CN108169516A - Physical quantity transducer, physical quantity sensor device, electronic equipment and moving body - Google Patents
Physical quantity transducer, physical quantity sensor device, electronic equipment and moving body Download PDFInfo
- Publication number
- CN108169516A CN108169516A CN201711263648.8A CN201711263648A CN108169516A CN 108169516 A CN108169516 A CN 108169516A CN 201711263648 A CN201711263648 A CN 201711263648A CN 108169516 A CN108169516 A CN 108169516A
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- Prior art keywords
- physical quantity
- quantity transducer
- extension
- support portion
- addition
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- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 35
- 230000001133 acceleration Effects 0.000 description 32
- 239000000203 mixture Substances 0.000 description 29
- 230000008646 thermal stress Effects 0.000 description 21
- 239000011521 glass Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 15
- 238000001514 detection method Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 230000009467 reduction Effects 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 230000035882 stress Effects 0.000 description 11
- 230000002401 inhibitory effect Effects 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000003068 static effect Effects 0.000 description 7
- 239000010931 gold Substances 0.000 description 6
- 230000002829 reductive effect Effects 0.000 description 6
- 239000000725 suspension Substances 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 239000000470 constituent Substances 0.000 description 4
- 230000036961 partial effect Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 102220367607 c.37C>T Human genes 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- NJWNEWQMQCGRDO-UHFFFAOYSA-N indium zinc Chemical compound [Zn].[In] NJWNEWQMQCGRDO-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 102220295071 rs1021613206 Human genes 0.000 description 1
- 102220013441 rs12272086 Human genes 0.000 description 1
- 102220023217 rs387907538 Human genes 0.000 description 1
- 102220013368 rs397516586 Human genes 0.000 description 1
- 102220100736 rs878854061 Human genes 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/135—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by making use of contacts which are actuated by a movable inertial mass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D1/00—Control of position, course, altitude or attitude of land, water, air or space vehicles, e.g. using automatic pilots
- G05D1/08—Control of attitude, i.e. control of roll, pitch, or yaw
- G05D1/0891—Control of attitude, i.e. control of roll, pitch, or yaw specially adapted for land vehicles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60G—VEHICLE SUSPENSION ARRANGEMENTS
- B60G17/00—Resilient suspensions having means for adjusting the spring or vibration-damper characteristics, for regulating the distance between a supporting surface and a sprung part of vehicle or for locking suspension during use to meet varying vehicular or surface conditions, e.g. due to speed or load
- B60G17/015—Resilient suspensions having means for adjusting the spring or vibration-damper characteristics, for regulating the distance between a supporting surface and a sprung part of vehicle or for locking suspension during use to meet varying vehicular or surface conditions, e.g. due to speed or load the regulating means comprising electric or electronic elements
- B60G17/019—Resilient suspensions having means for adjusting the spring or vibration-damper characteristics, for regulating the distance between a supporting surface and a sprung part of vehicle or for locking suspension during use to meet varying vehicular or surface conditions, e.g. due to speed or load the regulating means comprising electric or electronic elements characterised by the type of sensor or the arrangement thereof
- B60G17/01908—Acceleration or inclination sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60G—VEHICLE SUSPENSION ARRANGEMENTS
- B60G2400/00—Indexing codes relating to detected, measured or calculated conditions or factors
- B60G2400/05—Attitude
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60G—VEHICLE SUSPENSION ARRANGEMENTS
- B60G2800/00—Indexing codes relating to the type of movement or to the condition of the vehicle and to the end result to be achieved by the control action
- B60G2800/01—Attitude or posture control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60T—VEHICLE BRAKE CONTROL SYSTEMS OR PARTS THEREOF; BRAKE CONTROL SYSTEMS OR PARTS THEREOF, IN GENERAL; ARRANGEMENT OF BRAKING ELEMENTS ON VEHICLES IN GENERAL; PORTABLE DEVICES FOR PREVENTING UNWANTED MOVEMENT OF VEHICLES; VEHICLE MODIFICATIONS TO FACILITATE COOLING OF BRAKES
- B60T2230/00—Monitoring, detecting special vehicle behaviour; Counteracting thereof
- B60T2230/02—Side slip angle, attitude angle, floating angle, drift angle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60T—VEHICLE BRAKE CONTROL SYSTEMS OR PARTS THEREOF; BRAKE CONTROL SYSTEMS OR PARTS THEREOF, IN GENERAL; ARRANGEMENT OF BRAKING ELEMENTS ON VEHICLES IN GENERAL; PORTABLE DEVICES FOR PREVENTING UNWANTED MOVEMENT OF VEHICLES; VEHICLE MODIFICATIONS TO FACILITATE COOLING OF BRAKES
- B60T8/00—Arrangements for adjusting wheel-braking force to meet varying vehicular or ground-surface conditions, e.g. limiting or varying distribution of braking force
- B60T8/24—Arrangements for adjusting wheel-braking force to meet varying vehicular or ground-surface conditions, e.g. limiting or varying distribution of braking force responsive to vehicle inclination or change of direction, e.g. negotiating bends
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Automation & Control Theory (AREA)
- Pressure Sensors (AREA)
Abstract
This application discloses physical quantity transducer, physical quantity sensor device, electronic equipment and moving bodys.The physical quantity transducer includes：Base portion；Wiring is configured at the base portion；Support portion, including being engaged in the first joint portion of the base portion and being engaged in the second joint portion of the wiring；Suspended portion is connected to the support portion；And electrode finger, the suspended portion is supported in, wherein, the support portion includes the first extension, which separates between first joint portion and the suspended portion with the base portion.
Description
Technical field
The present invention relates to physical quantity transducer, physical quantity sensor device, electronic equipment and moving bodys.
Background technology
For example, the acceleration transducer as detectable acceleration, it is known to the composition described in patent document 1.Patent
The acceleration transducer of document 1 has：Acceleration sensor element；And supporting substrate and wiring substrate, by acceleration sensing
Device is clipped in the middle and is configured.In addition, acceleration sensor element has：It is fixed on the support portion of supporting substrate；Movable electrode portion,
It can be to the displacement of detection axis direction relative to support portion；And it is fixed on the fixation electrode portion of supporting substrate.In such composition
In acceleration transducer, it can be detected according to the variation of static capacity formed between fixed electrode portion and movable electrode portion
Acceleration.
In the acceleration transducer of patent document 1, support portion has：The engagement that surface is engaged with insulating layer on it
Portion；And in its lower surface and the joint portion for connecting metal layer engagement.
Existing technical literature
Patent document
Patent document 1：No. 2010/032821 bulletin of International Publication
But in the acceleration transducer of patent document 1, support portion is in its lower surface only with connecting metal layer engagement, institute
With easily because generating stress during coefficient of thermal expansion differences mutual between support portion and connection metal layer.
In addition, support portion and the engagement that the engagement for connecting metal layer is silicon and metal, so bond strength may not fill
Point.
In addition, surface is to be engaged via insulating layer with supporting substrate to support portion on it, so while support portion and branch
The engagement of support group plate and the bond stress that generates may be applied to support portion.
Therefore, it is possible to support portion can be damaged with insulating layer and connect the bond stability of metal layer or make temperature special
Property reduce.
Invention content
The object of the present invention is to provide while the bond strength for reducing support portion reduces, temperature characterisitic can be reduced
Physical quantity transducer, physical quantity sensor device, electronic equipment and the moving body of reduction.
The present invention be in order to solve the above problems at least part and invent, and can be realized by following invention.
The physical quantity transducer of the present invention, which is characterized in that have：Base portion；Wiring is configured at the base portion；Support portion,
With being engaged in the first joint portion of the base portion and be engaged in the second joint portion of the wiring；Suspended portion is connected to institute
State support portion；Electrode finger is supported in the suspended portion, and the support portion has the first extension, and first extending area is in institute
It states between the first joint portion and the suspended portion, and is separated with the base portion.
It can obtain as a result, while the reduction of bond strength of support portion is reduced, the reduction of temperature characterisitic can be reduced
Physical quantity transducer.
The present invention physical quantity transducer in, it is preferable that the length at first joint portion with the support portion and
It is longer than the length of the suspended portion on the orthogonal direction in the direction of suspended portion arrangement.
The reduction of temperature characterisitic can be more effectively reduced as a result,.
In the physical quantity transducer of the present invention, it is preferable that first joint portion has the corner with fillet.
Stress concentration be can inhibit as a result, to the corner at the first joint portion, therefore can for example reduce the support caused by corner
There is the situation in crack in stripping or support portion of the portion from base portion.
In the physical quantity transducer of the present invention, it is preferable that the support portion has the second extension, second extension
It is separated positioned at first joint portion and the first extension side opposite side, and with the base portion.
The reduction of temperature characterisitic can be more effectively reduced as a result,.
In the physical quantity transducer of the present invention, it is preferable that the length of first extension is in first extension
It is longer than the length of second extension on the direction arranged with second extension.
As a result, while inhibiting to maximize, the reduction of temperature characterisitic can be preferably reduced.
In the physical quantity transducer of the present invention, it is preferable that first joint portion has notch section, in the notch section
It is configured with second joint portion.
The bond strength of base portion and support portion can be fully improved as a result, make support portion and being electrically connected for wiring more excellent,
Also, it can seek to realize the miniaturization of physical quantity transducer.
In the physical quantity transducer of the present invention, it is preferable that first joint portion includes the branch under overlook observation
A part for the outer rim of support part.
It can not increase support portion as a result, and in the case of the size for keeping first, second extension, make first
Joint portion further increases.
The physical quantity sensor device of the present invention, which is characterized in that there is the physical quantity transducer of the present invention.
The effect of above-mentioned physical quantity transducer can be enjoyed as a result, so as to can obtain the high physical quantity transducer dress of reliability
It puts.
The electronic equipment of the present invention, which is characterized in that there is the physical quantity transducer of the present invention.
The effect of above-mentioned physical quantity transducer can be enjoyed as a result, so as to can obtain the high electronic equipment of reliability.
The moving body of the present invention, which is characterized in that there is the physical quantity transducer of the present invention
There can be the effect of above-mentioned physical quantity transducer as a result, so as to can obtain the high moving body of reliability.
Description of the drawings
Fig. 1 is the vertical view for showing the physical quantity transducer involved by the first embodiment of the present invention.
Fig. 2 is the line A-A sectional view in Fig. 1.
Fig. 3 is the partly enlarged top view of physical quantity transducer shown in FIG. 1.
Fig. 4 is the enlarged partial sectional view of physical quantity transducer shown in FIG. 1.
Fig. 5 is the enlarged partial sectional view of physical quantity transducer shown in FIG. 1.
Fig. 6 is the chart of the relationship for the stress for showing the length of the first extension and being applied to suspended portion.
Fig. 7 is the sectional view for showing the physical quantity transducer involved by second embodiment of the present invention.
Fig. 8 is the partly enlarged top view of physical quantity transducer shown in Fig. 7.
Fig. 9 is the vertical view for showing the physical quantity transducer involved by third embodiment of the present invention.
Figure 10 is the sectional view for showing the physical quantity sensor device involved by the 4th embodiment of the present invention.
Figure 11 is the stereogram for showing the electronic equipment involved by the 5th embodiment of the present invention.
Figure 12 is the stereogram for showing the electronic equipment involved by the sixth embodiment of the present invention.
Figure 13 is the stereogram for showing the electronic equipment involved by the 7th embodiment of the present invention.
Figure 14 is the stereogram for showing the moving body involved by the 8th embodiment of the present invention.
Reference sign
1 physical quantity transducer；2 base portions；21 recess portions；22nd, 23,24 fixed part；25th, 26,27 groove portion；3 sensings
Device element；4 fix electrode portion；41 first fix electrode portion；411 suspended portions；411a, 411b, 411c part；412、412′
412 〞 first fix electrode finger；413 support portions；The first joint portions of 413a；413a ' notch sections；The second joint portions of 413b；
The first extensions of 413c；The second extensions of 413d；42 second fix electrode portion；421 suspended portions；421a、421b、421c
Part；422nd, 422 ' 422 〞 second fix electrode finger；423 support portions；The first joint portions of 423a；423a ' notch sections；423b
Second joint portion；The first extensions of 423c；The second extensions of 423d；51 movable portion supports portions；511 support portions；511a
One joint portion；511a ' notch sections；The second joint portions of 511b；The first extensions of 511c；The second extensions of 511d；512 is outstanding
Frame portion；52 movable parts；521 frame portions；522 first Y-axis extensions；523 first X-axis extensions；524 second Y-axis extensions；
525 second X-axis extensions；526 first protruding portions；527 second protruding portions；528 first opening portions；529 second opening portions；
53rd, 54 spring portion；6 movable electrode portions；61 first movable electrode portions；611st, 611 ', 611 the first movable electrodes of 〞 refer to；62
Second movable electrode portion；621st, 621 ', 621 the second movable electrodes of 〞 refer to；71st, 72,73 wiring；8 caps；81 recess portions；82
Intercommunicating pore；83 seal members；89 glass dust；1000 physical quantity sensor devices；1010 substrate plates；1011 connection terminals；
1012 mounting terminals；1020 circuit elements；1030 molded sections；1100 PCs；1102 keyboards；1104 main parts；
1106 display units；1108 display units；1200 pocket telephones；1202 operation keys；1204 receivers；1206 microphones；
1208 display units；1300 digital cameras；1302 shells；1304 light receiving units；1306 shutter key；1308 memories；
1310 display units；1500 automobiles；1501 car bodies；1502 vehicle attitude controllers；1503 wheels；Ax acceleration；BW1、
BW2 bonding wires；L central shafts；L411 axis；L421 axis；S storage spaces.
Specific embodiment
Hereinafter, it is sensed based on the physical quantity transducer that the present invention will be described in detail of the embodiment shown by attached drawing, physical quantity
Device device, electronic equipment and moving body.
First embodiment
First, illustrate the physical quantity transducer involved by the first embodiment of the present invention.
Fig. 1 is the vertical view for showing the physical quantity transducer involved by the first embodiment of the present invention.Fig. 2 is in Fig. 1
Line A-A sectional view.Fig. 3 is the partly enlarged top view of physical quantity transducer shown in FIG. 1.Fig. 4 and Fig. 5 is shown in FIG. 1
The enlarged partial sectional view of physical quantity transducer.Fig. 6 is the length for showing the first extension and the stress for being applied to suspended portion
The chart of relationship.In addition, hereinafter, for purposes of illustration only, by the upside in the paper in Fig. 1, Fig. 3 nearby side and Fig. 2, Fig. 4, Fig. 5
Also referred to as " on ", the paper back side in Fig. 1, Fig. 3 and the downside in Fig. 2, Fig. 4, Fig. 5 are also referred to as " under ".In addition, such as Fig. 1 extremely
Shown in Fig. 5, using 3 mutually orthogonal axis as X-axis, Y-axis and Z axis, the direction parallel with X-axis is also referred to as " X-direction ", with Y
The parallel direction of axis is also referred to as " Y direction ", and the direction parallel with Z axis is also referred to as " Z-direction ".In addition, the arrow by each axis
The front end side in direction is also referred to as " positive side ", and opposite side is also referred to as " negative side ".
Physical quantity transducer shown in FIG. 1 is the acceleration transducer of the acceleration A x of detectable X-direction.Such object
Reason quantity sensor 1 has：Base portion 2；The sensor element 3 being configured on base portion 2；And in a manner of covering sensor element 3
The cap 8 engaged with base portion 2.
(base portion)
As shown in Figure 1, base portion 2 is formed as the plate of the flat shape with rectangle.In addition, base portion 2 has in upper surface side
There is open recess portion 21.In addition, under the overlook observation from Z-direction, sensor element 3 to be wrapped in the side of inside by recess portion 21
Formula forms bigger than sensor element 3.The recess portion 21 plays work as the backoff portion for preventing sensor element 3 from being contacted with base portion 2
With.
In addition, as shown in Fig. 2, base portion 2 has the fixation rack-like fixed part 22 for being set to 21 bottom surface of recess portion.Also, it passes
Sensor component 3 is engaged in the fixed part 22.In addition, as shown in Figure 1, base portion 2 upper surface side have open groove portion 25,
26、27.In addition, one end of groove portion 25,26,27 is located at the outside of cap 8 respectively, the other end is connect respectively with recess portion 21.
As above-described base portion 2, it is, for example, possible to use the glass material by containing alkaline metal ions (mobile ion)
Expect the glass substrate that (for example, belle heat resistant glass (registered trademark) this borosilicate glass) is formed.As a result, for example, according to
The constituent material of cap 8, base portion 2 can be engaged with cap 8 by anodic bonding, and can carry out strength engagement.In addition, by
In the base portion 2 that can obtain that there is translucency, so can visual confirmation sensor via base portion 2 from the outside of physical quantity transducer 1
The state of element 3.
But base portion 2 is not limited to glass substrate, for example, it is also possible to use silicon substrate or ceramic substrate.In addition, using
In the case of silicon substrate, it is preferable to use high-resistance silicon substrate or surface are due to thermal oxide shape from the viewpoint of short circuit is prevented
Into the silicon substrate of silicon oxide film (insulating properties oxide).
In addition, as shown in Figure 1, groove portion 25,26,27 is provided with wiring 71,72,73.In addition, matching in groove portion 25,26,27
One end of line 71,72,73 is exposed respectively to the outside of cap 8, is played a role as with the terminal that external device (ED) is electrically connected.
In addition, as shown in Fig. 2, the other end of wiring 71,72,73 is pulled around via recess portion 21 to fixed part 22 respectively.Also, wiring
71st, 72,73 respectively in the top of fixed part, is electrically connected with sensor element 3.
Constituent material as wiring 71,72,73 is not particularly limited, it is, for example, possible to use golden (Au), silver-colored (Ag), platinum
(Pt), the metal material of palladium (Pd), iridium (Ir), copper (Cu), aluminium (Al), nickel (Ni), Ti (titanium), tungsten (W) etc., include these metals
Alloy, ITO (the Indium Tin Oxide of material：Tin indium oxide), IZO (Indium Zinc Oxide：Indium zinc oxide),
(example is applied in combination in one or more of these materials by the oxide system transparent conductive material of ZnO, IGZO etc.
Such as, as more than two layers of laminated body).
(cap)
As shown in Figure 1, cap 8 is formed as the plate with rectangular planar shape.In addition, as shown in Fig. 2, cap 8 is under
Surface side has open recess portion 81.Also, cap 8 is engaged with base portion 2, so that sensor element 3 is accommodated in recess portion 81.And
And by cap 8 and base portion 2, it is formed with the storage space S of storage sensor element 3.
In addition, as shown in Fig. 2, cap 8 has the intercommunicating pore 82 inside and outside connection storage space S, and can be via intercommunicating pore 82
Storage space S is replaced with to required appearance.In addition, being configured with sealing element 83 in intercommunicating pore 82, sealed and connected by sealing element 83
Through-hole 82.
As sealing element 83, as long as intercommunicating pore 82 can be sealed, just there is no particular limitation, it is, for example, possible to use golden
(Au) it be alloy, gold (Au)/aluminium (Al) is the various alloys such as alloy, low melting point glass that/tin (Sn), which is alloy, gold (Au)/germanium (Ge),
Glass materials such as glass etc..
In storage space S, it is preferable that the inert gases such as nitrogen, helium are sealed with, on temperature in use (- 40 DEG C~80 DEG C left sides
It is right) under, essentially become atmospheric pressure.By making storage space S that can increase viscous drag for atmospheric pressure and play damping effect, from
And terminate the vibrations of movable part 52 possessed by sensor element 3 rapidly.Therefore, the detection of the acceleration of physical quantity 1 can be improved
Precision.
In the present embodiment, such cap 8 is made of silicon substrate.But silicon substrate is not limited only to as cap 8,
For example, it is also possible to use glass substrate or ceramic substrate.In addition, it is not limited especially as base portion 2 and the joint method of cap 8
It is fixed, according to the material of base portion 2 and cap 8 suitably select, for example, anodic bonding, by plasma irradiation making activation
Composition surface be engaged with each other activation engagement, engaged by the grafting material of glass dust etc., by the upper surface of base portion 2 and lid
Diffusion engagement of metal film engagement that the lower surface in portion 8 is formed etc..
In the present embodiment, as shown in Fig. 2, base portion 2 and cap 8 via an example as grafting material glass dust 89
(low-melting glass) and engage.In a state that base portion 2 is overlapped with cap 8, storage space S's is inside and outside via groove portion 25,26,27
Connection, but by using glass dust 89 while so that the base portion 2 is engaged with cap 8, can seal groove portion 25,26,27, thus
Storage space can be more easily sealed.In addition, base portion 2 and cap 8 by anodic bonding etc. (cannot seal groove portion 25,26,
27 joint method) in the case of engagement, such as SiO can be passed through2Film blocks groove portion 25,26,27, the SiO2Film by using
The formation such as the CVD method of TEOS (tetraethoxysilane).
(sensor element)
As shown in Figure 1, sensor element 3 has：Fixed electrode portion 4, is fixed on base portion 2；Movable portion supports portion 51, it is fixed
In base portion 2；Movable part 52, can displacement in the X-axis direction relative to movable portion supports portion 51；Spring portion 53,54 connects movable part
Support portion 51 and movable part 52；And it is set to the movable electrode portion 6 of movable part 52.Consolidate in addition, fixed electrode portion 4 has first
Electrode portion 42 is fixed in fixed electrode portion 41 and second, and movable electrode portion 6 has the first movable electrode portion 61 and the second movable electrode portion
62.Wherein, movable portion supports portion 51, movable part 52, spring portion 53,54 and movable electrode portion 6 are formed as one.
Such sensor element 3 such as can by by as phosphorus (P), boron (B) impurity adulterate silicon substrate pattern
And it is formed.In addition, sensor element 3 is engaged in base portion 2 (fixed part 22) by anodic bonding.But sensor element 3
There is no particular limitation to the joint method of base portion 2 for material, sensor element 3.
In addition, there is no particular limitation for the thickness of sensor element 3, for example, being 20 μm or more 50 in the present embodiment
Below μm.As a result, while the mechanical strength for fully maintaining sensor element 3, sensor element 3 can be made thinning.Therefore,
It can seek the miniaturization (slimming) of realization physical quantity transducer 1.
It is fixed between the fixation electrode portion 42 of electrode portion 41 and second as shown in Figure 1, movable portion supports portion 51 is located at first.This
Kind movable portion supports portion 51 has：It is fixed on the support portion 511 of fixed part 22；And it is connected to the suspended portion of support portion 511
512.As shown in Fig. 2, this movable portion supports portion 51 is electrically connected in support portion 511 with wiring 71.
In addition, suspended portion 512 is located at the X-direction positive side of support portion 511, be formed as the lengthwise extended in the X-axis direction
Shape.Also, the end of the X-direction negative side of suspended portion 512 is connected to support portion 511.In addition, width (the Y of suspended portion 512
The length of axis direction) it is smaller than the width (length of Y direction) of support portion 511.It can seek to realize the small of suspended portion 512 as a result,
Type, is not accompanied by the enlargement for the movable part 52 being located at around suspended portion 512, and the quality of movable part 52 is made to become larger.Therefore,
While the enlargement for inhibiting sensor element 3, physical quantity can be more accurately detected.In addition, it hereinafter, is seen from Z-direction
Under the overlook observation examined, axis L centered on the imaginary axis that suspended portion 512 is halved in the Y-axis direction.
As shown in Figure 1, movable part 52 is formed as frame-shaped under the overlook observation from Z-direction, movable part branch is surrounded
Support part 51, spring portion 53,54 and first, second fix electrode portion 41,42.As a result, by regarding movable part 52 as frame-shaped, can
While inhibiting the size of movable part 52, the quality bigger of movable part 52 can be made.Therefore, in the large size for inhibiting sensor element 3
While change, physical quantity can be more accurately detected.
In addition, movable part 52 has the first opening portion 528 and the second opening portion 529 being arranged in the Y-axis direction.
Also, the first fixation electrode portion 41 and the first movable electrode portion 61 are configured in the first opening portion 528, in the second opening portion
The second fixation electrode portion 42 and the second movable electrode portion 62 are configured in 529.
In addition, if the shape of movable part 52 is described in detail, movable part 52 has：Frame portion 521, encirclement can
Dynamic portion's support portion 51, spring portion 53,54 and first, second fix electrode portion 41,42；First Y-axis extension 522, positioned at first
The X-direction positive side of opening portion 528 extends from frame portion 521 to Y direction negative side；First X-axis extension 523, from the first Y-axis
The front end of extension 522 extends to X-direction negative side；Second Y-axis extension 524, positioned at the X-axis side of the second opening portion 529
To positive side, extend from frame portion 521 to Y direction positive side；And the second X-axis extension 525, before the second Y-axis extension 524
End extends to X-direction negative side.In addition, first, second Y-axis extension 522,524 is respectively near spring portion 53, along spring
Portion 53 is configured, and first, second X-axis extension 523,525 is located near movable portion supports portion 51 respectively, along movable portion supports portion 51
Configuration.
In addition, movable part 52 has：First protruding portion 526, by fill the first opening portion 528 redundant space in a manner of from
Frame portion 521 is prominent into the first opening portion 528；Second protruding portion 527, to fill the side of the redundant space of the second opening portion 529
Formula is prominent into the second opening portion 529 from frame portion 521.As a result, by setting first, second protruding portion 526,527, can make movable
The quality bigger in portion 52, the enlargement without leading to movable part 52.Therefore, the higher physical quantity transducer of sensitivity can be become
1。
In addition, as shown in Figure 1, spring portion 53 is connected to end and the movable portion supports of the X-direction positive side of movable part 52
The end of the X-direction positive side in portion 51, spring portion 54 are connected to end and the movable portion supports of the X-direction negative side of movable part 52
The end of the X-direction negative side in portion 51.Movable part 52 is can support in the both sides of X-direction as a result, so the posture of movable part 52
And motion stability.Therefore, acceleration can more accurately be detected.
In addition, as shown in Figure 1, fixed electrode portion 4 has：First fixes electrode portion 41, in the first opening portion 528；
Second fixes electrode portion 42, in the second opening portion 529.In addition, these first, second fixation electrode portions 41,42 are in Y-axis side
It is configured to arrangement.
In addition, the first fixation electrode portion 41 has：Support portion 413 is fixed on fixed part 22；Suspended portion 411, is supported in
Support portion 413；Multiple first fix electrode finger 412, extend from suspended portion 411 to Y direction both sides.It is as shown in Fig. 2, such
First fixation electrode portion 41 is electrically connected in support portion 413 with wiring 72.In addition, support portion 413, suspended portion 411 and each
A first fixation electrode finger 412 is formed as one.
In addition, suspended portion 411 is formed as rodlike elongate shape, one end is connected to support portion 413.In addition, suspended portion
411 under the overlook observation from Z-direction, extends along inclined direction is distinguished relative to X-axis and Y-axis.More specifically
For ground, suspended portion 411 is tilted in a manner of becoming larger with front end side of the spacing distance of central axis L towards suspended portion 411.Pass through
In this way, easily support portion 413 is configured near support portion 511.In addition, the axis L411 as suspended portion 411 is relative to X
The gradient of axis, is not particularly limited, but preferably 10 ° or more 45 ° hereinafter, less than more preferred 10 ° or more 30 °.It can press down as a result,
System first fixes extension of the electrode portion 41 to Y direction, so as to seek to realize the miniaturization of sensor element 3.
In addition, the first fixation electrode finger 412 extends from suspended portion 411 to Y direction both sides.That is, first fixes electrode finger
412 have：First fixes electrode finger 412 ', positioned at the Y direction positive side of suspended portion 411；First fixes 412 〞 of electrode finger, is located at
Y direction negative side.In addition, the first fixation electrode finger 412 ', 412 〞 be provided with separated from each other along X-direction respectively it is multiple.
In addition, the length (length of Y direction) of multiple first fixation electrode fingers 412 ' is gradually passed towards X-direction positive side
Subtract.On the other hand, the length (length of Y direction) of 412 〞 of multiple first fixation electrode fingers is gradually passed towards X-direction positive side
Increase.
In addition, as shown in Figure 1, the second fixation electrode portion 42 has：Support portion 423 is fixed on fixed part 22；Suspended portion
421, it is supported in support portion 423；Multiple second fix electrode finger 422, extend from suspended portion 421 to Y direction both sides.Such as Fig. 2
Shown, such second fixation electrode portion 42 is electrically connected in support portion 423 with wiring 73.In addition, support portion 423, outstanding
Frame portion 421 and each second fixation electrode finger 422 are formed as one.
In addition, suspended portion 421 is formed as rodlike elongate shape, one end is connected to support portion 423.In addition, suspended portion
421 under the overlook observation from Z-direction, extends along inclined direction is distinguished relative to X-axis and Y-axis.More specifically
For, suspended portion 421 is tilted in a manner of becoming larger with front end side of the distance of central axis L towards suspended portion 421.It sets in this way
It puts, easily support portion 423 is configured near support portion 511.In addition, axis L421 the inclining relative to X-axis as suspended portion 421
Gradient is not particularly limited, but preferably 10 ° or more 45 ° hereinafter, less than more preferred 10 ° or more 30 °.It can inhibit second as a result,
Fixed extension of the electrode portion 42 to Y direction, so as to seek to realize the miniaturization of sensor element 3.
In addition, the second fixation electrode finger 422 extends from suspended portion 421 to Y direction both sides.That is, second fixes electrode finger
Have：Second fixes electrode finger 422 ', positioned at the Y direction positive side of suspended portion 421；Second fixes 422 〞 of electrode finger, positioned at Y-axis
Direction negative side.In addition, the second fixation electrode finger 422 ', 422 〞 be provided with separated from each other along X-direction respectively it is multiple.
In addition, the length (length of Y direction) of multiple second fixation electrode fingers 422 ' is gradually passed towards X-direction positive side
Increase.On the other hand, the length (length of Y direction) of 422 〞 of multiple second fixation electrode fingers is gradually passed towards X-direction positive side
Subtract.
In addition, as shown in Figure 1, movable electrode portion 6 has：First movable electrode portion 61, in the first opening portion 528；
Second movable electrode portion 62, in the second opening portion 529.
In addition, the first movable electrode portion 61 has：Multiple first movable electrodes refer to 611, positioned at the Y-axis side of suspended portion 411
To both sides, extend along Y direction.Have that is, the first movable electrode refers to 611：First movable electrode refers to 611 ', positioned at suspended portion
411 Y direction positive side；First movable electrode refers to 611 〞, positioned at Y direction negative side.In addition, the first movable electrode refer to 611 ',
611 〞 are provided with multiple separated from each other along X-direction respectively.
In addition, each first movable electrode refers to 611 is being located at X-direction just relative to the corresponding first fixation electrode finger 412
Side, it is via gap and opposite with the first fixation electrode finger 412.
In addition, the length (length of Y direction) that multiple first movable electrodes refer to 611 ' is gradually passed towards X-direction positive side
Subtract.On the other hand, multiple first movable electrodes refer to the length (length of Y direction) of 611 〞 and are gradually passed towards X-direction positive side
Increase.
In addition, as shown in Figure 1, the second movable electrode portion 62 has：Multiple second movable electrodes refer to 621, positioned at suspended portion
421 Y direction both sides, extend along Y direction.Have that is, the second movable electrode refers to 621：Second movable electrode refers to 621 ', position
In the Y direction positive side of suspended portion 421；Second movable electrode refers to 621 〞, positioned at Y direction negative side.In addition, the one or two moving electrode
621 ', 621 〞 of finger are provided with multiple separated from each other along X-direction respectively.
In addition, each second movable electrode refers to 621 is being located at X-direction just relative to the corresponding second fixation electrode finger 422
Side, it is via gap and opposite with the second fixation electrode finger 422.
In addition, the length (length of Y direction) that multiple second movable electrodes refer to 621 ' is gradually passed towards X-direction positive side
Increase.On the other hand, multiple second movable electrodes refer to the length (length of Y direction) of 621 〞 and are gradually passed towards X-direction positive side
Subtract.
More than, the composition of physical quantity transducer 1 is briefly described.Applying X to such physical quantity transducer 1
During the acceleration of axis direction, movable part 52 according to the size of the acceleration make spring portion 43,54 carry out flexible deformation while in X
Displacement in axis direction.Along with such displacement, the first movable electrode refers to 611 and first and fixes the gap and the of electrode finger 412
Two movable electrodes refer to 621 gaps that electrode finger 422 is fixed with second and change respectively, and along with the displacement, the first movable electricity
Pole refer to 611 and the first static capacity between fixation electrode finger 412 size and the second movable electrode refer to 621 fixed with second it is electric
The size that pole refers to the static capacity between 422 changes respectively.Therefore, can acceleration be detected according to the variation of these static capacities.
Especially, in present embodiment, each first movable electrode refers to 611 and fixes electrode finger relative to corresponding first
412 are located at X-direction positive side, on the contrary, each second movable electrode refers to 621 fixes electrode finger 422 relative to corresponding second
In X-direction negative side.That is, each first movable electrode refers to 611 is located at X-axis side relative to the first pairs of fixation electrode finger 412
To the side of (first direction), each second movable electrode refers to 621 and is located at X-axis relative to the second pairs of fixation electrode finger 422
The opposite side in direction (first direction).Therefore, when the acceleration for applying X-direction, the first movable electrode refers to 611 and first and consolidates
Fixed electrode refers to 412 gap shrinks, and the second movable electrode refers to 621 and second and fixes the gap enlargement of electrode finger 422, Huo Zhexiang
Instead, the first movable electrode refers to 611 and first fixes the gap enlargement of electrode finger 412, and the second movable electrode, which refers to 621 and second, to be fixed
The gap shrinks of electrode finger 422.So as to by being obtained between referring to 611 from the first fixation 412 and first movable electrode of electrode finger
First detection signal and from second fixation 422 and second movable electrode of electrode finger refer to obtained between 621 second detection signal
Differential operational is carried out, noise can be eliminated, so as to more accurately detect acceleration.
According to such physical quantity transducer 1, between the first fixation 412 and first movable electrode of electrode finger refers to 611 and the
Between two fixation 422 and second movable electrodes of electrode finger refer to 621, fully big static capacity is respectively formed, and can be made each
The length of a electrode finger 412,422,611,621 shortens.Therefore, excellent accuracy of detection can be played, while may also suppress each
The breakage of electrode finger 412,422,611,621, so as to become the physical quantity transducer 1 that can play excellent impact resistance.
Further, while the breakage for inhibiting each interdigital primary grades 412,422,611,621, can also make each electrode finger 412,
422nd, 611,621 thickness is thinning, so as to seek to realize the miniaturization of physical quantity transducer 1.
Especially, in physical quantity transducer 1, suspended portion 411,421 is distinguished respectively along relative to X-direction and Y direction
Inclined direction extension.It multiple first fixes in electrode finger 412 as a result, may include that shorter first fixes interdigital 412, so as to
First fixation electrode portion 41 is whole more not easily damaged.Similarly, may include in multiple second fixation electrode fingers 422 shorter
Second fixes electrode finger 422, whole further not easily damaged so as to fix electrode portion 42 as second.First movable electrode refers to
611 and second movable electrode to refer to 621 same.Therefore, each electrode finger 412,422,611,621 further can effectively be inhibited
Breakage, from as the physical quantity transducer 1 of superior impact resistance can be played.
Next, bonding part, the first fixation electrode portion 41 to movable portion supports portion 51 and fixed part 22 (base portion 2)
The joint portion of electrode portion 42 and fixed part 22 (base portion 2) is fixed with the bonding part of fixed part 22 (base portion 2) and second
The composition divided, is described in detail respectively.
As shown in Figures 3 and 4, the support portion 511 in movable portion supports portion 51 has：First joint portion 511a is engaged in solid
Determine frame portion 22；Second joint portion 511b, is engaged in wiring 71.In addition, as described above, sensor element 3 passes through anode with base portion 2
Engagement directly engages, thus the shape of the first joint portion 511a is substantial and support portion 511 on the contact with fixed part 22
Partial shape is equal.In addition, there is no component between support portion 511 and wiring 71, and directly engage, so the second joint portion
The shape of 511b substantially with being equal with the shape of the contact portion of wiring 71 on support portion 511.
In addition, support portion 511 has：First extension 511c, between the first joint portion 511a and suspended portion 512,
It is separated with base portion 2.As a result, by having the first extension 511c, the thermal stress of the first joint portion 511a is resulted from (by as base
The glass of the constituent material in portion 2 and thermal stress caused by the coefficient of thermal expansion differences of the silicon of the constituent material as sensor element 3.
Hereinafter, identical) it absorbs and slows down by the first extension 511c, so as to be not easy to pass to suspended portion 512.Therefore, it can inhibit
The undesirable deformation of the suspended portion 512 as caused by thermal stress.
In addition, as depicted in figs. 3 and 5, the support portion 413 of the first fixation electrode portion 41 has：First joint portion 413a, connects
Together in fixed part 22；Second joint portion 413b, is engaged in wiring 72.In addition, as described above, sensor element 3 is logical with base portion 2
Anodic bonding is crossed directly to engage, thus the shape of the first joint portion 413a substantially on support portion 413 with fixed part 22
The shape of contact portion be equal.In addition, not there are component between support portion 413 and wiring 72, and directly engage, so the
The shape of two joint portion 413b substantially with being equal with the shape of the contact portion of wiring 72 on support portion 413.
In addition, support portion 413 has：First extension 413c, between the first joint portion 413a and suspended portion 411,
It is separated with base portion 2.As a result, by having the first extension 413c, the thermal stress of the first joint portion 413a is resulted from by first
Extension 413c is absorbed and is slowed down, so as to be not easy to pass to suspended portion 411.Therefore, it can inhibit the suspension as caused by thermal stress
The undesirable deformation in portion 411.
In addition, as depicted in figs. 3 and 5, the support portion 423 of the second fixation electrode portion 42 has：First joint portion 423a, connects
Together in fixed part 22；Second joint portion 423b, is engaged in wiring 73.In addition, as described above, sensor element 3 is logical with base portion 2
Anodic bonding is crossed directly to engage, thus the shape of the first joint portion 423a substantially on support portion 423 with fixed part 22
The shape of contact portion be equal.In addition, not via component between support portion 423 and wiring 73, and directly engage, so the
The shape of two joint portion 423b substantially with being equal with the shape of the contact portion of wiring 73 on support portion 423.
In addition, support portion 423 has：First extension 423c, between the first joint portion 423a and suspended portion 421,
It is separated with base portion 2.As a result, by having the first extension 423c, the thermal stress of the first joint portion 423a is resulted from by first
Extension 423c is absorbed and is slowed down, so as to be not easy to pass to suspended portion 421.Therefore, it can inhibit the suspension as caused by thermal stress
The undesirable deformation in portion 421.
As a result, by inhibiting the deformation of the suspended portion 512,411,421 as caused by thermal stress, nature can inhibit (no
Apply the stationary state of acceleration A x) under the first movable electrode refer to 611 variations with the relative position of the first fixation electrode finger 412
And second movable electrode refer to 621 and second fix electrode finger 422 relative position variation.Therefore, it can inhibit nature
Lower first movable electrode refer to 611 and first the static capacity between fixation electrode finger 412 and the second movable electrode refer to 621 and the
Static capacity between two fixation electrode fingers 422 changes caused by environment temperature.It can inhibit physical quantity transducer 1 as a result,
Temperature characterisitic reduction, so as to more accurately detect acceleration A x.
Further, support portion 511 can be sufficiently ensured support portion 511 and fixed frame by having the second joint portion 511b
While the bond strength in portion 22, support portion 511 can be made to carry out excellent be electrically connected with wiring 71.Similarly, support portion 413 is logical
It crosses and has the second joint portion 413b, while can be sufficiently ensured support portion 413 and the bond strength of fixed part 22, support can be made
Portion 413 carries out excellent be electrically connected with wiring 73.In addition, support portion 423 can be sufficiently ensured by having the second joint portion 423b
While support portion 423 and the bond strength of fixed part 22, support portion 423 can be made to carry out excellent be electrically connected with wiring 73.
By upper, physical quantity transducer 1 has：Base portion 2；Wiring 71,72,73, is configured at base portion 2；Support portion 511, has
It is engaged in the first joint portion 511a of base portion 2 and is engaged in the second joint portion 511b of wiring 71；Support portion 413, has and connects
The first joint portion 413a together in base portion 2 and the second joint portion 413b for being engaged in wiring 72；Support portion 423 has engagement
In base portion 2 the first joint portion 423a and be engaged in the second joint portion 423b of wiring 73；Suspended portion 512 is connected to support
Portion 511；Suspended portion 411 is connected to support portion 413；Suspended portion 421 is connected to support portion 423；First, second movable electrode refers to
611st, 621, it is supported in suspended portion 512 as electrode finger；First fixes electrode finger 412, and suspended portion is supported in as electrode finger
411；Second fixes electrode finger 422, and suspended portion 421 is supported in as electrode finger.Also, support portion 511 has to be connect positioned at first
The the first extension 511c separated between conjunction portion 511a and suspended portion 512 and with base portion 2, support portion 413 has to be connect positioned at first
The the first extension 413c separated between conjunction portion 413a and suspended portion 411 and with base portion 2, support portion 423 has to be connect positioned at first
The the first extension 423c separated between conjunction portion 423a and suspended portion 421 and with base portion 2.By this composition, as described above,
While the bond strength of support portion 511,413,423 is inhibited to decline, the available physical quantity that temperature characterisitic can be inhibited to decline
Sensor 1.
In addition, the length L13 of the X-direction (stretching out direction) as the first extension 511c is not particularly limited, according to
Size of support portion 511 etc. and it is different, for example, when the length of the X-direction of support portion 511 is set as L19, L13 preferably 0.2 ×
More than L19,0.4 × below L19.Said effect (that is, absorbing and slow down the effect of thermal stress) can be given full play to as a result,.In addition,
The enlargement of excessive (more than the necessity) of the first extension 511c can be prevented, inhibition impact characteristics be (the first extension 511c's
Mechanical strength) reduction.In addition, can be sufficiently ensured the size of the first joint portion 511a, and can fully maintain support portion 511 with
The higher bond strength of fixed part 22.The length L23's of the X-direction of first extension 413c and the first extension 423c
The length L33 of X-direction is same.
In addition, the length L18 of the X-direction (stretching out direction) as the first joint portion 511a is not particularly limited, according to
Size of support portion 511 etc. and it is different, for example, when the length of the X-direction of support portion 511 is set as L19, L18 preferably 0.4 ×
More than L19,0.7 × below L19.Can be sufficiently ensured the size of the first joint portion 511a as a result, and can maintain support portion 511 with
The very high bond strength of fixed part 22.In addition, it can be ensured that the fully length L13 of the first long extension 511c can fill
Said effect (that is, absorbing and slow down the effect of thermal stress) is waved in distribution.The length L28 of the X-direction of first joint portion 413a with
And first joint portion 423a X-direction length L38 it is same.
Here, the length L19 of the X-direction of support portion 511 is not particularly limited, for example, it is preferable to 80 μm or more 120 μm with
Under, less than more preferable 90 μm or more 110 μm.As a result, while the size for inhibiting support portion 511, the can be substantially ensured respectively
One joint portion 511a and the first extension 511c sizes.In addition, the length L13 as the first extension 511c in this case
It is not particularly limited, for example, it is preferable to less than 16 μm or more 48 μm Zuo You, less than more preferred 18 μm or more 44 μm.Here, Fig. 6
For the model for being 100 μm about the length L19 of support portion 511, the length L13 of the first extension 511c is shown and is applied to suspension
The chart of the relationship of the stress in portion 512.It was found from the figure that the length L13 of the first extension 511c at 30 μm (that is, L13≤0.3
× L19) in following range, stress drastically declines, in the range (that is, 0.3 × L19 of L13 ＞) more than 30 μm, under stress
It drops shallower.From the chart it is found that in order to while the excessive enlargement for preventing the first extension 511c, excellent answer is played
Power relaxation properties, the length L13 of the first extension 511 preferably comprise the front and rear range of 30 μm (that is, L13=0.3 × L19),
That is, as described above, 0.2 × more than L19,0.4 × below L19.
In addition, in present embodiment, although support portion 511,413,423 has the first extension, support portion respectively
511st, it is at least one in 413,423 to have the first extension.That is, can s omit first extension 511c, 413c, 423c in
One or two.
In addition, as shown in figure 3, (direction, that is, X-direction arranged with support portion 511 and suspended portion 512 is just in Y direction
The direction of friendship) on, the length L11 of the first joint portion 511a can be than the length L12 long of suspended portion 512.It is fully maintaining as a result,
While support portion 511 and the higher bond strength of fixed part 22, the thermal stress generated on the first joint portion 511a can be made
Further it is not easy to be transmitted to suspended portion 512.Similarly, in the Y-axis direction, the length L21 of the first joint portion 413a compares suspension
The length L22 long in portion 411.As a result, while support portion 413 and the very high bond strength of fixed part 22 is maintained, make
The thermal stress for resulting from the first joint portion 413a is further not easy to be transmitted to suspended portion 421.Similarly, in the Y-axis direction,
The length L31 of one joint portion 423a is than the length L32 long of suspended portion 421.Maintaining support portion 423 and fixed part 22 as a result,
Very high bond strength while, the thermal stress for resulting from the first joint portion 423a is made further to be not easy to be transmitted to suspension
Portion 421.Therefore, by physical quantity transducer 1, the reduction of temperature characterisitic further can effectively be inhibited.
In addition, in movable portion supports portion 51, as the length L11 of the first joint portion 511a and the length of suspended portion 512
The relationship of L12 is not particularly limited, and can be L11=L12.May be L11 ＜ L12.In addition, fix electrode portion 41 first
In, the relationship of the length L22 of the length L21 and suspended portion 411 as the first joint portion 413a is also not particularly limited, Ke Yiwei
L21=L22, or L21 ＜ L22.In addition, it is fixed in electrode portion 42 second, the length as the first joint portion 423a
The relationship of L31 and the length L32 of suspended portion 421 are also not particularly limited, and can be L31=L32, or L31 ＜ L32.
In addition, as shown in figure 3, support portion 511 has the second extension 511d, second extension 511d connects positioned at first
The opposite side (X-direction negative side) of the first extension 511c of conjunction portion 511a, separates with base portion 2.Pass through this second extension
511d also can absorb and slows down the thermal stress for resulting from the first joint portion 511a, so the heat for resulting from the first joint portion 511a should
Power is further not easy to be transmitted to suspended portion 512.Similarly, support portion 413 has the second extension 413d, second extension
413d is located at the opposite side (X-direction negative side) of the first extension 413c of the first joint portion 413a, is separated with base portion 2.Pass through
This second extension 413d also can absorb and slows down the thermal stress for resulting from the first joint portion 413a, is connect so resulting from first
The thermal stress of conjunction portion 413a is further not easy to be transmitted to suspended portion 411.Similarly, support portion 423 has the second extension
423d, second extension 423d are located at the opposite side (X-direction negative side) of the first extension 423c of the first joint portion 423a,
It is separated with base portion 2.It is also can absorb by this second extension 423d and slows down the thermal stress for resulting from the first joint portion 423a,
So the thermal stress for resulting from the first joint portion 423a is further not easy to be transmitted to suspended portion 421.Therefore, it is passed by physical quantity
Sensor 1 further can effectively inhibit the reduction of temperature characterisitic.
In addition, support portion 511 can not also have the second extension 511d.Similarly support portion 413 can not also have second
Extension 413d, support portion 423 can not also have the second extension 423d.
In addition, as shown in figure 3, X-direction (the first extension 511c and the second extension 511d arrangement direction) on,
The length L13 of first extension 511c is than the length L14 long of the second extension 511d.Inhibit as a result, effectively to suspended portion 512
While transmitting thermal stress, the enlargement of the second extension 511d can inhibit.Similarly, in X-direction (the first extension 413c
With the direction of the second extension 413d arrangements) on, length of the length L23 than the second extension 413d of the first extension 413c
L24 long.As a result, while effectively inhibiting to transmit thermal stress to suspended portion 411, the large size of the second extension 413d can inhibit
Change.Similarly, in X-direction (direction of the first extension 423c and the second extension 423d arrangements), the first extension
The length L33 of 423c is than the length L34 long of the second extension 423d.Effectively inhibiting to transmit thermal stress to suspended portion 421 as a result,
While, it can inhibit the enlargement of the second extension 423d.Therefore, by physical quantity transducer 1, it can inhibit the same of enlargement
When, further effectively inhibit the reduction of temperature characterisitic.
In addition, in movable portion supports portion 51, length L13's and the second extension 511d as the first extension 511c
The relationship of length L14 is not particularly limited, and can be L13=L14, or L13 ＜ L14.In addition, fix electrode first
In portion 41, the relationship of length L23 and the length L24 of the second extension 413d as the first extension 413c also do not limit especially
It is fixed, can be L23=L24, or L23 ＜ L24.In addition, it is fixed in electrode portion 42 second, as the first extension
The length L33 of 423c and the relationship of the length L34 of the second extension 423d are also not particularly limited, and can be L33=L34,
Can be L33 ＜ L34.
In addition, as shown in figure 3, in support portion 511, the first joint portion 511a has notch section 511a ', in notch section
511a is provided with the second joint portion 511b.By this composition, the first joint portion 511a and the second joint portion are fully being kept
While the size of 511b, it can seek to realize the miniaturization of support portion 511.Similarly, in support portion 413, the first joint portion
413a has notch section 413a ', and notch section 413a ' is provided with the second joint portion 413b.By this composition, fully keeping
While the size of first joint portion 413a and the second joint portion 413b, it can seek to realize the miniaturization of support portion 413.Equally
Ground, in support portion 423, the first joint portion 423a has notch section 423a ', and notch section 423a ' is provided with the second joint portion
423b.By this composition, while the size for fully keeping the first joint portion 423a and the second joint portion 423b, can seek
Realize the miniaturization of support portion 423.Therefore, base portion 2 and sensor element 3 (support portion 511,413,423) can fully be improved
Bond strength, make sensor element 3 and wiring 71,72,73 carry out it is excellent be electrically connected, can further seek to realize that physical quantity passes
The miniaturization of sensor 1.
In addition, the first joint portion 511a can not also have notch section 511a '.Similarly, the first joint portion 413a may not be used yet
Has notch section 413a '.Similarly, the first joint portion 423a can not also have notch section 423a '.
In addition, as shown in figure 3, in support portion 511, the first joint portion 511a is in the overlook observation from Z-direction
Under, a part for the outer rim comprising support portion 511.Specifically, the first joint portion 511a is seen in the vertical view from Z-direction
It examines down, the both ends of Y direction are Chong Die with the outer rim of support portion 511.By this composition, the Y-axis of the first joint portion 511a can be made
The length in direction is longer, so support portion 511 can not be made to become larger, and can keep first, second extension 511c, 511d's
In the case of size, the first joint portion 511a can be made to become larger, so as to improve the bond strength of support portion 511 and fixed part 22.
But the first joint portion 511a can be Y direction only one end it is Chong Die with the outer rim of support portion 511 or any one
End is all Chong Die with the outer rim of support portion 511.
Similarly, in support portion 413, the first joint portion 413a includes branch under the overlook observation from Z-direction
A part for the outer rim of support part 413.Specifically, the first joint portion 413a is under the overlook observation from Z-direction, Y-axis
One end of direction positive side is Chong Die with the outer rim of support portion 413.By this composition, the Y direction of the first joint portion 413a can be made
Length it is longer, so support portion 413 can not be made to become larger, and can be in the size for keeping first, second extension 413c, 413d
In the case of, the first joint portion 413a can be made to become larger, so as to improve the bond strength of support portion 413 and fixed part 22.But
First joint portion 413a can be that the both ends of Y direction are Chong Die with the outer rim of support portion 413 or any one end all with branch
The outer rim overlapping of support part 413.
Similarly, in support portion 423, the first joint portion 423a includes branch under the overlook observation from Z-direction
A part for the outer rim of support part 423.Specifically, the first joint portion 423a is under the overlook observation from Z-direction, Y-axis
One end of direction positive side is Chong Die with the outer rim of support portion 423.By this composition, the Y direction of the first joint portion 423a can be made
Length it is longer, so support portion 423 can not be made to become larger, and can be in the size for keeping first, second extension 423c, 423d
In the case of, the first joint portion 423a can be made to become larger, so as to improve the bond strength of support portion 423 and fixed part 22.But
First joint portion 423a can be that the both ends of Y direction are Chong Die with the outer rim of support portion 423 or any one end all with branch
The outer rim overlapping of support part 413.
Second embodiment
Next, the physical quantity transducer involved by second embodiment of the present invention is illustrated.
Fig. 7 is the sectional view for showing the physical quantity transducer involved by second embodiment of the present invention.Fig. 8 is Fig. 7 institutes
The partly enlarged top view of the physical quantity transducer shown.
Physical quantity transducer 1 involved by present embodiment is in addition to the composition difference of first joint portion 511a, 413a, 423a
In addition, it is substantially identical with the physical quantity transducer of above-mentioned first embodiment 1.
In addition, in the following description, about the physical quantity transducer 1 of second embodiment, with above-mentioned first embodiment party
It is illustrated centered on the difference of formula, and omits the explanation of identical item.In addition, in Fig. 7 and Fig. 8, pair with it is above-mentioned first real
The identical composition of mode is applied, marks identical reference numeral.
As shown in fig. 7, base portion 2 has 3 fixed parts 22,23,24 for being set to recess portion 21.These fixed parts 22,
23rd, 24 to may also be that the fixed part 22 of above-mentioned first embodiment is divided into the fixed frame of 3 in the Y-axis direction.This
Outside, wiring 71 has been pulled around in fixed part 22, wiring 72 has been pulled around in fixed part 23, wiring has been pulled around in fixed part 24
73.Also, support portion 511 is bonded in fixed part 22, support portion 413 is bonded in fixed part 23, in fixed part 24
It is bonded to support portion 423.
As shown in figure 8, in support portion 511, the first joint portion 511a is whole under the overlook observation from Z-direction
Body supported portion 511 is surrounded.That is, the first joint portion 511a is under the overlook observation from Z-direction, not comprising support portion
511 outer rim.By this composition, for example, the silicon substrate for being engaged in base portion 2 is made to pattern so as to form sensor element 3
When, even if generating mask misalignment, support portion 511 misplaces relative to the forming position of fixed part 22 relative to specified position, the
Peripheral part of one joint portion 511a may be allowed the dislocation, so as to can inhibit the reduction of the area of the first joint portion 511a.Therefore,
It can maintain the bond strength of support portion 511 and fixed part 22.
Similarly, in support portion 413, the first joint portion 413a is under the overlook observation from Z-direction, whole quilt
Support portion 413 surrounds.It is identical with above-mentioned support portion 511 by this composition, even if producing mask misalignment, can also maintain to prop up
Support part 413 and the bond strength of fixed part 23.
Similarly, in support portion 423, the first joint portion 423a is whole under the overlook observation from Z-direction
Supported portion 423 is surrounded.It is identical with above-mentioned support portion 511 by this composition, even if producing mask misalignment, can also maintain
Support portion 423 and the bond strength of fixed part 24.
In addition, in support portion 511, the first joint portion 511a has the corner with fillet.For more specifically, the
For one joint portion 511a under the overlook observation from Z-direction, the shape for removing notch section 511a ' is rectangle substantially,
Each corner carries fillet.By such composition, it can inhibit stress to concentrate to the corner of the first joint portion 511a, so for example
It can inhibit the support portion 511 as caused by corner and crack occur from fixed part 22 (base portion 2) stripping or support portion 511
Situation.
Similarly, in support portion 413, the first joint portion 413a has the corner with fillet.For more specifically,
For first joint portion 413a under the overlook observation from Z-direction, the shape for removing notch section 413a ' is rectangle substantially,
Its each corner carries fillet.By such composition, it can inhibit stress to concentrate to the corner of the first joint portion 413a, so example
As can inhibit the support portion 413 as caused by corner from fixed part 23 remove or support portion 413 in there is the situation in crack.
Similarly, in support portion 423, the first joint portion 423a has the corner with fillet.For more specifically,
For first joint portion 423a under the overlook observation from Z-direction, the shape for removing notch section 423a ' is rectangle substantially,
Its each corner carries fillet.By such composition, stress is can inhibit to concentrate to the corner of the first joint portion 423a, so,
For example, can inhibit the support portion 423 as caused by corner from fixed part 24 remove or support portion 423 in there are the feelings in crack
Condition.
Therefore, by this composition, the high physical quantity transducer 1 of mechanical strength can be become.
By the composition of this second embodiment, the effect identical with above-mentioned first embodiment can also be played.
Third embodiment
Next, the physical quantity transducer involved by third embodiment of the present invention is illustrated.
Fig. 9 is the vertical view for showing the physical quantity transducer involved by third embodiment of the present invention.In addition, in order to just
In explanation, the diagram to base portion, cap and wiring is omitted in fig.9, only sensor element is illustrated.
Physical quantity transducer 1 involved by present embodiment other than the composition difference of sensor element 3, substantially with it is upper
The physical quantity transducer 1 for stating first embodiment is identical.
In addition, in the following description, about the physical quantity transducer 1 of third embodiment, with above-mentioned second embodiment party
It is illustrated centered on the difference of formula, and omits the explanation about identical item.In addition, in Fig. 9, about with it is above-mentioned first real
The identical composition of mode is applied, marks identical reference numeral.
As shown in figure 9, in the present embodiment, movable portion supports portion 51 is set to the outside of movable part 52.It is in addition, movable
Portion's support portion 51 is provided with a pair in a manner of clamping movable part 52, in X-direction.Though in addition, not illustrated, correspond to
Movable portion supports portion 51 is provided with a pair, and fixed part 22 is also provided with a pair.In addition, the movable part positioned at X-direction positive side
Support portion 51 is connected to movable part 52 via spring portion 53, positioned at the movable portion supports portion 51 of X-direction negative side via spring 54
It is connected to movable part 52.
In addition, each movable portion supports portion 51 is identical with above-mentioned second embodiment, have support portion 511 and suspended portion
512.In addition, each support portion 511 has：First joint portion 511a, is engaged in fixed part 22；Second joint portion 511b, connects
Together in wiring 71；First extension 511；And the second extension 511d.
In addition, the first fixation electrode portion 41 is identical with above-mentioned second embodiment, have support portion 413 and suspended portion 411.
In addition, suspended portion 411 has：The part 411a extended from support portion 413 to Y direction negative side；And from part 411a's
Part 411b, 411c that front end extends to X-direction both sides, wherein, multiple first fix electrode finger 412 from part
411b, 411c extend towards Y direction positive side.In addition, support portion 413 has：First joint portion 413a, is engaged in fixed frame
Portion 23；Second joint portion 413b, is engaged in wiring 72；First extension 413c is configured at the first joint portion 413a and part
Between 411a；Second extension 413d is configured at the opposite side of the first extension 413c of the first joint portion 413a.
In addition, the second fixation electrode portion 42 is identical with above-mentioned second embodiment, have support portion 423,421 and of suspended portion
Second fixes electrode finger 422.In addition, suspended portion 421 has：The part extended from support portion 423 to Y direction positive side
421a；Part 421b, the 421c extended from the front end of part 421a to X-direction both sides, wherein, multiple second fix electricity
Pole refers to 422 and extends from part 421b, 421c towards Y direction negative side.In addition, support portion 423 has：First joint portion
423a is engaged in fixed part 24；Second joint portion 423b, is engaged in wiring 73；First extension 423c is configured at first and connects
Between conjunction portion 423a and part 421a；Second extension 423d is configured at the first extension 423c's of the first joint portion 423a
Opposite side.
By this third embodiment, the effect identical with above-mentioned first embodiment can be also played.Especially, this reality
It applies in mode, a pair of of movable portion supports portion 51 is configured in the outside of movable part 52, it is possible to more stably support movable part
52.Therefore, the posture of movable part 52 and action are more stablized, so as to more accurately detect acceleration A x.
4th embodiment
Next, the physical quantity transducer equipment involved by the 4th embodiment of the present invention is illustrated.
Figure 10 is the sectional view for showing the physical quantity sensor device involved by the 4th embodiment of the present invention.
As shown in Figure 10, physical quantity transducer equipment 1000 has：Substrate plate 1010；Physical quantity transducer 1, is set to base
On bottom plate 1010；Circuit element 1020 (IC), is set on physical quantity transducer 1；Bonding wire BW1, by physical quantity transducer 1 and electricity
Circuit component 1020 is electrically connected；Substrate plate 1010 and circuit element 1020 are electrically connected by bonding wire BW2；And molded section 1030, by object
Reason quantity sensor 1 and circuit element 1020 mold.Here, above-mentioned first~third embodiment can be used in physical quantity transducer 1
Any one of.
Substrate plate 1010 is the substrate for supporting physical quantity transducer 1, for example, for interposer substrate.In this substrate plate
1010 upper surface is configured with multiple connection terminals 1011, and multiple mounting terminals 1012 are configured in lower surface.In addition, in substrate
Internal wirings (not shown) are configured in plate 1010, each connection terminal 1011 is through thus internal wirings and corresponding mounting terminal
1012 are electrically connected.It is not particularly limited as this substrate plate 1010, it is, for example, possible to use silicon substrate, ceramic substrate, tree
Aliphatic radical plate, glass substrate, glass epoxy substrate etc..
In addition, the base portion 2 of physical quantity transducer 1 is configured at towards downside (1010 side of substrate plate) on substrate plate 1010.And
And physical quantity transducer 1 is engaged via joint element with substrate plate 1010.
In addition, circuit element 1020 is configured on physical quantity transducer 1.Also, circuit element 1020 is via joint element
It is engaged with the cap 8 of physical quantity transducer 1.In addition, circuit element 1020 is via bonding wire BW1 and the wiring of physical quantity transducer 1
71st, it 72,73 is electrically connected, is electrically connected via bonding wire BW2 and the connection terminal 1011 of substrate plate 1010.In this circuit
In element 1020, include the driving circuit of driving physical quantity transducer 1 as needed, based on from the defeated of physical quantity transducer 1
Go out the detection circuit of signal detection acceleration, the signal of self-detection circuit in future is converted to specified signal and the output circuit of output
Deng.
In addition, molded section 1030 is by 1020 molding of physical quantity transducer 1 and circuit element.Physical quantity can be protected as a result,
Sensor 1 and circuit element 1020 be not by damages such as moisture, dust, impacts.It is not particularly limited as molded section 1030, example
Such as, the expoxy glass resin of thermohardening type can be used, for example, can be patterned by transfer moudling.
This physical quantity sensor device 1000 has physical quantity transducer 1.Therefore, physical quantity transducer 1 can be enjoyed
Effect, so as to obtain the high physical quantity sensor device 1000 of reliability.
In addition, the composition as physical quantity sensor device 1000 is not limited only to above-mentioned composition, for example, it can be physics
Quantity sensor 1 is accommodated in the such composition of ceramic package.
5th embodiment
Next, the electronic equipment involved by the 5th embodiment of the present invention is illustrated.
Figure 11 is the stereogram for showing the electronic equipment involved by the 5th embodiment of the present invention.
The PC 1100 of movable type (or notebook type) shown in Figure 11 is to be applicable in the physical quantity for having the present invention
The equipment of the electronic equipment of sensor.In the figure, PC 1100 is by having the main part 1104 of keyboard 1102 and tool
The display unit 1106 of standby display unit 1108 is formed, display unit 1106 via hinged structures portion be rotatably supported in
Main part 1104.The physical quantity transducer 1 to play a role as acceleration transducer is built-in in this PC 1100.This
In, any one of above-mentioned first~third embodiment can be used in physical quantity transducer 1.
This PC 1100 (electronic equipment) has physical quantity transducer 1.Therefore, above-mentioned physical quantity transducer is enjoyed
1 effect can play higher reliability.
Sixth embodiment
Next, the electronic equipment involved by the sixth embodiment of the present invention is illustrated.
Figure 12 is the stereogram for showing the electronic equipment involved by the sixth embodiment of the present invention.
Pocket telephone 1200 (also comprising PHS) shown in Figure 12 is to be applicable in the physical quantity transducer for having the present invention
Electronic equipment equipment.In the figure, pocket telephone 1200 has antenna (not shown), multiple operation keys 1202, listens
Cylinder 1204 and microphone 1206, wherein, display unit 1208 is configured between operation key 1202 and receiver 1204.This portable electric
The physical quantity transducer 1 to play a role as acceleration transducer is accommodated in phone 1200.Here, physical quantity transducer 1 can
Use any one of above-mentioned first~third embodiment.
This PC 1100 (electronic equipment) has physical quantity transducer 1.Therefore, above-mentioned physical quantity transducer is enjoyed
1 effect can play higher reliability.
7th embodiment
Next, the electronic equipment involved by the 7th embodiment of the present invention is illustrated.
Figure 13 is the stereogram for showing the electronic equipment involved by the 7th embodiment of the present invention.
Digital camera 1300 shown in Figure 13 is to be applicable in the electronic equipment for having the physical quantity transducer of the present invention to set
It is standby.In the figure, the back side of shell (fuselage) 1302 is provided with display unit 1310, consist of based on caused by CCD into
As signal is shown, display unit 1310 plays a role as the view finder that subject is shown as to electronic image.In addition,
The face side (back side in figure) of shell 130 is provided with the light-receiving for including optical lens (imaging optical system) or CCD etc.
Unit 1304.Also, after photographer's confirmation is shown in the subject image of display unit 1310, when pressing shutter key 1306,
The imaging signal of CCD at this time is forwarded and is stored in memory 1308.It is built-in in this digital camera 1300 as acceleration
The physical quantity transducer 1 that degree sensor plays a role.Here, above-mentioned first~third embodiment party can be used in physical quantity transducer 1
Any one of formula.
This digital camera 1300 (electronic equipment) has physical quantity transducer 1.Therefore, above-mentioned physical quantity transducer is enjoyed
1 effect can play higher reliability.
In addition, the electronic equipment of the present invention is in addition to above-mentioned PC and pocket telephone and present embodiment
Other than digital camera, it is equally applicable to such as smart phone, tablet computer terminal, wrist-watch (including smartwatch), ink jet type and spits
Go out the wearable of device (such as ink-jet printer), portable personal computer, television set, HMD (head-mounted display) etc.
Terminal, video camera, video recorder, navigation device, pager, electronic notebook (including carrying communication function), electronic dictionary, electronics
Arithmetic unit, electronic game station, word processor, work station, videophone, safety TV monitor, electronics binoculars,
POS terminal, Medical Devices (for example, electronic thermometer, sphygmomanometer, blood-glucose meter, ECG tester, diagnostic ultrasound equipment,
Fujinon electronic video endoscope), fish finder, various sensing equipments, mobile terminal base station equipment, meters are (for example, vehicle, aviation
The meters of machine, ship), flight simulator, network server etc..
8th embodiment
Next, the moving body involved by the 8th embodiment of the present invention is illustrated.
Figure 14 is the stereogram for showing the moving body involved by the 8th embodiment of the present invention.
Automobile 1500 shown in Figure 14 is the automobile for being applicable in the moving body for having the physical quantity transducer of the present invention.At this
In figure, the physical quantity transducer 1 to play a role as acceleration transducer is built-in in automobile 1500, passes through physical quantity transducer
The posture of 1 detectable car body 1501.The detection signal of physical quantity transducer 1 is supplied to vehicle attitude controller 1502, vehicle
Posture of the body posture control device 1502 based on the signal detection car body 1501, and can be according to the output control suspension detected
Soft or hard or each wheel 1503 of control brake.Here, above-mentioned first~third can be used to implement for physical quantity transducer 1
Any one of mode.
This automobile 1500 (moving body) has physical quantity transducer 1.Therefore, the effect of above-mentioned physical quantity transducer 1 is enjoyed
Fruit can play higher reliability.
In addition, physical quantity transducer 1 is in addition to this, it is also widely portable to navigation system, air conditioning for automobiles, ANTI LOCK
System (ABS), air bag, tire pressure monitoring system (TPMS：Tire Pressure Monitoring System), engine control
Electronic control unit (the ECU of the cell monitors of device, hybrid vehicle and electric vehicle etc.：electronic control
unit)。
In addition, automobile 1500 is not limited only to as moving body, for example, being also applied for aircraft, ship, AGV (homing guidances
Vehicle), two leg walking robot, unmanned plane etc. unmanned vehicle etc..
More than, the physical quantity transducer of the present invention, physical quantity sensor device, electronics are set based on embodiment illustrated
Standby and moving body is illustrated, but the present invention is not limited to this, and the composition of each section can also be replaced into identical work(
Energy is formed arbitrarily.Alternatively, it is also possible to add any other construct to the present invention.In addition it is also possible to by the above embodiment
It carries out appropriately combined.In addition, in the above embodiment, X-direction and Y direction are mutually orthogonal, but be not limited only to this, only
Intersect.
In addition, in the above embodiment, the composition that sensor element is one is illustrated, but components Department can also be set
It is multiple.At this point, by the way that multiple element portion is configured in a manner that detection axis is mutually different, the acceleration of multiple axis directions can detect
Degree.
In addition, in the above embodiment, the acceleration transducer of the detection acceleration as physical quantity transducer is carried out
Explanation, but the physical quantity detected as physical quantity transducer is not limited only to acceleration.
Claims (12)
1. a kind of physical quantity transducer, which is characterized in that including：
Base portion；
Wiring is configured at the base portion；
Support portion, including being engaged in the first joint portion of the base portion and being engaged in the second joint portion of the wiring；
Suspended portion is engaged in the support portion；And
Electrode finger is supported in the suspended portion,
The support portion include the first extension, first extension under overlook observation be located at first joint portion with it is described
Between suspended portion, and separated with the base portion.
2. physical quantity transducer according to claim 1, which is characterized in that
The length at first joint portion compares institute on the direction orthogonal with the direction of the support portion and suspended portion arrangement
The length for stating suspended portion is long.
3. physical quantity transducer according to claim 1 or 2, which is characterized in that
The corner at first joint portion has fillet.
4. physical quantity transducer according to any one of claim 1 to 3, which is characterized in that the support portion includes the
Two extensions, second extension is under the overlook observation positioned at first joint portion and the first extension side phase
Anti- side, and separated with the base portion.
5. physical quantity transducer according to claim 4, which is characterized in that
The length of first extension arranges under the overlook observation in first extension and second extension
Direction on it is longer than the length of second extension.
6. physical quantity transducer according to any one of claim 1 to 5, which is characterized in that first joint portion is set
It is equipped with notch section；
Under the overlook observation, second joint portion is configured in the notch section.
7. physical quantity transducer according to any one of claim 1 to 6, which is characterized in that under the overlook observation,
First joint portion includes a part for the outer rim of the support portion.
8. a kind of physical quantity sensor device, which is characterized in that including：
Physical quantity transducer described in any one of claim 1 to 7；And
The circuit element being electrically connected with the physical quantity transducer.
9. sensor device according to claim 8, which is characterized in that
The physical quantity transducer and the circuit element are accommodated in ceramic package.
10. sensor device according to claim 8, which is characterized in that
The physical quantity transducer and the circuit element are molded.
11. a kind of electronic equipment, which is characterized in that
Including the physical quantity transducer described in any one of claim 1 to 7.
12. a kind of moving body, which is characterized in that including：
Physical quantity transducer described in any one of claim 1 to 7；And
Posture control device detects posture, and detected by control based on the signal exported by the physical quantity transducer
Posture.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016237917A JP6866623B2 (en) | 2016-12-07 | 2016-12-07 | Physical quantity sensors, physical quantity sensor devices, electronic devices and mobiles |
| JP2016-237917 | 2016-12-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108169516A true CN108169516A (en) | 2018-06-15 |
| CN108169516B CN108169516B (en) | 2022-01-25 |
Family
ID=60627467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711263648.8A Active CN108169516B (en) | 2016-12-07 | 2017-12-04 | Physical quantity sensor, physical quantity sensor device, electronic apparatus, and moving object |
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| US (1) | US10830789B2 (en) |
| EP (1) | EP3333579B1 (en) |
| JP (1) | JP6866623B2 (en) |
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| JP7176353B2 (en) * | 2018-10-29 | 2022-11-22 | セイコーエプソン株式会社 | Physical quantity sensors, electronic devices and mobile objects |
| JP2020134369A (en) * | 2019-02-21 | 2020-08-31 | セイコーエプソン株式会社 | Inertia sensor, electronic apparatus, and mobile body |
| RU203772U1 (en) * | 2021-01-27 | 2021-04-21 | Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский университет "Московский институт электронной техники" | SENSING ELEMENT OF MICROMECHANICAL SENSOR |
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| US9365414B2 (en) * | 2014-04-21 | 2016-06-14 | Freescale Semiconductor, Inc. | Sensor package having stacked die |
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- 2017-12-04 CN CN201711263648.8A patent/CN108169516B/en active Active
- 2017-12-06 US US15/833,258 patent/US10830789B2/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| EP3333579A1 (en) | 2018-06-13 |
| US20180156840A1 (en) | 2018-06-07 |
| CN108169516B (en) | 2022-01-25 |
| JP2018091818A (en) | 2018-06-14 |
| US10830789B2 (en) | 2020-11-10 |
| EP3333579B1 (en) | 2019-06-19 |
| JP6866623B2 (en) | 2021-04-28 |
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