CN108106777A - Pressure sensor and the method for manufacturing pressure sensor - Google Patents
Pressure sensor and the method for manufacturing pressure sensor Download PDFInfo
- Publication number
- CN108106777A CN108106777A CN201810063330.3A CN201810063330A CN108106777A CN 108106777 A CN108106777 A CN 108106777A CN 201810063330 A CN201810063330 A CN 201810063330A CN 108106777 A CN108106777 A CN 108106777A
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- Prior art keywords
- medium
- housing
- pressure sensor
- fluid media
- solder
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0004—Resistance soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/002—Resistance welding; Severing by resistance heating specially adapted for particular articles or work
- B23K11/0026—Welding of thin articles
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/0046—Fluidic connecting means using isolation membranes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
- G01L7/02—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges
- G01L7/022—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges constructional details, e.g. mounting of elastically-deformable gauges
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Illustrate a kind of pressure sensor（1）, with housing（2）；Diaphragm（3）, the diaphragm and housing（2）Form the room being outwardly closed off（4）；And for room（4）Fill fluid media (medium)（5）Filling opening（6）.The filling opening（6）By soldering closure or melting welding closure（7,8）Closing.Additionally illustrate one kind for manufacturing pressure sensor（1）Method, wherein providing housing（2）, the housing and diaphragm（3）Form room（4）, it is open by filling（6）Use fluid media (medium)（5）Fill the room（4）, then it is open by soldering or the melting welding closing filling（6）.
Description
Technical field
Illustrate a kind of pressure sensor with housing, the housing is filled with fluid media (medium).In addition, it also illustrates
A kind of method for manufacturing pressure sensor.
Background technology
Pressure sensor there is known by document US 3,559,488.
The known pressure sensor filled with transmission medium needs the closing for filling opening, is opened via the filling
Mouth is packed into transmission medium.In order to run, which must have strict leakproofness steady in a long-term and usually by matching somebody with somebody
Ground press-in metal balls or metallic pin are closed to realize.
The content of the invention
Being solved for the task of at least several embodiments is to illustrate pressure sensor.At least several embodiments are in addition
Task be to illustrate the method for manufacturing pressure sensor.
These tasks are solved by subject matter of the independent claims.The advantageous embodiment of these themes and improvement side
Case comes from following description and attached drawing in addition.
There is housing according to the pressure sensor of at least one embodiment.In addition, the pressure sensor has diaphragm, institute
Diaphragm is stated to be preferably fixed at the housing.The diaphragm can be for example connected by melting welding or soldering with housing.Diaphragm preferably has
Metal is made of metal.Diaphragm can be for example made of stainless steel.Instead, diaphragm can also have plastics or glass.
In this case, diaphragm for example can also be with case bonding.
According to another embodiment, the diaphragm with housing forms the room being outwardly closed off or the cavity being outwardly closed off.It should
It is preferably filled with fluid media (medium) room.Fluid media (medium) is preferably inert, nonconducting liquid.Fluid media (medium) for example can be oil,
Such as silicone oil or apricot kernel oil.Fluid media (medium) here and can be also referred to as to transmission medium, filled media or transmission below
Medium or transmission liquid.
According to another embodiment, sensor element is arranged in the chamber.Sensor element is used to receive mechanical measurement
Parameter is simultaneously converted into electric signal.Such as sensor element has the piezoelectric electro resistive silicon chip with silicon diaphragm, in the silicon
It is inwardly spread on diaphragm or mixes resistive element.Silicon chip for example may be mounted in glass body or silicon body.Pass through silicon
The pressure-dependent deformation of diaphragm and the resistive element related with deformation applied on it form voltage, can by the voltage
To realize that pressure determines.
Preferably, sensor element is arranged in the recess of housing in the chamber.The sensor element can for example by
Closing line is contacted, these closing lines are conductively connected with the printed conductor being applied on housing.
Pressure sensor described herein especially can be adapted to the absolute pressure for measuring medium or relative pressure or suitable
Pressure differential between two media is measured.
In other embodiments, which there is filling to be open.Filling is open to fill the room with fluid media (medium).
Such as passage is connected opening is filled with the room so that the room can be filled out by filling opening via the passage by fluid media (medium)
It fills.The housing can be open with one or more filling and one or more passages should for being filled with fluid media (medium)
Room.These passages can arbitrarily be set herein through housing.
According to another embodiment, filling opening is closed by soldering closure.Soldering closure can for example have
There is brazing metal.The housing tight seal for filling opening or pressure sensor can be closed by soldering closure.
According to another embodiment, filling opening is closed by melting welding closure.Melting welding closure for example can be by
Electric resistance welding, the weldering of such as resistance bolck or ring block weld to generate.In application for closing in the fusion welding method of filling opening, realize
The result similar with during the closing by the closure of soldering.
Filling opening especially has strict leakproofness steady in a long-term by the closing of soldering or melting welding closure.This
Outside, it is different from the sealing of press-fit, when filling opening is closed by soldering or melting welding, the shell of pressure sensor will not be changed
The volume of fluid media (medium) in body.Therefore the closing of the tight seal of the pressure sensor of Filled Dielectrics can be realized, without
The additional press-in of medium volume, the additional press-in of the medium volume may result in the pressure ratio in the housing of pressure sensor
Interference variation.
In addition, under the soldering of filling opening of pressure sensor described here or melting welding encapsulation situations, need not abide by
It keeps under mated condition（As for example under press-fit or the other kinds of encapsulation situations based on power engagement）Stringent tolerance.
It is possible thereby to cost savings are advantageously carried out in the case where manufacturing pressure sensor described herein, because eliminating cooperation essence
The bothersome manufacture of true metal balls, metallic pin etc..
According to another embodiment, which has ceramics and/or glass and/or plastics and/metal or by these material
One of material is made.According to another embodiment, housing is FR4 housings.Especially, the housing of pressure sensor described herein exists
Fill the one or more that can have in the region of opening in above-mentioned material.The housing of the pressure sensor of filled media is by it
Manufactured a variety of materials or raw material are unsuitable for press-fit due to its property of raw material.It is thus impossible to using by for many shells
Traditional sealing technique of the press-fit of body raw material.This more particularly to plastics, ceramics or glass housing.
Compared with known pressure sensor, in pressure sensor described here, for the quantity of the material of housing
Extending does not allow the raw material of press-fit especially.Therefore by by soldering or melting welding closure closing filling opening, also may be used
To close the pressure sensor of filled media with ceramics, plastics, glass or FR4 housings come tight seal.
According to another form of implementation, housing has metal layer in the region of filling opening.Metal layer for example can
It is manufactured by being applied to the metal paste on housing by screen printed method, the metal paste is then at such as 800 to 900 DEG C
At a temperature of be calcined.It is preferably filled with opening to be surrounded by metal layer, without being closed by it.According to the selection of case material, metal
Layer can be closed for the strict melting welding steady in a long-term or soldering of filling opening --- for example in the pricker using brazing metal
In the case that sealing closes --- it is favourable.
According to another embodiment, filling opening is directly closed by solder.Here, the filling of solder closing housing is opened
Mouthful, and without using additional packaged unit.The solder for example can be applied to housing or gold in the region of filling opening
Belong on layer.
According to another embodiment, solder and fluid media (medium) are respectively provided with surface stress, and the surface stress of wherein solder is big
In the surface stress of fluid media (medium).Preferably, the surface stress of solder is ten times of the surface stress of fluid media (medium).According to one kind
Particularly advantageous embodiment, the surface stress of solder are between 10 times to 50 times of the surface stress of fluid media (medium), including end
Value.In the case where applying the solder of unleaded tin solder form and silicone oil as fluid media (medium), the surface stress of tin solder is in
At 25 times of silicone oil.
Because the surface stress of solder can realize extra fluid be advantageously greater than the surface stress of fluid media (medium)
Medium is removed by the solder from filling opening and the solder that hardens is by housings close.
According to another embodiment, pressure sensor has packaged unit.The packaged unit is preferably open around filling
Region in housing melting welding or soldering.Especially, packaged unit and metal layer melting welding or soldering.Packaged unit for example can be by
It is embodied as metallic plate.According to an embodiment favourable, more particularly, to melting welding closing, packaged unit is melted with metal layer
There is one or more protuberances, so-called welding block before weldering.It can be for example arranged on the one side of packaged unit herein
Ring-type protuberance.Packaged unit is arranged on housing or is arranged in using one or more of protuberances to close filling opening
On metal layer on housing.In fusion process, protuberance is melted and can be with housing or with being applied to shell at least partly
Metal layer formation on body is stably connected with.
In addition, illustrate a kind of method for manufacturing pressure sensor.The pressure that thus can be manufactured or thus manufacture
Sensor can have the one or more features of aforementioned embodiments.Embodiments described below is equally applicable for pressure biography
Sensor, as it is also suitable for the method for manufacturing pressure sensor.
According to another embodiment, housing is evacuated, and mode is, for example, and from the room and all air is in housing
Intermediate space and cavity in pump out.Then the room fluid media (medium) is for example opened via will fill by the filling opening of housing
The passage filling that mouth is connected with the room.Hereafter the room is closed, mode is will filling by soldering or melting welding tight seal
Closure of openings.It as already described abovely, can be directly by solder or by by packaged unit melting welding or being soldered to housing
Metal layer that is upper or being applied on housing is open to close the filling.
According to another embodiment, when closing the room with fluid media (medium) at least by filling opening covering.Such as the housing
It can be dipped into therefore at least with filling opening in the fluid media (medium).It, will when closing the room according to another embodiment
Pressure sensor is fully immersed in fluid media (medium).Such as pressure sensor can be presented to be filled with fluid media (medium)
In the shell filled with fluid media (medium) such as silicone oil so that pressure sensor is at least with filling opening or advantageously also fully
It immerses in fluid media (medium) and silicone oil at least partly or entirely the housing of overburden pressure sensor and especially covers
Filling opening.Being then filled with opening can be in the case where using silicone oil namely it may be said that by soldering or melting welding in oil sump
It is closed, without clearing up filling opening in advance or wanting melting welding or the surface of shell to be brazed namely deoil in advance.
It is possible thereby to advantageously assure that, there is no air to be enclosed in the chamber during closing filling opening.As a result, may be used
To prevent the volume change of the chamber in closed process.
When directly closing filling opening by solder, solder for example can be applied to shell in the region of filling opening
It on body or is applied on metal layer, afterwards again fills pressure sensor with fluid media (medium).Then, pressure sensor can be as above
It is filled describedly by the way that housing is immersed in fluid media (medium) with fluid media (medium), and the solder can be with the fluid media (medium)
It is for example heated in the case of moistening by laser so that solder will fill closure of openings.Instead, pressure sensor can be first
First in the region for the filling opening that fluid media (medium) is filled and solder is moistened in heating process by fluid media (medium) if necessary
It is applied on housing.
It is moistened by the preferred inertia filled media of filling opening that will be closed, it can be advantageous to prevent as needed for soldering
Metal surface such as metal layer oxidation.
Description of the drawings
Other advantages and advantageous embodiment of pressure sensor are obtained from the embodiment described with reference to Fig. 1 to 4
It arrives.
Wherein：
Fig. 1 shows the schematic cross sectional views of the pressure sensor of the filled media according to one embodiment,
Fig. 2 shows the schematic diagram for being used to manufacture the method for pressure sensor according to another embodiment,
Fig. 3 show the pressure sensor of the filled media according to another embodiment schematic cross sectional views and
Fig. 4 shows the schematic cross sectional views of the pressure sensor of the filled media according to another embodiment.
In these embodiments and figure, identical or identical function component is respectively arranged with identical attached drawing mark
Note.Shown element and its mutual magnitude relationship does not regard perspec-tive as in principle, more properly each member
Part --- such as layer, component and region --- in order to the better property shown and/dimensionally exaggerated to be better understood from
Ground is thick or the earth is shown.
Specific embodiment
Fig. 1 shows the embodiment of pressure sensor 1 in schematic cross sectional views.Pressure sensor 1 has housing 2, should
Housing is implemented as ceramic shell.Instead, housing 2 can also be implemented as metal shell, glass shell, plastic casing or
FR4 housings or the combination with the material.
Pressure sensor 1 has diaphragm 3 in addition, which is connected with housing 2 and is outwardly closed off by the diaphragm 3 composition
Room 4.It is filled with fluid media (medium) 5 room 4.Fluid media (medium) 5 is silicone oil.Instead, fluid media (medium) 5 can also be apricot kernel oil or its
He is non-conductive and is suitable for the liquid of pressure measurement.
Housing 2 has recess, and sensor element 9 is arranged in the concave.Sensor element 9 has with integrated resistance
Piezoelectric electro resistive silicon diaphragm.The silicon diaphragm deformation in the case where power is applied on silicon diaphragm, thus for example links together
As the resistance variations of Wheatstone bridge, thus, it is possible to realize that pressure determines.The silicon diaphragm of sensor element 9 is for example by from silicon
Material is removed in substrate, is for example manufactured by etching.
Sensor element 9 is by closing line 14 and the printed conductor being arranged on housing 2（It is not shown）It is conductively connected.Thus
It can realize the external electrical contact of pressure sensor 1.
In addition, pressure sensor 1 also has filling opening 6, it is connected by passage 13 with room 4.Filling opening 6 is shown
Embodiment in be disposed on the one side opposite with diaphragm 3 of housing 2.Pressure sensor 1 is especially in the area of filling opening 6
There is ceramic material in domain.Filling opening 6 is closed by soldering closure 7.Instead, filling opening 6 can also be by melting welding
Closure 8 is closed.
It can be by the housing with ceramics by the closing for soldering 8 form of closure 7 or melting welding closure for filling opening 6
It closes 2 tight seals, wherein the housing is unsuitable for press-fit due to its property of raw material, such as with metal balls or metallic pin
Press-in cooperation form.
In addition, the closing of soldering 8 form of closure 7 or melting welding closure of filling opening 6 advantageously need not bothersomely
Housing 2 is handled, and is therefore caused（Especially compared with the housing with cooperation）Cost reduction.
The flow chart for being used to manufacture the method for pressure sensor according to another embodiment is shown in FIG. 2.For example,
The pressure sensor of the embodiment according to Fig. 1 can be manufactured by shown method.Pressure sensor feature is drawn below
With therefore purely illustrative the element for being related to Fig. 1 in the case where using reference numeral shown in Fig. 1.
Housing 2 is provided in first method step 20, which connects diaphragm 3 and form room 4.It is preferred that it is generated in housing 2 true
Sky, mode are, for example, to pump out the air in the passage 13 in room 4 and/or housing 2 from housing 2.
Then, fluid media (medium) 5 --- such as silicon is used without gas by filling opening 6 in another method step 21
Oil --- filled chamber 4.For this purpose, housing is impregnated with fluid media (medium), mode is, for example, that housing 2 is immersed in silicone oil.As a result,
The entire internal volume fluid media (medium) 5 of pressure sensor 1 is filled so that is applied in the operation later of pressure sensor
Pressure on diaphragm 3 inerrably can be transferred to sensor from diaphragm 3 via the fluid media (medium) 5 as transmission liquid as far as possible
On element 9.
In other method and step 22 then, 6 envelopes that are open will be filled by method for welding or by fusion welding method
It closes.In closed process, preferably at least by filling opening 6, with fluid media (medium) 5 namely for example, silicone oil covers, so as to realize
The closing that no gas enters.Therefore situation that the closing is preferably melted by the so-called oil of soldering or fusion welding method in oil sump
Get off to realize.But the filling opening 6 to be closed need not be advantageously cleared up in method described here before closing.Institute
Even if it is also tight seal after stating closing of the closing in oil sump.
When using method for welding, close by packaged unit and close or directly realized by solder.Here, it closes
Suitable geometry designs can realize the closing of housing by the surface stress of solder.
In the case where being closed by method for welding, soldering is preferably in the metal layer or metallization knot that can be brazed
It is carried out on the thick-layer cream of structure --- such as calcining, wherein the thick-layer cream is still pre-prepd if necessary（vorbelotet）.
Here, using it is different, using or not utilize the method for welding of solder be possible.It especially can be with fluid media (medium) 5
Just solder is applied in the region of filling opening before filling housing and is heated after housing is filled.Instead of
Solder can be applied in heating process in the region for filling opening of housing by ground after housing is filled.
The surface stress of liquid solder is preferably greater than the surface stress of fluid media (medium) 5 so that extra fluid media (medium) 5 passes through
Solder is removed from filling opening and the solder that hardens is by housings close.For example, the surface stress of solder is using metal welding
It it is more times of surface stress of fluid media (medium) when material and organic fluid medium are as filled media.It is thus, for example unleaded using
Tin solder and during by the use of silicone oil as fluid media (medium), the surface stress of solder is about 25 times of the surface stress of oil.
When instead closing filling opening by fusion welding method, metal layer preferably adapts to and closes method.In electric resistance welding
It is for example fused into method by melting the ring block of packaged unit.
Since in melting welding or the soldering short heat effect time, the expansion of filled media can be ignored.
It is as described herein to be especially for manufacturing the method characteristic of pressure sensor, by the filling of pressure sensor
The volume change of the system of medium minimizes and thus simplifies filling process.
Fig. 3 shows the pressure sensor 1 in the sectional view according to another embodiment, wherein filling opening 6 is sealed by melting welding
Object 8 is closed to be closed.The pressure sensor 1 of Fig. 3, which has, is combining the element of Fig. 1 descriptions：The room of housing 2, diaphragm 3 and filled media
4.Unlike the pressure sensor of Fig. 1, filling opening 6 is pure to be schematically arranged in housing 2, on it diaphragm 3 and shell
On 2 fixed same side of body.In addition, will fill 6 passages 13 being connected with room 4 that are open is configured to U-shaped.
Metal layer 10 is disposed on housing 2.The metal layer 10 is for example applied to by screen printed method on housing 2
And it such as is calcined under the temperature conditions between 800 to 900 DEG C.Metal layer be applied on housing especially about filling
In the region of opening 6, but the filling opening 6 is not closed.It is implemented as the packaged unit 11 of metallic plate and metal layer 10
Melting welding.
With 10 melting welding of metal layer before, packaged unit 11 have protuberance 12, by melting welding by the packaged unit with gold
Before belonging to the connection of layer 10, packaged unit 11 is arranged in the protuberance on metal layer 10.For the sake of visuality, in figure 3
Protuberance 12 is illustrated with the state before melting welding.Such as protuberance 12 is configured to cricoid welding block, in fusion process at least
Part is melted and enters with metal layer 10 and is stably connected with.
The sectional view of the pressure sensor 1 according to another embodiment is shown in FIG. 4.Pressure sensor 1 is in its principle
Property structure on correspond to Fig. 3 pressure sensor.Unlike shown embodiment in figure 3, filling opening 6 is Fig. 4's
It is closed in embodiment by soldering closure 7.Here, 70 direct confining pressure of the solder sensing being applied on metal layer 10
The filling opening 6 of device 1.Surface stress of the surface stress of solder 70 preferably as described above than fluid media (medium) 5 is big, for example, at least
It it is its 10 times so that the solder 70 that extra fluid media (medium) 5 is removed and hardens as previously described can close housing.
The present invention is not limited to these embodiments by the description by embodiment, but including each new feature and spy
Each combination of sign.This is especially included in each combination of the feature in claim, even if this feature or combination do not have in itself
Have and clearly illustrated in claim or embodiment.
Reference numerals list
1 pressure sensor
2 housings
3 diaphragms
Room 4
5 fluid media (medium)s
6 filling openings
7 soldering closures
70 solders
8 melting welding closures
9 sensor elements
10 metal layers
11 packaged units
12 protuberances
13 passages
14 closing lines
20,21,22 method and steps.
Claims (12)
1. pressure sensor（1）, have
- housing（2）,
- diaphragm（3）, the diaphragm and housing（2）Form the room being outwardly closed off（4）, the room fluid media (medium)（5）Filling and
- in housing（2）In be used for room（4）Fill fluid media (medium)（5）Filling opening（6）,
- wherein described housing（2）With material ceramics and/or glass in one or more,
- wherein described housing（2）It is open around filling（6）Region in have metal layer（10）,
- wherein described fill is open（6）Directly pass through solder（70）Closing,
- wherein described solder（70）With the fluid media (medium)（5）It is respectively provided with surface stress, and the solder（70）Surface
Stress is more than the fluid media (medium)（5）Surface stress.
2. pressure sensor according to claim 1, wherein in the room（4）In be disposed with sensor element（9）.
3. the pressure sensor according to one of preceding claims, wherein the fluid media (medium) is oil.
4. the pressure sensor according to one of preceding claims, wherein the oil is silicone oil and the solder is soldering
Material.
5. the pressure sensor according to one of preceding claims is situated between wherein the surface stress of the solder is the fluid
At least 10 times of the surface stress of matter.
6. for manufacturing pressure sensor（1）Method, including step：
A）Housing is provided（2）, the housing and diaphragm（3）Form room（4）, wherein the housing（2）With for room（4）It fills out
Fill fluid media (medium)（5）Filling opening,
- wherein described housing（2）With the one or more in following material：Ceramics, glass, plastics,
- wherein described housing（2）It is open around filling（6）Region in have metal layer（10）,
B）Pass through housing（2）Filling opening（6）Use fluid media (medium)（5）Fill the room（4）,
C）Directly pass through solder（70）Close the filling opening（6）, wherein the solder（70）With the fluid media (medium)（5）Point
Not Ju You surface stress, and the solder（70）Surface stress be more than the fluid media (medium)（5）Surface stress.
7. according to the method described in claim 6, not to the filling opening to be closed wherein before closing（6）It is cleared up and
It eliminates by fluid media (medium)（5）Caused by pollution.
8. the method according to claim 6 or 7, wherein fluid media (medium) extra during the filling opening is closed is by institute
Solder is stated to squeeze out due to higher surface stress.
9. the method according to one of claim 6 to 8, wherein with the fluid media (medium) fill the pressure sensor it
It is preceding to be applied to the solder in the region of the filling opening.
10. the method according to one of claim 6 to 8, wherein filling the pressure sensor with the fluid media (medium)
The solder is applied in the region of the filling opening afterwards.
11. the method according to one of claim 7 to 10, wherein closing the room（4）When fluid media (medium)（5）It will fill out
Fill opening（6）Covering.
12. the method described in one of claim 7 to 10, wherein closing the room（4）When by pressure sensor（1）Leaching completely
Enter in fluid media (medium)（5）In.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011102837A DE102011102837A1 (en) | 2011-05-30 | 2011-05-30 | Pressure sensor and method for producing a pressure sensor |
| DE102011102837.8 | 2011-05-30 | ||
| CN201280026158.5A CN103562697A (en) | 2011-05-30 | 2012-05-10 | Pressure sensor and method for producing a pressure sensor |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280026158.5A Division CN103562697A (en) | 2011-05-30 | 2012-05-10 | Pressure sensor and method for producing a pressure sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108106777A true CN108106777A (en) | 2018-06-01 |
| CN108106777B CN108106777B (en) | 2020-11-24 |
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ID=46062277
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280026158.5A Pending CN103562697A (en) | 2011-05-30 | 2012-05-10 | Pressure sensor and method for producing a pressure sensor |
| CN201810063330.3A Active CN108106777B (en) | 2011-05-30 | 2012-05-10 | Pressure sensor and method for producing a pressure sensor |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280026158.5A Pending CN103562697A (en) | 2011-05-30 | 2012-05-10 | Pressure sensor and method for producing a pressure sensor |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9625336B2 (en) |
| EP (1) | EP2715301B8 (en) |
| JP (1) | JP5739583B2 (en) |
| CN (2) | CN103562697A (en) |
| DE (1) | DE102011102837A1 (en) |
| WO (1) | WO2012163650A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2715301B1 (en) | 2018-11-07 |
| EP2715301B8 (en) | 2018-12-26 |
| DE102011102837A1 (en) | 2012-12-06 |
| JP5739583B2 (en) | 2015-06-24 |
| JP2014517923A (en) | 2014-07-24 |
| WO2012163650A1 (en) | 2012-12-06 |
| CN108106777B (en) | 2020-11-24 |
| EP2715301A1 (en) | 2014-04-09 |
| US20140216163A1 (en) | 2014-08-07 |
| CN103562697A (en) | 2014-02-05 |
| US9625336B2 (en) | 2017-04-18 |
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