconduction, photovoltaic etc.
Multiple types.Wherein the pyroelectric infrared sensor based on pyroelectric effect is at low cost, processing circuit is simple, response speed
Fastly, the advantages that detecting light spectrum range is wide is an important component of infrared sensor.
For pyroelectric infrared sensor, in order to enhance the response of sensor, other than preparing absorbed layer, make sensitive material
Expect surface there is micro-structure appropriate (such as groove, mesh) to be also an important channel, because micro-structure boundary can generate
Big temperature change, to help to improve output signal electric current.It is red for the rigid pyroelectricity based on piezoelectric ceramics or crystal
Outer sensor, sensitive material surface micro-structure are usually used the semiconductor microactuators processing technology such as photoetching, etching and are process.
Equally, it is the response for enhancing flexible pyroelectric infrared sensor, makes sensitive material surface that there is appropriate micro-structure to be
One good selection.But above-mentioned micro-processing technology is but not suitable for flexible pyroelectric infrared sensor, because of pressure
Electric polymer is easy to happen depolarization when temperature is higher to substantially reduce its performance, as PVDF is easily moved back if 80 DEG C
Polarization, and micro process minimum temperature is about 110 DEG C of photoresist stoving temperature.Therefore the micro fabrication of aforementioned conventional is uncomfortable
Preparation for flexible pyroelectric infrared sensor sensitive material surface micro-structure.
Summary of the invention
It is an object of the invention to: the preparation method that a kind of flexible thermal with micro-structure releases electric sensitive thin film, solution are provided
Determined it is current micro-structure is prepared on the sensitive material surface of flexible pyroelectric infrared sensor using traditional micro-processing technology, due to
The technical issues of processing temperature height makes sensitive material that depolarization phenomenon occur.
The technical solution adopted by the invention is as follows:
A kind of flexible thermal with micro-structure releases the preparation method of electric sensitive thin film, comprising the following steps:
Step 1: configuration pyroelectricity polymer solution；
Step 2: the solution is cast to for the first time on curtain coating plate, forms film after solvent volatilization；
Step 3: the solution is carried out second on the membrane using silk screen print method and is cast, shape after solvent volatilization
At film microstructure；
Step 4: removing silk-screen printing web plate, obtain that there is the flexible thermal of micro-structure to release electric sensitive thin film.
Further, in the step 1, the mass percent of the pyroelectricity polymer solution is 4wt%-30wt%.
Further, the film microstructure of the film and step 3 of the step 2 with a thickness of 10 μm -100 μm.
Further, in the step 3 silk screen print method particular content step are as follows:
S301: film upper surface is close in silk-screen printing web plate lower surface；
S302: second of the solution is cast in silk-screen printing web plate upper surface；
S303: the solution of second of curtain coating is pressed into silk-screen printing web plate hollowed out area using spreading knife, completes silk
Wire mark brush.
In conclusion by adopting the above-described technical solution, the beneficial effects of the present invention are:
1. preparation method of the invention is easy to operate, low to environmental requirement, do not needed during casting film-forming twice
It increases temperature, depolarization phenomenon will not be generated.
2. can according to need design web plate and mold, adjust polymer solution concentration, with prepare different micro-structure and
Control thickness.
3. being cast twice in the present invention, solution and solute used are identical, and it is unlimited in interface to be formed by film for curtain coating twice
It dissolves each other, finally obtains really integrated, release electric sensitive thin film with the flexible thermal of micro-structure.Due in sensitive thin film micro-structure
There are temperature gradients for boundary, increase film internal heat flows component, improve rate of temperature change, finally improve device heat and release
Electroresponse signal.
Detailed description of the invention
Examples of the present invention will be described by way of reference to the accompanying drawings, in which:
Fig. 1 is first time casting film-forming schematic diagram of the invention；
Fig. 2 is silk-screen printing web plate (channel patterns) apparatus structure schematic diagram of the present invention；
Fig. 3 is that the finally obtained flexible thermal with groove microstructure of the present invention releases electric sensitive thin film schematic diagram；
Silk-screen printing web plate (mesh pattern) apparatus structure schematic diagram needed for Fig. 4 present invention；
Fig. 5 is that the finally obtained flexible thermal with rectangle hole micro-structure of the present invention releases electric sensitive thin film schematic diagram；
Marked in the figure: 1- is cast plate, 2- heated at constant temperature platform, 3- film, 4- silk-screen printing web plate (channel patterns), 6- silk screen
Printing screen (mesh pattern), 7- film microstructure (groove structure), 8- film microstructure (rectangle hole structure).
Specific embodiment
All features disclosed in this specification or disclosed all methods or in the process the step of, in addition to mutually exclusive
Feature and/or step other than, can combine in any way.
It elaborates with reference to the accompanying drawing to the present invention.
A kind of flexible thermal with micro-structure releases the preparation method of electric sensitive thin film, comprising the following steps:
Step 1: configuration pyroelectricity polymer solution；
Step 2: the solution is cast to for the first time on curtain coating plate 1, forms film 3 after solvent volatilization；
Step 3: the solution being carried out second on the film 3 using silk screen print method and is cast, after solvent volatilization
Form film microstructure 7；
Step 4: removing silk-screen printing web plate 4, obtain that there is the flexible thermal of micro-structure to release electric sensitive thin film.
In the step 1, the mass percent of the pyroelectricity polymer solution is 4wt%-30wt%.
The film microstructure 7 of the film 3 and step 3 of the step 2 with a thickness of 10 μm -100 μm.
The particular content step of silk screen print method in the step 3 are as follows: film 3 is close in 4 lower surface of silk-screen printing web plate
Upper surface；Second of the solution is cast in 4 upper surface of silk-screen printing web plate；Second is cast using spreading knife
Solution is pressed into 4 hollowed out area of silk-screen printing web plate, completes silk-screen printing.
Specific embodiment 1
Step 1: configuration pyroelectricity polymer solution
Pyroelectricity polymer powder or particle are dissolved in solvent, heating water bath stirs 2 hours to 12 hours, obtains concentration
Percentage is the pyroelectricity polymer solution of 4wt%-30wt%.
Step 2: device prepares
Device is made of curtain coating plate 1, heated at constant temperature platform 2, silk-screen printing web plate 4, glue scraper, wherein curtain coating plate 1, screen printing
Brush web plate 4, glue scraper need to be ultrasonically treated 15min in waters in the acetone and alcohol mixed solution of 1: 1 proportion, to guarantee that its is clean
Only.
Step 3: preparing, there is the flexible thermal of micro-structure to release electric sensitive thin film 3
Selection pyroelectricity polymer material type and solvent type as needed configure pyroelectricity polymer as needed
The concentration of solution, 1 center of Xiang Liuyan plate are cast pyroelectricity polymer solution, and curtain coating plate 1 is placed on heated at constant temperature platform 2
On, it adjusts temperature control dry out solvent between 50 DEG C to 60 DEG C and completes first time casting film-forming, obtain film 3；
The film 3 is close in the lower surface of silk-screen printing web plate 4, described in the upper surface use of silk-screen printing web plate 4
Pyroelectricity polymer solution carries out second and is cast, and the solution of second of curtain coating is pressed into silk-screen printing web plate 4 using glue scraper
Hollowed out area, by the control of 2 temperature of heated at constant temperature platform, dry out solvent completes second of casting film-forming between 50 DEG C to 60 DEG C, obtains
Film microstructure 7；
Curtain coating plate 1, glue scraper are removed, preparation process is completed, obtaining, there is the flexible thermal of micro-structure to release electric sensitive thin film.
Specific embodiment 2
Step 1: PVDF (Kynoar) powder is dissolved in 2- methyl pyrrolidone by configuration pyroelectricity polymer solution
(NMP) in solvent, the mass ratio of solute and solvent is 20: 80,70 DEG C of heating water baths and magnetic agitation 12 hours, dissolves PVDF
Uniformly.
Step 2: placing one block of curtain coating plate 1, by pyroelectricity polymer solution curtain coating on curtain coating plate 1, be placed in 60 DEG C of perseverance
On warm warm table 2, regulating thermostatic warm table 2 to level makes solvent volatilize, and completes first time casting film-forming, obtains with a thickness of 10 μ
The film 3 (as shown in Figure 1) of m.
Step 3: silk-screen printing web plate 4 (channel patterns, groove width are 300 μm with groove interval) lower surface is close to
Pyroelectricity polymer solution 1 is cast in 4 upper surface of silk-screen printing web plate, uses glue scraper by film 3 (as shown in Figure 2)
The solution of second of curtain coating is pressed into 4 hollowed out area of silk-screen printing web plate, obtains film microstructure 7, completes silk-screen printing；
Heated at constant temperature platform 2 is controlled at 60 DEG C, solvent is made sufficiently to volatilize, film microstructure 7 obtained by second of casting film-forming
With a thickness of 10 μm, removing finally to obtain after silk-screen printing web plate 4, there is the flexible thermal of groove microstructure to release electric sensitive thin film (such as
Shown in Fig. 3).
Embodiment 3
Step 1: PVDF (Kynoar) powder is dissolved in dimethylformamide by configuration pyroelectricity polymer solution
(DMF) in solvent, the mass ratio of solute and solvent is 20:80,70 DEG C of heating water baths simultaneously magnetic agitation 12 hours, dissolves PVDF
Uniformly.
Step 2: placing one block of curtain coating plate 1, by pyroelectricity polymer solution curtain coating on curtain coating plate 1, be placed in 60 DEG C of perseverance
On warm warm table 2, regulating thermostatic warm table 2 to level makes solvent volatilize, and completes first time casting film-forming, obtains with a thickness of 10 μ
The film 3 (as shown in Figure 1) of m.
Step 3: silk-screen printing web plate 6 (mesh pattern, quadratic mesh width, interval are 300 μm) lower surface is close to
Pyroelectricity polymer solution is cast by film 3 (as shown in Figure 4) in 6 upper surface of silk-screen printing web plate, will using glue scraper
The solution of second of curtain coating is pressed into web plate hollowed out area, obtains film microstructure 8, completes silk-screen printing；
Heated at constant temperature platform 2 is controlled at 60 DEG C, solvent is made sufficiently to volatilize, film microstructure 8 obtained by second of casting film-forming
With a thickness of 10 μm, removing finally to obtain after silk-screen printing web plate 6, there is the flexible thermal of mesh micro-structure to release electric sensitive thin film (such as
Shown in Fig. 5).
Claims (4)
1. the preparation method that a kind of flexible thermal with micro-structure releases electric sensitive thin film, it is characterised in that: the following steps are included:
Step 1: configuration pyroelectricity polymer solution；
Step 2: the solution being cast in curtain coating plate (1) for the first time, forms film (3) after solvent volatilization；
Step 3: the solution is carried out second on the film (3) using silk screen print method and is cast, shape after solvent volatilization
At film microstructure (7)；
Step 4: removing silk-screen printing web plate (4) used in silk screen print method, obtain there is the flexible thermal of micro-structure to release electrically susceptible
Feel film.
2. a kind of flexible thermal with micro-structure according to claim 1 releases the preparation method of electric sensitive thin film, feature
Be: in the step 1, the percentage of the pyroelectricity polymer solution is 4wt%-30wt%.
3. a kind of flexible thermal with micro-structure according to claim 1 releases the preparation method of electric sensitive thin film, feature
Be: the film microstructure (7) of the film (3) and step 3 of the step 2 with a thickness of 10 μm -100 μm.
4. a kind of flexible thermal with micro-structure according to claim 1 releases the preparation method of electric sensitive thin film, feature
It is: the particular content step of silk screen print method in the step 3 are as follows:
S301: film (3) upper surface is close in silk-screen printing web plate (4) lower surface；
S302: second of the solution is cast in silk-screen printing web plate (4) upper surface；
S303: the solution of second of curtain coating is pressed into silk-screen printing web plate (4) hollowed out area using spreading knife, completes silk screen
Printing.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711427055.0A CN108172691B (en) | 2017-12-25 | 2017-12-25 | A kind of flexible thermal with micro-structure releases the preparation method of electric sensitive thin film |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711427055.0A CN108172691B (en) | 2017-12-25 | 2017-12-25 | A kind of flexible thermal with micro-structure releases the preparation method of electric sensitive thin film |
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| CN108172691A CN108172691A (en) | 2018-06-15 |
| CN108172691B true CN108172691B (en) | 2019-09-03 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1889235A (en) * | 2006-07-31 | 2007-01-03 | 西安工业大学 | Method for producing amorphous silicon thermal imaging detector micro-structure with self-supporting |
| CN101273474A (en) * | 2005-09-22 | 2008-09-24 | 宇部兴产株式会社 | Thermo-electric converting material and process for producing the same |
| CN101691202A (en) * | 2009-08-11 | 2010-04-07 | 西安交通大学 | Method for preparing polyvinylidene fluoride piezo film with microstructure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5218961B2 (en) * | 2008-03-25 | 2013-06-26 | 独立行政法人物質・材料研究機構 | Artificial opal film generator |
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2017
- 2017-12-25 CN CN201711427055.0A patent/CN108172691B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101273474A (en) * | 2005-09-22 | 2008-09-24 | 宇部兴产株式会社 | Thermo-electric converting material and process for producing the same |
| CN1889235A (en) * | 2006-07-31 | 2007-01-03 | 西安工业大学 | Method for producing amorphous silicon thermal imaging detector micro-structure with self-supporting |
| CN101691202A (en) * | 2009-08-11 | 2010-04-07 | 西安交通大学 | Method for preparing polyvinylidene fluoride piezo film with microstructure |
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