CN207529453U - Magnetic image sensor - Google Patents

Magnetic image sensor Download PDF

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Publication number
CN207529453U
CN207529453U CN201721730841.3U CN201721730841U CN207529453U CN 207529453 U CN207529453 U CN 207529453U CN 201721730841 U CN201721730841 U CN 201721730841U CN 207529453 U CN207529453 U CN 207529453U
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China
Prior art keywords
magnetic
chip
signal processing
image sensor
sense
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CN201721730841.3U
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Inventor
戚务昌
孙晓锋
姜利
曲涛
咸杰
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Weihai Hualing Opto Electronics Co Ltd
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Weihai Hualing Opto Electronics Co Ltd
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Abstract

The utility model discloses a kind of magnetic image sensors.Wherein, which includes:Permanent magnet, for generating magnetic field;At least one sense magnetic chip group, at least one sense magnetic chip group is in parallel, each feels multiple sense magnetic chips that magnetic chip group includes series connection, and each sense magnetic chip is respectively positioned in the magnetic field of permanent magnet generation and the magnetic field respectively sensed is converted to electric signal;Signal processing chip is connected at least one sense magnetic chip group, for receiving the electric signal of each sense magnetic chip group;Interface module is connected with signal processing chip, for the electric signal of output signal processing chip output.The utility model solves the technical issues of magnetic image sensor cost in the relevant technologies is higher.

Description

Magnetic image sensor
Technical field
The utility model is related to field of image sensors, in particular to a kind of magnetic image sensor.
Background technology
Made on the media such as bank note, bill, marketable securities specific magnetic information have become it is modern anti-fake a kind of heavy Want means, it is therefore desirable to which specific sensor differentiates these magnetic informations.With rapid development of economy, Magnetic Sensor demand Also it is increasing.
Existing magnetic image sensor is primarily present several drawbacks, and magnetic image sensor existing first needs magnetic strength chip Quantity is more, needs close-packed arrays across entire scanning length, and chip volume is big, causes whole small product size inclined Greatly, installing to later product increases difficulty.In addition each magnetic strength chip needs to export signal all the way, to be matched per road output signal Set of circuits does signal processing, greatly increases cost, also improves the use difficulty of product.
For the magnetic image sensor cost in the relevant technologies it is higher the technical issues of, not yet propose effective solve at present Scheme.
Utility model content
The utility model embodiment provides a kind of magnetic image sensor, at least to solve the biography of the magnetic image in the relevant technologies The technical issues of sensor cost is higher.
According to the one side of the utility model embodiment, a kind of magnetic image sensor is provided, the magnetic image sensor Including:Permanent magnet, for generating magnetic field;At least one sense magnetic chip group, each multiple sense magnetic felt magnetic chip group and include series connection Chip, each sense magnetic chip are respectively positioned in the magnetic field of permanent magnet generation and the magnetic field respectively sensed are converted to electric signal;Letter Number processing chip is connected at least one sense magnetic chip group, for receiving the electric signal of at least one sense magnetic chip group;Interface Module is connected with signal processing chip, for the electric signal of output signal processing chip output.
Further, at least one sense magnetic chip component is at least one sense magnetic chip group unit, each to feel magnetic chip group Unit include one sense magnetic chip group or parallel connection multiple sense magnetic chip groups, signal processing chip include at least one input terminal and One output terminal, each input terminal are connect with a sense magnetic chip group unit, and output terminal is connected with interface module, signal processing Chip is used to the electric signal that at least one input terminal receives being sequentially output to interface module.
Further, signal processing chip further includes clock signal terminal, and clock signal terminal is used to receive clock signal, signal Processing chip, which triggers for subject clock signal and passes through output terminal, is sequentially output the electric signal that at least one input terminal receives.
Further, which further includes:Differential amplifier circuit is connected to signal processing chip and interface mould Between block, the electric signal for being exported to the output terminal of signal processing chip carries out differential amplification.
Further, the input anode of differential amplifier circuit is connected with the output terminal of signal processing chip, and difference is put The input cathode of big circuit is connected with reference voltage, and the output terminal of differential amplifier circuit is connected with the input terminal of interface module It connects.
Further, each multiple sense magnetic chips of sense magnetic chip group are alternatively arranged along preset direction.
Further, which further includes:Framework, permanent magnet are mounted in framework;First line substrate, until A few sense magnetic chip group and signal processing chip are arranged on the side of first line substrate, and framework is arranged on first line substrate Opposite side.
Further, which further includes:At least a piece of protective layer is covered at least one sense magnetic chip group And/or the outside of signal processing chip.
Further, which further includes:Cover sheet is located at the top of first line substrate, is used for Cover the chip on first line substrate.
Further, which further includes:Second circuit base plate, side of the framework far from first line substrate The side of the second circuit base plate is arranged on, interface module is arranged on the opposite side of the second circuit base plate;Signal connecting line, for even Connect signal processing chip and interface module.
In the utility model embodiment, magnetic field is generated by permanent magnet, by least one sense magnetic chip group in parallel, Wherein, each sense magnetic chip group includes the multiple sense magnetic chips connected, each magnetic field felt magnetic chip and be respectively positioned on permanent magnet generation It is interior and the magnetic field respectively sensed is converted into electric signal, pass through and signal processing core that at least one sense magnetic chip group is connected Piece receives the electric signal of each sense magnetic chip group, and core is handled by the interface module output signal being connected with signal processing chip The electric signal of piece output, solves the technical issues of magnetic image sensor cost in the relevant technologies is higher, and then realize energy Enough reduce the technique effect of the cost of magnetic image sensor.
Description of the drawings
Attached drawing described herein is used to provide a further understanding of the present invention, and forms the part of the application, The illustrative embodiments and their description of the utility model are not formed for explaining the utility model to the improper of the utility model It limits.In the accompanying drawings:
Fig. 1 is the schematic cross-section according to a kind of optional magnetic image sensor of the utility model embodiment;
Fig. 2 is the electronic schematic diagram according to a kind of optional magnetic image sensor of the utility model embodiment;
Fig. 3 is the electronic schematic diagram according to the optional magnetic image sensor of another kind of the utility model embodiment;
Fig. 4 is the electronic schematic diagram according to the optional magnetic image sensor of another kind of the utility model embodiment;
Fig. 5 is the electronic schematic diagram according to the optional magnetic image sensor of another kind of the utility model embodiment.
Specific embodiment
In order to which those skilled in the art is made to more fully understand the utility model, below in conjunction with the utility model reality The attached drawing in example is applied, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that described Embodiment is only the embodiment of the utility model part, instead of all the embodiments.Based on the reality in the utility model Apply example, those of ordinary skill in the art's all other embodiments obtained without making creative work all should When the range for belonging to the utility model protection.
It should be noted that term " first " in the specification and claims of the utility model and above-mentioned attached drawing, " second " etc. is the object for distinguishing similar, and specific sequence or precedence are described without being used for.It should be appreciated that in this way The data used can be interchanged in the appropriate case, can be in addition at this so as to the embodiment of the utility model described herein In diagram or description those other than sequence implement.In addition, term " comprising " and " having " and their any deformation, meaning Figure is to cover non-exclusive include.
This application provides a kind of embodiments of magnetic image sensor.
Fig. 1 is according to a kind of schematic cross-section of optional magnetic image sensor of the utility model embodiment, such as Fig. 1 institutes Show, which includes permanent magnet 2, and (each sense magnetic chip group includes the multiple of series connection at least one sense magnetic chip group Feel magnetic chip 5), signal processing chip 7, interface module 11.Permanent magnet 2 is used to generate magnetic field.Each sense magnetic chip 5 is respectively positioned on forever In the magnetic field that magnet 2 generates, and the magnetic field respectively sensed is converted into electric signal.Signal processing chip 7 and at least one sense Magnetic chip group is connected, for receiving the electric signal of at least one sense magnetic chip group.Interface module 11 and 7 phase of signal processing chip Connection, the electric signal exported for output signal processing chip 7.
Optionally, at least one sense magnetic chip component is at least one sense magnetic chip group unit, each to feel magnetic chip group list Member includes a sense magnetic chip group or multiple sense magnetic chip groups of parallel connection, it should be noted that each sense magnetic chip group is pertaining only to One sense magnetic core blade unit.Signal processing chip 7 includes at least one input terminal and an output terminal, each input terminal and one Feel the connection of magnetic chip group unit, at least one input terminal is corresponded at least one sense magnetic chip group unit, each input terminal The sense magnetic chip group unit connected can be referred to as a sub-prime, and each sub-prime inputs an electric signal to input terminal.For example, such as Shown in Fig. 3, each input terminal of signal processing chip 7 is connect with a sense magnetic chip group unit (sub-prime), each feels magnetic chip The sense magnetic chip group that group unit includes multiple parallel connections is connected, and each sense magnetic chip group includes multiple sense magnetic chips 5.At signal The output terminal of reason chip 7 is connected with the interface module 11 shown in Fig. 1, and signal processing chip 7 is used for successively will be at least one The electric signal output that input terminal receives is to interface module 11.
Signal processing chip 7 further includes clock signal terminal, and clock signal terminal is used to receive clock signal, signal processing chip 7 trigger for subject clock signal and pass through output terminal and are sequentially output the electric signal that at least one input terminal receives.Such as Fig. 5 institutes Show, the multiple input end of signal processor 7 connects one to one respectively with multiple sub-primes, the clock signal of signal processing chip 7 End passes through another input terminal and receives enabling signal SI for receiving clock signal clk, and signal processing chip 7 is receiving After enabling signal SI, the reception of one of multiple input end is sequentially output by output terminal according to the edging trigger of clock signal clk The electric signal arrived.
Further, as shown in figure 5, the magnetic image sensor further includes differential amplifier circuit 10, differential amplifier circuit 10 It is connected between signal processing chip 7 and interface module 11 (being not shown in Fig. 5), for the output terminal to signal processing chip 7 The electric signal of output carries out differential amplification, and exports to interface module 11.
As shown in figure 5, the input anode (+) of differential amplifier circuit 10 is connected with the output terminal of signal processing chip 7, For receiving signal SIGin, the input cathode (-) of differential amplifier circuit 10 is connected with reference voltage Vref, differential amplification The output terminal of circuit 10 is connected with the input terminal of interface module 11, for export by signal SIGin and reference voltage Vref into Signal SIGout after row differential amplification.
Multiple sense magnetic chips 5 of each sense magnetic chip group are alternatively arranged along preset direction.An as shown in Fig. 2, sense magnetic core Piece group includes multiple sense magnetic chips 5 of series connection, and linearly compartment of terrain arranges, the sense magnetic chip group and signal processing chip 7 Connection.
As shown in Figure 1, the magnetic image sensor further includes framework 1, permanent magnet 2 is mounted in framework 1;The magnetic image senses Device further includes first line substrate 4, and at least one sense magnetic chip group and signal processing chip 7 are arranged on first line substrate 4 Side, framework 1 are arranged on the opposite side of first line substrate 4.
The magnetic image sensor further includes at least a piece of protective layer, is covered at least one sense magnetic chip group and/or signal The outside of processing chip 7.For example, as shown in Figure 1, protective layer 3 is covered in above at least one sense magnetic chip group, protective layer 6 covers It covers above signal processing chip 7.
As shown in Figure 1, the magnetic image sensor further includes cover sheet 8, cover sheet 8 is located at first line substrate 4 Top, for covering the chip on first line substrate 4, including at least at least one sense magnetic chip group and signal processing chip 7。
As shown in Figure 1, the magnetic image sensor further includes the second circuit base plate 12, wherein, framework 1 is far from First Line roadbed The side of plate 4 is arranged on the side of the second circuit base plate 12, and interface module 11 is arranged on the opposite side of the second circuit base plate 12.
The magnetic image sensor further includes signal connecting line 9, for connection signal processing chip 7 and interface module 11.Tool Body, as shown in Figure 1, signal connecting line 9 is connected between signal processing chip 7 and differential amplifier circuit 10.
A kind of specific embodiment of the magnetic image sensor of embodiment offer is described below:
As shown in Figure 1, magnetic image sensor includes the framework 1 to play a supportive role, permanent magnet 2, permanent magnet are equipped in framework 1 2 top is equipped with first line substrate 4, and the upper surface of first line substrate 4 is equipped with the sense magnetic chip 5 of isostere product very little, with And signal processing chip 7, multiple sense magnetic chips 5 are spaced apart, and change output by mode induced field in parallel after first connecting Signal, output signal pass through signal processing chip 7, and treated, and signal can be equipped with letter by the lower surface of first line substrate 4 Number interface unit namely signal connecting line 9 are connected to the second circuit base plate 12 of lower surface.Electric signal passes through the second circuit base plate It is exported after 10 differential amplification of differential amplifier circuit on 12 by interface module 11 (for example, socket).4 upper table of first line substrate The upper surface of the sense magnetic chip 5 in face is equipped with high intensity and ultra-thin protective layer 3, and the upper surface of signal processing chip 7 is equipped with high-strength Degree and ultra-thin protective layer 6 are felt and cover sheet 8 are equipped with outside the protective layer of magnetic chip 5 and signal processing chip 7.
As shown in Fig. 2, multiple sense magnetic chips 5 are spaced apart, spread all over sweep length region, can both scan will sweep in this way The all information retouched, and reduce the quantity of chip, greatly reduce cost.
As shown in figure 3, the sense magnetic chip in magnetic image sensor is connected by mode in parallel after first connecting, by multiple Feel magnetic chip 5 and form a sense magnetic chip group, multiple sense magnetic chip groups form a sub-prime, each sub-prime and signal processing chip 7 input terminal connection.In practical applications, can be felt between magnetic chip 5 according to the distribution size of scanning magnetic signal, change Away from;Can also sub-prime spacing size be changed according to the requirement of resolution ratio.Then according to the needs of sweep length come select 1 or The multiple sub-primes of person are formed.Each sub-prime can finally export signal all the way, these signals are all aggregated into signal processing chip 7, letter Number processing chip 7 can select 1 or multiple according to actual demand.
As shown in figure 4, there are one fixed and uniform magnetic fields for permanent magnet 2, after energization, each sub-prime can generate one surely Fixed voltage.When there is region of the scanning object 13 by the scanning of this sub-prime, if scanning object 13 containing magnetisable material or Soft magnetism can cause the variation in magnetic field, so as to influence the variation of one or more magnetic strength chip resistance values, cause when the substance for feeling magnetic The variation of the whole resistance value of entire sub-prime so as to change the size of sub-prime output voltage, and passes through signal processing chip 7 and successively will The voltage change of each sub-prime is transmitted out, is connected on differential amplifier circuit 10, (is connect by socket by amplified signal Mouth mold block 11) transmission come out, can thus detect this road magnetic strength chip area be magnetic substance process, pass through voltage change Size can reflect the power of magnetisable material.Otherwise without magnetisable material, magnetic field will not change, and feel the resistance value of magnetic chip It will not change, the voltage of sub-prime will not change, and then the signal being output on signal processing chip 7 will not change.
As shown in figure 5, the input terminal of each sub-prime logical transport control circuit corresponding with signal processing chip 7 connects It connects, the output of signal processing chip 7 is connected to the input anode of difference amplifier (differential amplifier circuit) 10, reference voltage Vref is connected to the input cathode of difference amplifier 10, the result of the output terminal output difference amplification of difference amplifier 10.
The utility model embodiment provides a kind of magnetic image sensor of low cost, by by the sense magnetic core of volume very little Piece is arranged in order on circuit base plate and the circuit handled sense magnetic chip output signal is integrated into signal processing core Piece is formed a kind of using simple low-cost magnetic image sensor.The magnetic image sensor that the utility model embodiment provides In sense magnetic chip be alternatively arranged, multiple sense magnetic chips are connected by mode in parallel after first connecting, and make can be with per scanning all the way Length become larger.Both signal way to be processed had been reduced in this way, greatly reduced the difficulty and post-processing of data post processing Cost, and can ensure in the range of effective scanning, feel magnetic chip all thoughts magnetic responses, not missing inspection.
The above is only the preferred embodiment of the application, it is noted that for the ordinary skill people of the art For member, under the premise of the application principle is not departed from, several improvements and modifications can also be made, these improvements and modifications also should It is considered as the protection domain of the application.

Claims (10)

1. a kind of magnetic image sensor, which is characterized in that including:
Permanent magnet, for generating magnetic field;
At least one sense magnetic chip group, each multiple sense magnetic chips felt magnetic chip group and include series connection are each to feel the equal position of magnetic chip Electric signal is converted in the magnetic field generated in the permanent magnet and by the magnetic field respectively sensed;
Signal processing chip is connected at least one sense magnetic chip group, for receiving at least one sense magnetic chip The electric signal of group;
Interface module is connected with the signal processing chip, for exporting the electric signal of the signal processing chip output.
2. magnetic image sensor according to claim 1, which is characterized in that at least one sense magnetic chip component is extremely Few sense magnetic chip group unit, each multiple sense magnetic chips felt magnetic chip group unit and include a sense magnetic chip group or parallel connection Group, the signal processing chip include at least one input terminal and an output terminal, each input terminal and a sense magnetic chip group Unit connects, and the output terminal is connected with the interface module, and the signal processing chip is used for will be described at least one defeated Enter the electric signal that termination receives to be sequentially output to the interface module.
3. magnetic image sensor according to claim 2, which is characterized in that the signal processing chip further includes clock letter Number end, for receiving clock signal, the signal processing chip is used for by clock signal triggering simultaneously the clock signal terminal The electric signal that at least one input terminal receives is sequentially output by the output terminal.
4. magnetic image sensor according to claim 2, which is characterized in that the magnetic image sensor further includes:
Differential amplifier circuit is connected between the signal processing chip and the interface module, for the signal processing The electric signal of the output terminal output of chip carries out differential amplification.
5. magnetic image sensor according to claim 4, which is characterized in that the input anode of the differential amplifier circuit It is connected with the output terminal of the signal processing chip, the input cathode of the differential amplifier circuit is connected with reference voltage It connects, the output terminal of the differential amplifier circuit is connected with the input terminal of the interface module.
6. magnetic image sensor according to claim 1, which is characterized in that multiple sense magnetic chips of each sense magnetic chip group It is alternatively arranged along preset direction.
7. magnetic image sensor as claimed in any of claims 1 to 6, which is characterized in that the magnetic image sensing Device further includes:
Framework, the permanent magnet are mounted in the framework;
First line substrate, at least one sense magnetic chip group and the signal processing chip are arranged on the First Line roadbed The side of plate, the framework are arranged on the opposite side of the first line substrate.
8. magnetic image sensor according to claim 7, which is characterized in that the magnetic image sensor further includes:
At least a piece of protective layer is covered in the outside of at least one sense magnetic chip group and/or the signal processing chip.
9. magnetic image sensor according to claim 8, which is characterized in that the magnetic image sensor further includes:
Cover sheet is located at the top of the first line substrate, for covering the chip on the first line substrate.
10. magnetic image sensor according to claim 7, which is characterized in that the magnetic image sensor further includes:
Second circuit base plate, side of the framework far from the first line substrate are arranged on the one of second circuit base plate Side, the interface module are arranged on the opposite side of second circuit base plate;
Signal connecting line, for connecting the signal processing chip and the interface module.
CN201721730841.3U 2017-12-12 2017-12-12 Magnetic image sensor Active CN207529453U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721730841.3U CN207529453U (en) 2017-12-12 2017-12-12 Magnetic image sensor

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Application Number Priority Date Filing Date Title
CN201721730841.3U CN207529453U (en) 2017-12-12 2017-12-12 Magnetic image sensor

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107993333A (en) * 2017-12-12 2018-05-04 威海华菱光电股份有限公司 Magnetic image sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107993333A (en) * 2017-12-12 2018-05-04 威海华菱光电股份有限公司 Magnetic image sensor

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