CN108156754A - Vertical connection interface structure, circuit board with the structure and manufacturing method thereof - Google Patents
Vertical connection interface structure, circuit board with the structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN108156754A CN108156754A CN201710066115.4A CN201710066115A CN108156754A CN 108156754 A CN108156754 A CN 108156754A CN 201710066115 A CN201710066115 A CN 201710066115A CN 108156754 A CN108156754 A CN 108156754A
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- circuit board
- connection interface
- vertical connection
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000010410 layer Substances 0.000 claims description 106
- 239000000463 material Substances 0.000 claims description 90
- 238000009413 insulation Methods 0.000 claims description 29
- 239000002356 single layer Substances 0.000 claims description 27
- 229920002120 photoresistant polymer Polymers 0.000 claims description 26
- 230000005540 biological transmission Effects 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 8
- 239000012774 insulation material Substances 0.000 claims description 6
- 230000005130 electrotropism Effects 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
- 230000008054 signal transmission Effects 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 13
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 238000000151 deposition Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000012966 insertion method Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
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- 239000011248 coating agent Substances 0.000 description 1
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- 230000003628 erosive effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Abstract
The invention relates to a vertical connection interface structure, a circuit board with the structure and a manufacturing method thereof, wherein at least one layer of circuit board is connected through the vertical connection interface structure to solve the processing problem of high aspect ratio of the circuit board, solve the problem of longer signal transmission path among the multilayer circuit boards, and simultaneously have the functions of improving the stacking structure of the circuit board and pin pitch conversion.
Description
【Technical field】
The present invention relates to a kind of circuit board, more particularly to a kind of vertical connection interface structure, the circuit of the tool structure
Plate and its manufacturing method, circuit board are, for example, printed circuit board, but not limited to this.
【Background technology】
As electronic product develops towards precise treatment and multifunction, the chip structure of the integrated circuit in electronic product
Tend to be complicated, and the operating frequency of the chip structure also greatly improves, led for the electronic product of higher frequency wave band
Domain.Since the size of tested chip is increasingly reduced, the spacing of foot position also reduces together, therefore tests the chip electrical characteristic institute
The perforation spacing (pitch) of the circuit board used will reduce, i.e., the boring aperture of perforation must also reduce.But the circuit
The multilayer circuit board that plate is formed due to multiple material layers in a manner of one step press causes higher aspect-ratio structure, causes
Drilling operation is difficult.The schematic diagram of the circuit board connecting interface of the prior art as shown in Figure 1.In multilayer circuit board 10, perforation
Hole 12 connects the conductive pattern 16 of upper surface 14a and lower surface 14b, and longitudinal height H of through hole 12 is much larger than two conductive patterns
Horizontal spacing P between case 16 forms the structure of higher aspect ratio, be not easy to carry out Drilling operation to through hole 12.
To solve the above problems, the prior art proposes a kind of multiple pressure or layer reinforced structure, another kind circuit as shown in Figure 2
The multiple pressure structure 11 of plate connecting interface, the first conductive pattern 16a of the first through hole 12a connections upper surface 14a, the second through hole
The second conductive pattern 16b of the first conductive pattern 16a and upper surface 14a of 12b connections lower surface 14b, and the first through hole
The other end of 12a connects the second through hole 12b intermediate regions, forms an extension of section 18 and an extra section (stub)
20, although such mode can reduce aspect ratio, the i.e. ratio of H and P of the ratio less than Fig. 1 of the H of Fig. 2 and P, when signal exists
The second of the lower surface 14b of the first conductive pattern 16a and the second through hole 12b of the upper surface 14a of first through hole 12a is conductive
When being transmitted between pattern 16b, the formation of extension of section 18 signal transmission path is longer, and the loss of signal transmission is more tight
Weight, and extra section (stub) 20 can be because of the depth of the through hole, and the signal transmission of different frequency is influenced, in summary ask
Topic causes the transmission quality of signal to be deteriorated.Therefore it needs to propose a kind of new-type interface structure, it is above-mentioned to solve the problems, such as.
【Invention content】
One of present invention is designed to provide a kind of vertical connection interface structure, the circuit board of the tool structure and its manufacture
Method connects an at least layer circuit board, to solve the processing problems of the high aspect ratio of circuit board by vertical connection interface structure.
Another object of the present invention is to provide a kind of vertical connection interface structure, the circuit board and its system that have the structure
Method is made, an at least layer circuit board is connected by vertical connection interface structure, is passed with solving signal between the multilayer circuit board
The problem of defeated path is longer.
The further object of the present invention is to provide a kind of vertical connection interface structure, the circuit board and its system that have the structure
Method is made, an at least layer circuit board, such as one layer of flexible circuit board and at least one are connected by vertical connection interface structure
The hard circuit board of layer, to improve the problem of the nesting structural embedded control of circuit board and foot column pitch conversion.
To reach above-mentioned purpose, in one of present invention embodiment vertical connection interface structure manufacturing method, for circuit
Plate includes the following steps：A conductive layer is formed on a base material；A photoresist layer is formed on the conductive layer；The lithographic system of progress
Journey defines an engagement pad pattern with the photoresist layer, and exposes the conductive layer of a part to the open air；Using the engagement pad pattern as erosion
Mask is carved, the conductive layer exposed to the open air is etched, to form several conductive contact pads, wherein each several conductive contact pads are mutual
Mutually it is electrically insulated；The photoresist layer is removed, with exposure several conductive contact pads；In several conductive contact pads and
A dielectric insulation layer is formed on the base material, to cover several conductive contact pads；In the base material and the dielectric
Several trepannings are respectively formed relative to the position of several conductive contact pads, and in insulating layer in the base material and described
Several trepannings of dielectric insulation layer expose the conductive contact pad；And it is formed and inserted in each several trepannings
Conductive material is to form a conductive bump group, so that institute is electrically connected in the both side surface of each several conductive contact pads
State conductive bump group.
In one embodiment, the base material is dielectric insulation material.
In one embodiment, a dielectric insulation layer is formed to cover in several conductive contact pads and on the base material
In the step of covering several conductive contact pads, it is included in several conductive contact pads and fitting one is situated between on the base material
Electric insulation layer.
In one embodiment, the conductive bump group is the material of conductive paste or conducting resinl.
In one embodiment, it is formed in each several trepannings and inserts conductive material to form the conductive bump
Group makes the both side surface of each several conductive contact pads be electrically connected in the step of the conductive bump group, including
Form several first conductive bumps of the conductive bump group and several second conductive bumps, several first conductive bumps
It is set among the base material, several second conductive bumps are set among the dielectric insulation layer, wherein each described
The both side surface difference of several conductive contact pads is corresponding be electrically connected each several first conductive bumps with it is each described
Between several second conductive bumps.
The manufacturing method of vertical connection interface structure in one of present invention embodiment, for circuit board, includes the following steps：
A conductive layer is formed on a base material；A photoresist layer is formed on the conductive layer；Micro-photographing process is carried out, is determined with the photoresist layer
An adopted engagement pad pattern, and expose the conductive layer of a part to the open air；Using the engagement pad pattern as etch mask, etch what is exposed to the open air
The conductive layer, to form several conductive contact pads, each several conductive contact pads are electrically insulated mutually；In the base material
On relative to the position of several conductive contact pads form several trepannings, and expose to the open air in several trepannings of the base material
Go out the conductive contact pad；Conductive material is inserted in several trepannings to form several first conductive bumps, so that each
One side surface of several conductive contact pads is corresponding to be electrically connected each several first conductive bumps；And removal institute
State photoresist layer.
In one embodiment, the base material is dielectric insulation material.
In one embodiment, first conductive bump is conductive paste or conducting resinl material.
In one embodiment, the step for removing removing photoresistance layer is in the advance for forming several first conductive bump steps
Several first conductive bump steps are gone or are formed to carry out later.
There is the circuit board of vertical connection interface structure in one of present invention embodiment, including：One first multilayer circuit board,
Equipped with the first multi-layer board and perforation first multiple-plate several first through hole structures；One second multilayer circuit board, is equipped with
Second multi-layer board and perforation second multiple-plate several second through-hole structures；And a vertical connection interface structure, if
It is placed between first multilayer circuit board and second multilayer circuit board, is for electrically connecting to first multilayer circuit board
And second multilayer circuit board, the vertical connection interface structure include：One base material；Several conductive contact pads, are set to
On the base material, each several conductive contact pads are electrically insulated mutually；One dielectric insulation layer is set to several conductions
In engagement pad and on the base material, to cover several conductive contact pads；And a conductive bump group, it is set to the base material
Among the dielectric insulation layer, each several conductive contact pads are electrically connected to described in the conductive bump group
One through-hole structure and second through-hole structure.
In one embodiment, the conductive bump group includes several first conductive bumps and several second conductive bumps,
Several first conductive bumps are set among the base material, and several second conductive bumps are set to the dielectric insulation
Among layer, the both side surfaces of each several conductive contact pads is corresponding respectively to be electrically connected at each described several first and leads
Between electric convex block and each several second conductive bumps, and several first conductive bumps are electrically connected described first
The first through hole structure of multilayer circuit board, several second conductive bumps are electrically connected second multilayer circuit board
Second through-hole structure.
In one embodiment, each several conductive contact pads respectively with each several first conductive bumps and
Each several second conductive bumps are along a conllinear transmission path into electric connection.
In one embodiment, each several conductive contact pads respectively with each several first conductive bumps, every
One several second conductive bumps, the first through hole structure and second through-hole structure are along a conllinear transmission path
Into electric connection.
In one embodiment, the conllinear transmission path is vertical path.
In one embodiment, each several conductions are electrically connected to heat pressing mode in the conductive bump group
Engagement pad is to the first through hole structure and second through-hole structure.
There is the circuit board of vertical connection interface structure in one of present invention embodiment, including：One single layer board, is equipped with
Several first through hole structures of lamina and the perforation lamina；And a vertical connection interface structure, it is set to described
In single layer board, the single layer board is for electrically connecting to, the vertical connection interface structure includes：One base material；It is several
Conductive contact pad is set on the base material, and each several conductive contact pads are electrically insulated mutually；And several first conductions
Convex block is set among the base material, and each several first conductive bumps are corresponding to be electrically connected each described several lead
Electrical contact pad is to each several first through hole structures.
In one embodiment, the single layer board is flexible circuit board.
In one embodiment, each several conductive contact pads respectively with each several first conductive bumps and
The first through hole structure is along a conllinear transmission path into electric connection.
In one embodiment, the conllinear transmission path is vertical path.
In one embodiment, each several first conductive bumps are each to heat the corresponding electric connection of pressing mode
Several conductive contact pads are to each several first through hole structures.
There is the circuit board of vertical connection interface structure in one of present invention embodiment, including：One single layer board, is equipped with
Several first through hole structures of one lamina and the perforation lamina；And two groups of vertical connection interface structures, it sets respectively
It is placed in the both side surface of the single layer board, is for electrically connecting to the both ends of each several first through hole structures,
Each group of vertical connection interface structure includes：One base material；Several conductive contact pads are set on the base material, if each described
Dry conductive contact pad is electrically insulated mutually；And several first conductive bumps, it is set among the base material, each described several
One conductive bump is corresponding to be electrically connected each several conductive contact pads to the first through hole structure.
In one embodiment, the single layer board is hard circuit board.
In one embodiment, each several conductive contact pads of two groups of vertical connection interface structures and each
Several first conductive bumps respectively with the first through hole structure along a conllinear transmission path into electric connection.
In one embodiment, the conllinear transmission path is vertical path.
In one embodiment, each several first conductive bumps are each to heat the corresponding electric connection of pressing mode
Several conductive contact pads are to the first through hole structure.
【Description of the drawings】
To describe the technical solutions in the embodiments of the present invention more clearly, below by institute in the detailed description to embodiment
Attached drawing to be used is needed to be described.
Fig. 1 is painted the schematic diagram of the circuit board connecting interface of the prior art.
Fig. 2 is painted the schematic diagram of the another kind circuit board connecting interface of the prior art.
Fig. 3 A-3D are painted the structure diagram of the manufacturing process of vertical connection interface structure in first embodiment of the invention.
Fig. 4 A-4C are painted the structure diagram of the manufacturing process of vertical connection interface structure in second embodiment of the invention.
Fig. 5 is painted the schematic diagram of the circuit board with vertical connection interface structure in first embodiment of the invention.
Fig. 6 is painted the schematic diagram of the circuit board with vertical connection interface structure in second embodiment of the invention.
Fig. 7 is painted the schematic diagram of the circuit board with vertical connection interface structure in third embodiment of the invention.
【Specific embodiment】
Schema is please referred to, wherein identical element numbers represent identical component or similar component, original of the invention
Reason is to implement to illustrate in appropriate computing environment.The following description is based on illustrated present invention specific implementation
Example is not construed as the limitation present invention other specific embodiments not detailed herein.
With reference to figure 3A-3D, it is painted the structure of the manufacturing process of vertical connection interface structure in first embodiment of the invention
Schematic diagram.In figure 3 a, a conductive layer 102 is formed on a base material 100.It e.g. presses, transfer, deposition method forms conduction
Layer 102.In one embodiment, the base material 100 is dielectric insulation material, and the material of the conductive layer 102 is, for example, metal, such as
Copper, aluminium and gold, but not limited to this.In figure 3 a, photoresist layer 104, e.g. base material are formed on the conductive layer 102
100 upper surfaces, which are coated with, to be formed photoresist and/or is that lower surface is coated with to form photoresist.
In Fig. 3 A and Fig. 3 B, micro-photographing process is carried out, an engagement pad pattern 106 is defined with the photoresist layer 104, and
Expose the conductive layer 102 of a part to the open air.
In figure 3b, using the engagement pad pattern 106 as etch mask (etching mask), etch expose to the open air it is described
Conductive layer 102, to form several conductive contact pad 106a, wherein each several conductive contact pads 106 are electrically insulated mutually,
Or each several conductive contact pad 106a are disconnected from each other.In figure 3b, the photoresist layer 104 is removed, with described in exposure
Several conductive contact pad 106a.The photoresist layer 104 is removed e.g. in a manner of divesting or be ashed.
In fig. 3 c, a dielectric insulation layer is formed on several conductive contact pad 106a and on the base material 100
108, to cover several conductive contact pad 106a.If such as the dielectric insulation layer 108 is formed in described with laminating type
On dry conductive contact pad 106a and on the base material 100.
In fig. 3d, relative to several conductive contacts in the base material 100 and in the dielectric insulation layer 108
The position of pad 106a is respectively formed several trepannings 110, and described in the base material 100 and the dielectric insulation layer 108
Several trepannings 110 expose the conductive contact pad 106a.In one embodiment, institute is e.g. formed with laser thermal reaction method
State several trepannings 110.In fig. 3d, it is formed in each several trepannings 110 and inserts conductive material to form a conductive stud
Block group 112, so that the conductive bump is electrically connected in the both side surface 106b of each several conductive contact pad 106a
Group 112, the conductive bump group 112 include several first conductive bump 112a and several second conductive bump 112b.One
In embodiment, according to the material of different conductive bump groups 112, e.g. to transfer, insert or deposition method forms conduction
Group of bumps 112.In one embodiment, the conductive bump group 112 is the material of conductive paste or conducting resinl.In an embodiment
In, several first conductive bump 112a are set among the base material 100, and the second conductive bump 112b, which is set to, to be given an account of
Among electric insulation layer 108, wherein the both side surface 106b of each conductive contact pad 106a respectively it is corresponding be electrically connected at it is each
Between several first conductive bump 112a and every one second conductive bump 112b.
With reference to figure 4A-4C, it is painted the structure of the manufacturing process of vertical connection interface structure in second embodiment of the invention
Schematic diagram.In Figure 4 A, a conductive layer 102 is formed on a base material 100.It e.g. presses, transfer, deposition method forms conduction
Layer 102.In one embodiment, the base material 100 is dielectric insulation material, and the material of the conductive layer 102 is, for example, metal, such as
Copper, aluminium and gold, but not limited to this.In Figure 4 A, photoresist layer 104, e.g. base material are formed on the conductive layer 102
100 upper surfaces, which are coated with, to be formed photoresist and/or is that lower surface is coated with to form photoresist, is 100 upper and lower surface of base material coating shape herein
Into photoresist.
In Fig. 4 A and Fig. 4 B, micro-photographing process is carried out, an engagement pad pattern 106 is defined with the photoresist layer 104, and
Expose the conductive layer 102 of a part to the open air.
In figure 4b, using the engagement pad pattern 106 as etch mask (etching mask), etch expose to the open air it is described
Conductive layer 102, to form several conductive contact pad 106a, wherein each several conductive contact pads 106 are electrically insulated mutually,
Or each several conductive contact pad 106a are disconnected from each other.
In figure 4 c, in the base material 100 several open is formed relative to the position of several conductive contact pad 106a
Hole 110, and expose the conductive contact pad 106a in several trepannings 110 of the base material 100.In an embodiment
In, several trepannings 110 are e.g. formed with laser thermal reaction method.In figure 4 c, in each several trepannings 110
Formation inserts conductive material to form several first conductive bump 112a, so that the two of each several conductive contact pad 106a
Several first conductive bump 112a are electrically connected in side surface 106b.In one embodiment, it is led according to different first
The material of electric convex block 112a, e.g. with transfer, insert or deposition method formed the first conductive bump 112a.In an embodiment
In, the first conductive bump 112a is the material of conductive paste or conducting resinl.In one embodiment, several first conductive bumps
112a is set among the base material 100, wherein the corresponding electric connections of side surface 106b of each conductive contact pad 106a
In the bottom of every one first conductive bump 112a.In figure 4 c, removing photoresistance layer 104 is removed, e.g. in a manner of divesting or be ashed
Remove the photoresist layer 104.In different embodiments, it removes before the step of forming the first conductive bump 112a or later
Photoresist layer 104, as shown in Figure 4 C, formed the first conductive bump 112a after remove photoresist layer 104, by removing photoresistance layer 104 with
It avoids the first conductive bump 112a excessive towards both sides, the first adjacent conductive bump 112a is made effectively to electrically isolate or mutually
Phase separation.
With reference to figure 5, it is painted the schematic diagram of the circuit board with vertical connection interface structure in first embodiment of the invention.
Circuit board with vertical connection interface structure includes the first multilayer circuit board 114, the second multilayer circuit board 116 and vertically connects
Connection interface structure, the vertical connection interface structure is as shown in Figure 3D.In one embodiment, the vertical connection interface structure example
It is electrically connected first multilayer circuit board 114 and second multilayer circuit board 116 in a vertical manner in this way.Such as Fig. 5 institutes
Show, it is logical that the first multilayer circuit board 114 is equipped with the first multi-layer board 114a and several the first of perforation the first multi-layer board 114a
Pore structure 118a.If the second multilayer circuit board 116 is equipped with the second multi-layer board 116a's and perforation the second multi-layer board 116a
Dry second through-hole structure 118b.
As shown in figure 5, the vertical connection interface structure is set to first multilayer circuit board 114 and more than described second
Between layer circuit board 116, it is for electrically connecting to first multilayer circuit board 114 and second multilayer circuit board 116, institute
It states vertical connection interface structure and includes a base material 100, several conductive contact pad 106a, dielectric insulation layer 108 and conductive bump
Group 112.Several conductive contact pad 106a are set on the base material 100, and each several conductive contact pad 106a are electric mutually
Property insulation or it is disconnected from each other.Dielectric insulation layer 108 is set on several conductive contact pad 106a and the base material 100
On, to cover several conductive contact pad 106a.Conductive bump group 112 is set to the base material 100 and the dielectric insulation
Among layer 108, it is logical that each several conductive contact pad 106a to described first are electrically connected in the conductive bump group 112
Pore structure 118a and the second through-hole structure 118b.
In embodiment shown in Fig. 5, the conductive bump group 112 includes several first conductive bump 112a and several
Second conductive bump 112b, several first conductive bump 112a are set among the base material 100, and described several second lead
Electric convex block 112b is set among the dielectric insulation layer 108, the both side surface of each several conductive contact pad 106a
106b is corresponding respectively to be electrically connected at each several first conductive bump 112a and each several second conductive studs
Between block 112b, and several first conductive bump 112a are electrically connected described the of first multilayer circuit board 114
One through-hole structure 118a, several second conductive bump 112b are electrically connected described the of second multilayer circuit board 116
Two through-hole structure 118b.In one embodiment, the first conductive bump 112a of vertical connection interface structure is to heat pressing mode
Fit in first through hole structure 118a, such as the melting temperature of the first conductive bump 112a is equal to or less than a pressing-in temp,
Wherein described pressing-in temp refers to the base material 100 of vertical connection interface structure and first multilayer circuit board 114 and/or is institute
The temperature that electric insulation layer 108 and second multilayer circuit board 116 form bonding state is given an account of, according to the pressing-in temp, with
Make the surface melting of the first conductive bump 112a and be electrically connected with the engagement pad of first through hole structure 118a.Together
Sample, the second conductive bump 112b of vertical connection interface structure fits in the second through-hole structure 118b to heat pressing mode,
Such as second the melting temperature of conductive bump 112b be equal to or less than the pressing-in temp, according to the pressing-in temp so that
It the surface melting of two conductive bump 112b and is electrically connected with the engagement pad of the second through-hole structure 118b.In an embodiment
In, according to base material 100, dielectric insulation layer 108, the first conductive bump 112a and the second conductive bump 112b material it is different and
It is fixed, pressing-in temp be, for example, between Celsius 100 to 250 degree, but not limited to this, be, for example, less than 100 degree or more than 250 degree.
As shown in figure 5, in one embodiment, each several conductive contact pad 106a are respectively with each described several
One conductive bump 112a and each several second conductive bump 112b are formed along a conllinear transmission path TP and are electrically connected
It connects.In a preferred embodiment, each several conductive contact pad 106a respectively with each several first conductive bumps
112a, each several second conductive bump 112b, the first through hole structure 118a and second through-hole structure
118b is electrically connected along the conllinear transmission path TP, and the conllinear transmission path TP is vertical path, is solved
The problem of signal transmission path is longer between the multilayer circuit board.Further, the ratio of the H and P of Fig. 5 are less than the prior art
The ratio of the longitudinal height H and horizontal spacing P of middle Fig. 1 solve the processing problems of the high aspect ratio of circuit board.
With reference to figure 6, it is painted the schematic diagram of the circuit board with vertical connection interface structure in second embodiment of the invention.
Circuit board with vertical connection interface structure includes the first multilayer circuit board 114 and vertical connection interface structure, described to hang down
Direct-connected connection interface structure is as shown in Figure 4 C.In one embodiment, the vertical connection interface structure is, for example, electric in a vertical manner
Property the connection single layer board 114b, single layer board 114b be equipped with the lamina 114c's and perforation lamina 114c
Several first through hole structure 118a.
As shown in fig. 6, the vertical connection interface structure is set on the single layer board 114b, it is for electrically connecting to
The single layer board 114b, the vertical connection interface structure include base material 100, several conductive contact pad 106a and several
First conductive bump 112a, several conductive contact pad 106a are set on the base material 100, each several conductive contact pads
106a is electrically insulated mutually.Several first conductive bump 112a are set among the base material 100, and each described several first lead
Electric convex block 112a is corresponding to be electrically connected each several conductive contact pad 106a to each several first through hole structures
118a.In one embodiment, the single layer board 114b is flexible circuit board.In one embodiment, it is each described several to lead
Electrical contact pad 106a is respectively with each several first conductive bump 112a and the first through hole structure 118a along one
Conllinear transmission path TP is electrically connected.The conllinear transmission path TP is vertical path.In the embodiment of Fig. 6,
Further include protective layer 117 on the upper and lower surfaces of lamina 114c of single layer board 114b, with protect first through hole structure 118a or
It is the contact point 115 for only exposing a part to the open air.In embodiment shown in Fig. 6, the circuit board with vertical connection interface structure can
For foot column pitch, such as can be by the circuit (non-icon) of the first conductive bump 112a tops using vertical connection interface structure
The larger foot column pitch of single layer board 114b (such as contact point 115 of extension) is converted into compared with bound feet column pitch.
In one embodiment, the first conductive bump 112a of vertical connection interface structure fits in to heat pressing mode
One through-hole structure 118a, such as the melting temperature of the first conductive bump 112a are equal to or less than a pressing-in temp, wherein described
Pressing-in temp refers to the temperature of the base material 100 and single layer board 114b formation bonding states of vertical connection interface structure
Degree, according to the pressing-in temp so that the surface melting of the first conductive bump 112a and with first through hole structure 118a
Engagement pad be electrically connected.In one embodiment, it is different according to the material of base material 100 and first conductive bump 112a and
It is fixed, pressing-in temp be, for example, between Celsius 100 to 250 degree, but not limited to this, be, for example, less than 100 degree or more than 250 degree.
With reference to figure 7, it is painted the schematic diagram of the circuit board with vertical connection interface structure in third embodiment of the invention.
Circuit board with vertical connection interface structure includes single layer board 114b and two groups of vertical connection interface structures, individual layer electricity
Road plate 114b is equipped with several first through hole structure 118a of a lamina 114c and the perforation lamina 114c.
As shown in fig. 7, two groups of vertical connection interface structures are respectively arranged at the both side surface of the single layer board 114b
On, it is for electrically connecting to the both ends of each several first through hole structure 118a, each group of vertical connection interface structure packet
Include base material 100, several conductive contact pad 106a and several first conductive bump 112a.Several conductive contact pad 106a are set to
On the base material 100, each several conductive contact pad 106a are electrically insulated mutually.Several first conductive bump 112a settings
Among the base material 100, each several first conductive bump 112a are corresponding to be electrically connected each several conductions
Engagement pad 106a to the first through hole structure 118a.
As shown in fig. 7, in one embodiment, the single layer board 114b is hard circuit board.Described two groups vertically connect
Each several conductive contact pad 106a of connection interface structure and each several first conductive bump 112a respectively with
The first through hole structure 118a is electrically connected along a conllinear transmission path TP.The conllinear transmission path TP is vertical
Transmission path.In embodiment shown in Fig. 7, there is hardness of the circuit board available for stacking up layers of vertical connection interface structure
Circuit board, to increase the storehouse number of plies of multilayer circuit board and intensity, it is noted that Fig. 7 is only with one layer of single layer board
For 114b, but not limited to this.In one embodiment, the first conductive bump 112a of vertical connection interface structure is pressed with heating
Mode fits in first through hole structure 118a, such as the melting temperature of the first conductive bump 112a is equal to or less than a pressing temperature
Degree, wherein the base material 100 and single layer board 114b that the pressing-in temp refers to vertical connection interface structure forms knot
The temperature of conjunction state, according to the pressing-in temp so that the surface melting of the first conductive bump 112a and with first through hole knot
The engagement pad of structure 118a is electrically connected.In one embodiment, depending on according to the material difference of the first conductive bump 112a, institute
State pressing-in temp be, for example, between Celsius 100 to 250 degree, but not limited to this, be, for example, less than 100 degree or more than 250 degree.
In conclusion the vertical connection interface structure of the present invention, the circuit board and its manufacturing method of the tool structure, pass through
Vertical connection interface structure connects an at least layer circuit board, to solve the processing problems of the high aspect ratio of circuit board.By vertical
Connecting interface structure connects an at least layer circuit board, and to solve between the multilayer circuit board, signal transmission path is longer to ask
Topic.And an at least layer circuit board, such as one layer of flexible circuit board and at least one are connected by vertical connection interface structure
The hard circuit board of layer, to improve the problem of the nesting structural embedded control of circuit board and foot column pitch conversion.
Although the present invention has used preferred embodiment disclosed above, however, it is not to limit the invention, skill belonging to the present invention
Have usually intellectual in art field, without departing from the spirit and scope of the invention, may make various changes and modifications, because
The scope of protection of the present invention shall be subject to the definition of the patent scope appended hereto for this.
Claims (25)
1. a kind of manufacturing method of vertical connection interface structure, for circuit board, which is characterized in that include the following steps：
A conductive layer is formed on a base material；
A photoresist layer is formed on the conductive layer；
Micro-photographing process is carried out, an engagement pad pattern is defined with the photoresist layer, and expose the conductive layer of a part to the open air；
Using the engagement pad pattern as etch mask, the conductive layer exposed to the open air is etched, to form several conductive contact pads,
In each several conductive contact pads be electrically insulated mutually；
The photoresist layer is removed, with exposure several conductive contact pads；
A dielectric insulation layer is formed in several conductive contact pads and on the base material, is connect with covering several conductions
Touch pad；
If it is respectively formed in the base material and in the dielectric insulation layer relative to the position of several conductive contact pads
Dry trepanning, and expose the conductive contact pad in several trepannings of the base material and the dielectric insulation layer；With
And
It is formed in each several trepannings and inserts conductive material to form a conductive bump group, described several led so that each
The conductive bump group is electrically connected in the both side surface of electrical contact pad.
2. the manufacturing method of the vertical connection interface structure of circuit board according to claim 1, which is characterized in that the base
Material is dielectric insulation material.
3. the manufacturing method of the vertical connection interface structure of circuit board according to claim 1, which is characterized in that described
A step of dielectric insulation layer is to cover several conductive contact pads is formed in several conductive contact pads and on the base material
In, it is included in several conductive contact pads and is bonded a dielectric insulation layer on the base material.
4. the manufacturing method of the vertical connection interface structure of circuit board according to claim 1, which is characterized in that described to lead
Electric group of bumps is the material of conductive paste or conducting resinl.
5. the manufacturing method of the vertical connection interface structure of circuit board according to claim 1, which is characterized in that each
It is formed in several trepannings and inserts conductive material to form the conductive bump group, make each several conductive contact pads
Both side surface is electrically connected in the step of the conductive bump group, and several first including forming the conductive bump group are led
Electric convex block and several second conductive bumps, several first conductive bumps are set among the base material, and described several
Two conductive bumps are set among the dielectric insulation layer, wherein the both side surface difference phase of each several conductive contact pads
It is corresponding to be electrically connected between each several first conductive bumps and each several second conductive bumps.
6. a kind of manufacturing method of vertical connection interface structure, for circuit board, which is characterized in that include the following steps：
A conductive layer is formed on a base material；
A photoresist layer is formed on the conductive layer；
Micro-photographing process is carried out, an engagement pad pattern is defined with the photoresist layer, and expose the conductive layer of a part to the open air；
Using the engagement pad pattern as etch mask, the conductive layer exposed to the open air is etched, to form several conductive contact pads, often
One several conductive contact pads are electrically insulated mutually；
Several trepannings are formed relative to the position of several conductive contact pads on the substrate, and in the institute of the base material
It states several trepannings and exposes the conductive contact pad；
Conductive material is inserted to form several first conductive bumps in several trepannings, so that each several conductions connect
One side surface of touch pad is corresponding to be electrically connected each several first conductive bumps；And
Remove the photoresist layer.
7. the manufacturing method of the vertical connection interface structure of circuit board according to claim 6, which is characterized in that the base
Material is dielectric insulation material.
8. the manufacturing method of the vertical connection interface structure of circuit board according to claim 6, which is characterized in that described
One conductive bump is conductive paste or conducting resinl material.
9. the manufacturing method of the vertical connection interface structure of circuit board according to claim 6, which is characterized in that described to go
It is conductive that the step of removing photoresistance layer carries out or formed described several first before several first conductive bump steps are formed
It is carried out after convex block step.
10. a kind of circuit board with vertical connection interface structure, including：
One first multilayer circuit board, equipped with the first multi-layer board and perforation first multiple-plate several first through hole structures；
One second multilayer circuit board, equipped with the second multi-layer board and perforation second multiple-plate several second through-hole structures；
And
One vertical connection interface structure is set between first multilayer circuit board and second multilayer circuit board, to
First multilayer circuit board and second multilayer circuit board are electrically connected, the vertical connection interface structure includes：
One base material；
Several conductive contact pads are set on the base material, and each several conductive contact pads are electrically insulated mutually；
One dielectric insulation layer is set in several conductive contact pads and on the base material, to cover several conductions
Engagement pad；And
One conductive bump group is set to the base material and among the dielectric insulation layer, the conductive bump group electrically connects respectively
Each several conductive contact pads are connect to the first through hole structure and second through-hole structure.
11. the vertical connection interface structure of circuit board according to claim 10, which is characterized in that the conductive bump group
Including several first conductive bumps and several second conductive bumps, several first conductive bumps be set to the base material it
In, several second conductive bumps are set among the dielectric insulation layer, the both sides of each several conductive contact pads
Surface respectively it is corresponding be electrically connected at each several first conductive bumps and each several second conductive bumps it
Between, and several first conductive bumps are electrically connected the first through hole structure of first multilayer circuit board, and it is described
Several second conductive bumps are electrically connected second through-hole structure of second multilayer circuit board.
12. the vertical connection interface structure of the circuit board according to claim 11, which is characterized in that each described several to lead
Electrical contact pad is conllinear along one with each several first conductive bumps and each several second conductive bumps respectively
Transmission path is into electric connection.
13. the vertical connection interface structure of the circuit board according to claim 12, which is characterized in that each described several to lead
Electrical contact pad respectively with each several first conductive bumps, each several second conductive bumps, the first through hole
Structure and second through-hole structure are along a conllinear transmission path into electric connection.
14. the vertical connection interface structure of the circuit board according to any one in claim 12 or 13, feature exist
In the conllinear transmission path is vertical path.
15. the vertical connection interface structure of circuit board according to claim 10, which is characterized in that the conductive bump group
Each several conductive contact pads are electrically connected to the first through hole structure and described second to heat pressing mode
Through-hole structure.
16. a kind of circuit board with vertical connection interface structure, which is characterized in that including：
One single layer board, several first through hole structures equipped with lamina and the perforation lamina；And
One vertical connection interface structure, is set in the single layer board, is for electrically connecting to the single layer board, described
Vertical connection interface structure includes：
One base material；
Several conductive contact pads are set on the base material, and each several conductive contact pads are electrically insulated mutually；And
Several first conductive bumps, are set among the base material, and each several first conductive bumps connect with respect to electrotropism
Each several conductive contact pads are connect to each several first through hole structures.
17. the vertical connection interface structure of the circuit board according to claim 16, which is characterized in that the single layer board
For flexible circuit board.
18. the vertical connection interface structure of the circuit board according to claim 16, which is characterized in that each described several to lead
Electrical contact pad is respectively with each several first conductive bumps and the first through hole structure along a conllinear transmission path
Into electric connection.
19. the vertical connection interface structure of the circuit board according to claim 18, which is characterized in that the conllinear transmission road
Diameter is vertical path.
20. the vertical connection interface structure of the circuit board according to claim 16, which is characterized in that each described several
To heat, pressing mode is corresponding to be electrically connected each several conductive contact pads to each described several the to one conductive bump
One through-hole structure.
21. a kind of circuit board with vertical connection interface structure, which is characterized in that including：
One single layer board, several first through hole structures equipped with a lamina and the perforation lamina；And
Two groups of vertical connection interface structures, are respectively arranged in the both side surface of the single layer board, are for electrically connecting to every
The both ends of one several first through hole structures, each group of vertical connection interface structure include：
One base material；
Several conductive contact pads are set on the base material, and each several conductive contact pads are electrically insulated mutually；And
Several first conductive bumps, are set among the base material, and each several first conductive bumps connect with respect to electrotropism
Each several conductive contact pads are connect to the first through hole structure.
22. the vertical connection interface structure of the circuit board according to claim 21, which is characterized in that the single layer board
For hard circuit board.
23. the vertical connection interface structure of the circuit board according to claim 21, which is characterized in that described two groups vertically connect
Each several conductive contact pads of connection interface structure and each several first conductive bumps are respectively with described first
Through-hole structure is along a conllinear transmission path into electric connection.
24. the vertical connection interface structure of the circuit board according to claim 23, which is characterized in that the conllinear transmission road
Diameter is vertical path.
25. the vertical connection interface structure of the circuit board according to claim 21, which is characterized in that each described several
To heat, pressing mode is corresponding to be electrically connected each several conductive contact pads to the first through hole knot to one conductive bump
Structure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105140126A TWI626870B (en) | 2016-12-05 | 2016-12-05 | Vertical connection interface structure, circuit board having interface structure and manufacturing method thereof |
| TW105140126 | 2016-12-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108156754A true CN108156754A (en) | 2018-06-12 |
| CN108156754B CN108156754B (en) | 2020-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710066115.4A Active CN108156754B (en) | 2016-12-05 | 2017-02-06 | Vertical connection interface structure, circuit board with the structure and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108156754B (en) |
| TW (1) | TWI626870B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11168279A (en) * | 1997-12-03 | 1999-06-22 | Fujitsu Ltd | Multilayer circuit board and manufacture thereof |
| JP2000312063A (en) * | 1999-04-28 | 2000-11-07 | Kyocera Corp | Wiring substrate and manufacture thereof |
| TW471244B (en) * | 1999-06-02 | 2002-01-01 | Ibiden Co Ltd | Multilayer printed circuit board and method of manufacturing multilayer printed circuit board |
| CN1440232A (en) * | 2002-02-18 | 2003-09-03 | 能洲株式会社 | Wiring membrane connector and manufacture thereof, multilayer wiring substrate manufacture |
| TW200427389A (en) * | 2003-04-22 | 2004-12-01 | Matsushita Electric Works Ltd | Copper-clad laminate for multilayer printed wiring board, multilayer printed wiring board and manufacturing method thereof |
| TW201618624A (en) * | 2014-11-10 | 2016-05-16 | 先豐通訊股份有限公司 | Circuit board with electroplated type and manufacturing method thereof |
-
2016
- 2016-12-05 TW TW105140126A patent/TWI626870B/en active
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2017
- 2017-02-06 CN CN201710066115.4A patent/CN108156754B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11168279A (en) * | 1997-12-03 | 1999-06-22 | Fujitsu Ltd | Multilayer circuit board and manufacture thereof |
| JP2000312063A (en) * | 1999-04-28 | 2000-11-07 | Kyocera Corp | Wiring substrate and manufacture thereof |
| TW471244B (en) * | 1999-06-02 | 2002-01-01 | Ibiden Co Ltd | Multilayer printed circuit board and method of manufacturing multilayer printed circuit board |
| CN1440232A (en) * | 2002-02-18 | 2003-09-03 | 能洲株式会社 | Wiring membrane connector and manufacture thereof, multilayer wiring substrate manufacture |
| TW200427389A (en) * | 2003-04-22 | 2004-12-01 | Matsushita Electric Works Ltd | Copper-clad laminate for multilayer printed wiring board, multilayer printed wiring board and manufacturing method thereof |
| TW201618624A (en) * | 2014-11-10 | 2016-05-16 | 先豐通訊股份有限公司 | Circuit board with electroplated type and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI626870B (en) | 2018-06-11 |
| CN108156754B (en) | 2020-11-20 |
| TW201822605A (en) | 2018-06-16 |
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