CN108156756A - A kind of isomery just have mercy on plate and based on isomery just have mercy on plate multi-layer board card manufacturing method - Google Patents
A kind of isomery just have mercy on plate and based on isomery just have mercy on plate multi-layer board card manufacturing method Download PDFInfo
- Publication number
- CN108156756A CN108156756A CN201810119526.XA CN201810119526A CN108156756A CN 108156756 A CN108156756 A CN 108156756A CN 201810119526 A CN201810119526 A CN 201810119526A CN 108156756 A CN108156756 A CN 108156756A
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- China
- Prior art keywords
- board
- plate
- rigid printed
- printed board
- mercy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000007639 printing Methods 0.000 claims abstract description 23
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 15
- 238000009434 installation Methods 0.000 claims description 6
- 238000013461 design Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000013497 data interchange Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
The invention discloses a kind of isomery just have mercy on plate, including rigid printed board, flexible printed circuit, mother daughter board connector, mother daughter board connector for controlling stack height between two neighboring rigid printed board is welded on rigid printed board one end, signal intercommunication is carried out by mother daughter board connector between adjacent rigid printed board, the printing of described flexible printed board one end is connected on rigid printed board and the other end is detachably connected on board, and signal intercommunication is carried out by flexible printed circuit between the rigid printed board that is correspondingly connected with, board.The isomery just have mercy on plate can meet well user individual, customize design requirement, limited space can be made full use of to optimize, it is simple in structure, have the very strong market competitiveness.The invention also discloses it is a kind of based on isomery just have mercy on plate multi-layer board card manufacturing method, process is simple, working efficiency is high.
Description
Technical field
It is that a kind of isomery has just been had mercy on and plate and just had mercy on the more of plate based on isomery specifically the present invention relates to field of electronic devices
Laminate card manufacturing method.
Background technology
In today of communication electronics rapid development, demand of the people to communication electronic equipment integrated level and flexibility is got over
Come higher.In traditional designing scheme, each business demand passes through usually using dedicated treatment trough position and interface slot position and is
The intercommunication of signal is with integrating between the progress veneer such as system backboard, mother daughter board connector or cable.In order to realize printed circuit board
（PrintedCircuitBoard, PCB）The extension of card function has following scheme：As shown in figure 8, printed circuit card includes：
Connector 101, switching buckle 102, veneer 103, System Backplane 104, subcard 105.Connector 101 for transfer buckle 102 with
Between veneer 103, transfer between buckle 102 and subcard 105 and electrically connected between veneer 102 and System Backplane 104
It connects.The main switching served between subcard 105 and veneer 103 of switching buckle 102.Switching buckle 102 can be parallel to veneer
103, it also can be perpendicular to veneer 103.In addition system own infrastructure also can be used in veneer 103, switching buckle 102 and subcard 105
Support is fixed.
Inventor has found during the embodiment of the present invention is realized：
On the one hand, the connector that is used using above scheme is more, cost is higher, simultaneously as connector is more to bring interface
Multi-part is more, and it is low the production links efficiency such as to lead to assemble, get ready the goods；
On the other hand, by mother daughter board connector shape, the fixed limitation of structure, the position between each board is also relatively fixed,
And define the structure design of multilayer board in certain space.This does not meet demand that is personalized, customizing board design.
Invention content
One of the objects of the present invention is to provide a kind of isomery just have mercy on plate, using flexible printed circuit can respectively with rigid printing
Plate, the characteristic of board flexible connection realize that position of the board in certain space is adjustable, so as to facilitate user according to actual conditions
The structure of the entire multilayer board of optimization design.The isomery has just had mercy on plate relative to the prior art, can be according to user demand identical
Greater number of board is designed in space or causes entire multi-layer board card body product smaller in the case where board quantity is identical,
Space is saved, and just rich harden structure is simple, constituent element is few for isomery of the present invention, not only convenient for control cost, but also it is advantageous
In raising production efficiency.
It has just had mercy on another object of the present invention is to providing a kind of based on isomery the multi-layer board card manufacturing method of plate, by existing
Have technology processing rigid printed board, flexible printed circuit, on the basis of mother daughter board connector, the design feature of plate of just having been had mercy on according to isomery into
The blocking of row multi-layer board is made, the process of manufacturing process is few, it is easy to operate, greatly improve production efficiency.
The present invention is achieved through the following technical solutions：A kind of isomery just have mercy on plate, with board be flexibly connected, mainly by rigidly printing
Making sheet, flexible printed circuit, mother daughter board connector composition connect between two neighboring rigid printed board for controlling between the plate of stack height
Device is welded on rigid printed board one end, and signal intercommunication, the flexibility are carried out by mother daughter board connector between adjacent rigid printed board
The printing of printing plate one end is connected on rigid printed board and the other end is detachably connected on board, the rigidity printing being correspondingly connected with
Signal intercommunication is carried out by flexible printed circuit between plate, board.
Further, in order to preferably realize the present invention, the rigid printed board single side or two-sided setting flexible print
Plate.
Further, in order to preferably realize the present invention, the whole rigid printed board, flexible printed circuit are in strip
Shape, the flexible printed circuit are set along the length direction of rigid printed board.
Further, in order to preferably realize the present invention, one end setting that the flexible printed circuit is connect with board is useful
In the star moon half bore for being welded and fixed board pin.
Further, in order to preferably realize the present invention, the front end of the star moon half bore sets stamp hole.
Further, in order to preferably realize the present invention, the star moon half bore is metallization star moon half bore.
Further, it in order to preferably realize the present invention, is connected between the rigid printed board end set positioning mounting plate
The shallow slot of device.
Further, in order to preferably realize the present invention, the mother daughter board connector is only is welded on rigid printed board
Surface-mounted device.
A kind of multi-layer board card manufacturing method for plate of just having been had mercy on based on isomery, is included the following steps：
Step S1：Prepare rigid printed board, flexible printed circuit, mother daughter board connector；
Step S2：The suitable mother daughter board connector of selection height is simultaneously welded to two adjacent, stacked on top rigidity printings
Between plate；
Step S3：Step S2 is repeated, multigroup rigid printed board, flexible printed circuit is stacked gradually and forms an entire multilayer structure
Frame；
Step S4：Multiple boards on the multi-tier structure formed in step S3 are installed, complete the making of a multilayer board.
Further, in order to preferably realize the present invention, in the step S1, rigid printed board and flexible printed circuit one
Change printing to be made, mother daughter board connector is individually processed.
Further, in order to preferably realize the present invention, in the step S2, the both ends corresponding weldering respectively of mother daughter board connector
It is connected at the shallow slot of rigid printing plate.
Further, in order to preferably realize the present invention, in the step S3, a rigid printed board and two flexible prints
The up/down two sides for being arranged on rigid printed board that making sheet is one group and two flexible printed circuits are opposite.
Further, in order to preferably realize the present invention, in the step S4, a flexible printed circuit and a board pair
It should connect and carry out signal intercommunication.
Compared with prior art, the present invention haing the following advantages and advantageous effect：
（1）It just haves mercy on plate the present invention provides a kind of isomery, passes through flexible printed circuit and realize flexibility between rigid printed board and board
Communication connection, i.e., by change flexible printed circuit stage casing stretch or be bent situation change flexible printed circuit connection board it is opposite
, at this time can be according to the different physical sizes of different boards in the position of rigid printed board, interior optimization cloth in a limited space
The position of each board of office is compared with existing product so as to be more reasonably utilized this space or is the energy in same space
The more board of preferred arrangement or it is to arrange board the space occupied smaller of identical quantity or is each board
The position of distribution is more reasonable.
（2）Isomery provided by the invention just have mercy on plate, element is few, simple in structure, connection relation is clear, not only contributes to control
Manufacturing cost also advantageously improves production efficiency, more competitive on the market.
（3）The present invention also provides it is a kind of based on isomery just have mercy on plate multi-layer board card manufacturing method, step is few, operation is simple
List, high yield rate, working efficiency are high.
Description of the drawings
Leftschematic diagram when Fig. 1 is present invention installation PCB main board.
Front schematic view when Fig. 2 is present invention installation PCB main board.
Fig. 3 is the front schematic view of the present invention.
Fig. 4 is a front view when rigid printed board single side connects a flexible printed circuit.
Fig. 5 is a left view when rigid printed board single side connects a flexible printed circuit.
Fig. 6 is a front view when rigid printed board connects two flexible printed circuits simultaneously.
Fig. 7 is a left view when rigid printed board connects two flexible printed circuits simultaneously.
Fig. 8 is the structure diagram of printed circuit card in the prior art.
In figure：
1- rigid printed boards, 2- flexible printed circuits, 3- mother daughter board connectors, 4-PCB mainboards, 11- shallow slots, 21- star moon half bore；
101- connectors, 102- switching buckles, 103- veneers, 104- System Backplanes, 105- subcards.
Specific embodiment
The present invention is described in further detail, but the implementation of the present invention is not limited to this with reference to embodiment.
Board is PCB main board in the following example.
Embodiment 1：
As shown in Figure 1-Figure 3, a kind of isomery just have mercy on plate, including rigid printed board, flexible printed circuit, mother daughter board connector, for controlling
The mother daughter board connector for making stack height between two neighboring rigid printed board is welded on rigid printed board one end, adjacent rigid printed board
Between signal intercommunication carried out by mother daughter board connector, the printing of described flexible printed board one end is connected on rigid printed board and another
End is detachably connected on board, and signal intercommunication is carried out by flexible printed circuit between the rigid printed board that is correspondingly connected with, board.
In the present embodiment, as shown in Figure 4, Figure 5, an isomery just have mercy on plate unit, including a rigid printed board, one it is soft
Property printed board, a mother daughter board connector, rigid printed board and flexible printed circuit integration printing be made, mother daughter board connector is welded on
On rigid printed board and mother daughter board connector is only connect with rigid printed board, and flexible printed circuit also connect with board and communicates.It is more
Just rich plate unit stacks assembled and forms multilayer board the isomery of a connection board.
The board, flexible printed circuit, rigid printed board, which are sequentially connected, to communicate, between two neighboring rigid printed board
By mother daughter board connector intercommunication, so as to fulfill the data interchange of entire multilayer board.
Since the flexible structure characteristic of flexible printed circuit, the board of flexible printed circuit one end connection can be printed relative to flexibility
The making sheet other end connection rigid printed board change location status, so as to flexible printed circuit length allow certain space in into
Line position puts adjusting, is conducive to user optimization space layout.
Embodiment 2：
A kind of isomery just have mercy on plate, including rigid printed board, flexible printed circuit, mother daughter board connector, for controlling two neighboring rigidity
The mother daughter board connector of stack height is welded on rigid printed board one end between printed board, by connecting between plate between adjacent rigid printed board
It connects device and carries out signal intercommunication, flexible printed board one end printing is connected on rigid printed board and the other end is detachably connected on
On board, signal intercommunication is carried out by flexible printed circuit between the rigid printed board that is correspondingly connected with, board.
In the present embodiment, as shown in Figure 6, Figure 7, an isomery just have mercy on plate unit, including a rigid printed board, two it is soft
Property printed board, a mother daughter board connector, rigid printed board and positioned at rigid printed board up/down two sides flexible printed circuit integration
Printing is made, and mother daughter board connector is welded on rigid printed board and mother daughter board connector is only connect with rigid printed board, flexible print
Plate also connect with board and communicates.Just rich plate unit stacks assembled and forms multilayer board the isomery of multiple connection boards.
The present embodiment and the difference of embodiment 1 are that rigid printed board two sides connects flexible printed circuit simultaneously.Therefore, originally
Just rich plate unit can connect two boards to an isomery in embodiment, be conducive to multilayer board Function Extension or performance boost.
Embodiment 3：
The present embodiment optimizes on the basis of embodiment 1 or 2, and one end that the flexible printed circuit is connect with board is provided with
For being welded and fixed the star moon half bore of board pin.The star moon half bore is metallization star moon half bore.
The pulling force of table bottom copper sheet can be increased using star moon half bore, copper sheet is avoided to come off, increase the connection of table bottom.
The other parts of the present embodiment are identical with above-described embodiment 1 or 2, and so it will not be repeated.
Embodiment 4：
The present embodiment optimizes on the basis of embodiment any one of 1-3, as shown in Fig. 4, Fig. 6, the rigid printed board end
Portion sets the shallow slot of location and installation mother daughter board connector.The effect of the shallow slot is exactly that the positioning of mother daughter board connector for convenience is pacified
Dress, when multiple isomeries have just had mercy on plate unit stacking, mother daughter board connector is coaxial from top to bottom, is conducive to improve entire multilayer
The intensity of board.
The other parts of the present embodiment are same as the previously described embodiments, and so it will not be repeated.
Embodiment 5：
The present embodiment optimizes on the basis of embodiment any one of 1-4, and the mother daughter board connector is only is welded on rigid print
Surface-mounted device in making sheet.Rigid printing plate patch welding, can improve product reliability, reduce technological operation difficulty.
The mother daughter board connector is commercial product, and internal structure, production method are the prior art, and buying on demand is
It can.Under normal conditions, according to the physical size of existing board, many factors such as heat dissipation of entire multilayer board structure, between plate
Connector is broadly divided into the several specifications of 5mm, 7mm, 9mm, 11mm, 13mm by its height.
The other parts of the present embodiment are same as the previously described embodiments, and so it will not be repeated.
Embodiment 6：
A kind of isomery just have mercy on plate, including rigid printed board, flexible printed circuit, mother daughter board connector, for controlling two neighboring rigidity
The mother daughter board connector of stack height is welded on rigid printed board one end between printed board, by connecting between plate between adjacent rigid printed board
It connects device and carries out signal intercommunication, flexible printed board one end printing is connected on rigid printed board and the other end is detachably connected on
On board, signal intercommunication is carried out by flexible printed circuit between the rigid printed board that is correspondingly connected with, board.
The rigid printed board single side or two-sided setting flexible printed circuit.
The rigid printed board, flexible printed circuit are whole in strip, and the flexible printed circuit is along rigid printed board
Length direction is set.
One end that the flexible printed circuit is connect with board is provided with the star moon half bore for being welded and fixed board pin.
The star moon half bore is metallization star moon half bore.
The mother daughter board connector is the surface-mounted device being only welded on rigid printed board.The rigid printed board end set
The shallow slot of location and installation mother daughter board connector.
A kind of multi-layer board card manufacturing method for plate of just having been had mercy on based on isomery, is included the following steps：
Step S1：Prepare rigid printed board, flexible printed circuit, mother daughter board connector；Wherein, rigid printed board and flexible printed circuit one
Bodyization printing is made, and mother daughter board connector is individually processed；
Step S2：The suitable mother daughter board connector of selection height is simultaneously welded to two adjacent, stacked on top rigidity printings
Between plate；Wherein, correspondence is welded at the shallow slot of rigid printing plate respectively at the both ends of mother daughter board connector；
Step S3：Step S2 is repeated, multigroup rigid printed board, flexible printed circuit is stacked gradually and forms an entire multilayer structure
Frame；Wherein, a rigid printed board and two flexible printed circuits are one group and what two flexible printed circuits were opposite is arranged on rigidity
The up/down two sides of printed board；
Step S4：Multiple boards on the multi-tier structure formed in step S3 are installed, complete the making of a multilayer board；Wherein,
One flexible printed circuit and a board, which are correspondingly connected with, carries out signal intercommunication.
The manufacturing method of the rigid printed board, flexible printed circuit, the manufacturing method of mother daughter board connector are existing skill
Art, and it is not claimed, therefore without repeating.In multi-layer board card manufacturing method described in the present embodiment, rigidity
Printed board, flexible printed circuit, mother daughter board connector are produced and processed using the prior art, carry out stacking the behaviour such as assembly after machining
Work.
Embodiment 7：
The present embodiment illustrates on the basis of embodiment any one of 1-6 with reference to a specific product structure.
A kind of isomery just have mercy on plate, it is two neighboring for controlling including rigid printed board, flexible printed circuit, mother daughter board connector
The mother daughter board connector of stack height is welded on rigid printed board one end between rigid printed board, passes through plate between adjacent rigid printed board
Between connector carry out signal intercommunication, the printing of described flexible printed board one end is connected on rigid printed board and the other end detachably connects
It is connected on board, signal intercommunication is carried out by flexible printed circuit between the rigid printed board that is correspondingly connected with, board.
The rigid printed board, flexible printed circuit are whole in strip, and the flexible printed circuit is along rigid printed board
Length direction is set.A length of 110mm ± 1mm, the width of the rigid printed board are 14.5mm ± 0.5mm.
As shown in Figure 6, Figure 7, the upper and lower faces of the rigid printed board connect one group of flexible printed circuit respectively.Two groups soft
The structure of property printed board is identical, position it is opposite be arranged on rigid printed board two sides, rigid printed board is connect with flexible printed circuit
Place 001, as shown in Figure 3.Further, in Fig. 6, four flexible printed circuits are one group, and a rigid printed board connects simultaneously at this time
Eight flexible printed circuits.In the present embodiment, a length of 9mm of its flexible wires of flexible printed circuit.
As shown in fig. 7, one end that the flexible printed circuit is connect with board is provided with to be welded and fixed board pin
Metallize star moon half bore.
As shown in fig. 6, the shallow slot of the rigid printed board end set location and installation mother daughter board connector.It is connected between the plate
Device is the surface-mounted device being only welded on rigid printed board.The height of general mother daughter board connector is 3mm, 5mm, 7mm, 9mm,
11mm。
Certainly, the size of rigid printed board, the size of flexible printed circuit, the size of mother daughter board connector are not limited in above-mentioned
Limitation, above-mentioned specific size are only conventional arrangement, during actual production processing use, can be made by oneself as needed completely
Justice selects conventional hardware to carry out assembling combination use, and details are not described herein again.
Any one of the other parts of the present embodiment and embodiment 1-6 are identical, and so it will not be repeated.
The above is only presently preferred embodiments of the present invention, not does limitation in any form to the present invention, it is every according to
According to the present invention technical spirit above example is made any simple modification, equivalent variations, each fall within the present invention protection
Within the scope of.
Claims (9)
- The plate 1. a kind of isomery is just had mercy on, is flexibly connected with board, it is characterised in that：Mainly by rigid printed board, flexible printed circuit, plate Between connector form, the mother daughter board connector for controlling stack height between two neighboring rigid printed board is welded on rigid printed board One end carries out signal intercommunication, flexible printed board one end printing connection between adjacent rigid printed board by mother daughter board connector On rigid printed board and the other end is detachably connected on board, by soft between the rigid printed board that is correspondingly connected with, board Property printed board carry out signal intercommunication.
- The plate 2. a kind of isomery according to claim 1 is just had mercy on, it is characterised in that：The rigid printed board single side or two-sided Flexible printed circuit is set.
- The plate 3. a kind of isomery according to claim 2 is just had mercy on, it is characterised in that：The rigid printed board, flexible printed circuit Whole is in strip, and the flexible printed circuit is set along the length direction of rigid printed board.
- The plate 4. a kind of isomery according to claim 1 is just had mercy on, it is characterised in that：What the flexible printed circuit was connect with board One end is provided with the star moon half bore for being welded and fixed board pin.
- The plate 5. a kind of isomery according to claim 4 is just had mercy on, it is characterised in that：The front end setting stamp of the star moon half bore Hole.
- 6. according to a kind of isomery of claim 1-5 any one of them just have mercy on plate, it is characterised in that：The rigid printed board end The shallow slot of location and installation mother daughter board connector is set.
- 7. according to a kind of isomery of claim 1-5 any one of them just have mercy on plate, it is characterised in that：The mother daughter board connector is only The surface-mounted device being welded on rigid printed board.
- 8. a kind of multi-layer board card manufacturing method for plate of just having been had mercy on based on isomery, it is characterised in that：Include the following steps：Step S1：Prepare rigid printed board, flexible printed circuit, mother daughter board connector；Step S2：The suitable mother daughter board connector of selection height is simultaneously welded to two adjacent, stacked on top rigidity printings Between plate；Step S3：Step S2 is repeated, multigroup rigid printed board, flexible printed circuit is stacked gradually and forms an entire multilayer structure Frame；Step S4：Multiple boards on the multi-tier structure formed in step S3 are installed, complete the making of a multilayer board.
- 9. a kind of multi-layer board card manufacturing method of plate of just having been had mercy on based on isomery according to claim 8, it is characterised in that：In the step S1, rigid printed board printing integrated with flexible printed circuit is made, and mother daughter board connector is individually processed；In the step S2, correspondence is welded at the shallow slot of rigid printing plate respectively at the both ends of mother daughter board connector；In the step S3, a rigid printed board and two flexible printed circuits is one groups and two flexible printed circuits are opposite sets It puts on the up/down two sides of rigid printed board；In the step S4, a flexible printed circuit and a board are correspondingly connected with and carry out signal intercommunication.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810119526.XA CN108156756B (en) | 2018-02-06 | Heterogeneous rigid-coiled board and manufacturing method of multi-layer board card based on same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810119526.XA CN108156756B (en) | 2018-02-06 | Heterogeneous rigid-coiled board and manufacturing method of multi-layer board card based on same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108156756A true CN108156756A (en) | 2018-06-12 |
| CN108156756B CN108156756B (en) | 2024-05-10 |
Family
ID=
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021128366A1 (en) * | 2019-12-28 | 2021-07-01 | 瑞声声学科技(深圳)有限公司 | Electronic element packaging structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01315970A (en) * | 1988-06-15 | 1989-12-20 | Hitachi Ltd | Connection device of printed substrate |
| US20080278922A1 (en) * | 2005-06-30 | 2008-11-13 | Anton Wimmer | Hardware Protection System for Sensitive Electronic-Data Modules Protecting Against External Manipulations |
| CN102665373A (en) * | 2012-05-09 | 2012-09-12 | 聚信科技有限公司 | Printed circuit board and manufacturing method thereof |
| CN207802533U (en) * | 2018-02-06 | 2018-08-31 | 国蓉科技有限公司 | A kind of isomery is just had mercy on plate |
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01315970A (en) * | 1988-06-15 | 1989-12-20 | Hitachi Ltd | Connection device of printed substrate |
| US20080278922A1 (en) * | 2005-06-30 | 2008-11-13 | Anton Wimmer | Hardware Protection System for Sensitive Electronic-Data Modules Protecting Against External Manipulations |
| CN102665373A (en) * | 2012-05-09 | 2012-09-12 | 聚信科技有限公司 | Printed circuit board and manufacturing method thereof |
| CN207802533U (en) * | 2018-02-06 | 2018-08-31 | 国蓉科技有限公司 | A kind of isomery is just had mercy on plate |
Non-Patent Citations (1)
| Title |
|---|
| 陈俊: "《电子基础实训教程》", 北京邮电大学出版社, pages: 123 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021128366A1 (en) * | 2019-12-28 | 2021-07-01 | 瑞声声学科技(深圳)有限公司 | Electronic element packaging structure |
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