CN108155197A - 系统级封装图像传感器 - Google Patents
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Abstract
本申请案涉及一种系统级封装图像传感器。图像传感器封装包含陶瓷衬底,其具有安置在所述陶瓷衬底中的空腔。玻璃层粘附到所述陶瓷衬底且围封所述陶瓷衬底中的所述空腔。图像传感器安置在所述玻璃层与所述陶瓷衬底之间的所述空腔中以电隔离所述图像传感器。图像传感器处理器安置在所述空腔中且电耦合到所述图像传感器以从所述图像传感器接收图像数据。
Description
技术领域
本发明大体上涉及半导体装置封装,且特定来说(但非排他性地)涉及图像传感器封装。
背景技术
图像传感器已变得无处不在。它们广泛应用于数码相机,蜂窝电话、安防摄像机,以及医疗、汽车和其它应用中。用于制造图像传感器的技术持续以迅猛的速度进步。举例来说,对更高分辨率和更低功耗的需求已促进这些装置的进一步微型化和集成化。
典型的图像传感器操作如下。来自外部场景的图像光入射到图像传感器上。图像传感器包含多个光敏元件,使得每一光敏元件吸收入射图像光的一部分。包含在图像传感器中的光敏元件(例如光电二极管)在吸收图像光时各自产生图像电荷。所产生的图像电荷量与图像光的强度成比例。所产生的图像电荷可用以产生表示外部场景的图像。
为产生高质量的图像,图像传感器需要被充分地电隔离以防止非所要电畸变。常规封装材料可能不具有现代传感器的充分绝缘性质。因此,可使用新的封装材料。
发明内容
本申请案的一个方面涉及图像传感器封装。在一个实施例中,所述图像传感器封装包括:陶瓷衬底,其具有安置在所述陶瓷衬底中的空腔;玻璃层,其粘附到所述陶瓷衬底且围封所述陶瓷衬底中的所述空腔;图像传感器,其安置在所述玻璃层与所述陶瓷衬底之间的所述空腔中以电隔离所述图像传感器;以及图像传感器处理器,其安置在所述空腔中且电耦合到所述图像传感器以从所述图像传感器接收图像数据。
本申请案的另一方面涉及图像传感器封装制造方法。在一个实施例中,所述方法包括:在陶瓷衬底中形成空腔;将图像传感器放置在所述陶瓷衬底的所述空腔中;将图像传感器处理器放置在所述陶瓷衬底的所述空腔中;将所述图像传感器和所述图像传感器处理器线接合到电触点;将胶水沉积在所述陶瓷衬底上;以及将玻璃层放置在所述胶水上以将所述玻璃层粘附到所述陶瓷衬底,其中所述图像传感器处理器和所述图像传感器安置在所述玻璃层与所述陶瓷衬底之间的所述空腔中。
附图说明
参考以下图式描述本发明的非限制性和非穷尽实例,其中除非另有规定,否则相似参考数字贯穿各种视图指代相似部分。
图1A是根据本发明的教示的图像传感器封装的横截面图。
图1B是根据本发明的教示的图像传感器封装的横截面图。
图1C是根据本发明的教示的图像传感器封装的横截面图。
图2A到2E说明根据本发明的教示的图像传感器封装制造的方法。
图3A到3E说明根据本发明的教示的图像传感器封装制造的方法。
图4说明根据本发明的教示的可含有图1A到1C的图像传感器封装的至少部分自动的汽车。
对应参考字符贯穿附图的若干视图指示对应组件。所属领域的技术人员应了解,图式中的元件出于简单和清楚的目的而说明,且未必是按比例绘制。举例来说,图式中一些元件的尺寸可相对于其它元件被放大以帮助提高对本发明的各种实施例的理解。此外,为了促进对本发明的这些各种实施例的更容易的观察,通常不描绘在商业上可行的实施例中有用的或必需的常见但众所周知的元件。
具体实施方式
本文中描述用于系统级封装图像传感器的设备和方法的实例。在以下描述中,阐述众多特定细节以提供对所述实例的透彻理解。然而,所属领域的技术人员将认识到,可在不具有一或多个特定细节的情况下或配合其它方法、组件、材料等等实践本文中所描述的技术。在其它情况下,未展示或详细地描述众所周知的结构、材料或操作以避免混淆某些方面。
贯穿本说明书的对“一个实例”或“一个实施例”的参考意指结合实例所描述的特定特征、结构或特性包含于本发明的至少一个实例中。因此,贯穿本说明书的各种位置的短语“在一个实例中”或“在一个实施例中”的出现未必都是指同一实例。此外,特定特征、结构或特性可以任何合适方式组合于一或多个实例中。
贯穿本说明书,使用若干所属领域的术语。这些术语具有其出自的所属领域的一般意义,除非本文中具体定义或其使用背景另有明确指示。
图1A是图像传感器封装100A的横截面图。图像传感器封装100A包含陶瓷衬底101、图像传感器103、专用集成电路(ASIC)105、图像传感器处理器107、组件109、玻璃层111、粘合剂113到117和线接合119。所属领域的技术人员将了解,根据本发明的教示,所描绘的许多组件可代替其它组件。然而,与常规半导体封装材料相比,陶瓷衬底101可传达更大的电隔离和增强的机械性质。
陶瓷衬底101具有安置在其内的空腔,且玻璃层111粘附到陶瓷衬底101且围封空腔。图像传感器103安置在玻璃层111与陶瓷衬底101之间的空腔中,使得图像传感器103电隔离。图像传感器处理器(ISP)107安置在空腔中且电耦合到图像传感器103以从图像传感器103接收图像数据。在一个实例中,ISP 107可将原始图像数据处理为可供电子装置使用的数据类型,或甚至可通过应用后图像效果(例如,裁剪、旋转、去除红眼、调整亮度、调整对比度或其它方式)来操纵图像数据。如所描绘,玻璃层111安置成靠近图像传感器103的照明侧,且玻璃层111(经由粘合剂113)粘合到陶瓷衬底101的升高部分。换句话说,在所描绘的实例中,玻璃层111粘合到空腔的壁上,使得在图像传感器103与玻璃层111之间存在气隙或真空。图像传感器103还包含安置在图像传感器103的照明表面上的多个微透镜,使得微透镜安置在玻璃层111与图像传感器103之间。
在所描绘的实例中,专用集成电路(ASIC)105安置在陶瓷衬底101中的空腔中,且取决于如何使用图像传感器封装100A(例如,手机、部分或完全自动的汽车、计算机等等)而耦合到图像传感器103或图像传感器处理器107中的至少一者。在一个实例中,ASIC 105可包含现场可编程门阵列。
图1A中还展示组件109,其可为用以控制图像传感器103的另一片电路,或者可控制供应到图像传感器103的功率。如所描绘,ASIC 105、图像传感器103、图像传感器处理器107和组件109安置在陶瓷衬底101上的空腔内的水平面上。此外,陶瓷衬底101包含安置在陶瓷衬底101上的接触垫;图像传感器103和图像传感器处理器107经由线接合119线接合到接触垫。
图1B是图像传感器封装100B的横截面图。图像传感器封装100B在许多方面类似于图像传感器封装100A。然而,图像传感器封装100B包含安置在陶瓷衬底101的空腔中的凸缘,且插入器121安置在凸缘上,使得插入器121跨越凸缘之间的间隙。此外,图像传感器103、图像传感器处理器107和ASIC 105安置在插入器121上。如所展示,图像传感器103和图像传感器处理器107安置在玻璃层111与插入器121之间;ASIC 105和组件109安置在陶瓷衬底101与插入器121之间。在说明性实例中,ASIC 105与ISP107垂直对准,而组件109与图像传感器103垂直对准。插入器121可为具有金属组件123(其可安置在两片塑料之间)的塑料,或可包含取决于插入器121的所要性质的硅。此外,可运用粘合剂131将插入器121安装在凸缘上。在所描绘的实例中,金属组件123可包含电互连件以将图像传感器103耦合到图像传感器处理器107和ASIC 105。
图1C是根据本发明的教示的图像传感器封装100C的横截面图。图像传感器封装100C在许多方面类似于图像传感器封装100A和100B。然而,不是插入器安置在凸缘上,而是图像传感器103安置在凸缘上且跨越凸缘之间的间隙。此外,图像传感器处理器107安置在陶瓷衬底101上、介于图像传感器103与陶瓷衬底101之间。换句话说,图像传感器处理器107安置在两个凸缘之间的第二空腔中。图像传感器103在垂直方向上安置在图像传感器处理器107与玻璃层111之间。如所说明,玻璃层111、图像传感器103和图像传感器处理器107被光学对准,使得图像光被引导通过玻璃层111,入射到图像传感器103上,且光被阻挡使其不能到达图像传感器处理器107。在所描绘的实例中,运用粘合剂117将图像传感器处理器107粘附到陶瓷衬底101上。
图2A到2E说明根据本发明的教示的图像传感器封装制造的方法。在方法中出现一些或所有过程图式的次序不应被视为限制性的。相反,受益于本发明的所属领域的一般技术人员将理解,可以未说明或甚至并行的各种次序来执行方法中的一些。此外,所述方法可省略某些图式以避免混淆某些方面。替代地,所述方法可包含在本发明的一些实施例/实例中可能并非必需的额外图式。
图2A展示在陶瓷衬底201中形成空腔。这可包含取一块陶瓷且将沟槽蚀刻到衬底中。替代地,陶瓷可经压制/烧结、注浆成型或其类似工艺以形成所要形状。所属领域的一般技术人员将了解,可使用许多技术和材料来形成陶瓷衬底201。举例来说,陶瓷衬底201可包含铝、硅、锌或其类似物的氧化物。
图2B说明将专用集成电路(ASIC)205和组件209放置到陶瓷衬底201中的空腔中。在所描绘的实例中,ASIC 205和组件209两者可在底部上具有焊球,且可耦合到陶瓷衬底201上的电触点。
图2C描绘将图像传感器203和图像传感器处理器207放置在陶瓷衬底201的空腔中。在所描绘的实例中,图像传感器203和图像传感器处理器207线接合219到安置在陶瓷空腔上的电触点。如所展示,ASIC 205、图像传感器203和图像传感器处理器207安置在空腔内的水平面上。
图2D展示将胶水213沉积在陶瓷衬底201。在一个实例中,胶水213可为环氧树脂或其类似物。然而,在其它实例中,胶水213可为光学地或热可交联的。
图2E说明将玻璃层211放置在胶水213上以将玻璃层211粘附到陶瓷衬底201上。因此,图像传感器处理器207和图像传感器203安置在玻璃层211与陶瓷衬底201之间的空腔中。这囊封图像传感器203,从而允许电隔离且机械稳固图像传感器封装。
图3A到3E说明根据本发明的教示的图像传感器封装制造的方法。在方法中出现一些或所有过程图式的次序不应被视为限制性的。相反,受益于本发明的所属领域的一般技术人员将理解,可以未说明的各种次序或甚至并行来执行方法中的一些。此外,所述方法可省略某些图式以避免混淆某些方面。替代地,所述方法可包含在本发明的一些实施例/实例中可能并非必需的额外图式。
图3A展示将ASIC 305和组件309安装到插入器321上。取决于设计考虑,插入器321可为具有金属323的塑料或硅。
图3B说明将图像传感器303和图像传感器处理器307安装在插入器321的相对侧上。因此,图像传感器303和图像传感器处理器307安置在插入器321的照明侧上,且ASIC305和组件309安置在非照明侧上。所有上述组件可线接合319到插入器321。
图3C描绘将插入器321粘附到陶瓷衬底301。在所描绘的实例中,运用粘合剂331将插入器321粘附到陶瓷衬底301。在一个实例中,将插入器321放置在空腔中包含将其放置在安置在陶瓷衬底301中的空腔内的凸缘上。如所展示,ASIC 305和组件309至少部分地安置在安置在两个凸缘之间的第二空腔中。
图3D展示将胶水313施加到陶瓷衬底301的凸缘。可运用自动胶水枪或任何其它设备来分配胶水313。
图3E说明运用胶水213将玻璃层211粘附到陶瓷衬底201。
图4说明可含有图1A到1C的图像传感器封装401的至少部分自动的汽车400。在一个实例中,汽车400可使用图像传感器401来停放自身。在其它实例中,在具有很少人为干预或无人为干预的情况下,汽车400可自动驾驶。图像传感器401可将关于汽车400的位置的光学信息中继到汽车400内含有的处理器。这可允许汽车400在交通中准确地进行自身定位。图像传感器封装401的陶瓷外壳可防止清晰图像获取的机械、化学和电磁干扰。例如,陶瓷和玻璃外壳可防止在事故中对关键感测组件的损坏,由此允许汽车400仍然能够将自身操纵在道路的一侧且不受危害。此外,陶瓷封装可帮助防止化学降解(例如,防止路盐腐蚀连接件)。
本发明的所说明的实例的以上描述(包含摘要中所描述的内容)并不意图为穷尽性的或将本发明限于所揭示的具体形式。尽管本文中描述本发明的特定实例是出于说明性目的,但如所属领域的技术人员将认识到,在本发明范围内的各种修改是可能的。
依据上文详细描述可对本发明做出这些修改。所附权利要求书中使用的术语不应解释为将本发明限于本说明书中所揭示的特定实例。而是,本发明的范围完全由所附权利要求书确定,所附权利要求书应根据权利要求解释的既定原则来解释。
Claims (19)
1.一种图像传感器封装,其包括:
陶瓷衬底,其具有安置在所述陶瓷衬底中的空腔;
玻璃层,其粘附到所述陶瓷衬底且围封所述陶瓷衬底中的所述空腔;
图像传感器,其安置在所述玻璃层与所述陶瓷衬底之间的所述空腔中以电隔离所述图像传感器;以及
图像传感器处理器,其安置在所述空腔中且电耦合到所述图像传感器以从所述图像传感器接收图像数据。
2.根据权利要求1所述的图像传感器封装,其中所述玻璃层安置成靠近所述图像传感器的照明侧,且其中所述玻璃层粘合到所述陶瓷衬底的升高部分。
3.根据权利要求2所述的图像传感器封装,其中所述图像传感器包含安置在所述图像传感器的照明表面上且安置在所述玻璃层与所述图像传感器之间的多个微透镜。
4.根据权利要求1所述的图像传感器封装,其进一步包括安置在所述陶瓷衬底的所述空腔中且耦合到所述图像传感器或所述图像传感器处理器中的至少一个的专用集成电路。
5.根据权利要求4所述的图像传感器封装,其进一步包括:
凸缘,其安置在所述陶瓷衬底的所述空腔中;以及
插入器,其安置在所述凸缘上、跨越所述凸缘之间的间隙,其中所述图像传感器、所述图像传感器处理器以及所述专用集成电路安置在所述插入器上。
6.根据权利要求5所述的图像传感器封装,其中所述图像传感器和所述图像传感器处理器安置在所述玻璃层与所述插入器之间,且其中所述专用集成电路安置在所述陶瓷衬底与所述插入器之间。
7.根据权利要求6所述的图像传感器封装,其中所述插入器包含用以将所述图像传感器耦合到所述图像传感器处理器和所述专用集成电路的电互连件,且其中所述插入器附接到所述凸缘。
8.根据权利要求1所述的图像传感器封装,其进一步包括安置在所述陶瓷衬底的所述空腔中的凸缘,其中所述图像传感器安置在所述凸缘上且跨越所述凸缘之间的间隙,且其中所述图像传感器处理器安置在所述陶瓷衬底上、介于所述图像传感器与所述陶瓷衬底之间,且其中所述图像传感器安置在所述图像传感器处理器与所述玻璃层之间。
9.根据权利要求1所述的图像传感器封装,其进一步包括安置在所述陶瓷衬底上的接触垫,其中所述图像传感器和所述图像传感器处理器被线接合到所述接触垫。
10.根据权利要求1所述的图像传感器封装,其中所述图像传感器封装包含在至少部分自动的汽车中。
11.一种图像传感器封装制造方法,其包括:
在陶瓷衬底中形成空腔;
将图像传感器放置在所述陶瓷衬底的所述空腔中;
将图像传感器处理器放置在所述陶瓷衬底的所述空腔中;
将所述图像传感器和所述图像传感器处理器线接合到电触点;
将胶水沉积在所述陶瓷衬底上;以及
将玻璃层放置在所述胶水上以将所述玻璃层粘附到所述陶瓷衬底,其中所述图像传感器处理器和所述图像传感器安置在所述玻璃层与所述陶瓷衬底之间的所述空腔中。
12.根据权利要求11所述的方法,其进一步包括将专用集成电路放置在所述陶瓷衬底中的所述空腔中,且将所述专用集成电路线接合到所述电触点。
13.根据权利要求12所述的方法,其中所述专用集成电路、所述图像传感器和所述图像传感器处理器安置在所述空腔内的水平面上。
14.根据权利要求11所述的方法,其进一步包括将插入器放置在所述腔中,其中所述腔包含凸缘,且其中所述插入器附接到所述陶瓷衬底的所述凸缘。
15.根据权利要求14所述的方法,其中将所述图像传感器和所述图像传感器处理器放置在所述空腔中包含将所述图像传感器和所述图像传感器处理器线接合到所述插入器且将所述插入器放置在所述空腔中。
16.根据权利要求15所述的方法,其中所述图像传感器和所述图像传感器处理器安置在所述插入器的照明侧上,且其中专用集成电路安置在所述插入器的与所述照明侧相对的暗侧上。
17.根据权利要求16所述的方法,其中所述插入器包含硅。
18.根据权利要求11所述的方法,其中所述空腔包含凸缘,且其中所述图像传感器放置在所述凸缘上,使得所述图像传感器安置在所述玻璃层与所述图像传感器处理器之间,其中所述图像传感器处理器安置在所述陶瓷衬底的平面表面上。
19.根据权利要求11所述的方法,其中线接合包含线接合到安置在所述陶瓷衬底中的所述空腔中的接触垫。
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CN111435669B (zh) * | 2019-01-15 | 2022-01-11 | 豪威科技股份有限公司 | 半导体器件封装及其制造方法 |
CN113097239A (zh) * | 2019-12-23 | 2021-07-09 | 豪威科技股份有限公司 | 图像传感器封装 |
CN113097239B (zh) * | 2019-12-23 | 2024-01-16 | 豪威科技股份有限公司 | 图像传感器封装 |
CN111341674A (zh) * | 2020-03-05 | 2020-06-26 | 西安锐晶微电子有限公司 | 一种陶瓷管壳封装熔封工艺 |
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US20180182797A1 (en) | 2018-06-28 |
TW201834228A (zh) | 2018-09-16 |
CN108155197B (zh) | 2021-12-31 |
US10243014B2 (en) | 2019-03-26 |
US9935144B1 (en) | 2018-04-03 |
TWI665794B (zh) | 2019-07-11 |
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