CN108134887A - Imaging sensor - Google Patents
Imaging sensor Download PDFInfo
- Publication number
- CN108134887A CN108134887A CN201711116705.XA CN201711116705A CN108134887A CN 108134887 A CN108134887 A CN 108134887A CN 201711116705 A CN201711116705 A CN 201711116705A CN 108134887 A CN108134887 A CN 108134887A
- Authority
- CN
- China
- Prior art keywords
- cover board
- metal cover
- imaging sensor
- framework
- connection area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 57
- 229910052751 metal Inorganic materials 0.000 claims abstract description 73
- 239000002184 metal Substances 0.000 claims abstract description 73
- 238000001514 detection method Methods 0.000 claims abstract description 13
- 238000009434 installation Methods 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims description 13
- 238000005452 bending Methods 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- 230000002421 anti-septic effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
- H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Facsimile Heads (AREA)
Abstract
The present invention provides a kind of imaging sensor, for reading the magnetic information on original copy, including：Framework, framework have installation cavity and detection opening, and detection opening is connected with installation cavity；Metal cover board, metal cover board lid are located at test openings, metal cover board ground connection setting, to eliminate the charge for contacting and generating with metal cover board when original copy passes through the upper surface of metal cover board.The present invention solves imaging sensor of the prior art at work, metal cover board surface generate electrostatic the electronic component in imaging sensor is interfered, and cause imaging sensor generate data processed result and pattern collection result accuracy it is poor the problem of.
Description
Technical field
The present invention relates to image sensing technical field, in particular to a kind of imaging sensor.
Background technology
For the anti-fake of the original copys such as bank note, bill or marketable securities, mainly using on imaging sensor detection original copy
The mode of magnetic information is realized, i.e., by imaging sensor caused by the extraneous factors such as magnetic field, electric current, ess-strain, temperature, light
The magnetic property of sensing element is converted into electric signal, and come on matching detection original copy by way of being analyzed and processed to electric signal
Corresponding magnetic information, so as to fulfill the authenticity to original copy.
Existing imaging sensor is at work, former when upper surface of the original copy by the metal cover board of imaging sensor
The friction of original text and metal cover board can generate electrostatic, the electromagnetism that such electrostatic generates can to the electronic component in imaging sensor into
Row interference, so as to cause the accuracy of the data processed result of imaging sensor generation and pattern collection result poor, and then
Affect the job stability of imaging sensor.
Invention content
It is a primary object of the present invention to provide a kind of imaging sensor, existed with solving imaging sensor of the prior art
During work, the electrostatic that metal cover board surface generates interferes the electronic component in imaging sensor, and image is caused to pass
The problem of data processed result of sensor generation and the poor accuracy of pattern collection result.
To achieve these goals, the present invention provides a kind of imaging sensor, for reading the magnetic information on original copy,
Including：Framework, framework have installation cavity and detection opening, and detection opening is connected with installation cavity；Metal cover board, metal cover board lid are set
In test openings, metal cover board ground connection setting is contacted with eliminating when original copy passes through the upper surface of metal cover board with metal cover board
And the charge generated.
Further, metal cover board is made of non-magnetic stainless steel.
Further, imaging sensor further includes first circuit board, and first circuit board has an earthed circuit, metal cover board with
Earthed circuit is electrically connected.
Further, first circuit board has conductive connection area, and conductive connection area is located on earthed circuit, metal cover
Plate includes cover board body and pin configuration, and the first end of pin configuration is connect with cover board body, and the second end of pin configuration passes through
Fastener is connected at conductive connection area.
Further, first circuit board has conductive connection area, and conductive connection area is located on earthed circuit, metal cover
Plate includes cover board body and pin configuration, and the first end of pin configuration is connect with cover board body, the second end welding of pin configuration
At conductive connection area.
Further, first circuit board is located at framework bottom end, and conductive connection area is connected to after pin configuration bending.
Further, imaging sensor further includes conductor structure, and the first end of conductor structure is electrically connected with metal cover board, leads
The second end of cable architecture is electrically connected with earthed circuit.
Further, imaging sensor further includes magnetic image reading part and conductive structure, wherein, the setting of magnetic image reading part
In installation cavity, magnetic image reading part includes second circuit board, and second circuit board has earthed circuit and conductive connection area, leads
Electric coupling area is located on earthed circuit, between conductive structure connection metal cover board and conductive connection area.
Further, framework is made of an electrically conducting material, and metal cover board contacts setting with framework, to be grounded setting.
Further, framework is made of aluminum.
It applies the technical scheme of the present invention, by the way that the metal cover board of imaging sensor is grounded setting, so as to be passed when image
During sense device working, original copy with metal cover board can be contacted to the charge that electrostatic occurs and generates and be oriented to the earth rapidly, it is therefore prevented that electricity
Lotus gathers on the surface of metal cover board and stops, and the magnetic field for avoiding charge formation is normal to the electronic component in imaging sensor
Work interferes, and ensures that the data processed result of imaging sensor generation and the accuracy of pattern collection result,
And then improve the job stability of imaging sensor.
Description of the drawings
The accompanying drawings which form a part of this application are used to provide further understanding of the present invention, and of the invention shows
Meaning property embodiment and its explanation do not constitute improper limitations of the present invention for explaining the present invention.In the accompanying drawings：
Fig. 1 shows a kind of internal structure schematic diagram of the imaging sensor of alternative embodiment according to the present invention；
Fig. 2 shows the schematic diagrames of the earthing mode of the metal cover board of the embodiment one of the imaging sensor in Fig. 1；
Fig. 3 shows the schematic diagram of the earthing mode of the metal cover board of the embodiment two of the imaging sensor in Fig. 1；
Fig. 4 shows the schematic diagram of the earthing mode of the metal cover board of the embodiment three of the imaging sensor in Fig. 1；
Fig. 5 shows the schematic diagram of the earthing mode of the metal cover board of the example IV of the imaging sensor in Fig. 1.
Wherein, above-mentioned attached drawing is marked including the following drawings：
10th, framework；11st, installation cavity；12nd, detection opening；20th, metal cover board；21st, cover board body；22nd, pin configuration；
30th, first circuit board；40th, fastener；50th, conductor structure；60th, magnetic image reading part；61st, second circuit board；70th, conductive knot
Structure.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.Below
Description only actually at least one exemplary embodiment is illustrative, is never used as to the present invention and its application or makes
Any restrictions.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Lower all other embodiments obtained, shall fall within the protection scope of the present invention.
In order to solve imaging sensor of the prior art at work, the electrostatic that metal cover board surface generates passes image
Electronic component in sensor interferes, and causes the data processed result and pattern collection result of imaging sensor generation
Accuracy it is poor the problem of, the present invention provides a kind of imaging sensors.
In the alternative embodiment shown in the application Fig. 1 to Fig. 5, for reading the image sensing of the magnetic information on original copy
Device includes framework 10 and metal cover board 20, and framework 10 has installation cavity 11 and detection opening 12, detection opening 12 and installation cavity 11
Connection, the lid of metal cover board 20 are located at detection opening 12, the ground connection setting of metal cover board 20, to eliminate original copy by metal cover board
The charge for contacting and generating with metal cover board 20 during 20 upper surface.
It, can will be former so as to when imaging sensor works by the way that the metal cover board 20 of imaging sensor is grounded setting
Original text contacts the charge that electrostatic occurs and generates with metal cover board 20 and is oriented to the earth rapidly, it is therefore prevented that charge is in the table of metal cover board 20
Area gathers stop, and the magnetic field for avoiding charge formation interferes the electronic component normal work in imaging sensor, from
And ensure the data processed result of imaging sensor generation and the accuracy of pattern collection result, and then improve image biography
The job stability of sensor.
Optionally, metal cover board 20 is made of non-magnetic stainless steel.Using metal cover board made of stainless steel 20 not only
The conduction to charge can be played, and is obviously improved the wear-resisting property of metal cover board 20 and antiseptic property, is avoided
Metal cover board 20 is worn with original copy Long Term Contact, improves the aesthetic appearance of imaging sensor, but also can play
Play the role of reliably protecting to the component in installation cavity 11.
Embodiment one
As shown in Fig. 2, imaging sensor further includes first circuit board 30, first circuit board 30 has earthed circuit, metal
Cover board 20 is electrically connected with earthed circuit.In this way, in the charge transfer to first circuit board 30 that electrostatic generates at metal cover board 20
Afterwards, it is conducted outward by earthed circuit.
Specifically, as shown in Fig. 2, first circuit board 30 has conductive connection area, conductive connection area is located at ground connection electricity
On the road, metal cover board 20 includes cover board body 21 and pin configuration 22, and the first end of pin configuration 22 is connect with cover board body 21,
The second end of pin configuration 22 is connected to by fastener 40 at conductive connection area.In this way, pin configuration 22 and cover board body
21 are structure as a whole, convenient for being fabricated to metal cover board 20, by planning the bending path of pin configuration 22, so as to make gold
Belong to the charge at cover board 20 successfully to conduct outward to the conductive connection area of first circuit board 30, eventually pass through earthed circuit
It is oriented to the earth.It should be noted that first circuit board 30 is printed circuit board, conductive connection area is naked leakage on printed circuit board
Copper sheet.In addition, fastener 40 with first circuit board 30 is detachably connected is led so that the second end of pin configuration 22 is pressed on
At electric coupling area.Optionally, fastener 40 is fastening bolt component.It should also be noted that, first circuit board 30 is located at frame
10 bottom end of body is connected to conductive connection area after 22 bending of pin configuration.
Embodiment two
As shown in figure 3, the embodiment and embodiment one difference lies in, first circuit board 30 has conductive connection area,
Conductive connection area is located on earthed circuit, and metal cover board 20 includes cover board body 21 and pin configuration 22, pin configuration 22
First end is connect with cover board body 21, and the second end of pin configuration 22 is welded at conductive connection area.The of pin configuration 22
Two ends are welded at conductive connection area, while ensure that metal cover board 20 is electrically connected with first circuit board 30, further
Increase the stability that pin configuration 22 is connect with first circuit board 30, it is ensured that pin configuration 22 will not with first circuit board
30 junction is got loose, but also can simplify the assembling work process of imaging sensor, reduces adding for imaging sensor
Work manufactures cost, is conducive to improve the market competitiveness of imaging sensor.
Embodiment three
As shown in figure 4, the embodiment is with embodiment one, difference lies in imaging sensor further includes conductor structure 50, leads
The first end of cable architecture 50 is electrically connected with metal cover board 20, and the second end of conductor structure 50 is electrically connected with earthed circuit.It is in this way, sharp
The characteristics of with conductor structure 50 for flexible circuitry, convenient for planning the wiring path of conductor structure 50, and convenient for selection conducting wire knot
The both ends of structure 50 and the position of metal cover board 20 and the connection end point of first circuit board 30, simplify metal cover board 20 and first
The connection difficulty of circuit board 30.
Example IV
As shown in figure 5, the embodiment is with embodiment one, difference lies in imaging sensor further includes magnetic image reading part 60
With conductive structure 70, wherein, magnetic image reading part 60 is arranged in installation cavity 11, magnetic image reading part 60 include second circuit board
61, second circuit board 61 has earthed circuit and conductive connection area, and conductive connection area is located on earthed circuit, conductive structure
Between 70 connection metal cover boards 20 and conductive connection area.In this way, by leading between the charge that electrostatic generates at metal cover board 20
Electric structure 70 is transferred to the earthed circuit of second circuit board 61 and is directed to the earth, significantly shortens the motion path of charge,
Ensure that the charge at metal cover board 20 can steadily be conducted outward.Optionally, conductive structure 70 is metal annular in shape
Plate had both increased the contact area of conductive structure 70 and metal cover board 20 in this way, was conducive to the movement of charge, and conductive structure
70 also are able to play the supporting role to metal cover board 20, conducive to the overall structure stability of imaging sensor is improved.
You need to add is that in order to ensure the functional completeness of imaging sensor, magnetic image reading part 60 further includes permanent magnetism
Body, magnetic chip and control chip, wherein, permanent magnet is located at the lower section of second circuit board 61, magnetic chip and controls chip with the
Two circuit boards 61 connect, and protrude setting towards the side of metal cover board 20.In this way, permanent magnet is for one constant magnetic of generation
, magnetic chip is located in magnetic field, and when the original copy with magnetic information passes through the upper surface of metal cover board 20, magnetic chip detects original
During the magnetic information of original text, the magnetic moment direction in magnetic chip is changed by the change of external magnetic field, and resistance value changes, and leads to
Signal will be converted into containing the magnetic information on original copy by crossing carrying second circuit board 61, and control chip is used to control simultaneously signal
Signal is amplified.
In the application in another alternative embodiment (not shown), framework 10 is made of an electrically conducting material, metal cover board 20 with
The contact setting of framework 10, to be grounded setting.In this way, the charge that electrostatic generates at metal cover board 20 can be directly delivered to
Diffusion occurs in the larger framework 10 of volume or conducts to the earth.
Optionally, framework 10 is made of aluminum, and certainly, in order to reduce the overall weight of imaging sensor, framework 10 can be with
It is made of conductive plastics.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative
It is also intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, operation, device, component and/or combination thereof.
Unless specifically stated otherwise, the component and positioned opposite, the digital table of step otherwise illustrated in these embodiments
It is not limited the scope of the invention up to formula and numerical value.Simultaneously, it should be appreciated that for ease of description, each portion shown in attached drawing
The size divided not is to be drawn according to practical proportionate relationship.For technology, side known to person of ordinary skill in the relevant
Method and equipment may be not discussed in detail, but in the appropriate case, and the technology, method and apparatus should be considered as authorizing explanation
A part for book.In shown here and discussion all examples, any occurrence should be construed as merely illustrative, and
Not by way of limitation.Therefore, the other examples of exemplary embodiment can have different values.It should be noted that：Similar label
Similar terms are represented in following attached drawing with letter, therefore, once it is defined in a certain Xiang Yi attached drawing, then subsequent attached
It does not need to that it is further discussed in figure.
In the description of the present invention, it is to be understood that the noun of locality such as " forward and backward, upper and lower, left and right ", " laterally, vertical,
Vertically, orientation or position relationship indicated by level " and " top, bottom " etc. are normally based on orientation or position shown in the drawings and close
System is for only for ease of the description present invention and simplifies description, and in the case where not making to illustrate on the contrary, these nouns of locality do not indicate that
There must be specific orientation with the device or element for implying meaning or with specific azimuth configuration and operation, therefore cannot manage
It solves as limiting the scope of the invention；The noun of locality " inside and outside " refers to relative to inside and outside each component profile in itself.
For ease of description, spatially relative term can be used herein, as " ... on ", " ... top ",
" ... upper surface ", " above " etc., for describing such as a device shown in the figure or feature and other devices or spy
The spatial relation of sign.It should be understood that spatially relative term is intended to comprising the orientation in addition to device described in figure
Except different direction in use or operation.For example, if the device in attached drawing is squeezed, it is described as " in other devices
It will be positioned as " under other devices or construction after the device of part or construction top " or " on other devices or construction "
Side " or " under other devices or construction ".Thus, exemplary term " ... top " can include " ... top " and
" in ... lower section " two kinds of orientation.The device can also other different modes positioning (being rotated by 90 ° or in other orientation), and
And respective explanations are made in opposite description to space used herein above.
Furthermore, it is necessary to explanation, limits parts, it is only for be convenient for using the words such as " first ", " second "
Corresponding parts are distinguished, such as without Stated otherwise, above-mentioned word is there is no particular meaning, therefore it is not intended that this
The limitation of invention protection domain.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative
It is also intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, work, device, component and/or combination thereof.
It should be noted that term " first " in the description and claims of this application and above-mentioned attached drawing, "
Two " etc. be the object for distinguishing similar, and specific sequence or precedence are described without being used for.It should be appreciated that it uses in this way
Data can be interchanged in the appropriate case, so that presently filed embodiment described herein can be in addition to illustrating herein
Or the sequence other than those of description is implemented.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, that is made any repaiies
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of imaging sensor, for reading the magnetic information on original copy, which is characterized in that including：
Framework (10), the framework (10) have installation cavity (11) and detection opening (12), the detection opening (12) with it is described
Installation cavity (11) connects；
Metal cover board (20), metal cover board (20) lid are located at the detection opening (12), and the metal cover board (20) connects
Ground is set, and is contacted and is produced with the metal cover board (20) to eliminate when the original copy passes through the upper surface of the metal cover board (20)
Raw charge.
2. imaging sensor according to claim 1, which is characterized in that the metal cover board (20) is by non-magnetic stainless
Steel is made.
3. imaging sensor according to claim 1, which is characterized in that described image sensor further includes first circuit board
(30),
The first circuit board (30) has earthed circuit, and the metal cover board (20) is electrically connected with the earthed circuit.
4. imaging sensor according to claim 3, which is characterized in that the first circuit board (30), which has, to be conductively connected
Region, the conductive connection area are located on the earthed circuit, and the metal cover board (20) is including cover board body (21) and draws
Leg structure (22), the first end of the pin configuration (22) are connect with the cover board body (21), the pin configuration (22)
Second end is connected to by fastener (40) at the conductive connection area.
5. imaging sensor according to claim 3, which is characterized in that the first circuit board (30), which has, to be conductively connected
Region, the conductive connection area are located on the earthed circuit, and the metal cover board (20) is including cover board body (21) and draws
Leg structure (22), the first end of the pin configuration (22) are connect with the cover board body (21), the pin configuration (22)
Second end is welded at the conductive connection area.
6. imaging sensor according to claim 4 or 5, which is characterized in that the first circuit board (30) is positioned at described
Framework (10) bottom end is connected to the conductive connection area after pin configuration (22) bending.
7. imaging sensor according to claim 3, which is characterized in that described image sensor further includes conductor structure
(50),
The first end of the conductor structure (50) is electrically connected with the metal cover board (20), the second end of the conductor structure (50)
It is electrically connected with the earthed circuit.
8. imaging sensor according to claim 1, which is characterized in that described image sensor further includes magnetic image reading
Portion (60) and conductive structure (70), wherein, the magnetic image reading part (60) is arranged in the installation cavity (11),
The magnetic image reading part (60) includes second circuit board (61), and the second circuit board (61) has earthed circuit and leads
Electric coupling area, the conductive connection area are located on the earthed circuit, and the conductive structure (70) connects the metal cover
Between plate (20) and the conductive connection area.
9. imaging sensor according to claim 1, which is characterized in that the framework (10) is made of an electrically conducting material, institute
It states metal cover board (20) and contacts setting with the framework (10), to be grounded setting.
10. imaging sensor according to claim 9, which is characterized in that the framework (10) is made of aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711116705.XA CN108134887B (en) | 2017-11-13 | 2017-11-13 | Image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711116705.XA CN108134887B (en) | 2017-11-13 | 2017-11-13 | Image sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108134887A true CN108134887A (en) | 2018-06-08 |
| CN108134887B CN108134887B (en) | 2024-02-06 |
Family
ID=62388554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711116705.XA Active CN108134887B (en) | 2017-11-13 | 2017-11-13 | Image sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108134887B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109523686A (en) * | 2018-11-29 | 2019-03-26 | 威海华菱光电股份有限公司 | Imaging sensor |
| CN109584433A (en) * | 2018-11-13 | 2019-04-05 | 威海华菱光电股份有限公司 | Magnetic image sensor |
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|---|---|---|---|---|
| JP2008156108A (en) * | 2006-12-26 | 2008-07-10 | Funai Electric Co Ltd | Image forming device and image reader |
| CN102098402A (en) * | 2009-12-09 | 2011-06-15 | 村田机械株式会社 | Auto document feeder and document reader |
| CN202798908U (en) * | 2012-10-19 | 2013-03-13 | 威海华菱光电股份有限公司 | Contact-type image sensor |
| CN104813229A (en) * | 2013-04-26 | 2015-07-29 | 京瓷办公信息系统株式会社 | Image formation device |
| CN106412465A (en) * | 2016-06-14 | 2017-02-15 | 威海华菱光电股份有限公司 | Image sensor |
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2017
- 2017-11-13 CN CN201711116705.XA patent/CN108134887B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008156108A (en) * | 2006-12-26 | 2008-07-10 | Funai Electric Co Ltd | Image forming device and image reader |
| CN102098402A (en) * | 2009-12-09 | 2011-06-15 | 村田机械株式会社 | Auto document feeder and document reader |
| CN202798908U (en) * | 2012-10-19 | 2013-03-13 | 威海华菱光电股份有限公司 | Contact-type image sensor |
| CN104813229A (en) * | 2013-04-26 | 2015-07-29 | 京瓷办公信息系统株式会社 | Image formation device |
| CN106412465A (en) * | 2016-06-14 | 2017-02-15 | 威海华菱光电股份有限公司 | Image sensor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109584433A (en) * | 2018-11-13 | 2019-04-05 | 威海华菱光电股份有限公司 | Magnetic image sensor |
| CN109523686A (en) * | 2018-11-29 | 2019-03-26 | 威海华菱光电股份有限公司 | Imaging sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108134887B (en) | 2024-02-06 |
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