JP2018148137A - Electronic device, manufacturing method of electronic device, electronic module, electronic equipment and mobile - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device in which bond strength of a first substrate and a second substrate is improved, and the joint of the first and second substrates and a housing space formed on the inside thereof are sealed hermetically, and to provide a manufacturing method of electronic device, an electronic module, electronic equipment and a mobile.SOLUTION: An electronic device includes a package having a housing space, and an element piece housed in the housing space, the package has a first substrate, a second substrate, and a joining member placed between the first and second substrates, and joining them. At least one of the first and second substrates has a protrusion projecting to the other side, and the joining member is placed to cover the protrusion at least partially.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic device, an electronic device manufacturing method, an electronic module, an electronic apparatus, and a moving body.

  For example, in Patent Document 1, a base wafer made of an insulating material such as Pyrex, a wiring arranged on the base wafer, a cap wafer made of an insulating material such as Pyrex, and the like are located between and bonded to each other. A structure having a frame-like glass frit is disclosed.

Further, in Patent Document 2, a base made of an insulating material such as Pyrex, an element piece anodically bonded to the base, and an anode bonded to the base so as to form a storage space for storing the element piece between the bases. And an acceleration sensor having a lid. In addition, since the groove part for routing wiring is formed in the base, the inside and outside of the storage space are communicated with each other through the groove part. Therefore, in the acceleration sensor of Patent Document 2, the groove portion is closed by a SiO ₂ film formed by a CVD method using TEOS (tetraethoxysilane) or the like, and the storage space is hermetically sealed.

JP 2000-307018 A JP 2013-164285 A

  However, in the structure of Patent Document 1 described above, the wiring is formed on the upper surface of the base wafer (the bonding surface with the cap wafer), and the wiring protrudes from the upper surface of the base wafer. Therefore, there is a difference between the bonding strength between the base wafer and the base wafer at the portion where the wiring is provided and the bonding strength between the base wafer and the base wafer at the portion where the wiring is not provided, and the base wafer and the base wafer are different. The bonding strength with the wafer becomes unstable.

On the other hand, in the acceleration sensor of Patent Document 2 described above, since the base and the lid are anodically bonded, the base and the lid can be bonded more firmly. However, in the acceleration sensor of Patent Document 2, it is necessary to form a SiO ₂ film using a CVD method using TEOS (tetraethoxysilane) or the like in order to hermetically seal the storage space. The number of processes increases, resulting in a time and cost burden.

  An object of the present invention is to improve the bonding strength between the first base and the second base, and to electronically seal the storage space formed inside the first base and the second base together with the joint between the first base and the second base, An object of the present invention is to provide an electronic device manufacturing method, an electronic module, an electronic apparatus, and a moving body.

  Such an object is achieved by the present invention described below.

An electronic device of the present invention includes a package having a storage space;
An element piece housed in the housing space,
The package is
A first substrate;
A second substrate;
A bonding member disposed between the first base and the second base and bonding the first base and the second base;
At least one of the first base and the second base has a convex portion protruding to the other side,
The joining member is arranged to cover at least a part of the convex portion.
As a result, an electronic device is obtained in which the bonding strength between the first substrate and the second substrate is improved, and the storage space formed inside the first substrate and the second substrate is hermetically sealed.

In the electronic device of the present invention, in a plan view seen from the direction in which the first base and the second base overlap,
It is preferable that the convex part has a frame shape so as to surround the storage space.
Accordingly, the contact area between the first base or the second base and the bonding member can be easily and effectively increased, and the bonding strength between the first base and the second base can be further increased. Moreover, since the substantially same joining strength can be exhibited over the whole circumference | surroundings of storage space, the joining state of a 1st base | substrate and a 2nd base | substrate is stabilized.

In the electronic device of the present invention, in a plan view seen from the direction in which the first base and the second base overlap,
It is preferable that the said convex part has a some convex piece arrange | positioned at intervals along the circumferential direction of the said storage space.
Thereby, the joint strength between the first base and the second base can be further increased.

In the electronic device according to the aspect of the invention, it is preferable that the width of the convex portion is gradually reduced from the proximal end side toward the distal end side.
Thereby, it becomes easy for a joining member to go around to the side surface of a convex part, and generation | occurrence | production of a void (bubble) can be suppressed more reliably. Therefore, the bonding strength between the first base and the second base can be further increased.

In the electronic device according to the aspect of the invention, it is preferable that the height of the convex portion is 0.01 μm or more and 10 μm or less.
Thereby, the surface area of a convex part can fully be ensured, and it becomes easy for a joining member to go around the convex part. Therefore, the bonding strength between the first base and the second base can be effectively increased.

In the electronic device according to the aspect of the invention, the first base has a groove that opens on the surface on the second base and extends in and out of the storage space, and a wiring disposed in the groove.
It is preferable that the joining member is provided in the groove at a portion where the groove and the joining member intersect.
Thereby, a groove part can be filled with a joining member, and storage space can be sealed airtight more easily.

In the electronic device of the present invention, it is preferable that the width of the groove portion gradually decreases from the opening side toward the bottom surface side.
Thereby, it becomes easy for a joining member to penetrate | invade in a groove part, and generation | occurrence | production of a void can be suppressed more reliably.

In the electronic device of the present invention, the joining member is preferably low-melting glass.
Thereby, it becomes a joining member which is easy to use and can join the first base and the second base more firmly.

The method for manufacturing an electronic device of the present invention includes a step of preparing a first substrate,
Bonding a substrate to the first substrate;
Processing the substrate to form element pieces, processing the first base to form convex portions;
Preparing a second substrate and bonding the second substrate to the first substrate via a bonding member so that the element piece is accommodated between the first substrate and the first substrate;
In the joining step, the joining member is disposed so as to cover at least a part of the convex portion.
As a result, an electronic device is obtained in which the bonding strength between the first substrate and the second substrate is improved, and the storage space formed inside the first substrate and the second substrate is hermetically sealed.

The electronic module of the present invention includes the electronic device of the present invention.
Thereby, the effect of the electronic device of this invention can be enjoyed and a highly reliable electronic module is obtained.

The electronic apparatus of the present invention includes the electronic device of the present invention.
Thereby, the effect of the electronic device of this invention can be enjoyed and a reliable electronic device can be obtained.

The moving body of the present invention includes the electronic device of the present invention.
Thereby, the effect of the electronic device of this invention can be enjoyed and a reliable mobile body is obtained.

It is a top view which shows the electronic device which concerns on 1st Embodiment of this invention. It is the sectional view on the AA line in FIG. It is the BB sectional view taken on the line in FIG. It is a figure which shows the voltage applied to the element piece which the electronic device shown in FIG. 1 has. It is sectional drawing which shows the modification of the electronic device shown in FIG. It is a flowchart which shows the manufacturing process of the electronic device shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the electronic device shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the electronic device shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the electronic device shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the electronic device shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the electronic device shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the electronic device shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the electronic device shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the electronic device shown in FIG. It is sectional drawing of the electronic device which concerns on 2nd Embodiment of this invention. It is a top view which shows the electronic device which concerns on 3rd Embodiment of this invention. It is CC sectional view taken on the line in FIG. It is a top view which shows the electronic device which concerns on 4th Embodiment of this invention. It is a top view which shows the electronic device which concerns on 5th Embodiment of this invention. It is sectional drawing which shows the electronic device which concerns on 6th Embodiment of this invention. It is sectional drawing which shows the electronic device which concerns on 7th Embodiment of this invention. It is sectional drawing which shows the electronic module which concerns on 8th Embodiment of this invention. It is a perspective view which shows the electronic device which concerns on 9th Embodiment of this invention. It is a perspective view which shows the electronic device which concerns on 10th Embodiment of this invention. It is a perspective view which shows the electronic device which concerns on 11th Embodiment of this invention. It is a perspective view which shows the mobile body which concerns on 12th Embodiment of this invention.

  Hereinafter, an electronic device, a method for manufacturing an electronic device, an electronic module, an electronic apparatus, and a moving body of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

<First Embodiment>
First, an electronic device according to a first embodiment of the present invention will be described.

  FIG. 1 is a plan view showing an electronic device according to the first embodiment of the present invention. 2 is a cross-sectional view taken along line AA in FIG. 3 is a cross-sectional view taken along line BB in FIG. FIG. 4 is a diagram illustrating voltages applied to the element pieces included in the electronic device illustrated in FIG. 1. FIG. 5 is a cross-sectional view showing a modification of the electronic device shown in FIG. FIG. 6 is a flowchart showing manufacturing steps of the electronic device shown in FIG. 7 to 14 are cross-sectional views for explaining a method of manufacturing the electronic device shown in FIG.

  In the following, for convenience of explanation, the front side in FIG. 1 and the upper side in FIGS. 2, 3, 5, 7 to 14 are also referred to as “upper”, and the back side in FIG. 2, FIG. 3, FIG. 5, and FIG. 7 to FIG. Also, as shown in each figure, the three axes orthogonal to each other are the X axis, Y axis, and Z axis, the direction parallel to the X axis is “X axis direction”, and the direction parallel to the Y axis is “Y axis direction” The direction parallel to the Z axis is also referred to as the “Z axis direction”. Further, the tip end side of each axis in the arrow direction is also referred to as “plus side”, and the opposite side is also referred to as “minus side”.

  An electronic device 1 shown in FIG. 1 is an acceleration sensor (physical quantity sensor) that can detect an acceleration Ax in the X-axis direction. Such an electronic device 1 has a package 2 and an element piece 6 accommodated in the package 2. Hereinafter, each of these units will be described in detail in order.

(package)
As shown in FIG. 2, the package 2 includes a base 3 (first base), a lid 4 (second base), and a joining member that is located between the base 3 and the lid 4 and joins them. 5. Such a package 2 has a storage space S, and the element piece 6 is stored in the storage space S.

  As shown in FIG. 1, the base 3 has a plate shape having a rectangular plan view shape. A frame-shaped joining region S3 joined to the joining member 5 is provided on the upper surface. In addition, the base 3 has a recess 31 that is located inside the bonding region S3 and opens on the upper surface side. The recess 31 functions as an escape portion for preventing (suppressing) the contact between the element piece 6 and the base 3.

  The base 3 has a convex portion 32 that is disposed on the upper surface (main surface on the lid 4 side) and protrudes upward (on the lid 4 side). The convex portion 32 has a frame shape surrounding the concave portion 31 in a plan view as viewed from the Z-axis direction (however, portions that intersect with groove portions 35, 36, and 37 described later are not considered). Moreover, the convex part 32 is provided in joining area | region S3, and at least one part (all in this embodiment) is covered with the joining member 5. FIG. By providing such a convex portion 32, the surface area of the joining region S3 becomes larger than when there is no convex portion 32 (that is, when the joining region S3 is flat), and the base 3 and the joining member 5 are joined. Increases area. Therefore, the bonding strength between the base 3 and the bonding member 5 can be increased.

  The base 3 has a frame-shaped (annular) recess 33 that surrounds the periphery of the recess 31 and opens to the upper surface side, and a frame that opens to the upper surface side and surrounds the recess 33 in a plan view as viewed from the Z-axis direction. And an annular recess 34 is formed, and a region between these is a protrusion 32. That is, the convex portion 32 is formed by digging the surrounding (inner side and outer side) portions, and the upper surface of the convex portion 32 is flush with the upper surface of the base 3. According to such a configuration, the number of manufacturing steps of the electronic device 1 can be reduced, as will be described in the method for manufacturing the electronic device 1 described later.

  The height T1 of the convex portion 32 is not particularly limited. For example, the height T1 is preferably 0.01 μm or more and 10 μm or less, and more preferably 0.05 μm or more and 1.0 μm or less. Thereby, the surface area of the convex part 32 can be sufficiently secured, and the joining member 5 easily goes around the convex part 32. Therefore, the bonding strength between the convex portion 32 and the bonding member 5 can be effectively increased. If the height T1 of the convex portion 32 exceeds 10 μm, depending on the type of the joining member 5, the joining member 5 becomes difficult to go around the convex portion 32, and a void is generated between the base 3 and the joining member 5. Is more likely to do.

  Further, the width W1 of the convex portion 32 (the length in the direction orthogonal to the extending direction of the convex portion 32 in a plan view as viewed from the Z-axis direction) is not particularly limited, but is, for example, 50 μm or more and 300 μm or less. It is preferably 80 μm or more and 200 μm or less, and more preferably 90 μm or more and 140 μm or less. Thereby, the surface area of the convex part 32 can be enlarged enough, preventing the excessive enlargement of the convex part 32. FIG. Therefore, it is possible to effectively increase the bonding strength between the convex portion 32 and the bonding member 5 while suppressing an increase in the size of the electronic device 1.

  Moreover, as shown in FIG. 1, the base 3 has three groove parts 35, 36, and 37 opened to the upper surface side. Each groove part 35, 36, 37 is formed across the concave part 33 and the concave part 34 across the convex part 32. Each groove 35, 36, 37 extends inside and outside the storage space S, and one end side thereof is located outside the storage space S and the other end side thereof is located within the storage space S.

  Although it does not specifically limit as depth D1 of each groove part 35,36,37, For example, it is preferable that it is deeper than the depth D2 of the recessed part 33 and 34, and is shallower than the depth D3 of the recessed part 31. FIG. That is, it is preferable to satisfy the relationship of D2 <D1 <D3. As will be described later, wirings 75, 76, and 77 for electrically connecting to the element piece 6 are disposed in the groove portions 35, 36, and 37. By setting the depth D1 to the above range, The length D1 is appropriate for disposing the wirings 75, 76, and 77.

  Specifically, when the groove portions 35, 36, and 37 are too deep (for example, D1 ≧ D3), an excessive gap may be formed between the wirings 75, 76, and 77 and the element piece 6. In this case, it is difficult to electrically connect the wirings 75, 76, 77 and the element piece 6. On the contrary, when the grooves 35, 36, and 37 are too shallow (for example, D1 ≦ D2), the gap between the wirings 75, 76, and 77 and the element piece 6 may be too small. There is a possibility that the wiring 75, 76, 77 contacts (electrically connects) with the element piece 6 at a portion other than the connection portion with the element piece 6, thereby causing a short circuit between the wirings 75, 76, 77.

  Examples of such a base 3 include glass materials containing alkali metal ions (mobile ions) such as sodium ions (for example, borosilicate glass such as Tempax glass (registered trademark) and Pyrex glass (registered trademark)). The glass substrate comprised by can be used. Thereby, for example, as will be described later, the element piece 6 formed from the silicon substrate can be bonded to the base 3 by the anodic bonding method. Therefore, the element piece 6 can be firmly bonded to the base 3. Further, since the base 3 is excellent in processing accuracy and easy to process, the recesses 31, 33, 34 and the grooves 35, 36, 37 can be easily formed, and the light-transmitting base 3 is obtained. You can also. Therefore, the state of the element piece 6 (for example, the presence or absence of “sticking” that is a phenomenon in which the element piece 6 sticks to the bottom surface of the recess 31 and the state of wiring) is visually recognized from the outside of the package 2 through the base 3. be able to.

  However, the base 3 is not particularly limited, and for example, a silicon substrate or a ceramic substrate may be used. When a silicon substrate is used as the base 3, a high-resistance silicon substrate is used from the viewpoint of preventing a short circuit, or a silicon substrate having a silicon oxide film (insulating oxide) formed on the surface by thermal oxidation or the like is used. It is preferable.

  Here, as described in the method for manufacturing the electronic device 1 described later, in this embodiment, the recess 31 and the grooves 35, 36, and 37 are each formed by isotropic etching using a wet etching method. The recesses 33 and 34 are each formed by anisotropic etching using a dry etching method. This facilitates the formation of these parts, and can reduce the number of manufacturing steps. However, the method for forming the recesses 31, 33, 34 and the groove portions 35, 36, 37 is not particularly limited.

  Further, as shown in FIG. 1, wirings 75, 76, and 77 that are electrically connected to the element pieces 6 are provided in the groove portions 35, 36, and 37. In addition, one end of each of the wirings 75, 76, and 77 is exposed to the outside of the lid body 4, and functions as an electrode pad P that is electrically connected to an external device (for example, a circuit element 1020 described later). To do.

  The constituent material of the wirings 75, 76, 77 is not particularly limited. For example, gold (Au), silver (Ag), platinum (Pt), palladium (Pd), iridium (Ir), copper (Cu), aluminum Metal materials such as (Al), nickel (Ni), Ti (titanium) and tungsten (W), alloys containing these metal materials, oxidation of ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), ZnO, IGZO, etc. Examples thereof include physical transparent conductive materials, and one or more of them can be used in combination (for example, as a laminate of two or more layers).

  As shown in FIG. 1, the lid body 4 has a plate shape having a rectangular plan view shape. Moreover, as shown in FIG. 2, the cover body 4 has the recessed part 41 opened to the lower surface side (base 3 side). In such a lid 4, a frame-like joining region S <b> 4 to be joined to the base 3 is provided on the lower surface (the surface on the base 3 side), and the element piece 6 is accommodated in the recess 41, It is joined to the upper surface (joining region S3) of the base 3 via the joining member 5. A storage space S for storing the element piece 6 is formed inside the cover body 4 and the base 3.

  As shown in FIG. 2, the lid 4 has a communication hole 42 that communicates the inside and outside of the storage space S. The storage space S can be replaced with a desired atmosphere through the communication hole 42. A sealing member 43 is disposed in the communication hole 42, and the communication hole 42 is hermetically sealed by the sealing member 43.

  The sealing member 43 is not particularly limited as long as the communication hole 42 can be sealed. For example, gold (Au) / tin (Sn) alloy, gold (Au) / germanium (Ge) alloy, gold (Au) / Various alloys such as aluminum (Al) alloys, glass materials such as low melting point glass, and the like can be used.

  In addition, when sealing the communication hole 42 with the sealing member 43, it can seal in a cleaner environment by performing heat processing and a dehydration process. Specifically, the base 3 and the lid 4 can be hermetically sealed in a state where outgas such as a solvent component generated from the joining member 5 is eliminated as much as possible. In addition, when sealing with the sealing member 43, pressure adjustment and selection of the atmospheric gas can be performed to perform hermetic sealing in a state suitable for the operation of the electronic device 1.

  The storage space S is an airtight space. The storage space S is preferably filled with an inert gas such as nitrogen, helium, or argon and is at atmospheric pressure at the operating temperature (about −40 ° C. to 120 ° C.). By setting the storage space S to atmospheric pressure, the viscous resistance is increased and the damping effect is exhibited, so that the vibration of the element piece 6 (movable portion 623 described later) can be quickly converged. Therefore, the detection accuracy of the acceleration Ax of the electronic device 1 is improved.

  As such a lid 4, for example, a silicon substrate can be used. However, the lid 4 is not particularly limited, and for example, a glass substrate or a ceramic substrate may be used.

  As shown in FIG. 2, the joining member 5 is located between the base 3 and the lid body 4 and joins them. More specifically, the joining member 5 is located between the joining region S3 of the base 3 and the joining region S4 of the lid 4 and joins the joining regions S3 and S4. As described above, the convex portion 32 is provided in the joint region S <b> 3, and the entire region of the convex portion 32 is covered with the joint member 5. Therefore, the bonding area between the bonding member 5 and the base 3 can be increased, and the bonding strength between the bonding member 5 and the base 3 can be increased. Therefore, the base 3 and the lid body 4 can be joined more firmly, and the mechanical strength of the electronic device 1 is improved.

  Such a joining member 5 is not particularly limited as long as the base 3 and the lid 4 can be joined. For example, low-melting glass (glass frit), various resin adhesives, brazing materials, and the like are used. be able to. However, in this embodiment, low melting glass (glass frit) is used as the joining member 5. Thereby, it becomes the joining member 5 which is easy to use and can join the base 3 and the lid body 4 more firmly. Further, since the low melting point glass is excellent in airtightness, the storage space S can be hermetically sealed by the joining member 5 more reliably. The low melting point glass means, for example, a glass material having a softening point (temperature at which the glass is softened and deformed by its own weight) of 600 ° C. or less.

For example, when the base 3 and the lid 4 are directly bonded by an anodic bonding method or the like, the inside and outside of the storage space S are in communication with each other through the groove portions 35, 36, and 37. Therefore, in this case, for example, it is necessary to close the grooves 35, 36, and 37 with a SiO ₂ film formed by a CVD method using TEOS (tetraethoxysilane), and this process is performed separately from the bonding process. Must be.

  On the other hand, in this embodiment, as shown in FIG. 3, by joining the base 3 and the lid body 4 using the joining member 5, the base 3 and the lid body 4 are joined. The groove portions 35, 36 and 37 can be closed by the member 5. Therefore, it is not necessary to perform a process of closing the grooves 35, 36, and 37 separately from the process of joining the base 3 and the lid 4, and the number of manufacturing processes of the electronic device 1 can be reduced. As described above, the groove portions 35, 36, and 37 can be easily blocked by filling the groove portions 35, 36, and 37 into the groove portions 35, 36, and 37 in the portion overlapping the bonding region S <b> 3 (bonding member 5). .

  The width W2 of each groove 35, 36, 37 (the length in the direction orthogonal to the extending direction of each groove 35, 36, 37 in a plan view as viewed from the Z-axis direction) is from the opening side to the bottom side ( It gradually decreases toward the Z axis direction minus side). That is, each groove part 35,36,37 has a taper-shaped cross-sectional shape. Thereby, it becomes easy for the joining member 5 to enter into each of the groove portions 35, 36, and 37 in a portion overlapping with the joining region S3. Moreover, generation | occurrence | production of the void (bubble) in the connection part of the bottom face and side surface of each groove part 35,36,37 can be suppressed more reliably. Therefore, the bonding strength between the base 3 and the bonding member 5 can be further increased. Moreover, the groove portions 35, 36, and 37 can be filled more reliably by the joining member 5, and the storage space S can be more hermetically sealed.

  In particular, in each groove part 35, 36, 37 of this embodiment, both side surfaces are curved, and the change rate of the width W2 gradually increases from the opening side toward the bottom surface side (Z-axis direction minus side). Thereby, a bottom face and a side face can be made into the continuous surface, and generation | occurrence | production of the void in the connection part of these surfaces can be suppressed more effectively. However, the cross-sectional shape of each groove part 35, 36, 37 is not particularly limited, and for example, the width W2 may be constant in the depth direction.

(Element piece)
As shown in FIG. 1, the element piece 6 includes a fixed electrode portion 61 fixed to the base 3 and a movable electrode portion 62 that can be displaced with respect to the base 3.

  Such an element piece 6 can be formed, for example, by patterning a silicon substrate doped with impurities such as phosphorus (P) and boron (B). The element piece 6 is bonded to the upper surface of the base 3 by an anodic bonding method. However, the material of the element piece 6 and the bonding method between the element piece 6 and the base 3 are not particularly limited.

  The movable electrode part 62 includes a pair of support parts 621 and 622, a movable part 623, a pair of connecting parts 624 and 625, and a movable electrode finger 626. The support portions 621 and 622 are arranged side by side in the X-axis direction with the concave portion 31 interposed therebetween, and are respectively joined to the upper surface of the base 3. The support portion 622 is electrically connected to the wiring 75 via the conductive bump B1 (conductive member). Note that the conductive bump B1 may be omitted, and the support portion 622 and the wiring 75 may be in direct contact with each other so as to be electrically connected. Similarly, the conductive bump B1 may be omitted and connected using a conductive wire or the like instead. The same applies to conductive bumps B2 and B3 described later.

  A movable portion 623 is located between the support portions 621 and 622. The movable portion 623 is provided so as to overlap the concave portion 31 in a plan view as viewed from the Z-axis direction, and contact with the base 3 is prevented. In addition, the movable portion 623 is connected to the support portion 621 via the connecting portion 624 at the end on the X axis direction plus side, and is connected to the support portion 622 via the connecting portion 625 at the end portion on the minus side in the X axis direction. It is connected. Each of the connecting portions 624 and 625 can be elastically deformed in the X-axis direction, and when an acceleration Ax is applied, the movable portion 623 elastically deforms the connecting portions 624 and 625 and X with respect to the support portions 621 and 622. Displace in the axial direction. The movable portion 623 is provided with a plurality of movable electrode fingers 626 extending on both sides in the Y-axis direction and intermittently juxtaposed in the X-axis direction.

  The fixed electrode unit 61 includes a plurality of first fixed electrode fingers 611 and a plurality of second fixed electrode fingers 612.

  The plurality of first fixed electrode fingers 611 are arranged on the plus side in the X-axis direction of each movable electrode finger 626, and are arranged in a comb-like shape that meshes with the corresponding movable electrode finger 626 at an interval. Yes. On the other hand, the plurality of second fixed electrode fingers 612 are disposed on the minus side in the X-axis direction of each movable electrode finger 626 so as to form a comb-tooth shape that meshes with the corresponding movable electrode finger 626 at an interval. Are lined up. Each of the first fixed electrode finger 611 and the second fixed electrode finger 612 is bonded (fixed) to the upper surface of the base 3 at the base end.

  Further, each first fixed electrode finger 611 is electrically connected to the wiring 76 via a conductive bump B2 (conductive member). Each of the second fixed electrode fingers 612 is electrically connected to the wiring 77 via a conductive bump B3 (conductive member).

  Next, the operation of the electronic device 1 will be described. When the electronic device 1 operates, for example, the voltage V1 in FIG. 4 is applied to the movable electrode portion 62 (movable electrode finger 626), and the voltage V2 is applied to the first fixed electrode finger 611 and the second fixed electrode finger 612. . When the acceleration Ax in the X-axis direction is applied to the electronic device 1, the movable portion 623 is displaced in the X-axis direction while elastically deforming the coupling portions 624 and 625 based on the magnitude of the acceleration Ax. Along with such a displacement, the gap between the movable electrode finger 626 and the first fixed electrode finger 611 and the gap between the movable electrode finger 626 and the second fixed electrode finger 612 change, and the movable electrode finger 626 can move according to the amount of change. The capacitance between the electrode finger 626 and the first fixed electrode finger 611 and the capacitance between the movable electrode finger 626 and the second fixed electrode finger 612 change. Therefore, the acceleration Ax can be detected based on these changes in capacitance.

  The configuration of the electronic device 1 has been described above. As described above, the electronic device 1 includes the package 2 having the storage space S and the element piece 6 stored in the storage space S. The package 2 is disposed between the base 3 as the first base, the lid 4 as the second base, the base 3 and the lid 4, and joins the base 3 and the lid 4. And a joining member 5. At least one of the base 3 and the lid 4 (the base 3 in the present embodiment) has a convex portion 32 protruding to the other side, and the joining member 5 has at least a part of the convex portion 32 (in the present embodiment). All). Thereby, the joining area of the joining member 5 and the base 3 can be increased, and the joining strength between the joining member 5 and the base 3, that is, the joining strength between the base 3 and the lid 4 can be increased. Therefore, the mechanical strength of the electronic device 1 is improved. In addition, since the storage space S formed inside the base 3 and the lid 4 is hermetically sealed by the joining member 5, the number of manufacturing steps of the electronic device 1 can be reduced. The manufacture of the electronic device 1 is facilitated.

  In addition, the joining member 5 should just be arrange | positioned covering at least one part of the convex part 32, for example, as shown in FIG. 5, a part of convex part 32 may be exposed from the joining member 5. As shown in FIG. . In other words, a part of the convex portion 32 may be located outside the joining region S3.

  As described above, in the electronic device 1, the convex portion 32 surrounds the storage space S (the concave portion 31) in a plan view as viewed from the Z-axis direction (the direction in which the base 3 and the lid body 4 overlap). It has a frame shape. Thereby, the contact area of the base 3 and the joining member 5 can be enlarged easily and effectively, and the joining strength of the base 3 and the cover body 4 can be raised more. Moreover, since substantially the same joining strength can be exhibited over the entire area around the storage space S, the joining state of the base 3 and the lid 4 is stabilized.

  Further, as described above, in the electronic device 1, the height T1 of the convex portion 32 is preferably 0.01 μm or more and 10 μm or less. Thereby, the surface area of the convex part 32 can be sufficiently secured, and the joining member 5 easily goes around the convex part 32. Therefore, the bonding strength between the convex portion 32 and the bonding member 5 can be effectively increased.

  Further, as described above, in the electronic device 1, the base 3 is open on the upper surface (the surface on the lid 4 side) and extends into and out of the storage space S, and the groove portions 35, 36. , 37 and wirings 75, 76, 77. In addition, the joining member 5 is provided in the groove portions 35, 36, and 37 at portions where the groove portions 35, 36, and 37 intersect with the joining member 5 (joining region S <b> 3). Thereby, the groove parts 35, 36, and 37 can be filled with the joining member 5, and the storage space S can be hermetically sealed more easily.

  Further, as described above, in the electronic device 1, the widths of the groove portions 35, 36, and 37 are gradually reduced from the opening side toward the bottom surface side. Thereby, in the part which overlaps with joining area | region S3, the joining member 5 becomes easy to penetrate | invade into each groove part 35,36,37. Moreover, generation | occurrence | production of the void in the corner | angular part formed by the bottom face and side surface of each groove part 35,36,37 can be suppressed more reliably. Therefore, the bonding strength between the bonding region S3 and the bonding member 5 can be further increased.

  Further, as described above, in the electronic device 1, the bonding member 5 is low-melting glass. Thereby, it becomes the joining member 5 which is easy to use and can join the base 3 and the lid body 4 more firmly. Further, since the low melting point glass is excellent in airtightness, the storage space S can be hermetically sealed by the joining member 5 more reliably.

  Next, a method for manufacturing the electronic device 1 will be described. As shown in FIG. 6, the manufacturing method of the electronic device 1 includes a preparation step of preparing a base 3 (first base), a substrate bonding step of bonding a substrate 60 that is a base material of the element piece 6 to the base 3, The substrate 60 is processed to form the element piece 6, the base 3 is processed to form the convex portion 32, and the lid 4 (second base) is prepared. A joining step of joining the lid body 4 to the base 3 via the joining member 5. Hereinafter, such a manufacturing method will be described in detail.

(Preparation process)
First, as shown in FIG. 7, for example, a base 3 made of a glass substrate made of borosilicate glass is prepared, and a recess 31 opened on the upper surface of the base 3 using a photolithography technique and a wet etching technique, and Grooves 35, 36, and 37 are formed. In the present embodiment, since the depths of the recess 31 and the grooves 35, 36, and 37 are different, the step of forming the recess 31 and the step of forming the grooves 35, 36, and 37 are performed separately. According to the wet etching, the base 3 can be isotropically etched, so that the grooves 35, 36, and 37 can be easily tapered as described above.

  Next, as shown in FIG. 8, wirings 75, 76 and 77 are formed in the groove portions 35, 36 and 37. Further, the method for forming the wirings 75, 76, 77 is not particularly limited. For example, a metal layer is formed by sputtering, vapor deposition, and the like, and this metal layer is patterned by using a photolithography technique and an etching technique. A method is mentioned. Alternatively, a lift-off method may be used in which a photoresist is patterned into a desired wiring shape in advance and then a metal film is formed on the entire surface to remove the photoresist and unnecessary metal layers.

(Board bonding process)
Next, as shown in FIG. 9, a mask M <b> 1 is formed on the region S <b> 32 where the convex portion 32 of the base 3 is formed. The material and forming method of the mask M1 are not particularly limited. For example, a film made of DLC (diamond-like carbon) is formed by sputtering, vapor deposition, or the like, and this film is formed using a photolithography technique and an etching technique. The method of patterning is mentioned. Alternatively, a lift-off method may be used in which a photoresist is patterned into a desired shape in advance and then a DLC film is formed on the entire surface to remove the photoresist and unnecessary DLC film. Next, conductive bumps B1, B2, and B3 are disposed on the wirings 75, 76, and 77.

  Next, as shown in FIG. 10, a substrate 60 which is a base material of the element piece 6 and is made of a silicon substrate is prepared, and this substrate 60 is bonded to the upper surface of the base 3 by anodic bonding. Here, a recess 601 is formed on the lower surface of the substrate 60 in order to prevent contact with the mask M1. Thereby, the lower surface of the board | substrate 60 can be made to contact the upper surface of the base 3 more reliably, and these can be joined more reliably.

(Formation process)
Next, after thinning the substrate 60 using CMP (Chemical Mechanical Polishing) as necessary, the substrate 60 is doped (diffused) with impurities such as phosphorus and boron to impart conductivity. Or you may use the board | substrate 60 to which electroconductivity was provided previously. Next, as shown in FIG. 11, a mask M2 having a shape corresponding to the element piece 6 is formed on the upper surface of the substrate 60, and the substrate 60 is dry-etched (RIE: reactive ion etching) through the mask M2. Preferably, inductively coupled plasma etching (ICP-RIE: Inductively Coupled Plasma-RIE) using a reactive gas such as sulfur hexafluoride (SF6) is used. Thereby, as shown in FIG. 12, the element piece 6 is obtained. At this time, by performing dry etching for a long time, the portions exposed from the mask M1 (element piece 6) and the mask M2 of the base 3 can be over-etched, and the recesses 33 and 34 can be formed. Thereby, the convex part 32 is obtained. According to such a method, since the element piece 6 and the convex portion 32 can be formed in the same process, the number of manufacturing steps of the electronic device 1 can be reduced, and the manufacturing of the electronic device 1 is easier. Become.

(Joining process)
Next, as shown in FIG. 13, the lid body 4 is prepared, and the lid body 4 is joined to the base 3 using the joining member 5. Thereby, the storage space S is formed and the element piece 6 is stored in the storage space S. Further, since at least a part of the convex portion 32 is covered by the joining member 5, the contact area between the base 3 and the joining member 5 is increased, and the joining strength can be increased.

  Next, a spherical sealing member 43 is disposed in the communication hole 42 of the lid 4, and the storage space S is replaced with a desired atmosphere through a gap between the communication hole 42 and the sealing member 43. Next, the communication hole 42 is sealed by irradiating the sealing member 43 with a laser to melt the sealing member 43. Thereby, the storage space S is sealed in a state where the atmosphere is replaced with a desired atmosphere. Thus, the electronic device 1 is obtained as shown in FIG.

  As described above, the method for manufacturing the electronic device 1 includes a preparation process for preparing the base 3 (first base), and a substrate bonding process for bonding the substrate 60 serving as a base material of the element piece 6 to the base 3. Then, the substrate 60 is processed to form the element piece 6, the base 3 is processed to form the convex portion 32, and the lid body 4 (second base) is prepared. A joining step of joining the lid body 4 to the base 3 via the joining member 5 so as to accommodate 6. And in the joining process, the joining member 5 is arrange | positioned so that at least one part (all in this embodiment) of the convex part 32 may be covered. Thereby, the joining area of the joining member 5 and the base 3 can be increased, and the electronic device 1 having a high joining strength between the base 3 and the lid 4 can be obtained. In addition, since the storage space S formed inside the base 3 and the lid 4 is hermetically sealed by the joining member 5, the number of manufacturing steps of the electronic device 1 can be reduced. The manufacture of the electronic device 1 is facilitated.

Second Embodiment
Next, an electronic device according to a second embodiment of the present invention will be described.

  FIG. 15 is a cross-sectional view of an electronic device according to the second embodiment of the present invention. Note that FIG. 15 corresponds to a cross-sectional view taken along line AA in FIG. 1 (FIG. 2).

  The electronic device 1 according to the present embodiment is the same as the electronic device 1 of the first embodiment described above except that the configuration of the convex portion 32 is different.

  In the following description, the electronic device 1 according to the second embodiment will be described with a focus on differences from the first embodiment described above, and description of similar matters will be omitted. In FIG. 15, the same reference numerals are given to the same configurations as those of the first embodiment described above.

  As shown in FIG. 15, in the electronic device 1 of the present embodiment, the width W1 of the convex portion 32 (the length in the direction orthogonal to the extending direction of the convex portion 32 in a plan view as viewed from the Z-axis direction) is It gradually decreases from the base end side toward the tip end side (Z-axis direction plus side). That is, the convex part 32 has a taper-shaped cross-sectional shape. As a result, for example, as in the first embodiment described above, the bonding member 5 can easily wrap around the side surface of the convex portion 32 as compared to the case where the width W1 of the convex portion 32 is constant in the height direction. Moreover, generation | occurrence | production of the void (bubble) in the connection part of the side surface of the convex part 32 and the bottom face of the recessed parts 33 and 34 can be suppressed more reliably. Therefore, the bonding strength between the base 3 and the bonding member 5 can be further increased.

  In particular, the convex portion 32 of the present embodiment has curved side surfaces, and the rate of change of the width W1 gradually decreases from the proximal end side toward the distal end side (Z-axis direction plus side). Thereby, the side surface of the convex part 32 and the bottom face of the recessed parts 33 and 34 can be made into the continuous surface, and generation | occurrence | production of the void in the said part can be suppressed more effectively.

  In addition, the convex part 32 of such a shape can be easily formed by forming the concave parts 33 and 34 by wet etching which is isotropic etching, for example.

  Also according to the second embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Third Embodiment>
Next, an electronic device according to a third embodiment of the invention will be described.

  FIG. 16 is a plan view showing an electronic device according to the third embodiment of the present invention. 17 is a cross-sectional view taken along line CC in FIG.

  The electronic device 1 according to the present embodiment is the same as the electronic device 1 of the first embodiment described above except that the configuration of the convex portion 32 is different.

  In the following description, the electronic device 1 according to the third embodiment will be described with a focus on differences from the first embodiment described above, and description of similar matters will be omitted. Moreover, in FIG. 16, the same code | symbol is attached | subjected about the structure similar to 1st Embodiment mentioned above.

  As shown in FIG. 16, in the electronic device 1 according to the present embodiment, the convex portion 32 is positioned apart from the first convex portion 321 outside the first convex portion 321 and the first convex portion 321 having a frame shape. And a frame-like second convex portion 322 surrounding the first convex portion 321. Thereby, for example, even if the width of the bonding region S3 is the same as that of the first embodiment described above, the surface area of the bonding region S3 can be increased as compared with the first embodiment described above. Therefore, according to the present embodiment, the bonding strength between the base 3 and the bonding member 5 can be further increased without increasing the size of the electronic device 1. In addition, as a structure of the convex part 32, it is located in the outer side of the 2nd convex part 322, spaced apart from the 2nd convex part, and the frame-shaped 3rd convex part surrounding the 2nd convex part 322, the 3rd convex part There may be a frame-like fourth convex portion that is located outside the third convex portion and is surrounded by the third convex portion, and the number of convex portions 32 is not limited.

  Also according to the third embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Fourth embodiment>
Next, an electronic device according to a fourth embodiment of the invention will be described.
FIG. 18 is a plan view showing an electronic device according to the fourth embodiment of the present invention.

  The electronic device 1 according to the present embodiment is the same as the electronic device 1 of the first embodiment described above except that the configuration of the convex portion 32 is different.

  In the following description, the electronic device 1 according to the fourth embodiment will be described with a focus on differences from the first embodiment described above, and description of similar matters will be omitted. Moreover, in FIG. 18, the same code | symbol is attached | subjected about the structure similar to 1st Embodiment mentioned above.

  As shown in FIG. 18, in the electronic device 1 according to the present embodiment, the convex portion 32 is formed in the storage space S (the concave portion 31) in a plan view viewed from the Z-axis direction (the direction in which the base 3 and the lid body 4 overlap). It has the some convex piece 320 arrange | positioned at intervals (intermittently) along the circumferential direction. Thereby, for example, even if the planar area of the joining region S3 (the area in plan view seen from the Z-axis direction) is the same as that of the above-described first embodiment, the joining area S3 is joined as compared with the above-described first embodiment. The surface area of the region S3 can be increased. Therefore, according to the present embodiment, the bonding strength between the base 3 and the bonding member 5 can be further increased without increasing the size of the electronic device 1.

  Further, the plurality of convex pieces 320 have substantially the same shape. Further, when the length of each convex piece 320 is L1 and the distance between two adjacent convex pieces 320 is L2, the ratio of L1 and L2 is not particularly limited, but 0.5 ≦ L1 / L2 ≦ 3, preferably 0.5 ≦ L1 / L2 ≦ 2, more preferably 0.8 ≦ L1 / L2 ≦ 1.5. In particular, in the present embodiment, L1 / L2 = 1 (L1 = L2). Thereby, the separation distance L2 can be made relatively short, and a sufficient number of convex pieces 320 can be arranged in the joining region S3. Therefore, the surface area of the joining region S3 can be increased, and the joining strength between the base 3 and the joining member 5 can be further increased.

  According to the fourth embodiment, the same effect as that of the first embodiment described above can be exhibited.

<Fifth Embodiment>
Next, an electronic device according to a fifth embodiment of the invention will be described.
FIG. 19 is a plan view showing an electronic device according to the fifth embodiment of the present invention.

  The electronic device 1 according to the present embodiment is the same as the electronic device 1 of the first embodiment described above except that the configuration of the convex portion 32 is different.

  In the following description, the electronic device 1 according to the fifth embodiment will be described with a focus on differences from the first embodiment described above, and description of similar matters will be omitted. Moreover, in FIG. 19, the same code | symbol is attached | subjected about the structure similar to 1st Embodiment mentioned above.

  As shown in FIG. 19, in the electronic device 1 of the present embodiment, the convex portion 32 has a plurality of convex pieces 320. And the some convex piece 320 is arrange | positioned at the grid | lattice form. More specifically, the protrusions 32 are positioned outside the plurality of first protrusions 320 ′ and the plurality of first protrusions 320 ′ arranged at intervals along the circumferential direction of the bonding region S3. And a plurality of second convex pieces 320 ″ arranged at intervals along the circumferential direction of the joining region S3. And between the two adjacent first convex pieces 320 ′. One second convex piece 320 ″ is arranged alongside the gap, and one first convex piece 320 ′ is arranged alongside the gap between two adjacent second convex pieces 320 ″. The distance L2 ′ between the two first convex pieces 320 ′ and the length L1 ″ of the second convex piece 320 ″ are substantially equal, and the distance L2 ″ between the two adjacent second convex pieces 320 ″ and the first convexity The length L1 ′ of the piece 320 ′ is substantially equal. Particularly, in this embodiment, L1 ′ = L1 ″ = L2 ′ = L2 ″. .

  Thereby, for example, even if the planar area of the joining region S3 (the area in plan view seen from the Z-axis direction) is the same as that of the above-described first embodiment, the joining area S3 is joined as compared with the above-described first embodiment. The surface area of the region S3 can be increased. Therefore, according to the present embodiment, the bonding strength between the base 3 and the bonding member 5 can be further increased without increasing the size of the electronic device 1.

  According to the fifth embodiment, the same effect as that of the first embodiment described above can be exhibited.

<Sixth Embodiment>
Next, an electronic device according to a sixth embodiment of the invention will be described.

  FIG. 20 is a sectional view showing an electronic device according to the sixth embodiment of the present invention. Note that FIG. 20 corresponds to a cross-sectional view taken along line AA in FIG. 1 (FIG. 2).

  The electronic device 1 according to the present embodiment is the same as the electronic device 1 of the first embodiment described above except that the convex portion 32 is omitted from the base 3 and the convex portion 44 is disposed on the lid 4. .

  In the following description, the electronic device 1 according to the sixth embodiment will be described with a focus on differences from the first embodiment described above, and description of similar matters will be omitted. Moreover, in FIG. 20, the same code | symbol is attached | subjected about the structure similar to 1st Embodiment mentioned above.

  As shown in FIG. 20, in the electronic device 1 of the present embodiment, the protrusions 32 (recesses 33 and 34) are omitted from the base 3, and instead protrude downward from the lower surface of the lid 4. A convex portion 44 is provided. The convex portion 44 is located in the joining region S4 and has a frame shape formed along the circumferential direction of the joining region S4. Then, at least a part (all in the present embodiment) of the convex portion 44 is covered with the joining member 5. Thereby, compared with 1st Embodiment mentioned above, the contact area of the cover body 4 and the joining member 5 can be enlarged, and the joining strength of the cover body 4 and the joining member 5 can be raised, for example.

  Also according to the sixth embodiment, the same effects as those of the first embodiment described above can be exhibited. In addition, the structure of the convex part 44 can apply the structure of the convex part 32 of each embodiment mentioned above as it is.

<Seventh embodiment>
Next, an electronic device according to a seventh embodiment of the invention will be described.

  FIG. 21 is a sectional view showing an electronic device according to the seventh embodiment of the present invention. FIG. 21 corresponds to a cross-sectional view taken along line AA in FIG. 1 (FIG. 2).

  The electronic device 1 according to the present embodiment is the same as the electronic device 1 of the first embodiment described above, except that the convex portion 44 is arranged on the lid 4.

  In the following description, the electronic device 1 according to the seventh embodiment will be described with a focus on differences from the first embodiment described above, and description of similar matters will be omitted. Moreover, in FIG. 21, the same code | symbol is attached | subjected about the structure similar to 1st Embodiment mentioned above.

  As shown in FIG. 21, in the electronic device 1 of the present embodiment, the base 3 is provided with a convex portion 32 and the lid 4 is also provided with a convex portion 44. Thereby, compared with 1st Embodiment mentioned above, the contact area of the cover body 4 and the joining member 5 can be enlarged, and the joining strength of the cover body 4 and the joining member 5 can be raised, for example. Therefore, for example, compared with the first embodiment, the bonding strength between the base 3 and the lid 4 can be further increased.

  Also according to the seventh embodiment, the same effect as that of the first embodiment described above can be exhibited.

<Eighth Embodiment>
Next, an electronic module according to an eighth embodiment of the invention will be described.
FIG. 22 is a cross-sectional view showing an electronic module according to the eighth embodiment of the present invention.

  As shown in FIG. 22, the electronic module 1000 includes a base substrate 1010, an electronic device 1 provided on the base substrate 1010, a circuit element 1020 (IC) provided on the electronic device 1, and the electronic device 1. A bonding wire BW1 that electrically connects the circuit element 1020; a bonding wire BW2 that electrically connects the base substrate 1010 and the circuit element 1020; and a molding portion 1030 that molds the electronic device 1 and the circuit element 1020. Have. Here, as the electronic device 1, for example, any one of the above-described embodiments can be used.

  The base substrate 1010 is a substrate that supports the electronic device 1, and is, for example, an interposer substrate. A plurality of connection terminals 1011 are arranged on the upper surface of the base substrate 1010 and a plurality of mounting terminals 1012 are arranged on the lower surface. In addition, an internal wiring (not shown) is disposed in the base substrate 1010, and each connection terminal 1011 is electrically connected to the corresponding mounting terminal 1012 through the internal wiring. Such a base substrate 1010 is not particularly limited, and for example, a silicon substrate, a ceramic substrate, a resin substrate, a glass substrate, a glass epoxy substrate, or the like can be used.

  The electronic device 1 is disposed on the base substrate 1010 with the base 3 facing downward (base substrate 1010 side). The electronic device 1 is bonded to the base substrate 1010 via a die attach material.

  The circuit element 1020 is disposed on the electronic device 1. The circuit element 1020 is bonded to the lid 4 of the electronic device 1 via a die attach material. The circuit element 1020 is electrically connected to each electrode pad P of the electronic device 1 through the bonding wire BW1, and is electrically connected to the connection terminal 1011 of the base substrate 1010 through the bonding wire BW2. Such a circuit element 1020 includes a drive circuit that drives the electronic device 1, a detection circuit that detects acceleration Ax based on an output signal from the electronic device 1, and a signal from the detection circuit that is converted into a predetermined signal. An output circuit and the like for output are included as necessary.

  The mold unit 1030 molds the electronic device 1 and the circuit element 1020. Thereby, the electronic device 1 and the circuit element 1020 can be protected from moisture, dust, impact, and the like. Although it does not specifically limit as the mold part 1030, For example, a thermosetting epoxy resin can be used, For example, it can mold by the transfer mold method.

  The electronic module 1000 as described above includes the electronic device 1. Therefore, the effect of the electronic device 1 described above can be enjoyed, and a highly reliable electronic module 1000 can be obtained.

  The configuration of the electronic module 1000 is not limited to the above configuration, and for example, the electronic device 1 may be configured to be housed in a ceramic package.

<Ninth Embodiment>
Next, an electronic apparatus according to a ninth embodiment of the invention will be described.
FIG. 23 is a perspective view showing an electronic apparatus according to the ninth embodiment of the present invention.

  A mobile (or notebook) personal computer 1100 shown in FIG. 23 is an application of an electronic apparatus including the electronic device of the present invention. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 incorporates the electronic device 1. Here, as the electronic device 1, for example, any one of the above-described embodiments can be used.

  Such a personal computer 1100 (electronic device) has an electronic device 1. Therefore, the effect of the electronic device 1 described above can be enjoyed and high reliability can be exhibited.

<Tenth Embodiment>
Next, an electronic apparatus according to a tenth embodiment of the invention will be described.
FIG. 24 is a perspective view showing an electronic apparatus according to the tenth embodiment of the present invention.

  A cellular phone 1200 (including PHS) illustrated in FIG. 24 is obtained by applying an electronic apparatus including the electronic device of the present invention. In this figure, a cellular phone 1200 includes an antenna (not shown), a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is provided between the operation buttons 1202 and the earpiece 1204. Has been placed. Such a cellular phone 1200 incorporates the electronic device 1. Here, as the electronic device 1, for example, any one of the above-described embodiments can be used.

  Such a cellular phone 1200 (electronic device) has the electronic device 1. Therefore, the effect of the electronic device 1 described above can be enjoyed and high reliability can be exhibited.

<Eleventh embodiment>
Next, an electronic apparatus according to an eleventh embodiment of the present invention will be described.
FIG. 25 is a perspective view showing an electronic apparatus according to the eleventh embodiment of the present invention.

  A digital still camera 1300 shown in FIG. 25 is an application of an electronic apparatus including the electronic device of the present invention. In this figure, a display unit 1310 is provided on the back of a case (body) 1302, and is configured to display based on an image pickup signal by a CCD. The display unit 1310 is a finder that displays an object as an electronic image. Function. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302. When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. Such a digital still camera 1300 incorporates the electronic device 1. Here, as the electronic device 1, for example, any of the above-described embodiments can be used.

  Such a digital still camera 1300 (electronic apparatus) has an electronic device 1. Therefore, the effect of the electronic device 1 described above can be enjoyed and high reliability can be exhibited.

  The electronic device of the present invention includes, for example, a smart phone, a tablet terminal, a watch (including a smart watch), an ink jet discharge, in addition to the personal computer and mobile phone of the above-described embodiment and the digital still camera of the present embodiment. Wearable terminals such as devices (for example, inkjet printers), laptop personal computers, televisions, HMDs (head-mounted displays), video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic Dictionary, calculator, electronic game device, word processor, workstation, video phone, security TV monitor, electronic binoculars, POS terminal, medical device (eg electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasound diagnosis Device, electronic endoscope), fish finder, various measuring equipment, mobile terminal base station equipment, instruments (eg, vehicles, aircraft, ship instruments), flight simulator, network server, etc. it can.

<Twelfth embodiment>
Next, a mobile unit according to a twelfth embodiment of the present invention is described.
FIG. 26 is a perspective view showing a moving body according to the twelfth embodiment of the present invention.

  An automobile 1500 illustrated in FIG. 26 is an automobile to which a moving object including the electronic device of the present invention is applied. In this figure, an electronic device 1 is built in an automobile 1500, and the posture of the vehicle body 1501 can be detected by the electronic device 1. The detection signal of the electronic device 1 is supplied to the vehicle body posture control device 1502, and the vehicle body posture control device 1502 detects the posture of the vehicle body 1501 based on the signal and controls the stiffness of the suspension according to the detection result. The brakes of the individual wheels 1503 can be controlled. Here, as the electronic device 1, for example, any one of the above-described embodiments can be used.

  Such an automobile 1500 (moving body) has the electronic device 1. Therefore, the effect of the electronic device 1 described above can be enjoyed and high reliability can be exhibited.

  In addition, the electronic device 1 includes a car navigation system, a car air conditioner, an anti-lock brake system (ABS), an air bag, a tire pressure monitoring system (TPMS), an engine control, and a hybrid vehicle. It can be widely applied to electronic control units (ECU) such as battery monitors for electric vehicles and electric vehicles.

  Further, the moving body is not limited to the automobile 1500, and can be applied to, for example, an unmanned airplane such as an airplane, a rocket, an artificial satellite, a ship, an AGV (automated guided vehicle), a bipedal walking robot, and a drone. .

  As described above, the electronic device, the electronic device manufacturing method, the electronic module, the electronic apparatus, and the moving body of the present invention have been described based on the illustrated embodiments, but the present invention is not limited to this, It can be replaced with any configuration having a similar function. In addition, any other component may be added to the present invention. Moreover, you may combine embodiment mentioned above suitably.

  In the above-described embodiment, the configuration in which the element piece can detect the acceleration in the X-axis direction has been described. However, the configuration of the element piece is not limited thereto, and for example, the acceleration in the Y-axis direction is detected. The structure which can be performed may be sufficient, and the structure which can detect the acceleration of a Z-axis direction may be sufficient. In the above-described embodiment, the configuration in which the electronic device has one element piece has been described. However, the number of element pieces is not particularly limited, and may be two or more. In the case of two or more, for example, it is preferable to have element pieces that can detect accelerations in different axial directions.

  In the above-described embodiment, the configuration in which the element piece can detect the acceleration has been described. However, the physical quantity detected by the element piece is not limited to the acceleration, and may be an angular velocity, for example. In this case, as the element piece, for example, any of a configuration capable of detecting an angular velocity around the X axis, a configuration capable of detecting an angular velocity around the Y axis, and a configuration capable of detecting the angular velocity around the Z axis. It can be. Moreover, you may have two or more element pieces selected from these. Of course, you may combine with the element piece which can detect the acceleration mentioned above.

  Further, in the above-described embodiment, the configuration in which the element piece can detect acceleration and the electronic device functions as a physical quantity sensor has been described. However, the configuration of the electronic device is not particularly limited. For example, the electronic device may have a configuration in which an oscillation device for an oscillator (a crystal oscillation element or the like) is used as an element piece.

  DESCRIPTION OF SYMBOLS 1 ... Electronic device, 2 ... Package, 3 ... Base, 31 ... Concave part, 32 ... Convex part, 320 ... Convex piece, 320 "... 2nd convex piece, 320 '... 1st convex piece, 321 ... 1st convex part, 322 ... 2nd convex part, 33, 34 ... Recessed part, 35, 36, 37 ... Groove part, 4 ... Lid, 41 ... Recessed part, 42 ... Communication hole, 43 ... Sealing member, 44 ... Convex part, 5 ... Joining member , 6 ... element piece, 60 ... substrate, 601 ... recess, 61 ... fixed electrode part, 611 ... first fixed electrode finger, 612 ... second fixed electrode finger, 62 ... movable electrode part, 621, 622 ... support part, 623 ... movable part, 624, 625 ... connecting part, 626 ... movable electrode finger, 75, 76, 77 ... wiring, 1000 ... electronic module, 1010 ... base substrate, 1011 ... connecting terminal, 1012 ... mounting terminal, 1020 ... circuit element, 1030 ... Mold part, 1100 ... Personal compilation 1102 ... Keyboard, 1104 ... Main unit, 1106 ... Display unit, 1108 ... Display unit, 1200 ... Mobile phone, 1202 ... Operation button, 1204 ... Earpiece, 1206 ... Speaker, 1208 ... Display, 1300 ... Digital Still camera, 1302 ... Case, 1304 ... Light receiving unit, 1306 ... Shutter button, 1308 ... Memory, 1310 ... Display unit, 1500 ... Automobile, 1501 ... Car body, 1502 ... Car body posture control device, 1503 ... Wheel, Ax ... Acceleration, B1 , B2, B3 ... conductive bumps, BW1, BW2 ... bonding wires, D1, D2, D3 ... depth, L1, L1 ', L1 "... length, L2, L2', L2" ... separation distance, M1, M2 ... Mask, P ... Electrode pad, S ... Storage space, S3, S4 ... Bonding area, S32 ... Area, T ... Height, V1, V2 ... voltage, W1, W2 ... width

Claims (12)

A package having a storage space;
An element piece housed in the housing space,
The package is
A first substrate;
A second substrate;
A bonding member disposed between the first base and the second base and bonding the first base and the second base;
At least one of the first base and the second base has a convex portion protruding to the other side,
The electronic device is characterized in that the joining member is disposed so as to cover at least a part of the convex portion. In a plan view seen from the direction in which the first base and the second base overlap,
The electronic device according to claim 1, wherein the convex portion has a frame shape so as to surround the storage space. In a plan view seen from the direction in which the first base and the second base overlap,
The electronic device according to claim 1, wherein the convex portion has a plurality of convex pieces arranged at intervals along the circumferential direction of the storage space.   4. The electronic device according to claim 1, wherein the width of the convex portion is gradually reduced from the base end side toward the tip end side.   5. The electronic device according to claim 1, wherein a height of the convex portion is 0.01 μm or more and 10 μm or less. The first base has a groove that opens on the surface of the second base and extends in and out of the storage space, and a wiring disposed in the groove.
The electronic device according to any one of claims 1 to 5, wherein the joining member is provided in the groove portion at a portion where the groove portion and the joining member intersect.   The electronic device according to claim 6, wherein the width of the groove portion gradually decreases from the opening side toward the bottom surface side.   The electronic device according to claim 1, wherein the joining member is low-melting glass. Preparing a first substrate;
Bonding a substrate to the first substrate;
Processing the substrate to form element pieces, processing the first base to form convex portions;
Preparing a second substrate and bonding the second substrate to the first substrate via a bonding member so that the element piece is accommodated between the first substrate and the first substrate;
In the bonding step, the bonding member is disposed so as to cover at least a part of the convex portion.   An electronic module comprising the electronic device according to claim 1.   An electronic apparatus comprising the electronic device according to claim 1.   A moving body comprising the electronic device according to claim 1.

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