KR20230011462A - Method of manufacturing Printed circuit nano-fiber web, Printed circuit nano-fiber web thereby and electronic device comprising the same - Google Patents

Abstract

Provided is a method for manufacturing a printed circuit nano-fiber web. According to an embodiment of the present invention, the method for manufacturing a printed circuit nano-fiber web comprises the steps of: (1) manufacturing a nano-fiber web by electrospinning a spinning solution containing fiber-forming components; and (2) printing a circuit pattern layer on the nano-fiber web by using a printed electronic technique. Therefore, the method can implement the printed circuit nano-fiber web which is printed with a circuit pattern and is flexible and resilient to suit future smart devices. In addition, the method can use a printed electronic process, thereby reducing the cost of manufacturing conductive materials, can minimize waste of conductive materials, thereby being economical and environmentally friendly, and can satisfy waterproof and breathable properties through the nano-fiber web with a plurality of pores, thereby being applied in a variety of future industrial fields.

Description

Method of manufacturing printed circuit nanofiber web, printed circuit nanofiber web manufactured through the same, and electronic device using the same

The present invention relates to a printed circuit nanofiber web, and more particularly, to a method for manufacturing a flexible, resilient, waterproof and breathable printed circuit nanofiber web, a printed circuit nanoweb manufactured thereby, and an electronic device using the same. .

In general, a printed circuit board (PCB) is a basic part of electrical and electronic products in various fields, and its utilization ranges from household appliances to semiconductor modules, inspection devices, automobiles, defense industries, and satellites. is gradually expanding.

In recent years, as expectations and demands for flexible electronics have increased, it is possible to print circuit patterns on flexible substrates in the form of films that cannot be mass-produced through processes using conventional photo-lithography. At the same time, the printed electronic technique, which is inexpensive and can greatly shorten the process time, is attracting attention.

The printed electronics technique is also referred to as a direct printing technique, and is a process of printing only a desired circuit pattern portion with conductive electronic ink on a substrate or film. The conventional photolithography method is uneconomical because there is a relatively high amount of wasted conductive material because copper or aluminum is plated on the entire substrate to form a circuit pattern, and then only necessary parts are removed using a mask, etc. By using, there is almost no waste of material, so the manufacturing cost can be greatly reduced. In addition, the conventional photolithography method requires at least 5 steps or more, but using a printed electronics technique can print a circuit pattern in at least 2 steps, which can greatly contribute to process simplification. Furthermore, the printed electronics technique has advantages in that a circuit pattern can be formed on a thin and small object, the accuracy of circuit pattern formation is improved, and an environmentally friendly manufacturing process is possible.

In this respect, the printed electronics technique is the most popular technology as an Internet of Things technology that allows all objects to have communication functions, and it is a technology that is most popular as a technology that enables all objects to have communication functions. Frequency Identification), solar cells, and many other applications.

*6 Meanwhile, future smart devices to be developed and utilized in the future are expected to be structurally and conceptually different from existing devices. It is being developed by embedding electronic components together. In the midst of these changes, the development of wearable printed circuit boards by users can promote the development of future devices such as smart clothes, so research on printed circuit boards implemented in a form that can be worn on the human body due to improved flexibility and technology development are essential.

Korean Patent Registration No. 10-1139970 (Patent Document 1) includes a first step of forming a circuit pattern on a seed layer formed on a flexible insulating substrate; a second step of applying a first photosensitive material on the circuit pattern; a third step of exposing and developing the first photosensitive material to form a protective pattern on the circuit pattern; a fourth step of etching the seed layer; and a fifth step of peeling the protective pattern, wherein the first photosensitive material is a liquid or film-type photosensitive material.

Using the manufacturing method of Patent Document 1, it is possible to implement a flexible printed circuit board, but since the base member is a flexible insulating substrate such as a polyimide film, it does not have sufficient flexibility, and does not unfold again after being folded or crumpled. Restoration characteristics cannot be expected, and there is a disadvantage that it cannot be applied to smart devices requiring wearable devices because it does not have air permeability.

Therefore, there is an urgent need to develop a technology for a printed circuit board that has flexibility, resilience, and air permeability and is manufactured in a wearable form and can be applied to flexible electronic devices or future wearable smart devices.

Registered Patent Publication No. 10-1139970

The present invention has been made in view of the above points, and an object of the invention is to provide a method for manufacturing a printed circuit board having flexibility and resilience by printing a circuit pattern on a nanofiber web and a smart device using the same.

In addition, the present invention improves the formation accuracy of circuit patterns using a printed electronics process, at the same time lowers the manufacturing cost of conductive materials and minimizes the waste of conductive materials, thereby manufacturing an economical and environmentally friendly printed circuit board manufacturing method and smart device using the same There is another object of the invention to provide.

In addition, the present invention applies a nanofiber web having a plurality of pores formed by accumulating nano-sized fibers as a base substrate for a printed circuit board, thereby satisfying the flexibility, resilience and air permeability required for wearable smart clothing. Another object of the invention is to provide a manufacturing method and a smart device using the same.

In order to solve the above problems, the present invention provides (1) the steps of preparing a nanofiber web by electrospinning a spinning solution containing a fiber forming component, and (2) a printed electronic technique on the nanofiber web. It provides a method for manufacturing a printed circuit nanofiber web comprising the step of printing a circuit pattern layer through.

According to an embodiment of the present invention, the step (2) comprises (2-1) spraying conductive ink on the nanofiber web and (2-2) sintering the sprayed conductive ink to form a circuit pattern layer. steps may be included.

In addition, the conductive ink may include conductive particles of at least one of gold, silver, copper, platinum, palladium, nickel, aluminum, and carbon.

In addition, the printed electronics technique may be performed by any one of inkjet printing and flexography.

In addition, the average pore diameter of the nanofiber web may be 0.1 to 10 μm.

In addition, the circuit pattern layer may be printed to a thickness of 0.1 to 10 μm from the surface of the nanofiber web.

In addition, the circuit pattern layer includes a first circuit pattern layer formed on the upper surface of the nanofibrous web and a second circuit pattern layer formed on the lower surface, and the first circuit pattern layer and the second circuit pattern layer are electrically conductive or can be de-energized

In addition, the nanofiber is polyurethane, polystyrene, polyvinylalcohol, polymethyl methacrylate, polylactic acid, polyethyleneoxide, polyvinyl acetate (polyvinyl acetate), polyacrylic acid, polycaprolactone, polyacrylonitrile, polyvinylpyrrolidone, polyvinylchloride, polycarbonate, PC (polycarbonate) , polyetherimide, polyethersulfone, polybenzimidazol, polyethylene terephthalate, polybutylene terephthalate, and any one selected from the group consisting of fluorine-based compounds. One or more compounds may be included as fiber-forming components.

In addition, the porosity of the nanofiber web may be 10 to 80%.

In addition, the printed circuit nanofiber web may further include a support for strength reinforcement on the opposite side of the nanofiber web on which the circuit pattern layer is printed.

In addition, the present invention provides a printed circuit nanofiber web having a plurality of nanofibers and a plurality of pores formed by crossing the plurality of nanofibers, and a circuit pattern layer formed to cover the nanofibers and pores.

In addition, the present invention provides an electronic device including a printed circuit nanofiber web manufactured by the above-described manufacturing method and at least one or more electronic components mounted on the printed circuit nanofiber web.

In addition, the electronic device is a sensor unit including at least one of a biosensor for detecting a user's body state and an environment sensor for detecting a surrounding environment, a short-range communication module used for short-range wireless communication, and a wireless communication It may be an electronic device including a control unit for performing antenna pattern and signal processing functions.

According to the manufacturing method of the printed circuit nanofiber web according to the present invention, it is possible to implement a printed circuit nanofiber web printed with circuit patterns having flexibility and resilience to be suitable for future smart devices. In addition, it is economical and eco-friendly by lowering the manufacturing cost of conductive materials using the printed electronics process and minimizing waste of conductive materials, while satisfying waterproofness and air permeability through a nanofiber web having a large number of pores. It can be applied in various ways.

1 is a view showing a conventional deposition-lithography process;
2 is a diagram showing a printed electronics process according to an embodiment of the present invention;
Figure 3 is a perspective view and a partially enlarged view showing a printed circuit nanofiber web according to an embodiment of the present invention, and
4 and 5 are views showing a printed circuit nanofiber web manufactured by a manufacturing method according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. This invention may be embodied in many different forms and is not limited to the embodiments set forth herein. In order to clearly describe the present invention in the drawings, parts irrelevant to the description are omitted, and the same reference numerals are added to the same or similar components throughout the specification.

The method for manufacturing a printed circuit nanofiber web according to the present invention includes (1) preparing a nanofiber web by electrospinning a spinning solution containing a fiber forming component, and (2) using a printed electronic technique. It is implemented by including the step of forming a circuit pattern layer on the nanofiber web.

The step (1) is a step of preparing a nanofiber web, which is a substrate for forming a circuit pattern layer, by electrospinning a spinning solution containing a fiber forming component. Prior to explaining step (1) according to the manufacturing method of the present invention, the reason for using the nanofibrous web as a substrate for forming the circuit pattern layer will be explained first.

A typical printed circuit board is a Rigid Printed Circuit Board (Rigid PCB) in which reinforcing materials such as glass fibers are added to epoxy resin and copper foil is adhered to it, and a flexible printed circuit in which copper foil is adhered to a polyimide substrate. It can be divided into a flexible printed circuit board (FPCB) and a rigid-flexible printed circuit board (R-F PCB) combining the advantages of a rigid printed circuit board and a flexible printed circuit board. In particular, in the case of printed circuit boards for future devices such as smart devices reflecting recent trends, excellent flexibility is required, and resilience and high bending characteristics that can maintain the original flat state even when folded or crumpled are required. However, polyimide used in conventional flexible printed circuit boards exhibits a certain level of flexibility, but has very low resilience to return to its original flat state when folded or crumpled, and is vulnerable to bending, so it is suitable for future devices. There are some inappropriate aspects.

Therefore, the present invention has excellent flexibility and resilience to be suitable for the above-mentioned future smart devices through a manufacturing method of printing a circuit pattern on a nanofiber web formed by randomly accumulating a plurality of nanofibers, and at the same time exhibits excellent bending characteristics A printed circuit Realization of nanofiber web.

That is, the printed circuit nanofibrous web implemented by the manufacturing method according to the present invention forms a circuit pattern layer to cover the surface of the fibers constituting the nanofiber web and the pores formed by the nanofibers, resulting in excellent flexibility of the nanofibers themselves. can be sufficiently utilized, and restoration properties recovered after being folded or crumpled due to the randomly stacked nanofibers can also be improved. Furthermore, by using a web-structured sheet, it can be applied to future-oriented devices such as ultra-thin devices and wearable devices.

In step (1), a known method for preparing a nanofibrous web may include nanofibers and form a fibrous web having a three-dimensional network shape. However, preferably, the nanofiber web may be formed by electrospinning a spinning solution containing a fiber forming component.

The nanofibers forming the nanofiber web may be formed by including a known fiber-forming component and a solvent.

Depending on the purpose, the fiber-forming component is polyurethane, polystyrene, polyvinylalcohol, polymethyl methacrylate, polylactic acid, polyethyleneoxide, poly Polyvinyl acetate, polyacrylic acid, polycaprolactone, polyacrylonitrile, polyvinylpyrrolidone, polyvinylchloride, polycarbonate, PC ( polycarbonate), polyetherimide, polyethersulfone, polybenzimidazol, polyethylene terephthalate, polybutylene terephthalate, and fluorine-based compounds selected from the group consisting of One or more may be included.

In addition, the fluorine-based compound is polytetrafluoroethylene (PTFE)-based, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA)-based, tetrafluoroethylene-hexafluoropropylene copolymer (FEP)-based, Tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer (EPE) system, tetrafluoroethylene-ethylene copolymer (ETFE) system, polychlorotrifluoroethylene (PCTFE) system, chlorotrifluoro It may include at least one compound selected from the group consisting of ethylene-ethylene copolymer (ECTFE)-based and polyvinylidene fluoride (PVDF)-based.

At this time, when the nanofibers include PVDF as a fiber-forming component, the weight average molecular weight of the PVDF may be 10,000 to 1,000,000, preferably 300,000 to 600,000, but is not limited thereto.

The fiber-forming component is preferably included in 5 to 30% by weight, preferably 8 to 20% by weight in the spinning solution, and if the fiber-forming component is less than 5% by weight, it is difficult to form a fiber, and it is not spun into a fiber during spinning. Even if it is sprayed in the form of droplets and spinning is performed, a lot of beads are formed and the volatilization of the solvent is not well done, which may cause pores to be clogged. In addition, if the fiber-forming component exceeds 30% by weight, the viscosity rises and solidification occurs on the surface of the solution, making it difficult to spin for a long time, and the fiber diameter increases, making it impossible to create fibers having a size of less than a micrometer.

The solvent may be used without limitation in the case of solvents that do not produce precipitates of fiber-forming components and do not affect the radioactivity of nanofibers described later, but preferably γ-butyrolactone, cyclohexanone, 3-hexanone, 3 - It may include at least one selected from the group consisting of heptanone, 3-octanone, N-methylpyrrolidone, dimethylacetamide, acetone dimethylsulfoxide, and dimethylformamide. For example, the solvent may be a mixed solvent of dimethylacetamide and acetone.

The prepared spinning solution may be prepared into nanofibers through a known electrospinning apparatus and method. For example, the electrospinning device uses an electrospinning device having a single spinning pack having one spinning nozzle, or using an electrospinning device having a single spinning pack with a plurality of single spinning packs or a spinning pack having a plurality of nozzles for mass production. also free In addition, in the electrospinning method, dry spinning or wet spinning having an external coagulation bath may be used, and there is no limitation according to the method.

When electrospinning is performed on a collector, for example, paper, by injecting the stirred spinning solution into the electrospinning apparatus, a nanofiber web formed of nanofibers can be obtained. As an example of the specific conditions for the electrospinning, the air pressure of the air injection nozzle provided in the nozzle of the spinning pack may be set in the range of 0.01 to 0.2 MPa. If the air pressure is less than 0.01 MPa, it does not contribute to collection and accumulation, and if it exceeds 0.2 MPa, the cone of the spinning nozzle is hardened and the needle is blocked, which may cause spinning trouble. In addition, when spinning the spinning solution, the injection rate of the spinning solution per nozzle may be 10 to 30 μl/min. In addition, the distance between the tip of the nozzle and the collector may be 10 to 30 cm. However, it is not limited to this and can be changed and implemented according to the purpose.

The nanofibrous web prepared through step (1) may have a plurality of pores formed by crossing the plurality of nanofibers. In this case, since breathability can be given to the printed circuit nanofiber web on which the circuit pattern is formed, it is possible to have the optimal function and structure required to interconnect various parts of clothes worn on the human body and various future smart devices and configure circuits. there is. That is, in the human body, sweat is generated to regulate body temperature according to the external environment, and this sweat is evaporated and released to the outside in the form of water vapor. The water vapor evaporated from the sweat is released to the outside through the printed circuit nanofiber web having air permeability. In addition, various circuit wires can be connected through pores, so that it can have functions and structures more suitable for future devices such as wearable smart devices.

To this end, the porosity of the nanofiber web may be 10 to 80%, for example, 50% to 60%. In addition, the nanofibers may have an average diameter of 0.1 to 10 μm, but are not limited thereto. In addition, the nanofiber web may have a thickness of 5 to 200 μm, for example, 10 to 20 μm. If the nanofibrous web has a thickness of less than 5 μm, the support function for the circuit pattern layer printed on the surface of the nanofibrous web may deteriorate, and thus the durability and mechanical properties of the printed circuit nanofibrous web may deteriorate. In addition, if the nanofibrous web has a thickness exceeding 200 μm, process handling characteristics may be deteriorated due to the excessive thickness of the circuit pattern layer, and in particular, when the circuit pattern layer is printed on both sides, conductive ink does not penetrate easily. Therefore, the formation of a uniform circuit pattern layer may be restricted, and the physical properties of the nanofiber web itself may be deteriorated due to aggregation in the conductive ink due to a decrease in penetration.

In addition, the average pore diameter of the nanofibrous web may be 0.1 to 10 μm, more preferably 0.1 to 3 μm, and for example, 0.25 μm. In addition, the basis weight of the nanofiber web may be 2 ~ 100g / ㎡, for example, 10g / ㎡ ~ 20g / ㎡.

At this time, in order to improve the stability of the circuit pattern layer formed on the nanofibrous web by reinforcing the insufficient strength of the nanofibrous web itself, the nanofibrous web may further include a support for reinforcing strength to suit the intended use. And, it may be implemented by further including a first nanofiber web or a second nanofiber web laminated on one side or both sides of the support for strength reinforcement.

Meanwhile, referring to FIG. 1, the conventional photo-lithography technique includes (a) forming a seed layer on a flexible or rigid substrate, (c) applying a photoresist, and (d) using a mask. Since it is performed including the exposure step, (e) developing step, (f) etching step, and circuit pattern forming step (g), the required process steps are complicated and the manufacturing time is long, and also using a mask or the like It is uneconomical because the amount of conductive material that is relatively wasted is large because it is removed leaving only the necessary parts. However, since the printed electronics technique according to the present invention is manufactured by printing only the desired circuit pattern portion with conductive electronic ink on a substrate or film, the circuit pattern can be printed in a two-step process, which can greatly contribute to process simplification, and the circuit pattern The accuracy of formation is improved, and there is little wasted material, so the manufacturing cost can be greatly reduced.

Therefore, the manufacturing method according to the present invention can minimize process steps only by steps (a) to (c), as shown in FIG. 2, and this step (2) uses a printed electronic technique. Thus, a circuit pattern layer is printed on the nanofiber web, and the printed electronics technique may be performed by any one of inkjet printing and flexography. However, the printed electronics technique in the present invention is not limited to the above-mentioned methods, and may include all methods that can be used as printed electronic techniques.

At this time, the inkjet printing method is a method of ejecting fine-sized conductive ink droplets (hereinafter referred to as droplets) from a head and colliding them with a target substrate to form a circuit pattern, and continuously according to the droplet ejection method. It can be classified into a continuous method for discharging droplets and a drop on demand method for selectively discharging droplets. In this case, the continuous method generally requires a large device and is used for low-resolution patterning, whereas the drop-on-demand method is characterized in that it is used when high-resolution patterning is required.

In addition, the Drop On Demand method uses a piezoelectric element to apply pressure to the ink to eject droplets, and a Piezo method that applies heat to the ink to instantaneously generate bubbles, and then to the pressure of the bubbles It can be classified as a bubble jet method in which liquid droplets are ejected by In the case of the piezo method, since it does not apply heat to the ink, the life of the head is relatively long and there is no limitation to consider thermal denaturation in the selection of ink. However, for high-resolution patterning, the production cost of the head is high. It can be disadvantageous in that it rises.

In the flexography method, conductive ink is applied on an anilox roller having a uniform grating, spread evenly through a doctor blade, and then the anilox roller and It is a method of printing on the surface of a target substrate by contacting a printing roll to transfer conductive ink in an embossed pattern on a flexible resin plate of the printing roll.

At this time, the step (2) may further include (2-1) spraying conductive ink on the nanofiber web and (2-2) sintering the sprayed conductive ink to form a circuit pattern layer. can

The conductive ink in step (2-1) may include at least one conductive particle selected from among gold, silver, copper, platinum, palladium, nickel, aluminum, and carbon particles. Considering conductivity and chemical resistance, gold and silver , platinum is preferable, and silver may be more preferable considering cost and sintering temperature to be described later. However, the conductive particles included in the conductive ink are not limited to the above-mentioned metals, and include all metals or non-metals that can be used as materials for the conductive ink. For example gold formate, silver formate, copper formate, platinum formate, palladium formate, nickel formate, aluminum formate, gold acetate, silver acetate, copper acetate, platinum acetate, palladium acetate, nickel acetate, aluminum acetate, gold oxalate, silver oxalate , copper oxalate, platinum oxalate, palladium oxalate, nickel oxalate, aluminum oxalate, gold malonate, silver malonate, copper malonate, platinum malonate, palladium malonate, nickel malonate, aluminum malonate, gold phthalate, silver phthalate, Copper phthalate, platinum phthalate, palladium phthalate, nickel phthalate, aluminum phthalate, and the like may be included as the conductive particles of the conductive ink. The conductive particles may be nano- or micro-scaled, and the type of conductive particles and the content ratio of the conductive ink may be appropriately selected according to the physical properties of the circuit pattern layer, so there is no particular limitation.

In addition, the conductive ink may further include a solvent and a binder for uniform dispersion of the conductive particles, and contain additives applied to printed electronics within a range that does not affect the effects of the present invention, depending on the intended use and need. it is possible to do Examples include viscosity modifiers, conductive aids, chalking inhibitors, antioxidants, pH modifiers, drying inhibitors, adhesion imparting agents, preservatives, antifoaming agents, leveling agents, surfactants, and the like, and binders When added, adhesion to the nanofiber web is improved, and uniform dispersion of the conductive ink can be induced. In this way, the composition and composition ratio of the additional additives may be appropriately selected in consideration of the physical properties of the circuit pattern layer so that all of them evaporate through a sintering process to be described later to form a uniform circuit pattern layer.

Meanwhile, the conductive particles included in the conductive ink may be prepared by dispersing the conductive particles in a solvent as described above. Since the conductive particles are dispersed in a very unstable state at the initial stage of dispersion, a phenomenon in which the conductive particles aggregate again may occur. . In particular, when conductive particles are used in a nano-size as in the present invention, such aggregation may cause deterioration in electrical properties that deteriorate the uniformity and electrical conductivity of the circuit pattern layer when forming a circuit pattern through a printing process. there is. Therefore, by performing the sintering step in step (2-2) to be described later, a uniform circuit pattern layer can be formed without using a dispersant for controlling dispersion.

Next, as step (2-2), a step of forming a circuit pattern layer by sintering the sprayed conductive ink is performed.

The (2-2) step is to form a circuit pattern layer by solidifying the conductive ink, and as an additional effect as described above, the dispersion stability and uniformity of the conductive ink are improved to form a more uniform circuit pattern layer. It is a step.

Sintering refers to a phenomenon in which bonding occurs and solidifies between powder particles when powder receives strong energy from the outside. In the case of the conductive ink composed of the metal particles, the sintering process simply bonds the particles to each other to reduce the size of the particles. becomes larger and ideally changes into a thin film form without voids, and substances such as additives additionally included on the surface of metal particles to improve dispersion stability disappear by thermal decomposition or volatilization, so conductivity characteristics can be maximized.

In the sintering treatment method according to an example of the present invention, heat treatment may be performed on the ink printed on the substrate using an oven or a furnace. However, it is not limited thereto, and various known sintering methods may be performed within a range that does not affect the physical properties of the nanofibrous web on which the circuit pattern layer is formed.

Next, the circuit pattern layer formed on the nanofiber web through step (2) may have a thickness of 0.1 to 10 μm from the surface of the nanofiber web. If the circuit pattern layer has a thickness of less than 0.1 μm from the surface of the nanofiber web, there is a risk of deterioration in stability of electrical properties through the circuit pattern layer, and if the circuit pattern layer is 10 μm from the surface of the nanofiber web If the thickness exceeds this, the excessive thickness of the circuit pattern layer may cause cracks in the nanofiber web or segmentation of the nanofibers constituting the nanofiber web, resulting in reduced elasticity, resulting in electrical conductivity of the printed circuit nanofiber web. this may fall Furthermore, when applied to small electronic products, it may be disadvantageous in terms of weight reduction and thinning.

At this time, the circuit pattern layers may be formed on the upper and lower surfaces of the nanofibrous web, respectively, and the circuit pattern layers formed on the upper and lower surfaces may be formed to conduct each other.

In the case of forming a circuit pattern layer on a substrate using conventional polyimide, there is a limitation in application to various industrial fields due to the need for an additional process such as providing a separate via hole because the top and bottom conduction is not performed, but according to the present invention In the case of forming a circuit pattern layer used in a printed circuit nanofiber web, it is possible to use it in more diverse industrial fields because it can achieve top and bottom conduction through pores without having to provide a separate via hole. For example, when used in a medical patch, not only flexibility, air permeability, thin structure and resilience are required, but also top and bottom conduction are essential, so the utilization of the printed circuit nanofiber web according to the present invention can be improved.

In addition, the circuit pattern layers may be formed on the upper and lower surfaces of the nanofibrous web, respectively, and the circuit pattern layers formed on the upper and lower surfaces may not conduct each other.

The above-described energized and non-conductive state of the circuit pattern layer can be implemented by adjusting the thickness of the nanofiber web. That is, by forming the nanofiber web to a certain thickness or more, it is possible to implement circuit pattern layers formed on the upper and lower surfaces of the nanofiber web so that they do not conduct electricity to each other, and by forming the nanofiber web to a thickness less than a certain thickness, the upper and lower parts of the nanofiber web Circuit pattern layers formed on the surface may be implemented to conduct electricity to each other. In addition, by adjusting the concentration of the conductive particles included in the above-described conductive ink or adjusting the porosity and pore size of the nanofibrous web, the conduction and non-conduction states of the circuit pattern layers formed on the upper and lower surfaces of the nanofibrous web are controlled. can do.

As such, the manufacturing method for realizing the printed circuit nanofiber web according to the present invention dramatically simplifies the manufacturing process, greatly reducing the process time and minimizing the waste of conductive materials, thereby saving resources and energy at the same time. can conceive In addition, it has excellent flexibility, resilience, air permeability, etc. to be suitable for future smart devices, so it can be applied to various industrial fields.

Accordingly, referring to FIG. 3, the present invention provides a nanofiber web 100 including a plurality of nanofibers 110, a plurality of pores formed by crossing the plurality of nanofibers 110, and a predetermined surface of the nanofiber web. Implement a printed circuit nanofiber web including a circuit pattern layer 120 formed to cover at least a portion of the plurality of nanofibers and the plurality of pores exposed in the region of. The description of other printed circuit nanofiber webs is the same as the description of the above-described manufacturing method, so it will be omitted.

The printed circuit nanofiber web according to an example of the present invention has a circuit pattern layer formed on one side, and in particular, as shown in FIG. 4, it has significantly better flexibility and resilience than conventional flexible printed circuit boards, as well as excellent flexibility and elasticity, it is possible to improve its utilization as a bio patch in the medical industry field, which has recently been in the limelight. In addition, as shown in FIG. 5, it can be manufactured in the form of various sensors that can be attached to virtually any part of the body, improving its utilization in various industrial fields related to electronic devices including the Internet of Things in the future. can promote field development.

In addition, the present invention implements an electronic device including a printed circuit nanofiber web having a circuit pattern layer formed on the nanofiber web using the above-described printed electronics technique and at least one electronic component mounted on the printed circuit nanofiber web. .

The electronic component may be appropriately selected according to various target industries. For example, the electronic component includes a sensor unit including at least one of a biosensor for detecting a user's body state and an environment sensor for detecting a surrounding environment; It may be an electronic device including a short-distance communication module used for short-distance wireless communication, an antenna pattern used for wireless communication, and a control unit for performing a signal processing function.

Although one embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiments presented herein, and those skilled in the art who understand the spirit of the present invention may add elements within the scope of the same spirit. However, other embodiments can be easily proposed by means of changes, deletions, additions, etc., but these will also fall within the scope of the present invention.

Claims (5)

(1) Electrospinning a spinning solution containing a fiber-forming component in an amount of 8 to 20% by weight,
When the spinning solution is sprayed from the nozzle of the spinning pack, the air pressure of the air spray is 0.01 to 0.2 Mpa,
Preparing a nanofiber web having an average pore diameter of 0.1 to 10 μm and a thickness of 10 to 20 μm; and
(2) printing a circuit pattern layer by printing conductive ink on the nanofiber web;
Step (2) above
2-1) printing conductive ink on the nanofiber web through any one of inkjet printing and flexography; and
2-2) forming a circuit pattern layer by sintering the conductive ink;
In the step (2), the circuit pattern layers are formed on the upper and lower surfaces of the nanofiber web, respectively, forming a first circuit pattern layer on the upper surface and a second circuit pattern layer on the lower surface, The manufacturing method of the printed circuit nanofiber web, characterized in that by infiltrating the conductive ink through the pores of the fiber web to conduct electricity between the first circuit pattern layer and the second circuit pattern layer without having a separate via hole.
According to claim 1,
The conductive ink is a method for producing a printed circuit nanofiber web comprising at least one conductive particle of gold, silver, copper, platinum, palladium, nickel, aluminum and carbon.
According to claim 1,
The circuit pattern layer is a method of manufacturing a printed circuit nanofiber web printed to a thickness of 0.1 to 10 μm from the surface of the nanofiber web.
According to claim 1,
The fiber-forming component of the nanofiber is polyurethane, polystyrene, polyvinylalcohol, polymethyl methacrylate, polylactic acid, polyethyleneoxide, poly polyvinyl acetate, polyacrylic acid, polycaprolactone, polyacrylonitrile, polyvinylpyrrolidone, polyvinylchloride, polycarbonate Any one selected from the group consisting of polyetherimide, polyethersulfone, polybenzimidazol, polyethylene terephthalate, polybutylene terephthalate, and fluorine-based compounds A method for producing a printed circuit nanofiber web comprising the above compounds.
According to claim 1,
The method of manufacturing a printed circuit nanofiber web having a porosity of 10 to 80% of the nanofiber web.

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