CN108091777B - Organic light-emitting display device and preparation method thereof - Google Patents
Organic light-emitting display device and preparation method thereof Download PDFInfo
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- CN108091777B CN108091777B CN201711386622.2A CN201711386622A CN108091777B CN 108091777 B CN108091777 B CN 108091777B CN 201711386622 A CN201711386622 A CN 201711386622A CN 108091777 B CN108091777 B CN 108091777B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
Abstract
The present invention relates to a kind of organic light-emitting display devices and preparation method thereof, this method comprises: providing array substrate；Anode layer is formed in the array substrate；Predeterminable area on the anode forms organic layer, wherein the organic layer at least partly uses InkJet printing processes to prepare to be formed；Cathode layer is formed on the organic layer；Protective layer is formed on the cathode layer.By InkJet printing processes organic layer can be formed accurately in predeterminable area, effectively avoid the position depositing organic material in non-predeterminable area, so that when being drilled and being encapsulated to organic light-emitting display device, organic material can be effectively avoided to lead to package failure in non-predeterminable area gasification, so that packaging effect is more preferably, and make the organic light-emitting display device manufacture with drilling more convenient, and cost of manufacture is lower.
Description
Technical field
The present invention relates to organic light emitting display manufacturing technology fields, more particularly to organic light-emitting display device and its preparation
Method.
Background technique
OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) display screen has self-luminous, surpasses
The advantages that frivolous, fast response time, visual angle wide, low in energy consumption, it is considered to be most potential display device.
With the extensive use of OLED, OLED screen needs to meet screen design requirement of different shapes.For example, in screen
Portion or localized borehole, to adapt to the demand of display device of various shapes.Drilling is generally beaten using laser cutting or drill bit
The mode in hole drills in the drilling region of OLED.
At present to the drilling region drilling technique of OLED still in budding state, technology is not fully mature, mainly deposits
The problem of be how to avoid screen domestic demand bore portion because organic material residual caused by package failure.This is solved the problems, such as at present
Main means are as follows: by fine mask plate control realize organic material residual the problem of, but this process requirement use it is fine
Mask plate not only makes complex manufacturing technology, and due to Material Cost valuableness, causes cost of manufacture higher；In addition a kind of common
Technology is then the region organic material gasification that will drill, and the accurate control of this process requirement height, otherwise remaining organic material holds
Easily lead to OLED package failure.
Summary of the invention
Based on this, it is necessary to provide a kind of organic light-emitting display device and preparation method thereof.
A kind of preparation method of organic light-emitting display device, comprising:
Array substrate is provided；
Anode layer is formed in the array substrate；
Predeterminable area on the anode forms organic layer, wherein the organic layer at least partly uses inkjet printing
Technique prepares to be formed, wherein the organic light-emitting display device has pixel region and drilling region, and the pixel region is institute
State predeterminable area, the drilling region forms through-hole for drilling, and drills on the anode region using InkJet printing processes
Outer formation organic layer；
Cathode layer is formed on the organic layer；
Protective layer is formed on the cathode layer.
It is described in one of the embodiments, to include: the step of forming anode layer in the array substrate
The anode layer is formed using evaporation process in the array substrate.
It is described in one of the embodiments, to include: the step of forming cathode layer on the organic layer
The cathode layer is formed using evaporation process on the organic layer.
The predeterminable area on the anode forms organic layer in one of the embodiments, wherein described organic
Before layer at least partly uses InkJet printing processes to prepare the step of being formed further include:
Organic material is dissolved in solvent, the black liquid comprising the organic material is formed；
The black liquid is stored into the memory of printer.
The predeterminable area on the anode forms organic layer in one of the embodiments, wherein described organic
Layer at least partly prepares the step of being formed using InkJet printing processes
It is by droplet generator that the black liquid jet printing in the memory is described pre- on the anode
If region, the organic layer is formed.
The predeterminable area on the anode forms organic layer in one of the embodiments, wherein described organic
Layer at least partly prepares the step of being formed using InkJet printing processes
The common layer in organic layer is formed using InkJet printing processes.
The predeterminable area on the anode forms organic layer in one of the embodiments, wherein described organic
Layer at least partly prepares the step of being formed using InkJet printing processes
Organic luminous layer in organic layer is formed using evaporation process.
In one of the embodiments, the organic luminous layer with a thickness of
It is described after the step of forming cathode layer on the organic layer in one of the embodiments, further include:
The position being aligned outside the predeterminable area successively to the protective layer, the cathode layer, the anode layer and
The array substrate drills.
A kind of organic light-emitting display device, the organic light-emitting display device as described in the examples are had using any of the above-described
The preparation method of machine luminous display unit is prepared.
Above-mentioned organic light-emitting display device and preparation method thereof, by InkJet printing processes can predeterminable area accurately
Formed organic layer, effectively avoid the position depositing organic material in non-predeterminable area so as to organic light-emitting display device into
When row drills and encapsulates, organic material can be effectively avoided to lead to package failure in non-predeterminable area gasification, so that packaging effect
More preferably, and make the organic light-emitting display device manufacture with drilling more convenient, and cost of manufacture is lower.
Detailed description of the invention
Fig. 1 is the flow diagram of the preparation method of the preparation method of the organic light-emitting display device of one embodiment；
Fig. 2 is the schematic diagram of the section structure of the organic electroluminescence device of one embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give better embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure
Add thorough and comprehensive.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term used herein is intended merely to the mesh of description specific embodiment
, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more relevant listed items
Any and all combinations.
For example, a kind of preparation method of organic light-emitting display device, comprising: provide array substrate；In the array substrate
Upper formation anode layer；Predeterminable area on the anode forms organic layer, wherein the organic layer at least partly uses ink-jet
Printing technology prepares to be formed；Cathode layer is formed on the organic layer；Protective layer is formed on the cathode layer.
In above-described embodiment, it can be formed accurately organic layer in predeterminable area by InkJet printing processes, effectively avoided
In the position depositing organic material of non-predeterminable area, so that when being drilled and being encapsulated to organic light-emitting display device, it can
It effectively avoids organic material from leading to package failure in non-predeterminable area gasification, so that packaging effect is more preferably, and makes that there is drilling
Organic light-emitting display device manufacture it is more convenient, and cost of manufacture is lower.
In one embodiment, as shown in Figure 1, providing a kind of preparation method of organic light-emitting display device, comprising:
Step 102, array substrate is provided.
For example, providing the array substrate including thin film transistor (TFT).For example, the thin film transistor (TFT) includes grid, layer insulation
Layer and source/drain.Specifically, which includes substrate, circuit layer and thin film transistor (TFT), which is glass substrate, again
Such as, which is flexible base board.For example, the array substrate be with LTPS (Low Temperature Poly-silicon, it is low
Warm polysilicon) substrate.
The circuit layer is powered for realizing circuit logic for organic electroluminescence device, and the thin film transistor (TFT) is for controlling
The work of organic electroluminescence device, for example, the thin film transistor (TFT) includes grid, interlayer insulating film and source/drain, for example, should
Array substrate includes substrate, the circuit layer being formed on substrate, the gate insulating layer being formed on circuit layer, to be formed in grid exhausted
Grid and formation and the interlayer insulating film on grid, the interlayer insulating film in edge layer offer via hole, which also wraps
Include the source/drain to be formed in via hole.
For example, further comprising the steps of: preparation array substrate before step 102.
For example, forming thin film transistor (TFT) on substrate, for example, forming circuit layer on substrate, grid are formed on circuit layer
Pole insulating layer, forms interlayer insulating film on gate insulating layer, and etching forms via hole on interlayer insulating film, is formed in via hole
Source/drain.
It should be understood that the array substrate can be implemented by using the prior art.The grid of the array substrate, layer insulation
Layer and source/drain can be realized by evaporation process, and InkJet printing processes realization can also be used.For example, using evaporation process in base
Each layer that thin film transistor (TFT) is formed on plate for another example forms each layer of thin film transistor (TFT) using InkJet printing processes on substrate.
Step 104, anode layer is formed in the array substrate.
For example, the material of anode layer is tin indium oxide (ITO), for example, forming tin indium oxide material in array substrate
Anode layer.For example, the material of anode layer is silver, for example, forming the anode layer of metallic silver in array substrate.For example, anode layer
With a thickness of 100~300nm, for another example, the anode layer with a thickness of 200nm.
Specifically, which connect with the source/drain in array substrate.
It is noted that the preparation of the anode layer, can be used evaporation process realization, it can also be real using inkjet printing
It is existing.The anode layer to be formed is prepared by inkjet printing, the range of anode layer formation can be accurately controlled, so that the formation of anode layer
It is more accurate.
Step 106, predeterminable area on the anode forms organic layer, wherein the organic layer at least partly uses
InkJet printing processes prepare to be formed.
Specifically, which is pixel region, which is used for luminescence display, for example, the organic light emission is aobvious
Showing device has pixel region.Region outside the predeterminable area be non-pixel region, non-predeterminable area or or drilling region, should
Drilling region forms through-hole for drilling, which is not display area.The organic layer is used to be powered in anode and cathode
After shine.For example, the organic light-emitting display device has pixel region and drilling region, which is predeterminable area,
The drilling region is non-predeterminable area, which surrounds the drilling region setting.
For example, predeterminable area on the anode forms organic layer, wherein the organic layer at least partly uses ink-jet
Printing technology prepares to be formed, and the organic layer surrounds the drilling region.For example, on the anode using InkJet printing processes
The overseas formation organic layer in bore area surrounds the organic of drilling region for example, being formed on the anode using InkJet printing processes
Layer.
The common layer that can be in organic layer to be formed is prepared using InkJet printing processes in the organic layer, is also possible to this
Organic luminous layer in organic layer.
In this step, organic layer is formed by inkjet printing, the range of the organic layer is accurately controlled, is effectively kept away
Exempt from drilling area deposition organic material, so that only forming organic layer in predeterminable area, that is, is only deposited in predeterminable area
Organic material, in this way, being conducive to the drilling in drilling region.Specifically, the lower drilling of the boiling point of organic material uses laser incising
The high temperature of erosion perhaps mode laser when drilling or encapsulate of drill bit punching will be so that organic material gasifies, and due to originally
In embodiment, organic material is not present in the region that drills, so that organic material will not be generated in boring procedure and encapsulation
Gasification, so that bubble will not be generated in encapsulation process, so that packaging effect is more preferably.
It should be understood that the organic layer further includes multilayered structure, for example, predeterminable area on the anode is formed with
Machine layer, wherein to be formed in the organic layer wherein at least one layer is prepared using InkJet printing processes.In such manner, it is possible to accurately
At least one layer in organic layer is formed in predeterminable area, reduces organic material in the deposition in drilling region, so that drilling encapsulation effect
Fruit is more preferably.
Step 108, cathode layer is formed on the organic layer.
For example, transparent cathode layer is formed on the organic luminous layer, for example, the cathode layer is by transparent conductive material
It is made, for example, the material of the cathode layer is magnesium silver alloy, for example, the cathode layer of magnesium silver alloy is formed on the organic layer,
For example, making cathode layer on organic luminous layer using vacuum evaporation.For example, the transmitance of the cathode layer is 75~85%,
Refractive index is 1.5~15.For another example, the cathode layer with a thickness of 200nm.
It is noted that the preparation of the cathode layer, can be used evaporation process realization, it can also be real using inkjet printing
It is existing.The cathode layer to be formed is prepared by inkjet printing, the range of cathode layer formation can be accurately controlled, so that the formation of cathode layer
It is more accurate.
Step 110, protective layer is formed on the cathode layer.
Specifically, this is protective layer used in packaging protection organic electroluminescence device, which includes upper
State the anode layer, organic layer and cathode layer sequentially formed in step.
Specifically, the protective layer uses PECVD (plasma enhanced chemical vapor deposition) or ALD (atomic layer deposition)
Method is prepared, for example, being prepared using PECVD method, the material for preparing the protective layer is silicon nitride (SiNx), titanium dioxide
One of silicon (SiOx), silicon carbide (SiC), silicon oxide carbide (SiOC), silicon oxynitride (SiON), thickness is at 0.1 μm~2 μm
Between；For another example, using ALD method prepare, prepare the protective layer material be silica (SiOx), aluminium oxide (Al2O3),
One of zirconium oxide (ZrOx), thickness is between 5nm~100nm.
In the present embodiment, the organic layer formed by inkjet printing, so that organic layer is only formed in predeterminable area, without
Organic layer can be formed in drilling region, effectively avoid the depositing organic material in drilling region, exist in this way, to drilling region
When drilling and encapsulating, the gasification of organic material can be effectively avoided, effectively avoids generating bubble when encapsulation, so that packaging effect is more
It is good.
In one embodiment, described includes: in the array base the step of forming anode layer in the array substrate
The anode layer is formed using evaporation process on plate.
For example, forming the anode layer using evaporation process in the array substrate.For example, using mask plate by anode
Material is deposited to forming the anode layer in array substrate.
For example, being respectively formed the anode using predeterminable area of the evaporation process in the array substrate and drilling region
Layer.That is, the anode layer is formed in predeterminable area.In this way, cost is relatively low for the anode layer formed by evaporation process, and work
Skill is more mature, so that the formation better effect of anode layer.
For example, forming the anode layer using predeterminable area of the evaporation process in the array substrate.Due to anode layer
It is formed in predeterminable area, reduces the anode material in drilling area deposition, is conducive to drill.
It is noted that the anode layer is prepared using metal material, there is metal material high temperature resistant to be not easy to gasify
The characteristics of, therefore, even if having the material of anode remain in drilling region in, in boring procedure, anode layer directly drilled and
Gasification phenomenon will not be generated, therefore, packaging effect can't be had an impact.
In one embodiment, described includes: on the organic layer the step of forming cathode layer on the organic layer
The cathode layer is formed using evaporation process.
For example, forming the cathode layer using evaporation process on the organic layer.For example, using mask plate by cathode material
The cathode layer is formed on material vapor deposition to organic layer.
For example, forming the cathode layer on the predeterminable area of organic layer using evaporation process.That is, the cathode layer
It is formed in predeterminable area.In this way, cost is relatively low for the cathode layer formed by evaporation process, and technique is more mature, so that negative
The formation better effect of pole layer, and since cathode layer is formed in predeterminable area, reduce the cathode material in drilling area deposition,
Be conducive to drill.
It is noted that the cathode layer is prepared using metal material, there is metal material high temperature resistant to be not easy to gasify
The characteristics of, therefore, even if thering is the material of part cathode to be formed by evaporation process and remaining in drilling region, in boring procedure
In, therefore cathode layer will directly be drilled can't have an impact packaging effect without generating gasification phenomenon.
Use inkjet printing mode to form organic layer to realize, in one embodiment, it is described on the anode
Predeterminable area formed organic layer, wherein the organic layer at least partly use InkJet printing processes prepare the step of being formed it
Before further include: organic material is dissolved in solvent, the black liquid comprising the organic material is formed；The black liquid is stored to beating
In the memory of print machine.For example, the predeterminable area on the anode forms organic layer, wherein the organic layer is at least
It includes: by droplet generator by the black liquid in the memory that part, which prepares the step of being formed using InkJet printing processes,
Jet printing forms the organic layer to the predeterminable area on the anode.
Specifically, which is black liquid memory, and the memory is for storing black liquid.In the present embodiment, will have first
Machine material is dissolved in solvent, forms solution containing organic material, which is black liquid, in this way, passing through high precision apparatus
Stock movement is controlled, organic material is accurately instilled in predeterminable area, forms film after the organic material of liquid is dry
The organic layer of layer.
For example, the stock has as formd the array substrate of anode, by controlling the movement of the array substrate, so that
Droplet generator can accurately be dropped in the predeterminable area on anode, form film layer after dry, that is to say, that can be accurately
Inkjet printing is carried out to the predeterminable area in array substrate, forms organic layer.
It should be understood that the organic layer includes common layer and organic luminous layer, for example, the common layer includes hole transport
Layer and electron transfer layer, the material of the hole transmission layer are hole mobile material, and the material of electron transfer layer is electron-transport material
The material of material, the organic luminous layer is luminous organic material, and therefore, which includes hole mobile material, electron-transport
Material and luminous organic material prepare the black liquid comprising hole mobile material respectively, pass comprising electronics when preparing the black liquid
The black liquid of defeated material and black liquid comprising luminous organic material, for example, hole mobile material, electron transport material are respectively to have
Machine material, hole mobile material, electron transport material can be used to be used in the existing technology for preparing organic electroluminescence device
Material realize.For example, hole mobile material, electron transport material and luminous organic material are dissolved separately in three solvents
In, it is respectively formed the black liquid comprising hole mobile material, the black liquid comprising electron transport material and comprising luminous organic material
Black liquid, for example, by the black liquid comprising hole mobile material, the black liquid comprising luminous organic material and including electron-transport material
The black liquid of material pass sequentially through InkJet printing processes injection on the anode layer, be respectively formed hole transmission layer, organic luminous layer and
Electron transfer layer.
In order to enable the performance of organic electroluminescence device is more preferably, in one embodiment, it is described on the anode
Predeterminable area forms organic layer, wherein the organic layer at least partly uses InkJet printing processes to prepare the step of being formed to include:
The common layer in organic layer is formed using InkJet printing processes.For example, the predeterminable area on the anode formed it is organic
Layer, wherein it includes: to be formed using evaporation process that the organic layer, which at least partly uses InkJet printing processes to prepare the step of being formed,
Organic luminous layer in organic layer.
For example, the organic layer includes common layer and organic luminous layer, the organic luminous layer, that is, pixel layer, the organic luminous layer
Including red (R), green (G) and blue (B) three sub-pixel.The common layer includes hole injection layer, hole transmission layer, electronic blocking
Layer, hole blocking layer, electron transfer layer and electron injecting layer, for example, forming hole injection layer, hole using InkJet printing processes
Transport layer, electronic barrier layer, hole blocking layer, electron transfer layer and electron injecting layer, for example, being formed using evaporation process organic
Luminescent layer, for example, as shown in Fig. 2, the hole injection layer 202, hole transmission layer 203 and electronic barrier layer 204 are sequentially formed in
On anode 301, for example, the organic luminous layer 205 is formed on electronic barrier layer 204, for example, the hole blocking layer 206, electronics
Transport layer 207 and electron injecting layer 208 are sequentially formed on organic luminous layer 205, for example, cathode layer 209 is formed in electronics note
Enter on layer 208.For example, protective layer 210 is formed on cathode layer 209.
For example, sequentially forming hole injection layer, hole transmission layer and electronics on the anode using InkJet printing processes
Barrier layer, forms organic luminous layer on the electronic barrier layer using evaporation process, is had using InkJet printing processes described
Hole blocking layer, electron transfer layer and electron injecting layer are sequentially formed on machine luminescent layer.In this step, organic luminous layer passes through biography
The evaporation process of system is formed, i.e., luminous organic material is deposited to electronic barrier layer using mask plate, to form organic light emission
Layer.
For example, sequentially forming hole injection layer using the predeterminable area of InkJet printing processes on the anode, hole passes
Defeated layer and electronic barrier layer form organic luminous layer using predeterminable area of the evaporation process on the electronic barrier layer, use
Predeterminable area of the InkJet printing processes on the organic luminous layer sequentially forms hole blocking layer, electron transfer layer and electronics note
Enter layer.
It should be understood that the common layer of traditional organic layer, including hole injection layer, hole transmission layer, electronic blocking
Layer, hole blocking layer, electron transfer layer and electron injecting layer etc. are all made of mask plate progress vapor deposition and are formed, be limited to steam
Coating technology, and it is limited to the precision and technology difficulty of mask plate, it is difficult to control the accurate of the vapor deposition of the organic material of common layer
Position can not effectively avoid the organic material of common layer from being deposited on drilling region, and in the present embodiment, it is formed by inkjet printing
Hole injection layer, hole transmission layer, electronic barrier layer, hole blocking layer, electron transfer layer and electron injecting layer, can be accurate
Ground is by above-mentioned hole injection layer, hole transmission layer, electronic barrier layer, hole blocking layer, electron transfer layer and electron injecting layer
It is formed in predeterminable area, common layer is formed accurately in predeterminable area, it is heavy to effectively prevent above-mentioned organic material
Product, so that effectively reducing the gasification of organic material in boring procedure, reduces the generation of bubble, makes in drilling region
Obtain packaging effect more preferably；And organic luminous layer therein is formed using traditional evaporation process, enables to organic electroluminescent
The luminescent properties of device are more preferably.
In one embodiment, the organic luminous layer with a thickness ofFor example, the organic luminous layer
With a thickness ofIt should be understood that having although organic luminous layer can be formed in predeterminable area by evaporation process
The thickness of machine luminescent layer is too big, and the luminous organic material of deposition is excessive, it will is easy so that depositing in drilling region more has
Machine luminescent material is easy to generate bubble in encapsulation process, therefore, in the present embodiment, the organic luminous layer with a thickness ofOn the one hand enable to the luminescent properties of organic luminous layer preferable, additionally it is possible to effectively reduce in drilling region
The luminous organic material of deposition, so that packaging effect is more preferably.
For example, the common layer with a thickness ofFor example, the common layer with a thickness of For example, hole injection layer, hole transmission layer, electronic barrier layer, hole blocking layer, electron transfer layer and electron injecting layer
The sum of thickness isFor example, hole injection layer, hole transmission layer, electronic barrier layer, hole blocking layer, electricity
The sum of sub- transport layer and the thickness of electron injecting layer areIt should be understood that common layer uses InkJet printing processes
It is formed, with a thickness ofEnable to the electron mobility of common layer higher, performance more preferably, additionally it is possible into one
Step avoids the organic material of common layer from being deposited on drilling region, so that packaging effect is more preferably.
In one embodiment, described after the step of forming cathode layer on the organic layer further include: in alignment institute
The position stated outside predeterminable area successively carries out the protective layer, the cathode layer, the anode layer and the array substrate
Drilling.For example, be aligned it is described drilling region position successively to the protective layer, the cathode layer, the anode layer and
The array substrate drills.For example, being bored in the position being aligned outside the predeterminable area to organic light-emitting display device
Hole.For example, drilling in the position for being aligned the drilling region to organic light-emitting display device.
In this way, since organic layer is not formed in drilling region, it is aligned the organic light emission in the drilling region
Each layer drills on the position of display device, so that through-hole is formed on the organic light-emitting display device, to meet different show
The shape need of display screen, for example, the organic light-emitting display device is allowed to be adapted to wrist-watch or other special-shaped display screens.
In one embodiment in the position outside the alignment predeterminable area successively to the protective layer, the yin
Before the step of pole layer, the anode layer and the array substrate are drilled further include: by the glass base in array substrate
Plate removing attaches flexible base board backwards to the one side of organic electroluminescence device in low-temperature polycrystalline silicon layer, for example, passing through laser irradiation
PI film layer, so that glass substrate is separated with low-temperature polycrystalline silicon layer, and glass substrate is separated, in the present embodiment, by array substrate
Glass substrate removing, and flexible base board is attached at low-temperature polycrystalline silicon layer, so that the two of the outer layer of organic light-emitting display device
Laminar substrate is flexible base board, followed by single punch, can effectively improve perforating efficiency, and to punch effect more
It is good.
In one embodiment, a kind of organic light-emitting display device is provided, the organic light-emitting display device is using above-mentioned
The preparation method of organic light-emitting display device described in any embodiment is prepared.
It is noted that above-mentioned preparation method can be applied to AMOLED (Active-matrix organic light
Emitting diode, active-matrix organic light emitting diode) on, and the shape of the upper drilling of the AMOLED can be arbitrarily
Shape, arbitrary dimension, that is to say, that the AMOLED is not limited to the shape that need to be drilled and position.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of preparation method of organic light-emitting display device characterized by comprising
Array substrate is provided；
Anode layer is formed in the array substrate；
Predeterminable area on the anode forms organic layer, wherein the organic layer at least partly uses InkJet printing processes
Preparation is formed, wherein the organic light-emitting display device has pixel region and drilling region, and the pixel region is described pre-
If region, the drilling region forms through-hole for drilling, using the InkJet printing processes overseas shape in bore area on the anode
At organic layer；
Cathode layer is formed on the organic layer；
Protective layer is formed on the cathode layer.
2. the preparation method of organic light-emitting display device according to claim 1, which is characterized in that described in the array
The step of formation anode layer, includes: on substrate
The anode layer is formed using evaporation process in the array substrate.
3. the preparation method of organic light-emitting display device according to claim 1, which is characterized in that described described organic
The step of forming cathode layer, includes: on layer
The cathode layer is formed using evaporation process on the organic layer.
4. the preparation method of organic light-emitting display device according to claim 1, which is characterized in that described in the anode
On predeterminable area formed organic layer, wherein the organic layer at least partly uses InkJet printing processes to prepare the step of being formed
Before further include:
Organic material is dissolved in solvent, the black liquid comprising the organic material is formed；
The black liquid is stored into the memory of printer.
5. the preparation method of organic light-emitting display device according to claim 4, which is characterized in that described in the anode
On predeterminable area formed organic layer, wherein the organic layer at least partly uses InkJet printing processes to prepare the step of being formed
Include:
By droplet generator by the black liquid jet printing in the memory to the preset areas on the anode
Domain forms the organic layer.
6. the preparation method of organic light-emitting display device according to claim 1, which is characterized in that described in the anode
On predeterminable area formed organic layer, wherein the organic layer at least partly uses InkJet printing processes to prepare the step of being formed
Include:
The common layer in organic layer is formed using InkJet printing processes.
7. the preparation method of organic light-emitting display device according to claim 6, which is characterized in that described in the anode
On predeterminable area formed organic layer, wherein the organic layer at least partly uses InkJet printing processes to prepare the step of being formed
Include:
Organic luminous layer in organic layer is formed using evaporation process.
8. the preparation method of organic light-emitting display device according to claim 7, which is characterized in that the organic luminous layer
With a thickness of
9. the preparation method of organic light-emitting display device according to claim 1, which is characterized in that described described organic
After the step of forming cathode layer on layer further include:
In the position being aligned outside the predeterminable area successively to the protective layer, the cathode layer, the anode layer and described
Array substrate drills.
10. a kind of organic light-emitting display device, which is characterized in that the organic light-emitting display device is using in claim 1-9
The preparation method of organic light-emitting display device described in any one is prepared.
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| CN201711386622.2A CN108091777B (en) | 2017-12-20 | 2017-12-20 | Organic light-emitting display device and preparation method thereof |
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| CN201711386622.2A CN108091777B (en) | 2017-12-20 | 2017-12-20 | Organic light-emitting display device and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6087196A (en) * | 1998-01-30 | 2000-07-11 | The Trustees Of Princeton University | Fabrication of organic semiconductor devices using ink jet printing |
| CN105448952A (en) * | 2014-09-04 | 2016-03-30 | 乐金显示有限公司 | Organic light emitting display panel and method for fabricating the same |
| JP2017045631A (en) * | 2015-08-27 | 2017-03-02 | セイコーエプソン株式会社 | Liquid body, method for evaluating defoaming property of liquid body, and method for forming element including organic semiconductor layer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6087196A (en) * | 1998-01-30 | 2000-07-11 | The Trustees Of Princeton University | Fabrication of organic semiconductor devices using ink jet printing |
| CN105448952A (en) * | 2014-09-04 | 2016-03-30 | 乐金显示有限公司 | Organic light emitting display panel and method for fabricating the same |
| JP2017045631A (en) * | 2015-08-27 | 2017-03-02 | セイコーエプソン株式会社 | Liquid body, method for evaluating defoaming property of liquid body, and method for forming element including organic semiconductor layer |
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