JPH03196206A - Heat treatment equipment - Google Patents

Heat treatment equipment

Info

Publication number
JPH03196206A
JPH03196206A JP33577489A JP33577489A JPH03196206A JP H03196206 A JPH03196206 A JP H03196206A JP 33577489 A JP33577489 A JP 33577489A JP 33577489 A JP33577489 A JP 33577489A JP H03196206 A JPH03196206 A JP H03196206A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
temperature
sensor
heat flux
wafer
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP33577489A
Other versions
JP2759116B2 (en )
Inventor
Kimiharu Matsumura
Hidekazu Shirakawa
Original Assignee
Tokyo Electron Ltd
Tokyo Erekutoron Kyushu Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To quickly heighten or lower the temperature by detecting the heat flux given from a heating means piercing through a substance to be treated via a heat flow sensor and estimating and controlling the temperature based on the heat flux.
CONSTITUTION: A temperature sensor 6 is provided at a point near the placing surface of a heating plate 1 for a wafer 3, and the output of the sensor 6 is supplied to a temperature control circuit 10 via a thermometer 7. At the same time, a heat flow sensor 8 is provided at a point near the surface of the wafer 3. The output of the sensor 8 is supplied to a heat flow meter 9 for acquisition of a heat flux. This heat flux is supplied to the circuit 10 and the temperature change of the wafer 3 is estimated from the heat flux. The circuit 10 refers to the temperature measurement information given from the sensor 6 only in a temperature setting period and controls a heating resistor 2. Furthermore the circuit 10 obtains an error between a reference temperature and the temperature of the wafer 3 estimated from the heat flux detected by the meter 9 and corrects the error. Thus it is possible to accurately control both temperature rising and dropping periods with high response.
COPYRIGHT: (C)1991,JPO&Japio
JP33577489A 1989-12-25 1989-12-25 Heat treatment method and heat treatment equipment Expired - Fee Related JP2759116B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33577489A JP2759116B2 (en) 1989-12-25 1989-12-25 Heat treatment method and heat treatment equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33577489A JP2759116B2 (en) 1989-12-25 1989-12-25 Heat treatment method and heat treatment equipment

Publications (2)

Publication Number Publication Date
JPH03196206A true true JPH03196206A (en) 1991-08-27
JP2759116B2 JP2759116B2 (en) 1998-05-28

Family

ID=18292302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33577489A Expired - Fee Related JP2759116B2 (en) 1989-12-25 1989-12-25 Heat treatment method and heat treatment equipment

Country Status (1)

Country Link
JP (1) JP2759116B2 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002170775A (en) * 2000-12-01 2002-06-14 Tokyo Electron Ltd Method and device for measuring temperature for semiconductor treating device and method and device for treating semiconductor
JP2004335621A (en) * 2003-05-02 2004-11-25 Tokyo Electron Ltd Heat treatment apparatus, temperature control method thereof and heat treatment system
US6886978B2 (en) * 2001-06-18 2005-05-03 Omron Corporation Electronic clinical thermometer
JP2008040530A (en) * 2006-08-01 2008-02-21 Omron Corp Control device and temperature controller
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
JP2008180491A (en) * 2006-12-27 2008-08-07 Kyoto Electron Mfg Co Ltd Incinerator
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
JP2009212199A (en) * 2008-03-03 2009-09-17 Canon Anelva Corp Substrate surface temperature measurement method, and substrate processing apparatus
JP2011145240A (en) * 2010-01-18 2011-07-28 Sumitomo Electric Ind Ltd Temperature measuring element mounting structure in semiconductor manufacturing device
JP2014149158A (en) * 2013-01-31 2014-08-21 Mitsubishi Electric Corp Device and method for controlling heating of test piece to be heated
US9429638B2 (en) 2008-11-21 2016-08-30 Cascade Microtech, Inc. Method of replacing an existing contact of a wafer probing assembly

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4563728B2 (en) * 2004-05-24 2010-10-13 株式会社小松製作所 Heat flux measurement board
US9134186B2 (en) 2011-02-03 2015-09-15 Kla-Tencor Corporation Process condition measuring device (PCMD) and method for measuring process conditions in a workpiece processing tool configured to process production workpieces

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01281042A (en) * 1988-05-02 1989-11-13 Meiji Seika Kaisha Ltd Method for controlling roasting of food

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01281042A (en) * 1988-05-02 1989-11-13 Meiji Seika Kaisha Ltd Method for controlling roasting of food

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4499274B2 (en) * 2000-12-01 2010-07-07 東京エレクトロン株式会社 Temperature measurement method and a semiconductor processing method in a semiconductor processing device
US6579731B2 (en) * 2000-12-01 2003-06-17 Tokyo Electron Limited Temperature measuring method and apparatus in semiconductor processing apparatus, and semiconductor processing method and apparatus
JP2002170775A (en) * 2000-12-01 2002-06-14 Tokyo Electron Ltd Method and device for measuring temperature for semiconductor treating device and method and device for treating semiconductor
US6886978B2 (en) * 2001-06-18 2005-05-03 Omron Corporation Electronic clinical thermometer
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
US7492175B2 (en) 2001-08-21 2009-02-17 Cascade Microtech, Inc. Membrane probing system
JP2004335621A (en) * 2003-05-02 2004-11-25 Tokyo Electron Ltd Heat treatment apparatus, temperature control method thereof and heat treatment system
US7876115B2 (en) 2003-05-23 2011-01-25 Cascade Microtech, Inc. Chuck for holding a device under test
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
JP2008040530A (en) * 2006-08-01 2008-02-21 Omron Corp Control device and temperature controller
JP4715669B2 (en) * 2006-08-01 2011-07-06 オムロン株式会社 air conditioner
JP2008180491A (en) * 2006-12-27 2008-08-07 Kyoto Electron Mfg Co Ltd Incinerator
JP2009212199A (en) * 2008-03-03 2009-09-17 Canon Anelva Corp Substrate surface temperature measurement method, and substrate processing apparatus
JP4515509B2 (en) * 2008-03-03 2010-08-04 キヤノンアネルバ株式会社 Substrate surface temperature measuring method, and a substrate processing apparatus using the same
US9429638B2 (en) 2008-11-21 2016-08-30 Cascade Microtech, Inc. Method of replacing an existing contact of a wafer probing assembly
JP2011145240A (en) * 2010-01-18 2011-07-28 Sumitomo Electric Ind Ltd Temperature measuring element mounting structure in semiconductor manufacturing device
JP2014149158A (en) * 2013-01-31 2014-08-21 Mitsubishi Electric Corp Device and method for controlling heating of test piece to be heated

Also Published As

Publication number Publication date Type
JP2759116B2 (en) 1998-05-28 grant

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees