JP2016169952A - Physical quantity sensor, method for manufacturing physical quantity sensor, electronic apparatus, and moving object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a physical quantity sensor that can reduce variations in accuracy of physical quantity detection, a method for manufacturing the physical quantity sensor, an electronic apparatus, and a moving object.SOLUTION: A physical quantity sensor 1 includes: a substrate 21 with an internal terminal 24; a lid part 22; a package 2 containing a container space S1; and a structure 9 in the space S1 having an IC 3 and an acceleration sensor element 4, the structure 9 being suspended above the substrate 21 by a bonding wire BY1 electrically connecting the IC 3 and the internal terminal 24 and the substrate 21 having a window part 26 allowing visual confirmation of the structure 9 being suspended above the substrate 21.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a physical quantity sensor, a physical quantity sensor manufacturing method, an electronic device, and a moving object.

  For example, Patent Document 1 discloses a physical quantity sensor in which an acceleration sensor element is disposed on a base substrate, an IC (integrated circuit) is disposed on the acceleration sensor element, and the acceleration sensor and the IC are covered with a mold resin. ing. However, in such a configuration, stress generated when the mold resin is cured (including stress remaining after curing) and stress applied according to the usage environment (temperature, humidity) are applied to the acceleration sensor element, and the There is a problem that it is not possible to maintain proper sensor characteristics.

JP 2014-183151 A

  An object of the present invention is to provide a physical quantity sensor, a method of manufacturing a physical quantity sensor, an electronic apparatus, and a moving body that can reduce fluctuations in the detection accuracy of the physical quantity.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.

The physical quantity sensor of the present invention includes a substrate having a terminal and a lid, and a package having an accommodating space inside,
A physical quantity sensor element accommodated in the accommodation space;
An IC fixed to the physical quantity sensor element and electrically connected to the physical quantity sensor element,
The structure including the physical quantity sensor element and the IC is suspended from the substrate by a bonding wire that electrically connects the IC and the terminal,
The substrate has a window portion through which the structure can be visually recognized when it floats from the substrate.
This makes it difficult for external stress to be applied to the physical quantity sensor element, thereby reducing fluctuations in the physical quantity detection accuracy. Further, since it can be confirmed that the structure body is floating (separated) from the substrate from the window portion, the yield is improved.

In the physical quantity sensor of the present invention, it is preferable that the physical quantity sensor element is located closer to the substrate than the IC.
Thereby, the balance of the structure in the state suspended by the bonding wire is improved.

In the physical quantity sensor according to the aspect of the invention, it is preferable that the window portion is provided at a position overlapping with the structure in a plan view of the substrate.
Thereby, the state which the structure floated from the board | substrate can be visually recognized more reliably.

In the physical quantity sensor of the present invention, it is preferable that the structure is cantilevered by the bonding wire.
Thereby, size reduction of a package can be achieved.

In the physical quantity sensor of the present invention, it is preferable that the window portion is a through hole.
Thereby, the structure of a window part becomes simple.

In the physical quantity sensor of the present invention, the through hole is sealed,
The housing space is preferably hermetically sealed.
Thereby, the structure can be protected from the external environment.

In the physical quantity sensor of the present invention, it is preferable that the accommodation space is filled with an inert gas.
Thereby, the environment of the accommodation space is stabilized.

In the physical quantity sensor of the present invention, it is preferable that the accommodation space is of the same gas type as the internal space of the structure in which the physical quantity sensor element is accommodated.
Thereby, the internal atmosphere of a structure can be made more stable.

The physical quantity sensor of the present invention preferably has an elastic body provided at a position facing the structure of the substrate.
Thereby, the impact of the structure hitting the substrate due to impact or the like can be mitigated, and damage to the apparatus can be reduced.

The method of manufacturing a physical quantity sensor of the present invention includes fixing a structure including a physical quantity sensor element and an IC on a substrate having a through hole so as to overlap the through hole;
Connecting the IC and the substrate by a bonding wire;
And releasing the fixation between the substrate and the structure and floating the structure away from the substrate by the elastic force of the bonding wire.
This makes it possible to manufacture a physical quantity sensor that can more easily reduce fluctuations in physical quantity detection accuracy.

In the physical quantity sensor manufacturing method of the present invention, in the fixing step, the structure is adsorbed to the substrate through the through hole,
In the step of separating, it is preferable to release the adsorption.
Thereby, said process can be performed more easily and reliably.

In the physical quantity sensor manufacturing method of the present invention, in the fixing step, the structure is bonded to the substrate via an adhesive layer,
In the step of separating, it is preferable to release the adhesion through the through hole.
Thereby, said process can be performed more easily and reliably.

An electronic apparatus according to the present invention includes the physical quantity sensor according to the present invention.
As a result, a highly reliable electronic device can be obtained.

The moving body of the present invention includes the physical quantity sensor of the present invention.
Thereby, a mobile body with high reliability is obtained.

It is sectional drawing of the physical quantity sensor which concerns on 1st Embodiment of this invention. It is sectional drawing which shows the modification of the physical quantity sensor shown in FIG. It is a top view which shows the acceleration sensor element which the physical quantity sensor shown in FIG. 1 has. It is a top view which shows the sensor part which an acceleration sensor element has. It is a top view which shows the sensor part which an acceleration sensor element has. It is a top view which shows the sensor part which an acceleration sensor element has. It is the sectional view on the AA line in FIG. It is a top view of the structure which the physical quantity sensor shown in FIG. 1 has. It is a figure for demonstrating the manufacturing method of the physical quantity sensor shown in FIG. It is a figure for demonstrating the manufacturing method of the physical quantity sensor shown in FIG. It is sectional drawing of the physical quantity sensor which concerns on 2nd Embodiment of this invention. It is sectional drawing which shows the state which adsorb | sucked the structure to the board | substrate. It is sectional drawing of the physical quantity sensor which concerns on 3rd Embodiment of this invention. It is a figure explaining the manufacturing method of the physical quantity sensor which concerns on 4th Embodiment of this invention. It is a figure explaining the manufacturing method of the physical quantity sensor which concerns on 4th Embodiment of this invention. 1 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which an electronic apparatus of the present invention is applied. It is a perspective view which shows the structure of the mobile telephone (a smart phone, PHS etc. are included) to which the electronic device of this invention is applied. It is a perspective view which shows the structure of the digital still camera to which the electronic device of this invention is applied. It is a perspective view which shows the motor vehicle to which the mobile body of this invention is applied.

  Hereinafter, a physical quantity sensor, a method of manufacturing a physical quantity sensor, an electronic device, and a moving body of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a cross-sectional view of a physical quantity sensor according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view showing a modification of the physical quantity sensor shown in FIG. FIG. 3 is a plan view showing an acceleration sensor element included in the physical quantity sensor shown in FIG. 4 to 6 are plan views each showing a sensor unit included in the acceleration sensor element. 7 is a cross-sectional view taken along line AA in FIG. FIG. 8 is a plan view of the structure of the physical quantity sensor shown in FIG. 9 and 10 are diagrams for explaining a method of manufacturing the physical quantity sensor shown in FIG.

  In the following description, three axes orthogonal to each other will be described as an X axis, a Y axis, and a Z axis. A direction parallel to the X axis is also referred to as an “X axis direction”, a direction parallel to the Y axis as “Y axis direction”, and a direction parallel to the Z axis as “Z axis direction”. A plane including the X axis and the Y axis is also referred to as an “XY plane”. The XY plane coincides with the horizontal plane, and the Z-axis direction coincides with the vertical direction.

  The physical quantity sensor 1 shown in FIG. 1 can be used as a three-axis acceleration sensor that can independently detect accelerations in the X-axis direction, the Y-axis direction, and the Z-axis direction. Such a physical quantity sensor 1 has a package 2 and a structure 9 accommodated in the package 2. The structure 9 has an acceleration sensor element (physical quantity sensor element) 4 and an IC (integrated circuit) 3 disposed on the acceleration sensor element 4, and is floated from the package 2 by the bonding wire BY1. Is arranged in.

[Package 2]
As shown in FIG. 1, the package 2 includes a plate-like substrate 21, a plate-like lid portion 22 arranged to face the substrate 21 with a gap therebetween, and a frame interposed between the substrate 21 and the lid portion 22. And a side wall portion 23 having a shape. And accommodation space S1 is formed surrounded by the board | substrate 21, the cover part 22, and the side wall part 23, and the structure 9 is accommodated in this accommodation space S1.

  As the board | substrate 21 and the side wall part 23, a silicon material, a ceramic material, a resin material, a glass material, a glass epoxy material etc. can be used, for example. Moreover, as the cover part 22, glass material, a silicon material, a metal material, a ceramic material etc. can be used, for example.

  In addition, a plurality of internal terminals 24 are disposed on the upper surface of the substrate 21, and a plurality of external terminals 25 are disposed on the lower surface. Each internal terminal 24 is electrically connected to a corresponding external terminal 25 through an internal wiring (not shown) formed in the substrate 21.

  In addition, the substrate 21 has a window portion 26 through which the structure 9 can be visually recognized from the outside of the package 2 in the accommodation space S1. Such a window portion 26 is arranged at a position overlapping the structure 9 (acceleration sensor element 4) in plan view of the substrate 21. Moreover, the window part 26 is comprised by the through-hole 261 which penetrated the board | substrate 21 in the thickness direction. Thus, by configuring the window portion 26 with the through-hole 261, the configuration of the window portion 26 is simplified. Further, as described in the manufacturing method described later, in the manufacturing process of the physical quantity sensor 1, there is a process of fixing the structure 9 to the substrate 21. However, the through hole 261 can be used as an adsorption hole. It can be easily fixed to the substrate 21.

  Here, since there is a possibility that moisture or scattered matter may enter the accommodation space S1 through the through hole 261, for example, a protective film having moisture resistance or the like is preferably disposed on the active surface of the IC 3 or the like. Thereby, corrosion etc. of the structure 9 can be suppressed effectively. In order to solve such a problem, the through hole 261 may be sealed with a sealing material 262 as shown in FIG. In this case, the function as the window portion 26 can be secured by using a light-transmitting (preferably substantially colorless and transparent) material as the sealing material 262. Thus, the accommodation space S1 can be hermetically sealed by sealing the through-hole 261 with the sealing material 262. Therefore, the structure 9 can be protected from moisture and scattered matter. The atmosphere of the hermetically sealed housing space S1 is not particularly limited, but may be filled with, for example, an inert gas such as nitrogen or argon. Moreover, a vacuum (reduced pressure state) may be used. Thereby, the atmosphere of the accommodation space S1 is stabilized, and the physical quantity sensor 1 is more reliable. Further, for example, the gas type of the atmosphere in the internal space of the accommodation space S <b> 1 may be the same as the gas type of the internal space of the acceleration sensor element 4. Thereby, the atmosphere in the internal space of the acceleration sensor element 4 can be made more stable.

[Acceleration sensor element 4]
As shown in FIG. 3, the acceleration sensor element 4 includes a package 5 having a base substrate 51 and a lid portion 52, and three sensor portions 6, 7, and 8 accommodated in the package 5.

-Base substrate 51-
The base substrate 51 is formed with recesses 511, 512, and 513 opened on the upper surface. Of these, the recess 511 functions as an escape portion for preventing contact between the sensor unit 6 and the base substrate 51 disposed above the recess 511. Similarly, the recess 512 functions as an escape portion for preventing contact between the sensor unit 7 and the base substrate 51 disposed above the recess 512. The recess 513 functions as an escape portion for preventing contact between the sensor unit 8 and the base substrate 51 disposed above the recess 513.

  In addition, the base substrate 51 is formed with recesses 511a, 511b, and 511c, recesses 512a, 512b, and 512c and recesses 513a, 513b, and 513c that open on the upper surface. Of these, the recesses 511a, 511b, and 511c are disposed around the recess 511, and wirings 691, 692, and 693 for the sensor unit 6 are disposed in the recesses 511a, 511b, and 511c. The recesses 512a, 512b, and 512c are disposed around the recess 512, and wirings 791, 792, and 793 for the sensor unit 7 are disposed in the recesses 512a, 512b, and 512c. The recesses 513a, 513b, and 513c are disposed around the recess 513, and wirings 891, 892, and 893 for the sensor unit 8 are disposed in the recesses 513a, 513b, and 513c. Further, the ends of these wirings 691, 692, 693, 791, 792, 793, 891, 892, 893 are exposed to the outside of the package 5, and the exposed portions serve as terminals T. Each terminal T is electrically connected to the terminal 32 of the IC 3 through the bonding wire BY2.

  Such a base substrate 51 is made of, for example, a glass material containing alkali metal ions (movable ions) (for example, borosilicate glass such as Pyrex glass (registered trademark)). Thereby, the sensor parts 6, 7, 8 formed from the silicon substrate can be firmly bonded to the base substrate 51 by anodic bonding. In addition, since light transmission can be imparted to the base substrate 51, the inside of the package 5 can be observed through the base substrate 51. However, the constituent material of the base substrate 51 is not limited to a glass material, and for example, a high-resistance silicon material can be used. In this case, joining with the sensor parts 6, 7, and 8 can be performed through a resin adhesive, a glass paste, a metal layer, etc., for example.

-Sensor part 6-
The sensor unit 6 is a part that detects acceleration in the X-axis direction. As shown in FIG. 4, the sensor unit 6 includes support units 611 and 612, a movable unit 62, connection units 631 and 632, a plurality of first fixed electrode fingers 64, and a plurality of second fixed electrodes. And a finger 65. The movable portion 62 includes a base portion 621 and a plurality of movable electrode fingers 622 that protrude from the base portion 621 to both sides in the Y-axis direction. Such a sensor unit 6 is formed of, for example, a silicon substrate doped with impurities such as phosphorus and boron.

  The support portions 611 and 612 are anodically bonded to the upper surface of the base substrate 51, and the support portion 611 is electrically connected to the wiring 691 through the conductive bump B11. A movable portion 62 is provided between the support portions 611 and 612. The movable part 62 is connected to the support parts 611 and 612 via the connection parts 631 and 632. Since the connecting portions 631 and 632 can be elastically deformed in the X-axis direction like a spring, the movable portion 62 can be displaced in the X-axis direction with respect to the support portions 611 and 612 as indicated by an arrow a.

  The plurality of first fixed electrode fingers 64 are arranged on one side in the X-axis direction of the movable electrode fingers 622 and are arranged in a comb-like shape that meshes with the corresponding movable electrode fingers 622 with a space therebetween. The plurality of first fixed electrode fingers 64 are anodically bonded to the upper surface of the base substrate 51 at the base end portion, and are electrically connected to the wiring 692 through the conductive bump B12.

  On the other hand, the plurality of second fixed electrode fingers 65 are arranged on the other side in the X-axis direction of the movable electrode fingers 622 and arranged in a comb-teeth shape that meshes with the corresponding movable electrode fingers 622 at an interval. It is out. The plurality of second fixed electrode fingers 65 are anodically bonded to the upper surface of the base substrate 51 at the base end portion, and are electrically connected to the wiring 693 through the conductive bump B13.

  Using such a sensor unit 6, the X-axis direction angular velocity is detected as follows. That is, when acceleration in the X-axis direction is applied, the movable portion 62 is displaced in the X-axis direction while elastically deforming the coupling portions 631 and 632 based on the magnitude of the acceleration. Along with the displacement, the capacitance between the movable electrode finger 622 and the first fixed electrode finger 64 and the capacitance between the movable electrode finger 622 and the second fixed electrode finger 65 change. . Then, the acceleration is obtained by the IC 3 based on the change in the capacitance.

-Sensor part 7-
The sensor unit 7 is a part that detects acceleration in the Y-axis direction. Such a sensor unit 7 has the same configuration as the sensor unit 6 except that the sensor unit 7 is arranged in a state of being rotated by 90 ° in plan view. As shown in FIG. 5, the sensor unit 7 includes support portions 711 and 712, a movable portion 72, connection portions 731 and 732, a plurality of first fixed electrode fingers 74, and a plurality of second fixed electrode fingers 75. ,have. The movable portion 72 includes a base portion 721 and a plurality of movable electrode fingers 722 protruding from the base portion 721 on both sides in the X-axis direction.

  The support portions 711 and 712 are anodically bonded to the upper surface of the base substrate 51, and the support portion 711 is electrically connected to the wiring 791 through the conductive bump B21. A movable portion 72 is provided between the support portions 711 and 712. The movable portion 72 is connected to the support portions 711 and 712 via the connection portions 731 and 732. Since the connecting portions 731 and 732 can be elastically deformed in the Y-axis direction like springs, the movable portion 72 can be displaced in the Y-axis direction with respect to the support portions 711 and 712 as indicated by an arrow b.

  The plurality of first fixed electrode fingers 74 are arranged on one side of the movable electrode finger 722 in the Y-axis direction, and are arranged in a comb-like shape that meshes with the corresponding movable electrode finger 722 at an interval. The plurality of first fixed electrode fingers 74 are anodically bonded to the upper surface of the base substrate 51 at the base end portion, and are electrically connected to the wiring 792 through the conductive bump B22.

  On the other hand, the plurality of second fixed electrode fingers 75 are arranged on the other side in the Y-axis direction of the movable electrode fingers 722, and are arranged in a comb-teeth shape that meshes with the corresponding movable electrode fingers 722 at an interval. It is out. The plurality of second fixed electrode fingers 75 are anodically bonded to the upper surface of the base substrate 51 at the base end portion, and are electrically connected to the wiring 793 through the conductive bump B23.

  Using such a sensor unit 7, the Y-axis direction angular velocity is detected as follows. That is, when acceleration in the Y-axis direction is applied, the movable portion 72 is displaced in the Y-axis direction while elastically deforming the connecting portions 731 and 732 based on the magnitude of the acceleration. With the displacement, the capacitance between the movable electrode finger 722 and the first fixed electrode finger 74 and the capacitance between the movable electrode finger 722 and the second fixed electrode finger 75 change. . Then, the acceleration is obtained by the IC 3 based on the change in the capacitance.

-Sensor part 8-
The sensor unit 8 is a part that detects acceleration in the Z-axis direction (vertical direction). As shown in FIG. 6, such a sensor unit 8 includes a pair of support units 811 and 812, a movable unit 82, and a pair of couplings that pivotably couple the movable unit 82 to the support units 811 and 812. The movable part 82 swings with respect to the support parts 811 and 812 about the connecting parts 831 and 832 as the axis J. Such a sensor unit 8 is formed of, for example, a silicon substrate doped with impurities such as phosphorus and boron.

  The support portions 811 and 812 are anodically bonded to the upper surface of the base substrate 51, and the support portion 811 is electrically connected to the wiring 891 through the conductive bump B31. A movable portion 82 is provided between the support portions 811 and 812. The movable portion 82 includes a first movable portion 821 located on the + Y direction side with respect to the axis J, and a second movable portion 822 located on the −Y direction side with respect to the axis J and larger than the first movable portion 821. doing. The first and second movable parts 821 and 822 have different rotational moments when acceleration in the vertical direction (Z-axis direction) is applied, and are designed so that a predetermined inclination occurs in the movable part 82 according to the acceleration. ing. Thereby, when acceleration in the Z-axis direction occurs, the movable portion 82 swings the seesaw around the axis J.

  Further, a first detection electrode 881 electrically connected to the wiring 892 is disposed at a position facing the first movable portion 821 on the bottom surface of the recess 513, and a wiring is disposed at a position facing the second movable portion 822. A second detection electrode 882 electrically connected to 893 is disposed. Therefore, an electrostatic capacity is formed between the first movable part 821 and the first detection electrode 881, and an electrostatic capacity is formed between the second movable part 822 and the second detection electrode 882. In addition, it is preferable that the 1st detection electrode 881 and the 2nd detection electrode 882 are comprised with transparent conductive materials, such as ITO, for example.

  Using such a sensor unit 8, the acceleration in the Z-axis direction is detected as follows. That is, when the acceleration in the Z-axis direction is applied, the movable portion 82 swings the seesaw around the axis J. By such seesaw swinging of the movable portion 82, the separation distance between the first movable portion 821 and the first detection electrode 881 and the separation distance between the second movable portion 822 and the second detection electrode 882 change, and these are changed accordingly. The capacitance during the change. Then, the acceleration is obtained by the IC 3 based on the change in the capacitance.

-Lid 52-
As shown in FIG. 7, the lid 52 has a recess 521 that opens on the lower surface, and is joined to the base substrate 51 so that the recess 521 forms an internal space S <b> 2 with the recesses 511, 512, and 513. Such a lid 52 is formed of a silicon substrate in this embodiment. Thereby, the cover part 52 and the base substrate 51 can be firmly joined by anodic bonding. When the lid 52 is bonded to the base substrate 51, the inside and outside of the internal space S2 are communicated with each other through the recesses 511a to 511c, 512a to 512c, and 513a to 513c formed on the base substrate 51. Therefore, for example, the recesses 511a to 511c, 512a to 512c, and 513a to 513c are closed by the SiO ₂ film 53 formed by a CVD method using TEOS (tetraethoxysilane) or the like.

[IC3]
As shown in FIG. 1, the IC 3 is disposed on the upper surface (on the lid 52) of the acceleration sensor element 4 via the adhesive layer 101. The adhesive layer 101 is not particularly limited as long as the IC 3 can be fixed on the acceleration sensor element 4. For example, solder, silver paste, resin adhesive (die attach agent), or the like can be used.

The IC 3 includes, for example, a drive circuit that drives the acceleration sensor element 4, a detection circuit that detects acceleration in each of the X-axis, Y-axis, and Z-axis directions based on a signal from the acceleration sensor element 4, and a detection circuit The output circuit etc. which convert the signal from 1 into a predetermined signal and output are included. Further, the IC 3 has a plurality of terminals 31 and a plurality of terminals 32 on the upper surface, each terminal 31 is electrically connected to the internal terminal 24 of the substrate 21 via the bonding wire BY1, and each terminal 32 is bonded to the bonding wire BY2. Is electrically connected to the terminal T of the acceleration sensor element 4.
The acceleration sensor element 4 and the IC 3 have been described above.

  As shown in FIG. 1, the structure 9 having the acceleration sensor element 4 and the IC 3 is suspended by a bonding wire BY1 in a state of being floated (separated) from the substrate 21. In other words, the structure 9 and the substrate 21 are connected by the bonding wire BY1 so that the state in which the structure 9 is floated with respect to the substrate 21 is maintained. With such a configuration, stress (for example, stress caused by impact, thermal stress caused by a difference in thermal expansion coefficient from the base substrate, etc.) is difficult to be applied to the acceleration sensor element 4. Variations can be suppressed. In particular, in the present embodiment, since the window portion 26 is disposed at a position overlapping the structure body 9 (acceleration sensor element 4) in a plan view of the substrate 21, the structure body 9 is mounted on the substrate via the window portion 26. It can be confirmed more easily that it is floating (separated) from 21. Therefore, inspection is facilitated, and the production yield of the physical quantity sensor 1 is improved.

  In the present embodiment, since the acceleration sensor element 4 is positioned below the IC 3 (on the substrate 21 side), the upper portion of the structure 9 is held by the bonding wire BY1. Therefore, the posture of the structure 9 is more stable, and the displacement of the structure 9 is suppressed. Therefore, problems such as the structural body 9 colliding with the inner surface of the package 2 and being damaged, or the bonding wire BY1 is disconnected can be suppressed. The bonding wire BY1 may have a dummy wire that does not include an electrical grounding function or an electrical function. By including the dummy wire, the posture of the structure 9 can be further stabilized.

In the present embodiment, the structure 9 is cantilevered by the bonding wire BY1. That is, at the end portion on one side in the left-right direction in FIGS. 1 and 8, more specifically, at the end portion on the opposite side of the end portion to which the bonding wire BY2 of IC3 is connected, the structure 9 is bonded to the bonding wire. Connected to BY1. Thus, by supporting the structure 9 in a cantilever manner, the arrangement space of the bonding wire BY1 can be reduced, and the size of the package 2 can be reduced accordingly. Further, since the degree of freedom of displacement of the structure 9 is increased, stress is not easily transmitted to the structure 9. However, the structure 9 may be supported at both ends by the bonding wire BY1.
The physical quantity sensor 1 has been described in detail above.

Next, a method for manufacturing the physical quantity sensor 1 will be described.
The manufacturing method of the physical quantity sensor 1 includes a first step of fixing the structure 9 on the substrate 21 having the through hole 261 so as to overlap the through hole 261, and a second step of connecting the IC 3 and the substrate 21 by the bonding wire BY1. And a third step of releasing the fixation between the substrate 21 and the structure 9 and floating the structure 9 away from the substrate 21 by the elastic force of the bonding wire BY1. Hereinafter, each process is demonstrated in order.

[First step]
First, as shown in FIG. 9A, a structure 9 is prepared in which an IC 3 is fixed on an acceleration sensor element 4 and these are electrically connected by a bonding wire BY2. Next, as shown in FIG. 9B, the structure 9 is arranged on the substrate 21 so as to overlap the through hole 261, and the structure 9 is sucked through the through hole 261, thereby The body 9 is sucked and fixed to the substrate 21. Thus, by providing the through hole 261 that functions as the window portion 26 later, the structure 9 can be easily fixed to the substrate 21.

[Second step]
Next, using a wire bonding technique, as shown in FIG. 9C, the terminal 31 of the IC 3 and the internal terminal 24 of the substrate 21 are connected by the bonding wire BY1. In addition, since the structure 9 is fixed to the substrate 21 in the first step, this step can be performed with higher accuracy.

[Third step]
Next, the adsorption of the structure 9 to the substrate 21 is released. As a result, as shown in FIG. 10A, the elastic force of the bonding wire BY1 is released, and the structural body 9 is lifted from the substrate 21 and separated from the substrate 21 by this elastic force. Next, the physical quantity sensor 1 is obtained by attaching the lid 22 as shown in FIG.
According to such a manufacturing method, the physical quantity sensor 1 can be obtained by a simple process.

Second Embodiment
FIG. 11 is a cross-sectional view of a physical quantity sensor according to the second embodiment of the present invention. FIG. 12 is a cross-sectional view showing a state in which the structure is adsorbed on the substrate.

  Hereinafter, the second embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.

  The second embodiment is the same as the first embodiment described above except that it has an elastic body provided on the substrate.

  As shown in FIG. 11, the physical quantity sensor 1 of the present embodiment includes a frame-like elastic body 27 provided around a through hole 261 on the upper surface of the substrate 21. The elastic body 27 is provided at a position facing the structure 9 (base substrate 51). The elastic body 27 is made of, for example, a rubber material.

  Such an elastic body 27 functions as an impact mitigating portion for mitigating the impact by colliding with the structure 9 when a strong impact or the like is applied, for example, and effectively reducing the damage to the structure 9. Can do. Further, in the first step of the manufacturing method of the physical quantity sensor 1, as shown in FIG. 12, the elastic body 27 is sandwiched between the substrate 21 and the structure 9, so that suction leakage is suppressed, and the structure 9 is The substrate 21 can be securely adsorbed and fixed firmly.

  Also according to the second embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Third Embodiment>
FIG. 13 is a cross-sectional view of a physical quantity sensor according to the third embodiment of the present invention.

  Hereinafter, the third embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.

  The third embodiment is the same as the first embodiment described above except that the arrangement of the acceleration sensor element and the IC is reversed.

  In the physical quantity sensor 1 of the present embodiment, as shown in FIG. 13, an acceleration sensor element 4 is arranged on the IC 3. That is, the IC 3 is disposed on the lower side (substrate 21) side of the acceleration sensor element 4. Thereby, the height of the bonding wire BY1 can be suppressed, and the height of the package 2 can be reduced.

  Also according to the third embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Fourth embodiment>
14 and 15 are diagrams for explaining a method of manufacturing a physical quantity sensor according to the fourth embodiment of the present invention.

  Hereinafter, the fourth embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.

  The fourth embodiment is the same as the first embodiment described above except that the manufacturing method of the physical quantity sensor is different.

  In the manufacturing method of the physical quantity sensor 1 of the present embodiment, the first step of fixing the structural body 9 so as to overlap the through hole 261 on the substrate 21 having the through hole 261, and the IC 3 and the substrate 21 are bonded by the bonding wire BY1. A second step of connecting, and a third step of releasing the fixation between the substrate 21 and the structure 9 and floating the structure 9 away from the substrate 21 by the elastic force of the bonding wire BY1. Hereinafter, each process is demonstrated in order.

[First step]
First, as shown in FIG. 14A, a structure 9 is prepared in which an IC 3 is fixed on an acceleration sensor element 4 and these are electrically connected by a bonding wire BY2. Next, as shown in FIG. 14B, the structure 9 is disposed on the substrate 21 so as to overlap the through hole 261 with the adhesive layer 29 interposed therebetween, whereby the structure 9 is bonded and fixed to the substrate 21. . Thus, by using the adhesive layer 29, the structure 9 can be easily fixed to the substrate 21.

[Second step]
Next, using a wire bonding technique, as shown in FIG. 14C, the terminal 31 of the IC 3 and the internal terminal 24 of the substrate 21 are connected by the bonding wire BY1. In addition, since the structure 9 is fixed to the substrate 21 in the first step, this step can be performed with higher accuracy.

[Third step]
Next, the structure 9 is pressed upward by the pressing member 100 through the through-hole 261, and the fixing of the structure 9 to the substrate 21 is released (the adhesive layer 29 is peeled off from the substrate 21). Thereby, as shown in FIG. 15A, the elastic force of the bonding wire BY <b> 1 is released, and the structure 9 is lifted from the substrate 21 and separated from the substrate 21 by this elastic force. Next, the physical quantity sensor 1 is obtained by attaching the lid portion 22 as shown in FIG.
According to such a manufacturing method, the physical quantity sensor 1 can be obtained by a simple process.

(Electronics)
Next, the electronic apparatus of the present invention will be described.

  FIG. 16 is a perspective view showing the configuration of a mobile (or notebook) personal computer to which the electronic apparatus of the present invention is applied.

  In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 incorporates a physical quantity sensor 1 that functions as an acceleration sensor.

  FIG. 17 is a perspective view illustrating a configuration of a mobile phone (including a smartphone, a PHS, and the like) to which the electronic device of the present invention is applied.

  In this figure, a cellular phone 1200 includes an antenna (not shown), a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is provided between the operation buttons 1202 and the earpiece 1204. Has been placed. Such a cellular phone 1200 incorporates a physical quantity sensor 1 that functions as an acceleration sensor.

  FIG. 18 is a perspective view showing the configuration of a digital still camera to which the electronic apparatus of the present invention is applied. In this figure, connection with an external device is also simply shown.

  A display unit 1310 is provided on the back of the case (body) 1302 of the digital still camera 1300, and is configured to display based on an image pickup signal from the CCD. The display unit 1310 displays the subject as an electronic image. Also functions as a viewfinder. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In this digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 includes, for example, a physical quantity sensor 1 that is used for camera shake correction as an acceleration sensor.

  Since such an electronic apparatus includes the physical quantity sensor 1, it has excellent reliability.

  In addition to the personal computer of FIG. 16, the mobile phone of FIG. 17, and the digital still camera of FIG. 18, the electronic apparatus of the present invention includes, for example, an ink jet discharge device (for example, an ink jet printer), a laptop personal computer, TV, video camera, video tape recorder, car navigation system, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game device, word processor, workstation, video phone, security TV monitor, electronic binoculars, POS terminal, medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices, instruments (for example, vehicles, aircraft, ships) Applicable to instruments), flight simulators, etc. Door can be.

(Moving body)
Next, the moving body of the present invention will be described.
FIG. 19 is a perspective view showing an automobile to which the moving body of the present invention is applied.

  As shown in FIG. 19, a physical quantity sensor 1 is built in an automobile 1500, and the posture of the vehicle body 1501 can be detected by the physical quantity sensor 1, for example. The detection signal of the physical quantity sensor 1 is supplied to the vehicle body posture control device 1502, and the vehicle body posture control device 1502 detects the posture of the vehicle body 1501 based on the signal, and controls the stiffness of the suspension according to the detection result. The brakes of the individual wheels 1503 can be controlled. The physical quantity sensor 1 also includes keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), air bag, tire pressure monitoring system (TPMS), engine It can be widely applied to electronic control units (ECUs) such as control, battery monitors of hybrid vehicles and electric vehicles.

  As described above, the physical quantity sensor, the physical quantity sensor manufacturing method, the electronic apparatus, and the moving body of the present invention have been described based on the illustrated embodiment, but the present invention is not limited to this, and the configuration of each part is the same. Any structure having a function can be substituted. In addition, any other component may be added to the present invention.

  In the above-described embodiment, the configuration in which the acceleration sensor element has three sensor units has been described. However, the number of sensor units is not limited to this and may be one or two. And four or more. In the embodiment described above, the acceleration sensor element is used as the physical quantity sensor element. However, the physical quantity sensor is not limited to the acceleration sensor element, and may be, for example, a pressure sensor element or an angular velocity sensor element. There may be. Further, for example, it may be a composite sensor that can simultaneously detect different physical quantities such as acceleration and angular velocity.

DESCRIPTION OF SYMBOLS 1 ... Physical quantity sensor 2 ... Package 21 ... Board | substrate 22 ... Cover part 23 ... Side wall part 24 ... Internal terminal 25 ... External terminal 26 ... Window part 261 ... Through-hole 262 ... Sealing material 27 …… Elastic body 29 …… Adhesive layer 3 …… IC
31 ... Terminal 32 ... Terminal 4 ... Acceleration sensor element 5 ... Package 51 ... Base substrate 511, 511a, 511b, 511c ... Recessed portion 512, 512a, 512b, 512c ... Recessed portion 513, 513a, 513b, 513c ...... Recessed portion 52 ...... Lid portion 521 ...... Recessed portion 53 ...... SiO ₂ film 6 ...... Sensor portion 611, 612 ...... Supporting portion 62 ...... Movable portion 621 ...... Base portion 622 ...... Movable electrode finger 631, 632 ...... Connecting portion 64 …… First fixed electrode finger 65 …… Second fixed electrode finger 691, 692, 693 …… Wiring 7 …… Sensor portion 711, 712 …… Supporting portion 72 …… Moving portion 721 …… Base portion 722 …… Movable electrode fingers 731, 732... Connecting portion 74... First fixed electrode finger 75... Second fixed electrode finger 791, 792, 793 .. wiring 8. 811, 812 ...... support part 82 ...... movable part 821 …… first movable part 822 ...... second movable part 831, 832 ...... connection part 881 ...... first detection electrode 882 ...... second detection electrode 891, 892 893 ... Wiring 9 ... Structure 100 ... Pressing member 101 ... Adhesive layer 1100 ... Personal computer 1102 ... Keyboard 1104 ... Main body 1106 ... Display unit 1108 ... Display unit 1200 ... Mobile phone 1202 …… Operation buttons 1204 …… Entrance 1206 …… Transmission mouth 1208 …… Display unit 1300 …… Digital still camera 1302 …… Case 1304 …… Light receiving unit 1306 …… Shutter button 1308 …… Memory 1310 …… Display unit 1312 ... Video signal output terminal 1314 ... Input / output terminal 1430 ... Levi monitor 1440 …… Personal computer 1500 …… Automobile 1501 …… Body 1502 …… Body attitude control device 1503 …… Wheel B11, B12, B13, B21, B22, B23, B31 …… Conductive bumps BY1, BY2 …… Bonding Wire J …… Shaft S1 …… Accommodating space S2 …… Internal space T …… Terminals a, b …… Arrow

Claims (14)

A package including a substrate including a terminal and a lid, and having an accommodation space therein;
A physical quantity sensor element accommodated in the accommodation space;
An IC fixed to the physical quantity sensor element and electrically connected to the physical quantity sensor element,
The structure including the physical quantity sensor element and the IC is suspended from the substrate by a bonding wire that electrically connects the IC and the terminal,
The physical quantity sensor according to claim 1, wherein the substrate has a window portion through which the structure body can be visually recognized in a floating state.   The physical quantity sensor according to claim 1, wherein the physical quantity sensor element is located closer to the substrate than the IC.   3. The physical quantity sensor according to claim 1, wherein the window is provided at a position overlapping the structure in a plan view of the substrate.   The physical quantity sensor according to claim 1, wherein the structure is cantilevered by the bonding wire.   The physical quantity sensor according to claim 1, wherein the window is a through hole. The through hole is sealed;
The physical quantity sensor according to claim 5, wherein the housing space is hermetically sealed.   The physical quantity sensor according to claim 6, wherein the housing space is filled with an inert gas.   The physical quantity sensor according to claim 6 or 7, wherein the accommodation space is the same gas type as the internal space of the structure in which the physical quantity sensor element is accommodated.   The physical quantity sensor according to claim 1, further comprising an elastic body provided at a position facing the structure of the substrate. Fixing a structure including a physical quantity sensor element and an IC on a substrate having a through hole so as to overlap the through hole; and
Connecting the IC and the substrate by a bonding wire;
And a step of releasing the fixation between the substrate and the structure and floating the structure away from the substrate by the elastic force of the bonding wire. In the fixing step, the structure is adsorbed to the substrate through the through hole,
The method of manufacturing a physical quantity sensor according to claim 10, wherein in the step of separating, the adsorption is released. In the fixing step, the structure is bonded to the substrate via an adhesive layer,
The method of manufacturing a physical quantity sensor according to claim 10, wherein in the step of separating, the adhesion is released through the through hole.   An electronic apparatus comprising the physical quantity sensor according to claim 1.   A moving body comprising the physical quantity sensor according to claim 1.

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