CN108156756B - Heterogeneous rigid-coiled board and manufacturing method of multi-layer board card based on same - Google Patents
Heterogeneous rigid-coiled board and manufacturing method of multi-layer board card based on same Download PDFInfo
- Publication number
- CN108156756B CN108156756B CN201810119526.XA CN201810119526A CN108156756B CN 108156756 B CN108156756 B CN 108156756B CN 201810119526 A CN201810119526 A CN 201810119526A CN 108156756 B CN108156756 B CN 108156756B
- Authority
- CN
- China
- Prior art keywords
- board
- rigid
- printed board
- flexible printed
- inter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000007639 printing Methods 0.000 claims abstract description 12
- 238000004891 communication Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 5
- 238000003466 welding Methods 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses an isomerism rigid-wound board, which comprises rigid printed boards, flexible printed boards and inter-board connectors, wherein the inter-board connectors used for controlling the stacking height between two adjacent rigid printed boards are welded at one end of each rigid printed board, the adjacent rigid printed boards are in signal communication through the inter-board connectors, one end of each flexible printed board is connected to the rigid printed board in a printing way, the other end of each flexible printed board is detachably connected to a board card, and the corresponding connected rigid printed boards and board cards are in signal communication through the flexible printed boards. The heterogeneous rigid-flexible board can well meet the personalized and customized design requirements of users, can fully utilize limited workpieces to carry out optimal design, and has simple structure and strong market competitiveness. The invention also discloses a manufacturing method of the multi-layer board card based on the heterogeneous rigid board, which has simple working procedures and high working efficiency.
Description
Technical Field
The invention relates to the field of electronic devices, in particular to an isomerism rigid-flexible board and a manufacturing method of a multilayer board card based on the isomerism rigid-flexible board.
Background
Today, the rapid development of communication electronics technology, there is an increasing demand for integration and flexibility of communication electronics. In conventional designs, each service requirement generally uses a dedicated processing slot and an interface slot, and performs signal intercommunication and integration between boards through a system backplane, an inter-board connector, or a cable. In order to realize the expansion of the functions of the printed circuit board card (PrintedCircuitBoard, PCB), the following scheme is adopted: as shown in fig. 8, the printed circuit board card includes: connector 101, switch gusset 102, single board 103, system back board 104, daughter card 105. The connector 101 is used for electrical connection between the adapter board 102 and the board 103, between the adapter board 102 and the daughter card 105, and between the board 102 and the system back board 104. The switching buckle 102 mainly adopts the switching function between the screwdriver clamp 105 and the single plate 103. The adapting buckle 102 may be parallel to the single board 103 or may be perpendicular to the single board 103. In addition, the single board 103, the adapting buckle 102 and the daughter card 105 can also be fixedly supported by adopting the architecture of the system itself.
The inventors found in the course of implementing the embodiments of the present invention that:
On one hand, the connectors used by the scheme are more, the cost is higher, and meanwhile, the connectors bring more interface parts, so that the production links such as assembly, stock and the like are low in efficiency;
On the other hand, the positions of the boards are relatively fixed due to the limitation of the shape and the structure fixation of the connectors between the boards, so that the structural design of the multi-layer boards in a certain space is limited. This does not meet the requirements of a personalized, customized board design.
Disclosure of Invention
The invention aims to provide an isomerism rigid board, which realizes the position adjustment of the board card in a certain space by utilizing the characteristic that the flexible printed board can be flexibly connected with the rigid printed board and the board card respectively, thereby being convenient for users to optimally design the structure of the whole multi-layer board card according to actual conditions. Compared with the prior art, the heterogeneous rigid-coiled board can be used for designing more boards in the same space according to the requirements of users, or the whole multilayer board is smaller in size under the condition that the boards are the same in number, so that the space is saved, and the heterogeneous rigid-coiled board is simple in structure, few in component elements, convenient to control the cost and beneficial to improving the production efficiency.
The invention further aims to provide a manufacturing method of the multi-layer board card based on the heterogeneous rigid-flexible board, which is based on the prior art for processing the rigid printed board, the flexible printed board and the connectors between boards, and the manufacturing method of the multi-layer board card is based on the structural characteristics of the heterogeneous rigid-flexible board, and has the advantages of few working procedures, simplicity in operation and great improvement on the production efficiency of products in the manufacturing process.
The invention is realized by the following technical scheme: the utility model provides an isomerism just flexible board, with board card flexonics, mainly constitute by rigidity printed board, flexible printed board, inter-plate connector for control adjacent two rigidity printed board between the inter-plate connector welding of stacking height carry out signal intercommunication at rigidity printed board one end through inter-plate connector between the adjacent rigidity printed board, flexible printed board one end printing is connected on rigidity printed board and the other end detachable connection is on the board card, corresponds the rigidity printed board of connection, carries out signal intercommunication through flexible printed board between the board card.
Further, in order to better realize the invention, the rigid printed board is provided with a flexible printed board on one side or two sides.
Further, in order to better realize the invention, the whole rigid printed board and the whole flexible printed board are long-strip-shaped, and the flexible printed board is arranged along the length direction of the rigid printed board.
Further, in order to better realize the invention, one end of the flexible printed board, which is connected with the board card, is provided with a star-moon half hole for welding and fixing the board card pin needle.
Further, in order to better realize the invention, the front end of the star-moon half hole is provided with a stamp hole.
Further, in order to better realize the invention, the star-moon half-hole is a metalized star-moon half-hole.
Further, in order to better realize the invention, the end part of the rigid printed board is provided with a shallow groove for positioning the connector between the mounting plates.
Further, in order to better implement the present invention, the board-to-board connector is a chip device soldered only to a rigid printed board.
A manufacturing method of a multi-layer board card based on an isomerism rigid-flexible board comprises the following steps:
Step S1: preparing a rigid printed board, a flexible printed board and an inter-board connector;
Step S2: selecting and soldering an inter-board connector of a suitable height between two adjacent, stacked rigid printing boards;
step S3: repeating the step S2 to enable a plurality of groups of rigid printed boards and flexible printed boards to be sequentially stacked to form a whole multi-layer framework;
Step S4: and (3) installing a plurality of boards on the multi-layer framework formed in the step (S3) to finish the manufacture of a multi-layer board.
Further, in order to better implement the present invention, in the step S1, the rigid printed board and the flexible printed board are integrally printed, and the inter-board connector is separately processed.
Further, in order to better implement the present invention, in the step S2, two ends of the inter-board connector are respectively welded at the shallow grooves of the rigid printed board.
Further, in order to better implement the present invention, in the step S3, one rigid printed board and two flexible printed boards are combined and the two flexible printed boards are disposed on the upper/lower sides of the rigid printed board in an opposite manner.
Further, in order to better implement the present invention, in step S4, a flexible printed board is correspondingly connected to a board card to perform signal intercommunication.
Compared with the prior art, the invention has the following advantages:
(1) The invention provides an isomerism rigid-flexible board, which is characterized in that flexible communication connection between a rigid printed board and boards is realized through the flexible printed board, namely, the positions of the boards connected through the flexible printed board relative to the rigid printed board are changed through changing the straightening or bending condition of the middle section of the flexible printed board, and at the moment, the positions of each board can be optimally distributed in a limited space according to different physical sizes of different boards, so that the space is more reasonably utilized.
(2) The heterogeneous rigid-coiled board provided by the invention has the advantages of few elements, simple structure and clear connection relation, is beneficial to controlling the generation cost, is beneficial to improving the production efficiency, and has more competitive power in the market.
(3) The invention also provides a manufacturing method of the multi-layer board card based on the heterogeneous rigid board, which has the advantages of few steps, simple operation, high yield and high working efficiency.
Drawings
Fig. 1 is a left side schematic view of the present invention when a PCB main board is mounted.
Fig. 2 is a schematic front view of the PCB board of the present invention.
Fig. 3 is a schematic front view of the present invention.
Fig. 4 is a front view of a rigid printed board with a flexible printed board attached to one side.
Fig. 5 is a left side view of a rigid printed board single-sided connection with a flexible printed board.
Fig. 6 is a front view of one rigid printed board when two flexible printed boards are simultaneously connected.
Fig. 7 is a left side view of one rigid printed board when two flexible printed boards are simultaneously connected.
Fig. 8 is a schematic diagram of a prior art printed circuit board card.
In the figure:
1-a rigid printed board, 2-a flexible printed board, 3-an inter-board connector, 4-a PCB main board, 11-a shallow slot and 21-a star-moon half hole;
101-connector, 102-switching buckle, 103-single board, 104-system backboard, 105-sub card.
Detailed Description
The present invention will be described in further detail with reference to examples, but embodiments of the present invention are not limited thereto. The board card is a PCB motherboard in the following embodiments.
Example 1:
As shown in fig. 1-3, an isomerism rigid-flexible board comprises a rigid printed board 1, a flexible printed board 2 and an inter-board connector 3, wherein the inter-board connector 3 used for controlling the stacking height between two adjacent rigid printed boards 1 is welded at one end of the rigid printed board 1, signal intercommunication is carried out between the adjacent rigid printed boards 1 through the inter-board connector 3, one end of the flexible printed board is connected with the rigid printed board 1 in a printing way, the other end of the flexible printed board is detachably connected with a board card, and signal intercommunication is carried out between the corresponding connected rigid printed boards 1 and board cards through the flexible printed board 2.
In this embodiment, as shown in fig. 4 and 5, an isomerism rigid-flexible board unit includes a rigid printed board 1, a flexible printed board 2, and an inter-board connector 3, where the rigid printed board 1 and the flexible printed board 2 are integrally printed, the inter-board connector 3 is welded on the rigid printed board 1, and the inter-board connector 3 is only connected with the rigid printed board 1, and the flexible printed board 2 is also connected with a board card for communication. The heterogeneous rigid-coiled board units of the plurality of connecting board cards are stacked and assembled to form the multi-layer board card.
The board card, the flexible printed boards 2 and the rigid printed boards 1 are sequentially connected for communication, and the two adjacent rigid printed boards 1 are communicated through the inter-board connector 3, so that the data communication of the whole multi-layer board card is realized.
Due to the flexible structural characteristic of the flexible printed board 2, the board card connected with one end of the flexible printed board 2 can change the position state relative to the rigid printed board 1 connected with the other end of the flexible printed board 2, so that the position adjustment is carried out in a certain space allowed by the length of the flexible printed board 2, and the optimization of the space layout by a user is facilitated.
Example 2:
The utility model provides an isomerism just flexible board, includes rigid printed board 1, flexible printed board 2, inter-plate connector 3 for control adjacent two rigid printed board 1 between pile up high inter-plate connector 3 welding in rigid printed board 1 one end, carry out signal intercommunication through inter-plate connector 3 between the adjacent rigid printed board 1, flexible printed board one end printing is connected on rigid printed board 1 and the other end detachable connection is on the integrated circuit board, carries out signal intercommunication through flexible printed board 2 between corresponding rigid printed board 1, the integrated circuit board that connects.
In this embodiment, as shown in fig. 6 and 7, an isomerism rigid-flexible board unit includes a rigid printed board 1, two flexible printed boards 2, and an inter-board connector 3, wherein the rigid printed board 1 and the flexible printed boards 2 located on the upper/lower sides of the rigid printed board 1 are integrally printed, the inter-board connector 3 is welded on the rigid printed board 1 and the inter-board connector 3 is connected with the rigid printed board 1 only, and the flexible printed board 2 is also connected with a board card for communication. The heterogeneous rigid-coiled board units of the plurality of connecting board cards are stacked and assembled to form the multi-layer board card.
The present embodiment is different from embodiment 1 in that both sides of a rigid printed board 1 are simultaneously connected with a flexible printed board 2. Therefore, in this embodiment, one heterogeneous rigid board unit can connect two boards, which is beneficial to the function expansion or performance improvement of the multi-layer board.
Example 3:
The embodiment is optimized on the basis of embodiment 1 or 2, and a star-moon half hole 21 for welding and fixing the pin needle of the board card is formed at one end of the flexible printed board 2 connected with the board card. The star-moon half holes 21 are metalized star-moon half holes 21.
The star-moon half holes 21 can increase the tensile force of the copper sheet at the surface and bottom layers, prevent the copper sheet from falling off and increase the connection between the surface and bottom layers.
Other portions of this embodiment are the same as those of embodiment 1 or 2 described above, and thus will not be described again.
Example 4:
this embodiment is optimized on the basis of any one of embodiments 1 to 3, and as shown in fig. 4 and 6, the end of the rigid printed board 1 is provided with a shallow groove 11 for positioning the inter-mounting board connector 3. The shallow slot 11 is used for facilitating positioning and installation of the board-to-board connector 3, and when a plurality of heterogeneous rigid-coiled board units are stacked, the board-to-board connector 3 is coaxial from top to bottom, so that the strength of the whole multi-layer board card is improved.
Other portions of the present embodiment are the same as those of the above embodiment, and thus will not be described again.
Example 5:
This embodiment is optimized on the basis of any one of embodiments 1-4, the board-to-board connector 3 being a chip device soldered only to the rigid printed board 1. The rigid printed board is welded by the patch, so that the reliability of the product can be improved, and the process operation difficulty is reduced.
The inter-board connector 3 is a commercial product, the internal structure and the production method of the inter-board connector are all the prior art, and the inter-board connector can be purchased according to the requirement. In general, the board-to-board connector 3 is mainly divided into several specifications of 5mm, 7mm, 9mm, 11mm and 13mm according to the height thereof according to various factors such as the physical size of the existing board card and the heat dissipation of the whole multi-layer board card structure.
Other portions of the present embodiment are the same as those of the above embodiment, and thus will not be described again.
Example 6:
The utility model provides an isomerism just flexible board, includes rigid printed board 1, flexible printed board 2, inter-plate connector 3 for control adjacent two rigid printed board 1 between pile up high inter-plate connector 3 welding in rigid printed board 1 one end, carry out signal intercommunication through inter-plate connector 3 between the adjacent rigid printed board 1, flexible printed board one end printing is connected on rigid printed board 1 and the other end detachable connection is on the integrated circuit board, carries out signal intercommunication through flexible printed board 2 between corresponding rigid printed board 1, the integrated circuit board that connects.
The flexible printed board 2 is arranged on one side or two sides of the rigid printed board 1.
The whole rigid printed board 1 and the whole flexible printed board 2 are long-strip-shaped, and the flexible printed board 2 is arranged along the length direction of the rigid printed board 1.
One end of the flexible printed board 2 connected with the board card is provided with a star-moon half hole 21 for welding and fixing the pin needles of the board card. The star-moon half holes 21 are metalized star-moon half holes 21.
The board-to-board connector 3 is a chip device soldered only to the rigid printed board 1. The end of the rigid printed board 1 is provided with a shallow groove 11 for positioning the inter-mounting board connector 3.
A manufacturing method of a multi-layer board card based on an isomerism rigid-flexible board comprises the following steps:
Step S1: preparing a rigid printed board 1, a flexible printed board 2 and an inter-board connector 3; wherein, the rigid printed board 1 and the flexible printed board 2 are integrally printed, and the inter-board connector 3 is independently processed;
step S2: an inter-board connector 3 of suitable height is selected and soldered between two adjacent, stacked rigid printing boards; wherein, the two ends of the inter-plate connector 3 are respectively welded at the shallow grooves 11 of the rigid printing plate correspondingly;
Step S3: repeating the step S2 to enable a plurality of groups of rigid printed boards 1 and flexible printed boards 2 to be sequentially stacked to form a whole multi-layer framework; wherein one rigid printed board 1 and two flexible printed boards 2 are a group, and the two flexible printed boards 2 are oppositely arranged on the upper/lower two sides of the rigid printed board 1;
Step S4: installing a plurality of boards on the multi-layer framework formed in the step S3 to finish the manufacture of a multi-layer board; wherein, a flexible printed board 2 is correspondingly connected with a board card for signal intercommunication.
The manufacturing methods of the rigid printed board 1 and the flexible printed board 2 and the manufacturing method of the inter-board connector 3 are all prior art, and are not claimed in the present invention, so that the description thereof will not be repeated. In the method for manufacturing the multilayer board according to the embodiment, the rigid printed board 1, the flexible printed board 2 and the inter-board connector 3 are manufactured and processed by adopting the prior art, and the operations such as stacking and assembling are performed after the processing is completed.
Example 7:
this example is described in connection with a specific product configuration based on any of examples 1-6.
The utility model provides an isomerism just flexible board, includes rigid printed board 1, flexible printed board 2, inter-plate connector 3 for control adjacent two rigid printed board 1 between pile up high inter-plate connector 3 welding in rigid printed board 1 one end, carry out signal intercommunication through inter-plate connector 3 between the adjacent rigid printed board 1, flexible printed board one end printing is connected on rigid printed board 1 and the other end detachable connection is on the integrated circuit board, carries out signal intercommunication through flexible printed board 2 between corresponding rigid printed board 1, the integrated circuit board that connects.
The whole rigid printed board 1 and the whole flexible printed board 2 are long-strip-shaped, and the flexible printed board 2 is arranged along the length direction of the rigid printed board 1. The length of the rigid printed board 1 is 110mm plus or minus 1mm, and the width is 14.5mm plus or minus 0.5mm.
As shown in fig. 6 and 7, the upper and lower surfaces of the rigid printed board 1 are respectively connected with a group of flexible printed boards 2. The two groups of flexible printed boards 2 have the same structure, are oppositely arranged on two sides of the rigid printed board 1, and are arranged at the connection 001 of the rigid printed board 1 and the flexible printed board 2, as shown in fig. 3. Further, in fig. 6, four flexible printed boards 2 are grouped together, and at this time, one rigid printed board 1 is connected to eight flexible printed boards 2 at the same time. In this embodiment, the flexible printed board 2 has a flexible line length of 9mm.
As shown in fig. 7, a metalized star-moon half hole 21 for welding and fixing the pin of the board card is arranged at one end of the flexible printed board 2 connected with the board card.
As shown in fig. 6, the end of the rigid printed board 1 is provided with a shallow groove 11 for positioning the inter-mounting board connector 3. The board-to-board connector 3 is a chip device soldered only to the rigid printed board 1. The height of the board connector 3 is generally 3mm, 5mm, 7mm, 9mm, 11mm.
Of course, the dimensions of the rigid printed board 1, the dimensions of the flexible printed board 2 and the dimensions of the inter-board connector 3 are not limited to the above-mentioned limitations, and the specific dimensions are only conventional, and in the actual production, processing and use process, the dimensions can be completely customized according to the needs or the conventional parts can be selected for assembly and combination, which is not repeated here.
Other portions of this embodiment are the same as any of embodiments 1 to 6, and thus will not be described in detail.
The foregoing description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and any simple modification, equivalent variation, etc. of the above embodiment according to the technical matter of the present invention fall within the scope of the present invention.
Claims (6)
1. An isomerism just flexible board, with board card flexonics, its characterized in that: mainly constitute by rigidity printed board (1), flexible printed board (2), inter-plate connector (3) for control adjacent two rigidity printed board (1) between pile up high inter-plate connector (3) welding in rigidity printed board (1) one end, carry out signal intercommunication through inter-plate connector (3) between adjacent rigidity printed board (1), flexible printed board (2) one end printing is connected on rigidity printed board (1) and the other end can dismantle and be connected on the board, carries out signal intercommunication through flexible printed board (2) between corresponding rigid printed board (1), the board that connect, namely: the board card, the flexible printed board (2) and the rigid printed board (1) are sequentially connected for communication;
The inter-board connector (3) is a patch device only welded on the rigid printed board (1);
The flexible printed board (2) is arranged on two sides of the rigid printed board (1); one rigid printed board (1) and two flexible printed boards (2) are a group, and the two flexible printed boards (2) are oppositely arranged on the upper/lower two sides of the rigid printed board (1).
2. An isomerised rigid board as claimed in claim 1, wherein: the whole rigid printed board (1) and the flexible printed board (2) are long, and the flexible printed board (2) is arranged along the length direction of the rigid printed board (1).
3. An isomerised rigid board as claimed in claim 1, wherein: one end of the flexible printed board (2) connected with the board card is provided with a star-moon half hole (21) for welding and fixing the board card pin needle.
4. A heterogeneous rigid board according to claim 3, characterized in that: stamp holes are formed in the front ends of the star-moon half holes (21).
5. An isomerised rigid board as claimed in any one of claims 1-4, wherein: the end part of the rigid printed board (1) is provided with a shallow groove (11) for positioning the inter-mounting-board connector (3).
6. A manufacturing method of a multi-layer board based on an isomerism rigid-coiled board is characterized by comprising the following steps: the method for manufacturing the isomerised rigid board as claimed in any one of claims 1-5, comprising the steps of:
Step S1: preparing a rigid printed board (1), a flexible printed board (2) and an inter-board connector (3); the rigid printed board (1) and the flexible printed board (2) are integrally printed, and the inter-board connector (3) is independently processed;
Step S2: selecting and soldering an inter-board connector (3) of suitable height between two adjacent, stacked rigid printing boards; two ends of the inter-plate connector (3) are respectively welded at shallow grooves (11) of the rigid printing plate correspondingly;
Step S3: repeating the step S2 to enable a plurality of groups of rigid printed boards (1) and flexible printed boards (2) to be sequentially stacked to form a whole multi-layer framework; the rigid printed board (1) and the two flexible printed boards (2) are a group, and the two flexible printed boards (2) are oppositely arranged on the upper/lower two sides of the rigid printed board (1);
Step S4: installing a plurality of boards on the multi-layer framework formed in the step S3 to finish the manufacture of a multi-layer board; and the flexible printed board (2) is correspondingly connected with a board card for signal intercommunication.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810119526.XA CN108156756B (en) | 2018-02-06 | 2018-02-06 | Heterogeneous rigid-coiled board and manufacturing method of multi-layer board card based on same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810119526.XA CN108156756B (en) | 2018-02-06 | 2018-02-06 | Heterogeneous rigid-coiled board and manufacturing method of multi-layer board card based on same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108156756A CN108156756A (en) | 2018-06-12 |
| CN108156756B true CN108156756B (en) | 2024-05-10 |
Family
ID=62459686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810119526.XA Active CN108156756B (en) | 2018-02-06 | 2018-02-06 | Heterogeneous rigid-coiled board and manufacturing method of multi-layer board card based on same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108156756B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021128366A1 (en) * | 2019-12-28 | 2021-07-01 | 瑞声声学科技(深圳)有限公司 | Electronic element packaging structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01315970A (en) * | 1988-06-15 | 1989-12-20 | Hitachi Ltd | Connection device of printed substrate |
| CN102665373A (en) * | 2012-05-09 | 2012-09-12 | 聚信科技有限公司 | Printed circuit board and manufacturing method thereof |
| CN207802533U (en) * | 2018-02-06 | 2018-08-31 | 国蓉科技有限公司 | A kind of isomery is just had mercy on plate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4891994B2 (en) * | 2005-06-30 | 2012-03-07 | シーメンス アクチエンゲゼルシヤフト | Circuit carrier for protecting sensitive electronic device data module against unauthorized operation from outside, and method of detecting unauthorized access to electronic device data module using the same |
-
2018
- 2018-02-06 CN CN201810119526.XA patent/CN108156756B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01315970A (en) * | 1988-06-15 | 1989-12-20 | Hitachi Ltd | Connection device of printed substrate |
| CN102665373A (en) * | 2012-05-09 | 2012-09-12 | 聚信科技有限公司 | Printed circuit board and manufacturing method thereof |
| CN207802533U (en) * | 2018-02-06 | 2018-08-31 | 国蓉科技有限公司 | A kind of isomery is just had mercy on plate |
Non-Patent Citations (1)
| Title |
|---|
| 陈俊.《电子基础实训教程》.北京邮电大学出版社,2011,第123页. * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108156756A (en) | 2018-06-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102394398B (en) | Connector assembly having a mating adapter | |
| EP2434575B1 (en) | Plug-in antenna | |
| CN102185195A (en) | Interconnect assembly having a separable mating interface | |
| CN102984881B (en) | Circuit board connection structure | |
| CA2539544A1 (en) | Electric power distribution and control apparatus | |
| CN101728670A (en) | Connector assembly with variable stack heights having power and signal contacts | |
| CN108156756B (en) | Heterogeneous rigid-coiled board and manufacturing method of multi-layer board card based on same | |
| CN101083873A (en) | Circuit board product and printed circuit board | |
| CN101472393A (en) | Stamping mold for flexible circuit board | |
| CN103889149A (en) | Electronic device and grid array module | |
| CN207802533U (en) | A kind of isomery is just had mercy on plate | |
| CN1805219A (en) | Connecting apparatus | |
| CN2572578Y (en) | Edge snap fastening connector | |
| CN102665373B (en) | Printed circuit board and manufacturing method thereof | |
| EP4138223A1 (en) | Bidirectional signal pin module, power module including the same, and method of manufacturing the same | |
| CN113573471B (en) | PCB board is to connection structure of board | |
| CN206211097U (en) | Shell fragment and terminal device | |
| CN102176558A (en) | LRM (Line replaceable module) low-frequency high-density surface mount connector plug | |
| CN100449880C (en) | Modular jack assembly with signal conditioning | |
| EP2555600B1 (en) | A PCB arrangement | |
| CN221239827U (en) | Current conversion switching structure suitable for large current source | |
| CN220189981U (en) | End surface contact heavy current contact element | |
| WO2015007093A1 (en) | Pluggable device | |
| CN216145782U (en) | Electronic device and connector | |
| CN221202867U (en) | Layout structure of laminated circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |