CN108145586A - Polissoir and polishing method - Google Patents
Polissoir and polishing method Download PDFInfo
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- CN108145586A CN108145586A CN201810004291.XA CN201810004291A CN108145586A CN 108145586 A CN108145586 A CN 108145586A CN 201810004291 A CN201810004291 A CN 201810004291A CN 108145586 A CN108145586 A CN 108145586A
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- Prior art keywords
- polishing
- component units
- unit
- polissoir
- panel
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The disclosure provides a kind of polissoir and polishing method.The polissoir includes：Upper disk, wherein the upper disk includes：Unit is polished, wherein the polishing unit includes height adjustment device, can be used in adjusting the height of the polishing unit；Telecontrol equipment is used to that the polishing unit to be enabled to do transverse movement and longitudinal movement；Polishing fluid delivery pipe；Solenoid valve, for controlling opening or closing for the polishing fluid delivery pipe；Wherein, each polishing unit is equipped with independent polishing fluid delivery pipe and solenoid valve.The disclosure can be used to implement the independent polishing operation of each component units of polished part by the independent polishing unit that disk on polissoir is set, and reduce whole polishing rate, so as to greatly reduce Zara caused by polishing.
Description
Technical field
This disclosure relates to polishing technology field, in particular to a kind of polissoir and polishing method.
Background technology
After completing to box process, the Q-Panel for being cut into several Single-Panel compositions is carried out liquid crystal display panel
Thinned is old process in the industry, has amplification to glass surface bad order due to being thinned, therefore is needed after being thinned to Q-
Panel is polished to eliminate bad order, and common bad order has concave point, salient point, wheelprint, scuffing etc..
As thinned base plate of liquid crystal panel is more and more thinner when below 0.2t (present thinning requirement≤), in thinning enterprise
In be frequently found to having etched TFT-LCD (Thin Film Transistor-Liquid Crystal Display, film
Transistor liquid crystal display (TFT-LCD)) after panel is processed by shot blasting, the TFT-LCD panels that manufacturer is but polished by customer complaint often are thinned
There is the broken bright spot (Zara Particle) bad.Since the bad problem is that can not test out under the inspection of common fluorescent lamp
, therefore how to improve and control the broken bright spot of liquid crystal display panel after attenuated polishing bad, it also becomes thinned factory and panel is thrown
One of critically important requirement of light quality management and control.
Zara Particle are derived from Japanese, for representing the bad of liquid crystal display panel, often refer to liquid crystal display panel and are drawn in dark-state
The small fine and closely woven bright spot that display area occurs under face.It is many to generate the reason of Zara Particle are bad, with liquid crystal cell
(Panel) structure design, manufacturing process, Display panel pattern etc. have relationship.Here Main Analysis is made of in panel
The broken bright spot as caused by pressure in by polishing process in the process.
Therefore, also there is the part that has much room for improvement in technical solution of the prior art.
It should be noted that information is only used for strengthening the reason to the background of the disclosure disclosed in above-mentioned background technology part
Solution, therefore can include not forming the information to the prior art known to persons of ordinary skill in the art.
Invention content
The disclosure is designed to provide a kind of polissoir and polishing method, so overcome at least to a certain extent by
One or more problem caused by the limitation of the relevant technologies and defect.
Other characteristics and advantages of the disclosure will be by the following detailed description apparent from or partially by this public affairs
The practice opened and acquistion.
According to one aspect of the disclosure, a kind of polissoir is provided, including：Upper disk, wherein the upper disk includes：Polishing
Unit wherein the polishing unit includes height adjustment device, can be used in adjusting the height of the polishing unit；Sportswear
It puts, is used to that the polishing unit to be enabled to do transverse movement and longitudinal movement；Polishing fluid delivery pipe；Solenoid valve, for controlling
Make opening or closing for the polishing fluid delivery pipe；Wherein, each polishing unit is equipped with independent polishing fluid delivery pipe and electricity
Magnet valve.
In a kind of exemplary embodiment of the disclosure, the telecontrol equipment includes：Transverse movement guide rail, the polishing are single
Member can do transverse movement along the transverse movement guide rail；Screw；Motion guide rail pedestal, adjacent motion guide rail pedestal pass through
The screw connection, the transverse movement guide rail can carry out longitudinal movement by the screw.
In a kind of exemplary embodiment of the disclosure, the height adjustment device is polishing unit center axis.
In a kind of exemplary embodiment of the disclosure, the polissoir further includes：Pressure inductor is set to institute
Polishing unit center axis one end is stated, for sensing the polish pressure of polishing unit.
According to another aspect of the disclosure, a kind of polishing method is provided, applied to polissoir, including：It obtains and waits to throw
Information before the polishing of each component units of light part；It is each according to information before the polishing of each component units and polishing rule generation
The burnishing parameters of component units；Control information is sent to the polissoir according to the burnishing parameters, wherein the control letter
It ceases that the polissoir is controlled to carry out each component units independent polishing operation.
In a kind of exemplary embodiment of the disclosure, information includes the dimensional parameters of each component units before the polishing
With visual examination result before polishing.
In a kind of exemplary embodiment of the disclosure, the polissoir includes polishing unit, and each composition is single
The dimensional parameters of member include the first edge lengths A and the second edge lengths B of each component units, wherein the polishing rule is：Root
According to the first edge lengths A and the second edge lengths B of each component units and the first edge lengths a and second of preset polishing unit
Edge lengths b, the laterally minimum amplitude of oscillation l of polishing unit and the minimum amplitude of oscillation h in longitudinal direction, obtain the lateral polishing needed for each component units
Element number and longitudinal direction polishing element number, transverse direction amplitude of oscillation L and longitudinal amplitude of oscillation H；According to it is described laterally polish element number and
The longitudinal direction polishing element number, the polishing unit that polishing unit is combined into each component units combine.
In a kind of exemplary embodiment of the disclosure, the lateral polishing unit number obtained needed for each component units
Amount and longitudinal direction polishing element number, transverse direction amplitude of oscillation L and longitudinal direction amplitude of oscillation H include：Work as x*a<A<(x+1) during * a, L=A-x*a；If
L>L then corresponds to component units laterally using x polishing unit；If L<It is laterally single using x+1 polishing then to correspond to component units by l
Member；And work as y*b<B<(y+1) during * b, H=B-y*b；If H>H then corresponds to component units longitudinally using y polishing unit, if H
<H then corresponds to component units longitudinally using y+1 polishing unit.
In a kind of exemplary embodiment of the disclosure, visual examination result is thrown including each component units before the polishing
Whether there is defect before light, wherein described send control information, wherein institute according to the burnishing parameters to the polissoir
The polishing operation that control information is used to control the polissoir independent to the progress of each component units is stated to include：Adjustment polishing is single
Member is incorporated into the polishing initial position of corresponding component units；When not having defect before component units polishing, phase is controlled
The polishing unit answered is combined without polishing operation；When there is defect before component units polishing, corresponding polishing is controlled
Unit combination is polished operation.
In a kind of exemplary embodiment of the disclosure, visual examination result further includes each component units before the polishing
The defects of before polishing degree, wherein it is described according to the burnishing parameters to the polissoir send control information, wherein described
The polishing operation that control information is used to control the polissoir independent to the progress of each component units further includes：According to described group
The defects of before being polished into unit degree, control the polishing condition of corresponding polishing unit combination.
In polissoir and polishing method in some embodiments of the disclosure, pass through the independence of disk setting on polissoir
Polishing unit be used to implement polished part each component units independent polishing operation, reduce whole polishing rate, so as to
Zara caused by enough greatly reduction polishings.
It should be understood that above general description and following detailed description are only exemplary and explanatory, not
The disclosure can be limited.
Description of the drawings
Attached drawing herein is incorporated into specification and forms the part of this specification, shows the implementation for meeting the disclosure
Example, and for explaining the principle of the disclosure together with specification.It should be evident that the accompanying drawings in the following description is only the disclosure
Some embodiments, for those of ordinary skill in the art, without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 shows a kind of vertical view of disk on polissoir in disclosure exemplary embodiment.
Fig. 2 shows the sectional views of disk on polissoir top a kind of in disclosure exemplary embodiment and polissoir.
Fig. 3 shows schematic diagram during a kind of polissoir work in disclosure exemplary embodiment.
Fig. 4 shows a kind of definition graph for polishing rule in disclosure exemplary embodiment.
Fig. 5 shows movement locus schematic diagram during a kind of polissoir polishing operation in disclosure exemplary embodiment.
Fig. 6 shows a kind of flow chart of polishing method in disclosure exemplary embodiment.
Fig. 7 shows the flow chart of another polishing method in disclosure exemplary embodiment.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to example set forth herein；Described feature, structure or characteristic can be with any suitable
Mode be incorporated in one or more embodiments.In the following description, many details are provided so as to provide to this
Disclosed embodiment is fully understood.It it will be appreciated, however, by one skilled in the art that can be with technical solution of the disclosure
And it omits one or more in the specific detail or other methods, constituent element, device, step etc. may be used.
It should be pointed out that in the accompanying drawings, for the size that may clearly exaggerate layer and region of diagram.It and can be with
Understand, when element or layer be referred to as another element or layer " on " when, it directly in other elements or can may have
Intermediate layer.Additionally, it is appreciated that when element or layer be referred to as another element or layer " under " when, it can be directly at other
Under element or there may be the layer or element of more than one centre.In addition, it is to be appreciated that when layer or element are referred to as
Two layers or two elements " between " when, it can between two layers or two elements unique layer or there may also be one
Above middle layer or element.Similar reference marker indicates similar element in the whole text.
Common polishing machine or polissoir, cardinal principle are to adsorb Q-Panel panels in fixed lower polishing
Upper polishing disk (or being referred to as upper disk) is attached to glass opposite side with certain pressure on disk (either referred to as lower wall), during polishing
Lower polishing disk actively rotates, and polishing disk passive rotation in drive, the polishing fluid containing cerium oxide flows into glass metal from upper disk both sides
Between upper disk, so as to be polished the surface glass contacted with upper polishing disk, the bad order on Single-Panel is eliminated.
Q-Panel in the embodiment of the present invention refers to the big glass of liquid crystal being cut into several small pieces, and every containing several small
Single-Panel (product).It is such to be just called Q-Panel per a piece of.It can be understood as comprising several small LCD screens
One glass, is usually applied to small-size product, such as mobile phone, pad class products.Liquid crystal factory is advantageous in this way, Ke Yirang
The foundries of profession are cut, and are loaded on circuit board backlight, form final products.
Said program the problem is that：Under normal conditions, the Q-Panel before polishing, counts according to Single-Panel
Bad order it is very low, only about 40% needs to polish, but existing polissoir be according to Q-Panel be unit polishing,
Eliminate about 40% Single-Panel bad orders while, remaining about 60% it is also meaningless without bad Single-Panel
Polishing, i.e. Single-Panel polishing rates 100%.
This technical major defect has：On the one hand, it is impossible to individually control whether each Single-Panel polishes,
Single-Panel 100% is polished, and causes polishing Zara fraction defectives high；On the other hand, it is impossible to individually control each Single-
The polishing condition of Panel and time, polishing time is long, and polishing cost is high, because the polishing time of Q-Panel depends on required throwing
The polishing time of longest Single Panel between light time.Meanwhile Q-Panel is integrally polished, polishing area is big, polishing cost
It is high.
Therefore, disclosure embodiment proposes a kind of polissoir, which can include：Upper disk, wherein institute
Disk is stated to include：Unit is polished, wherein the polishing unit includes height adjustment device, can be used in adjusting the polishing unit
Height；Telecontrol equipment is used to that the polishing unit to be enabled to do transverse movement and longitudinal movement；Polishing fluid delivery pipe；
Solenoid valve, for controlling opening or closing for the polishing fluid delivery pipe；Wherein, each polishing unit is equipped with independent polishing
Liquid delivery pipe and solenoid valve.
In the exemplary embodiment, the telecontrol equipment can include：Transverse movement guide rail, the polishing unit being capable of edge
It the transverse movement guide rail and does transverse movement；Screw；Motion guide rail pedestal, adjacent motion guide rail pedestal pass through the screw
Connection, the transverse movement guide rail can carry out longitudinal movement by the screw.
It should be noted that can arbitrarily realize the telecontrol equipment of the polishing unit transverse movement and longitudinal movement is
Can with, the disclosure is not limited to the concrete structure and composition for the telecontrol equipment that above-described embodiment enumerates.
In the exemplary embodiment, the height adjustment device can be polishing unit center axis.
It should be understood that the height adjustment device that can arbitrarily realize the polishing cell height regulatory function is can
To be applied to the scheme of the disclosure, it's not limited to that for the disclosure.
In the exemplary embodiment, the polissoir can also include：It is single to be set to the polishing for pressure inductor
First central shaft one end, for sensing the polish pressure of polishing unit.
It should be noted that, although illustrated by taking the polishing of liquid crystal display panel as an example in the following examples, but
The polissoir of the actually disclosure can be applied to the arbitrary workpiece for needing to polish, as long as it is multiple that the workpiece polished is needed to include
Component units not just can be applied to liquid crystal display panel.
The polissoir that embodiment of the present invention provides can be applied to liquid crystal panel surface polishing, can solve at present
General polishing mode is that whole polishing is carried out to Q-Panel in the industry, there is the meaningless polishing without undesirable Single-Panel
Problem, and to be also easy to produce polishing Zara etc. bad for whole polishing.
Through analysis, the main reason for generation for polishing Zara is the opposing compression due in polishing process, polishing upper lower burrs
Mutually squeezing and deforming between the layer glass up and down of friction drive Q-Panel, color film (Color after display screen pairing
Filter, referred to as CF) PS (Photo Spacer, support drum spacer material) on substrate stood in the thin of tft array substrate
On film transistor, PS and alignment film is made to rub back and forth under the action of extruding and deformation, so as to generate alignment film clast, clast
Into display AA areas, it is bad to form Zara, in liquid crystal display galvanization, shows that broken bright spot is bad.Therefore, polishing is reduced
The undesirable keys of Zara are without polishing or reducing the conditions such as polishing time, optimization polish pressure.
Embodiment of the present invention is described in detail below in conjunction with the accompanying drawings.
Fig. 1 shows a kind of vertical view of disk on polissoir in disclosure exemplary embodiment.
As shown in Figure 1, wherein, having several independent polishing units 1, each polishing unit 1 can be carried out at the same time past
Multiple and oscillating motion, such as the polishing path of S types can be formed；The transverse movement guide rail 2 of unit 1 is polished, it is each to polish unit 1
The free movement of transverse direction, i.e. X-Axis directions can be done along transverse movement guide rail 2, and each polishing unit can pass through Fig. 2
Shown polishing unit center axis 10 carries out height adjusting；The motion guide rail pedestal 3 of unit 1 is polished, wherein adjacent movement is led
Flange of rail seat 3 is attached by telescopic screw 4, i.e., the transverse movement guide rail 2 in X-Axis directions can carry out Y- by screw 4
The free movement in Axis directions.
Fig. 2 shows the sectional views of disk on polissoir top a kind of in disclosure exemplary embodiment and polissoir.
As shown in Fig. 2, including：Mechanism center shaft 5 on polissoir, polishing fluid delivery pipe (or referred to as polishing fluid is led
Pipe) 7, it can be used for controlling disk basal disc 8 on the solenoid valve 6 being opened or closed and polissoir of polishing fluid delivery pipe.Its
In, polishing unit 1 can be along polishing unit center axis small distance movement about 10, when control, which polishes unit 1, to be moved upwards, the throwing
Light unit 1 is not contacted with corresponding Single-Panel, then the corresponding Single-Panel is not polished；When control polishes unit
1 when moving downward, which contacts with corresponding Single-Panel, then the corresponding Single-Panel is carried out
Polishing.
Further, it is also possible to and pass through and polish the pressure inductor 9 of 10 upper end of unit center axis and realize each Single-
The polish pressure control of Panel, polished unit 1 are single by transverse movement guide rail 2, the screw 4 of transverse movement guide rail 2, polishing
After first central shaft 10 is adjusted, entire polissoir upper mechanism then can be in (the disk drive on such as of external dynamical system
Dynamic system) under do the amplitude of oscillation movement of certain frequency.
In the embodiment of the present invention, each unit 1 that polishes is equipped with a polishing fluid delivery pipe 7 and solenoid valve 6, so as to
Pair polishing unit contacted with Single-Panel supply polishing fluid, the polishing unit not contact with Single-Panel stop confession
To polishing fluid, so as to fulfill the individually controllable polishing to Single-Panel.
It should be noted that, although above-mentioned be not shown in figure, but above-mentioned polissoir can also include：Rack, lower wall, on
Disc driving system, lower disc driving system, recovery system and pumped vacuum systems (using conventional pumped vacuum systems) etc. are conventional
Structure specifically can refer to the prior art, and this will not be detailed here.
Wherein, the upper disc driving system of entire polissoir has further included the conventional components such as lift cylinder, transmission mechanism, and under
Disc driving system then includes components, upper disc driving system and the lower disc driving systems such as corresponding motor, transmission mechanism and is mounted on
In rack, and it can be controlled by operation panel.
Vertical view and polishing rule declaration figure when Fig. 3 and Fig. 4 is polishing machine work respectively.Wherein, 11 be polished Q-
Panel, each Q-Panel are made of several Single-Panel.
As shown in figure 3, computer is each by polishing regular (particular content see below) clearly polished Q-Panel
After the quantity of polishing unit needed for Single-Panel, work (operation is polished to corresponding Single-Panel) is needed
Polishing unit 1 by polishing the adjustment height of unit center axis 10, then pass through transverse movement guide rail 2 and the adjustment polishing of screw 4 is single
The position of member makes the position that each polishing unit combines opposite Single-Panel identical, all polishes unit combination in phase
The upper left corner of Single-Panel is answered, which is the initial position polished.
Fig. 5 shows movement locus schematic diagram during a kind of polissoir polishing operation in disclosure exemplary embodiment.
As shown in figure 5, figure acceptance of the bid shows polishing of the polishing unit from Single-Panel initial position to terminal position
Movement locus, after reaching end, then negative direction is polished to initial position with similar track, so does reciprocal polishing action.
Following for narration polishing rule is facilitated, do defined below：
Definition：The long edge lengths of polished Single-Panel are A, bond length B, and the long edge lengths for polishing unit are
A, bond length are b (as shown in Figure 4), and practical transverse direction (X-Axis directions) amplitude of oscillation is L, practical longitudinal direction (Y- during polishing
Axis directions) amplitude of oscillation be H, polishing unit transverse and longitudinal direction the minimum amplitude of oscillation be l and h.Lateral amplitude of oscillation L practical in this way by A, a,
L is codetermined, and H is determined by B, b, h.
Wherein, laterally polishing rule can be：Work as x*a<A<(x+1) during * a, L=A-x*a.
If L>L then corresponds to single Single-Panel laterally using x polishing unit；If L<L is then corresponded to single
Single-Panel is laterally using x+1 polishing unit.
Wherein, polishing rule in longitudinal direction can be：Work as y*b<B<(y+1) during * b, H=B-y*b.
If H>H, then for single Single-Panel longitudinally using y polishing unit；If H<H, then for single
Single-Panel is longitudinally using y+1 polishing unit.
In conclusion in the case of meeting horizontal and vertical polishing rule at the same time, the polishing of Single-Panel needs
Product of the quantity of unit for the two.
In the embodiment of the present invention, above-mentioned A, B can be input parameters, and a, b and l, h can be preset ginsengs in systems
Number calculates L, H and the number for laterally polishing unit, longitudinal direction polishing unit automatically according to this six known parameters systems.
It should be noted that above-mentioned polishing rule is only for for example, specifically can according to circumstances be configured
And adjustment, it's not limited to that for the disclosure.
The polissoir that embodiment of the present invention provides, can be by setting fixed lower wall and including several
The upper disk composition of a swing polishing units of independent reciprocal ＆, can realize the throwing to Single-Panel each on Q-Panel
Striation part controls, and decides whether to be polished according to the bad order inspection result of each Panel, polish pressure size, throw
Length etc. between light time.Such as without bad order Single-Panel without polishing, there is wheelprint, salient point etc. easily to polish bad
Reduction polish pressure or the time；There is the bad increase polishing time of the more difficult polishing such as concave point, scuffing or improve polish pressure, from
And realize the optimal polishing conditions of each Single-Panel, the polishing rate of Single-Panel is greatly reduced, to greatest extent
The generation of polishing Zara is reduced, while reduces polishing cost.
It should be noted that lower wall is fixed in the embodiment of the present invention, and realized by vacuum suction to liquid crystal display panel
Fixation, since liquid crystal display panel requires the bright and clean degree in CF faces high, usually only do the single-sided polishing in CF faces.But the disclosure is not
This is defined in, in different application scenarios, appropriate modification can be carried out according to the different requirements of polished part.
Fig. 6 shows a kind of flow chart of polishing method in disclosure exemplary embodiment.
As shown in fig. 6, the polishing method can be applied to the polissoir in above-described embodiment, this method can include with
Lower step.
In step s 110, information before the polishing of each component units of polished part is obtained.
In the exemplary embodiment, before information can include dimensional parameters and the polishing of each component units before the polishing
Visual examination result.
In the exemplary embodiment, the polissoir can include polishing unit, the size of each component units
Parameter can include the first edge lengths A and the second edge lengths B of each component units.
In the step s 120, each component units are generated according to information before the polishing of each component units and polishing rule
Burnishing parameters.
In the exemplary embodiment, the polishing rule can be：According to the first edge lengths A of each component units and
The laterally minimum amplitude of oscillation l of the first edge lengths a and the second edge lengths b of two edge lengths B and preset polishing unit, polishing unit
With the minimum amplitude of oscillation h in longitudinal direction, lateral polishing element number and longitudinal direction polishing element number, horizontal stroke needed for each component units are obtained
To amplitude of oscillation L and longitudinal amplitude of oscillation H；Element number and the longitudinal direction polishing element number are laterally polished according to described, unit will be polished
It is combined into the polishing unit combination of each component units.
In the exemplary embodiment, the lateral polishing element number obtained needed for each component units and longitudinal direction are thrown
Light unit quantity, transverse direction amplitude of oscillation L and longitudinal direction amplitude of oscillation H can include：Work as x*a<A<(x+1) during a, L=A-x*a；If L>L is then right
Answer component units laterally using x polishing unit；If L<L then corresponds to component units laterally using x+1 polishing unit；And
Work as y*b<B<(y+1) during b, H=B-y*b；If H>H then corresponds to component units longitudinally using y polishing unit, if H<H is then right
Answer component units longitudinally using y+1 polishing unit.
In step s 130, control information is sent to the polissoir according to the burnishing parameters, wherein the control
Information is used to that the polissoir to be controlled to carry out each component units independent polishing operation.
In the exemplary embodiment, visual examination result can be including being before the polishing of each component units before the polishing
It is no that there is defect.
In the exemplary embodiment, it is described to send control information to the polissoir according to the burnishing parameters, wherein
The polishing operation that the control information is used to control the polissoir independent to the progress of each component units includes：Adjustment polishing
Unit is incorporated into the polishing initial position of corresponding component units；When not having defect before component units polishing, control
Corresponding polishing unit combination is without polishing operation；When there is defect before component units polishing, corresponding throw is controlled
Light unit combination is polished operation.
In the exemplary embodiment, before visual examination result can also include the polishing of each component units before the polishing
Defect level.
In the exemplary embodiment, it is described to send control information to the polissoir according to the burnishing parameters, wherein
The polishing operation that the control information is used to control the polissoir independent to the progress of each component units can also include：Root
The defects of before being polished according to the component units degree, control the polishing condition of corresponding polishing unit combination.
The polissoir and polishing method that embodiment of the present invention provides, can be by designing independent reciprocating polishing list
Member can be realized and the independence of Single-Panel each on Q-Panel is polished.According to visual examination knot after product is thinned
Fruit, only the Single-Panel for having bad order is polished, no bad order without polishing, bad order degree is not
Same selection different polish pressure and/or polishing time compared with traditional Q-Panel is integrally polished, are improving Single-
While Panel polishes success rate, Zara etc. is bad caused by greatly reducing polishing cost and polishing.
Fig. 7 shows the flow chart of another polishing method in disclosure exemplary embodiment.
As shown in fig. 7, the polishing method may comprise steps of.
In step s 201, optics AOI detections are carried out to polished Q-Panel, obtains and form the polished Q-
Whether the size of each Single-Panel of Panel has bad order and as a certain or certain Single-Panel
During with bad order, bad order position, bad order degree etc..
Wherein, the full name of AOI (Automatic Optic Inspection) is automatic optics inspection, is former based on optics
The equipment for managing to be detected the common deficiency encountered in production.AOI is a kind of measuring technology, but is quickly grown, Hen Duochang
Family is all proposed AOI test equipments.Upon automatic detection, machine is adopted by the camera automatically scanning polished Q-Panel
Collect image, each Single-Panel of test is compared with the qualified parameter in database, by image procossing, is checked
Go out defect on each Single-Panel, and pass through display or Automatic Logos and defect is shown/marked.
It should be noted that the size of each Single-Panel of the polished Q-Panel is obtained by AOI, is
It is no to there is bad order and when a certain or certain Single-Panel have bad order, it is bad order position, outer
The mode for seeing the information such as undesirable level is not limited in enumerated AOI modes, other may be used in the embodiment of the present disclosure
Meaning mode obtains information above.
In step S202, each Single-Panel for the polished Q-Panel that above-mentioned steps S201 is obtained is uploaded
Size, whether there are bad order and when with bad order, the information such as bad order position, undesirable level.
In step S203, according to polishing rule, polishing unit combination and the upper disk amplitude of oscillation are calculated.
In the embodiment of the present invention, calculate polishing unit combination and refer to the size according to polishing unit, Single
Lateral polishing unit number, the longitudinal direction polishing unit number for each polishing unit combination that the size of Panel is calculated, specifically may be used
With referring to the explanation in relation to polishing rule in the embodiment of above-mentioned polissoir.
In the embodiment of the present invention, the upper disk amplitude of oscillation can be the practical polishing calculated according to above-mentioned polishing rule
The lateral amplitude of oscillation L and longitudinal amplitude of oscillation H actually polished.
In step S204, the polishing unit combination of polissoir adjust automatically.
In the embodiment of the present invention, the polissoir adjust automatically polishing unit combination refers to according to above-mentioned polishing rule meter
Calculation result combines the polishing unit number needed for each Single-Panel and corresponding polishing unit is combined into polishing list
Member combines, and corresponding polishing unit is combined to the initial position for the polishing for being adjusted to each Single-Panel.
In step S205, polishing unit center axis, which declines, starts polishing operation.
Whether this refers to have bad order according to each Single-Panel of upload, determine do not have appearance not
The corresponding polishing unit combinations of good Single-Panel do not need to be polished operation, and corresponding polishing unit center axis is not
It needs to decline；And the corresponding Single-Panel with bad order polishes unit combination and needs to be polished operation accordingly,
Its corresponding polishing unit center axis control, which declines, starts polishing operation.
Further, the embodiment of the present invention can also be according to the different appearances of the Single-Panel with bad order
Undesirable level determines the difference of the decline degree for polishing unit center axis in corresponding polishing unit combination, for example, there is wheel
The corresponding polishing unit center axis of control of the bad orders such as print, salient point drops to the first height, and can pass through pressure sensitive
Device senses the first polish pressure of first height, has in the corresponding polishing unit of control of the bad orders such as concave point, scuffing
Mandrel drops to the second height, wherein, first height is more than the described second height, and can pass through the pressure inductor
The second polish pressure of second height is sensed, wherein second polish pressure is more than first polish pressure, you can
With to there is the Single-Panel of the bad order of more difficult polishing to increase polish pressure；Alternatively, there are the bad orders such as wheelprint, salient point
With the identical height of corresponding polishing unit center axis declines of control for having the bad orders such as concave point, scuffing, but controlling has wheel
The corresponding polishing unit center axis of control of the bad orders such as print, salient point declines at the first time, and controlling has outside concave point, scuffing etc.
It sees the corresponding polishing unit center axis of undesirable control and declined for the second time, wherein, when second time is more than described first
Between, i.e., it can also be to there is the Single-Panel of the bad order of more difficult polishing to increase polishing time；Alternatively, throwing can also be passed through
Light pressure and the control simultaneously of the aspect of polishing time two are easier to or the Single-Panel of the bad order of more difficult polishing to having
Carry out the setting of different polishing conditions.
In step S206, polishing terminates.
With continued reference to embodiment shown in Fig. 7, the method can also include：In step S207, after above-mentioned polishing
Single-Panel carry out AOI reinspections.
In step S208, above-mentioned AOI reinspection results are followed up to judge whether the Single-Panel after above-mentioned polishing accords with
Close appearance regulation；If do not met, jump back to step S203 and re-start polishing；If met, into next step
S209。
In step S209, polishing operation terminates.
Embodiment of the present invention provides a kind of novel Q-Panel polissoirs, can be to each on Q-Panel
Single-Panel is carried out at the same time the polishing operation of different parameters, including not polished to the Single-Panel for not needing to polishing,
So as to effectively reduce Single-Panel polishing rates about 60%, it is bad to substantially reduce polishing Zara.Meanwhile because only to about 40%
Single-Panel be polished, therefore more than 60% is substantially reduced with the Single-Panel polishing times calculated, so as to real
The reduction of power is now polished, saves electric energy.In addition, the polishing condition of each Single-Panel is according to visual examination before polishing
As a result burnishing parameters can be automatically generated.Meanwhile the small distance movement function up and down of unit, Ke Yitong can be polished by setting
To the polishing of Single-Panel or not polished, the pressure sensor on cooperation polishing unit top can be adjusted each Shi Shixian
The polish pressure of Single-Panel, so as to fulfill the different polish pressures of different Single-Panel on same Q-Panel
Control.
Those skilled in the art will readily occur to the disclosure its after considering specification and putting into practice invention disclosed herein
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principle of the disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.Description and embodiments are considered only as illustratively, and the true scope and spirit of the disclosure are by appended
Claim is pointed out.
Claims (10)
1. a kind of polissoir, which is characterized in that including：
Upper disk, wherein the upper disk includes：
Unit is polished, wherein the polishing unit includes height adjustment device, can be used in adjusting the height of the polishing unit；
Telecontrol equipment is used to that the polishing unit to be enabled to do transverse movement and longitudinal movement；
Polishing fluid delivery pipe；
Solenoid valve, for controlling opening or closing for the polishing fluid delivery pipe；
Wherein, each polishing unit is equipped with independent polishing fluid delivery pipe and solenoid valve.
2. polissoir according to claim 1, which is characterized in that the telecontrol equipment includes：
Transverse movement guide rail, the polishing unit can do transverse movement along the transverse movement guide rail；
Screw；
Motion guide rail pedestal, adjacent motion guide rail pedestal are connected by the screw, and the transverse movement guide rail can pass through
The screw carries out longitudinal movement.
3. polissoir according to claim 1 or 2, which is characterized in that the height adjustment device is in polishing unit
Mandrel.
4. polissoir according to claim 3, which is characterized in that further include：
Pressure inductor is set to described polishing unit center axis one end, for sensing the polish pressure of polishing unit.
5. a kind of polishing method, applied to polissoir, which is characterized in that including：
Obtain information before the polishing of each component units of polished part；
The burnishing parameters of each component units are generated according to information before the polishing of each component units and polishing rule；
Control information is sent to the polissoir according to the burnishing parameters, wherein the control information is used to control the throwing
Light device carries out each component units independent polishing operation.
6. polishing method according to claim 5, which is characterized in that information includes each component units before the polishing
Visual examination result before dimensional parameters and polishing.
7. polishing method according to claim 6, which is characterized in that the polissoir includes polishing unit, described each
The dimensional parameters of a component units include the first edge lengths A and the second edge lengths B of each component units, wherein the polishing rule
It is then：
According to the first edge lengths A of each component units and the second edge lengths B and the first edge lengths a of preset polishing unit
With the second edge lengths b, the laterally minimum amplitude of oscillation l of polishing unit and the minimum amplitude of oscillation h in longitudinal direction, the horizontal stroke needed for each component units is obtained
To polishing element number and longitudinal direction polishing element number, transverse direction amplitude of oscillation L and longitudinal amplitude of oscillation H；
Element number and the longitudinal direction polishing element number are laterally polished according to described, it is single that polishing unit is combined into each composition
The polishing unit combination of member.
8. polishing method according to claim 7, which is characterized in that the lateral throwing obtained needed for each component units
Light unit quantity and longitudinal direction polishing element number, transverse direction amplitude of oscillation L and longitudinal direction amplitude of oscillation H include：
Work as x*a<A<(x+1) during * a, L=A-x*a；
If L>L then corresponds to component units laterally using x polishing unit；If L<L then corresponds to component units laterally using x+1
Polish unit；And
Work as y*b<B<(y+1) during * b, H=B-y*b；
If H>H then corresponds to component units longitudinally using y polishing unit, if H<H then corresponds to component units longitudinally using y+1
Polish unit.
9. polishing method according to claim 8, which is characterized in that visual examination result includes each group before the polishing
Whether there is defect before being polished into unit, wherein described send control letter according to the burnishing parameters to the polissoir
Breath, wherein the polishing operation that the control information is used to control the polissoir independent to the progress of each component units includes：
Adjustment polishing unit is incorporated into the polishing initial position of corresponding component units；
When not having defect before component units polishing, corresponding polishing unit combination is controlled without polishing operation；
When there is defect before component units polishing, corresponding polishing unit combination is controlled to be polished operation.
10. polishing method according to claim 9, which is characterized in that visual examination result further includes respectively before the polishing
The defects of before the polishing of a component units degree, wherein described send control letter according to the burnishing parameters to the polissoir
Breath, wherein the polishing operation that the control information is used to control the polissoir independent to the progress of each component units also wraps
It includes：
The defects of before being polished according to the component units degree, control the polishing condition of corresponding polishing unit combination.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810004291.XA CN108145586B (en) | 2018-01-03 | 2018-01-03 | Polissoir and polishing method |
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|---|---|---|---|
| CN201810004291.XA CN108145586B (en) | 2018-01-03 | 2018-01-03 | Polissoir and polishing method |
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| CN108145586B (en) | 2019-10-11 |
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