CN108172397B - Patch capacitor structure and performance detection method thereof - Google Patents
Patch capacitor structure and performance detection method thereof Download PDFInfo
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- CN108172397B CN108172397B CN201711210287.0A CN201711210287A CN108172397B CN 108172397 B CN108172397 B CN 108172397B CN 201711210287 A CN201711210287 A CN 201711210287A CN 108172397 B CN108172397 B CN 108172397B
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- ceramic dielectric
- dielectric film
- capacitor
- electrode layer
- blank
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- 239000003990 capacitor Substances 0.000 title claims abstract description 58
- 238000001514 detection method Methods 0.000 title claims abstract description 12
- 239000000919 ceramic Substances 0.000 claims abstract description 67
- 238000004519 manufacturing process Methods 0.000 claims abstract description 23
- 238000005520 cutting process Methods 0.000 claims abstract description 14
- 238000007650 screen-printing Methods 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 11
- 238000007689 inspection Methods 0.000 abstract description 11
- 230000001066 destructive effect Effects 0.000 abstract description 7
- 239000012528 membrane Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Abstract
The invention discloses a patch capacitor structure and a performance detection method thereof, comprising a capacitor blank and an external electrode end wrapped outside the capacitor blank, wherein the capacitor blank comprises a plurality of ceramic dielectric films which are overlapped, and the upper and lower adjacent ceramic dielectric films are distributed in a staggered way, and the patch capacitor structure is characterized in that: each ceramic dielectric film is printed with an electrode layer, the electrode layer comprises an inner electrode layer covered on the ceramic dielectric film and an airfoil electrode layer protruding out of the edges of the two sides of the ceramic dielectric film in the length direction, and the airfoil electrode layer is wrapped in a metal sheet of the outer electrode end; the capacitor blank manufacturing steps comprise: manufacturing a ceramic dielectric diaphragm; screen printing and superposition; (3) cutting; and fourthly, detecting electrodes, measuring the distance between the wing-shaped electrode layer and the edge of the capacitor blank, and judging whether the capacitor blank is qualified or not according to the data. The invention realizes direct inspection by utilizing the exposed airfoil electrode layer, and avoids the loss caused by destructive inspection.
Description
Technical Field
The present invention relates to a chip capacitor manufacturing process, and more particularly, to a chip capacitor structure and a performance detection method thereof.
Background
The patch capacitor is a capacitor material. The patch capacitance is all called: multilayer (laminated) chip ceramic capacitor, also called chip capacitor, is formed by laminating ceramic dielectric films with printed electrodes (inner electrodes) in a staggered mode, forming a ceramic chip by one-time high-temperature sintering, and sealing metal layers (outer electrodes) at two ends of the chip to form a monolithic-like structure, also called monolithic capacitor.
In the manufacturing process of the patch capacitor, the internal electrode is generated by adopting a screen printing mode at present, electrode ink (formed by mixed solvent of metal powder and ceramic material) is printed on a ceramic dielectric film, and then lamination (the ceramic dielectric films printed with the electrodes are overlapped according to different capacitance values to form a capacitor blank plate) and lamination are carried out, and the blank plate tightly combined needs to be cut into a single blank body. In this process, it is necessary to inspect the relative positions of the internal electrodes of the green body cut into particles, the inspection direction being divided into two directions, the width and the length.
However, the wide direction can be observed directly from the outside of the product particles, as shown in fig. 4, and the long direction internal electrodes are contained alternately inside the ceramic body, which can only be observed by destructive inspection, as shown in the perspective of fig. 5. As shown in fig. 6, too small a distance decreases the withstand voltage capability of the ceramic capacitor. The destructive inspection adopted at present causes the loss of products on one hand, and on the other hand, the destructive inspection needs to cut off the products for inspection, and the operation efficiency is influenced by time.
Disclosure of Invention
The invention aims to provide a patch capacitor structure and a performance detection method thereof, which can avoid damage to products by improving the structure and the manufacturing method, can be directly observed from the outside of the products, are more convenient to detect, improve the operation efficiency and reduce the production cost.
In order to achieve the above purpose, the invention adopts the following technical scheme: the utility model provides a paster capacitance structure, includes a capacitance body and wraps up the outer electrode end outside the capacitance body, the capacitance body includes that a plurality of ceramic dielectric membrane stack constitutes, upper and lower adjacent ceramic dielectric membrane dislocation distributes, the printing has the electrode layer on each ceramic dielectric membrane, and this electrode layer is including covering the inner electrode layer on ceramic dielectric membrane, and the protrusion in the wing section electrode layer on ceramic dielectric membrane both sides length direction edge, the wing section electrode layer parcel in the sheetmetal of outer electrode end.
In the above technical scheme, the airfoil electrode layer is positioned at four corners of the capacitor blank.
In order to achieve the above purpose, the invention adopts the following technical scheme: the performance detection method of the patch capacitor comprises two parts of capacitor blank manufacturing and external electrode end manufacturing, wherein the capacitor blank manufacturing steps comprise:
manufacturing a ceramic dielectric diaphragm;
screen printing and superposition;
(3) Cutting;
detecting electrodes;
in the screen printing process, airfoil electrode layers are printed on the edges of the two sides of the ceramic dielectric film in the length direction, and the airfoil electrode layers protrude out of the ceramic dielectric film and are positioned at the middle point of the side edges in the length direction; during the cutting, the wing-shaped electrode layers are cut along, so that the wing-shaped electrode layers are respectively reserved on four corners of the capacitor blank after the cutting is completed; in the step of electrode detection, long bias and wide bias data of an internal electrode of the capacitor blank are calculated and obtained according to the distance between the airfoil electrode layer and the edge of the capacitor blank, and whether the capacitor blank is qualified or not is judged according to the data.
In the above technical scheme, the overlapping process in the step (a) is as follows: the ceramic dielectric film comprises a plurality of ceramic dielectric films, wherein the upper and lower adjacent ceramic dielectric films are overlapped in a staggered manner, and the staggered overlapping mode is as follows: the lower layer is a first ceramic dielectric film combination arranged at intervals, the upper layer is a second ceramic dielectric film combination arranged at intervals, and the ceramic dielectric film in each second ceramic dielectric film combination is positioned in the middle of the adjacent ceramic dielectric film of the lower layer; the first ceramic dielectric film sheet and the second ceramic dielectric film sheet are combined and alternately overlapped until the design requirement is met.
In the above technical scheme, in the outer electrode end manufacturing part, the airfoil electrode layer is wrapped in the metal sheet of the outer electrode end after being bent.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. according to the invention, through adding the externally protruding wing-shaped electrode layers, after the ceramic dielectric film is overlapped, pressurized and cut into a single capacitor blank, the relative position relation of the internal electrodes can be judged by using a direct measurement mode of the exposed wing-shaped electrode layers, so that destructive inspection is avoided, the production efficiency is improved, and the loss (yield/cost) caused by the destructive inspection is reduced;
2. the airfoil electrode layer is formed in a printing mode and is finished in one step in synchronization with the generation mode of the internal electrode, so that the production process is not increased, and the production efficiency is not affected;
3. and the capacitor blank is cut along the position of the wing-shaped electrode layer, so that the cutting position is easy to judge, and the yield of the single capacitor blank is ensured.
Drawings
FIG. 1 is a schematic view of a screen-printed electrode according to a first embodiment of the present invention;
FIG. 2 is a schematic diagram showing a staggered superposition of single-row electrodes according to an embodiment of the present invention;
FIG. 3 is a schematic view of a single capacitor blank cut along the cutter line of FIG. 2;
FIG. 4 is a schematic view of the appearance of a single capacitor blank in the background of the invention;
FIG. 5 is a schematic diagram of the internal structure of FIG. 4 in perspective;
fig. 6 is a schematic diagram of measurement mode in the background of the invention.
Wherein: 1. a capacitor blank; 2. a ceramic dielectric film; 3. an airfoil electrode layer; 4. a first ceramic dielectric film sheet combination; 5. a second ceramic dielectric film combination; 6. cutting knife line position.
Detailed Description
The invention is further described below with reference to the accompanying drawings and examples:
embodiment one: referring to fig. 1-3, a patch capacitor structure comprises a capacitor blank 1 and an external electrode end wrapped outside the capacitor blank 1, wherein the capacitor blank 1 comprises a plurality of ceramic dielectric films 2 in a superposition mode (the superposition number is determined by the capacitance value of a capacitor to be generated), the upper adjacent ceramic dielectric films 2 and the lower adjacent ceramic dielectric films 2 are distributed in a staggered mode, each ceramic dielectric film 2 is printed with an electrode layer, the electrode layer comprises an internal electrode layer covered on the ceramic dielectric film 2, and wing-shaped electrode layers 3 protruding out of edges of two sides of the ceramic dielectric film 2 in the length direction, and the wing-shaped electrode layers 3 are located at four corners of the capacitor blank 1 and wrapped in metal sheets of the external electrode end.
The performance detection method comprises the steps of manufacturing a capacitor blank 1 and manufacturing an external electrode end, wherein the manufacturing steps of the capacitor blank 1 comprise:
the manufacturing process of the ceramic dielectric diaphragm 2 comprises the following steps:
a. raw material-ceramic powder batching key part (raw material determines the performance of patch capacitor MLCC);
b. ball milling-the ceramic ingredient particle diameter reaches micron level through a ball mill (approximately 2-3 days of ball milling);
c. ingredients-various ingredients are mixed according to a certain proportion;
d. mixing the mixed materials into paste by adding additives;
e. flow edge-uniformly coating the pasty slurry on a film (the film is made of special materials, so that the surface is smooth);
f. printing electrodes-electrode materials are printed on paste-like slurry after flowing edge according to certain rules (dislocation of electrode layers is ensured in the process, and the sizes of different MLCCs are ensured by the process);
screen printing and superposition, adopting the existing printing technology, superposing the flow of the printed electrode along the slurry block according to the difference of capacitance values, and then laminating to form a capacitor blank (the capacitance value of a specific size is determined by different layers),
(3) Cutting;
detecting electrodes;
in the screen printing process, airfoil electrode layers 3 are printed on the edges of the two sides of the ceramic dielectric film 2 in the length direction, and as shown in fig. 1, the airfoil electrode layers 3 protrude out of the ceramic dielectric film 2 and are positioned at the middle point of the side edges in the length direction;
during the cutting step, cutting along the airfoil electrode layer 3, so that the airfoil electrode layer 3 is respectively left on four corners of the capacitor blank 1 after the cutting is completed, as shown in fig. 2;
in the step of electrode detection, as shown in fig. 3, according to the distance between the airfoil electrode layer 3 and the edge of the capacitor blank 1, the data of the long bias X and the wide bias Y of the internal electrode of the capacitor blank 1 are obtained by calculation, and whether the capacitor blank 1 is qualified or not is judged according to the data.
In this embodiment, the stacking process is: taking a single-row electrode staggering as an example, the ceramic dielectric film comprises two rows of eight ceramic dielectric films 2, wherein the ceramic dielectric films 2 adjacent to each other from top to bottom are overlapped in a staggered manner, and the staggered overlapping mode is as follows: the lower layer is a first ceramic dielectric film sheet combination 4 which is arranged at intervals, the upper layer is a second ceramic dielectric film sheet combination 5 which is arranged at intervals, and the ceramic dielectric film sheet in each second ceramic dielectric film sheet combination 5 is positioned in the middle of the adjacent ceramic dielectric film sheet of the lower layer. Thus, the first ceramic dielectric film sheet and the second ceramic dielectric film sheet are combined and alternately overlapped until the design requirement is met. Then, the single capacitor blank 1 is cut along the cutting knife line 6 in fig. 2, and the wing electrodes protruding from the single capacitor blank are positioned at the four corners of the blank for inspection and measurement, and can be directly measured to replace the conventional destructive profile inspection mode.
The exposed airfoil electrode layer 3 can be wrapped in the metal sheet of the outer electrode end after being bent, so that the appearance of the finished product is not affected.
Claims (3)
1. A performance detection method of a patch capacitor comprises two parts of capacitor blank manufacture and external electrode end manufacture, and is characterized in that: the capacitor blank manufacturing steps comprise:
(1) Manufacturing a ceramic dielectric film;
(2) Screen printing and superposition;
(3) Cutting;
(4) Electrode detection;
in the screen printing process, airfoil electrode layers are printed on the edges of the two sides of the ceramic dielectric film in the length direction, and the airfoil electrode layers protrude out of the ceramic dielectric film and are positioned at the middle point of the side edges in the length direction; during the cutting, the wing-shaped electrode layers are cut along, so that the wing-shaped electrode layers are respectively reserved on four corners of the capacitor blank after the cutting is completed; in the step of electrode detection, long bias and wide bias data of an internal electrode of the capacitor blank are calculated and obtained according to the distance between the airfoil electrode layer and the edge of the capacitor blank, and whether the capacitor blank is qualified or not is judged according to the data.
2. The method for detecting the performance of a chip capacitor according to claim 1, wherein: the overlapping process in the step II is as follows: the ceramic dielectric film comprises a plurality of ceramic dielectric films, wherein the upper and lower adjacent ceramic dielectric films are overlapped in a staggered manner, and the staggered overlapping mode is as follows: the lower layer is a first ceramic dielectric film combination arranged at intervals, the upper layer is a second ceramic dielectric film combination arranged at intervals, and the ceramic dielectric film in each second ceramic dielectric film combination is positioned in the middle of the adjacent ceramic dielectric film of the lower layer; the first ceramic dielectric film sheet and the second ceramic dielectric film sheet are combined and alternately overlapped until the design requirement is met.
3. The method for detecting the performance of a chip capacitor according to claim 1, wherein: in the manufacturing part of the outer electrode end, the wing-shaped electrode layer is wrapped in a metal sheet of the outer electrode end after being bent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711210287.0A CN108172397B (en) | 2017-11-28 | 2017-11-28 | Patch capacitor structure and performance detection method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711210287.0A CN108172397B (en) | 2017-11-28 | 2017-11-28 | Patch capacitor structure and performance detection method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN108172397A CN108172397A (en) | 2018-06-15 |
| CN108172397B true CN108172397B (en) | 2024-01-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711210287.0A Active CN108172397B (en) | 2017-11-28 | 2017-11-28 | Patch capacitor structure and performance detection method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103050278A (en) * | 2012-12-20 | 2013-04-17 | 广东风华高新科技股份有限公司 | Multilayer ceramic capacitor and preparation method thereof |
| CN103531356A (en) * | 2013-09-29 | 2014-01-22 | 广东风华高新科技股份有限公司 | Preparation method for safety chip type multilayer ceramic capacitors |
| CN103794366A (en) * | 2014-02-17 | 2014-05-14 | 广东风华高新科技股份有限公司 | Manufacturing method for multi-layer ceramic capacitor |
| CN104299777A (en) * | 2014-10-29 | 2015-01-21 | 福州大学 | Multilayer ceramic capacitor based on graphene inner electrode layers |
| CN207474289U (en) * | 2017-11-28 | 2018-06-08 | 国巨电子（中国）有限公司 | A kind of patch capacitor structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050195556A1 (en) * | 2004-03-08 | 2005-09-08 | Shah Rajendra R. | Method of building multi-layer ceramic chip (MLCC) capacitors |
| KR101462769B1 (en) * | 2013-03-28 | 2014-11-20 | 삼성전기주식회사 | Multi layered ceramic capacitor, fabricating method thereof and circuit board for mounting the same |
-
2017
- 2017-11-28 CN CN201711210287.0A patent/CN108172397B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103050278A (en) * | 2012-12-20 | 2013-04-17 | 广东风华高新科技股份有限公司 | Multilayer ceramic capacitor and preparation method thereof |
| CN103531356A (en) * | 2013-09-29 | 2014-01-22 | 广东风华高新科技股份有限公司 | Preparation method for safety chip type multilayer ceramic capacitors |
| CN103794366A (en) * | 2014-02-17 | 2014-05-14 | 广东风华高新科技股份有限公司 | Manufacturing method for multi-layer ceramic capacitor |
| CN104299777A (en) * | 2014-10-29 | 2015-01-21 | 福州大学 | Multilayer ceramic capacitor based on graphene inner electrode layers |
| CN207474289U (en) * | 2017-11-28 | 2018-06-08 | 国巨电子（中国）有限公司 | A kind of patch capacitor structure |
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| Publication number | Publication date |
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| CN108172397A (en) | 2018-06-15 |
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