CN108089378B

CN108089378B - Baking method, baking device and baking oven

Info

Publication number: CN108089378B
Application number: CN201810004928.5A
Authority: CN
Inventors: 郭晓斌
Original assignee: HKC Co Ltd; Chongqing HKC Optoelectronics Technology Co Ltd
Current assignee: HKC Co Ltd; Chongqing HKC Optoelectronics Technology Co Ltd
Priority date: 2018-01-03
Filing date: 2018-01-03
Publication date: 2020-07-07
Anticipated expiration: 2038-01-03
Also published as: WO2019134582A1; CN108089378A; US11400485B2; US20210069746A1

Abstract

The invention is suitable for the technical field of material manufacturing, and provides a baking method, a baking device and a baking device, wherein the baking method comprises the following steps: acquiring a preset instruction, starting timing and circularly executing the following steps: controlling a first group of thimbles to ascend from an initial position to support the substrate, and recording the ascending times of the first group of thimbles; when the first group of ejector pins rises to a first preset position, controlling the first group of ejector pins to move a first preset distance towards a first preset direction so as to enable the substrate to move a first preset distance towards the first preset direction, wherein the first preset distance is related to the rising times of the first group of ejector pins; controlling the first group of ejector pins to descend so that the second group of ejector pins support the substrate; and when the first group of ejector pins descends to a second preset position, controlling the first group of ejector pins to return to the initial position. By the invention, repeated contact or long-time contact between the thimble and the same position of the substrate is prevented, and the problem of uneven heating in the baking process is effectively solved.

Description

Baking method, baking device and baking oven

Technical Field

The invention belongs to the technical field of material manufacturing, and particularly relates to a baking method, a baking device and a baking device.

Background

In the process of manufacturing a liquid crystal display panel, a Film is formed on a glass substrate, for example, a Polyimide Film (PI Film) is manufactured on the glass substrate, and the PI Film is an alignment Film or an orientation Film capable of aligning liquid crystal molecules in the liquid crystal display panel at a pre-tilt angle.

The PI film is obtained by coating PI liquid on a glass substrate and then pre-baking the glass substrate coated with the PI liquid, wherein the pre-baking can be realized by adopting a mode that a heating thimble alternately ascends to contact the glass substrate. However, in this heating method, the film shrinkage rate of the PI liquid is not uniform when the PI liquid is heated to form a film, which causes various phenomena such as uneven brightness of the liquid crystal display panel.

Disclosure of Invention

In view of the above, embodiments of the present invention provide a baking method, a baking apparatus, and a baking apparatus to solve the trace phenomenon of uneven brightness of a liquid crystal display panel caused by uneven heating in the conventional baking method.

One aspect of an embodiment of the present invention provides a baking method, including:

acquiring a preset instruction, starting timing and circularly executing the following steps:

controlling a first group of thimbles to ascend from an initial position to support the substrate, and recording the ascending times of the first group of thimbles;

when the first group of ejector pins rises to a first preset position, controlling the first group of ejector pins to move a first preset distance towards a first preset direction so as to enable the substrate to move the first preset distance towards the first preset direction, wherein the first preset distance is related to the rising times of the first group of ejector pins;

controlling the first group of ejector pins to descend so that the second group of ejector pins support the substrate;

and when the first group of ejector pins descends to a second preset position, controlling the first group of ejector pins to return to the initial position.

Another aspect of the embodiments of the present invention provides a baking apparatus, including:

the first acquisition unit is used for acquiring a preset instruction, starting timing and controlling the following units to work circularly:

the first lifting control unit is used for controlling the first group of ejector pins to lift from the initial position to support the substrate and recording the lifting times of the first group of ejector pins;

the first moving control unit is used for controlling the first group of ejector pins to move the first preset distance to the first preset direction when the first group of ejector pins ascend to the first preset position, so that the substrate moves the first preset distance to the first preset direction, and the first preset distance is related to the ascending times of the first group of ejector pins;

the first descending control unit is used for controlling the first group of ejector pins to descend so that the second group of ejector pins support the substrate;

and the first return control unit is used for controlling the first group of ejector pins to return to the initial position when the first group of ejector pins descends to the second preset position.

Another aspect of the embodiments of the present invention provides a baking apparatus, including a storage unit, a processing unit, and a computer program stored in the storage unit and executable on the processing unit, wherein the processing unit implements the following steps of the baking method when executing the computer program:

Another aspect of the embodiments of the present invention provides a computer-readable storage medium, which stores a computer program, where the computer program is executed by one or more processors to implement the following steps of the method provided by the embodiments of the present invention:

The embodiment of the invention starts timing and circularly executes the following steps by acquiring the preset instruction: controlling a first group of thimbles to ascend from an initial position to support the substrate, and recording the ascending times of the first group of thimbles; when the first group of ejector pins rises to a first preset position, controlling the first group of ejector pins to move a first preset distance towards a first preset direction so as to enable the substrate to move the first preset distance towards the first preset direction, wherein the first preset distance is related to the rising times of the first group of ejector pins; controlling the first group of ejector pins to descend so that the second group of ejector pins support the substrate; when the first group of ejector pins descends to a second preset position, controlling the first group of ejector pins to return to the initial position; the heating device prevents the same thimble from repeatedly contacting or contacting the same position of the substrate for a long time, so that the heating time of each position of the substrate is consistent, and the problem of uneven heating in the baking process is effectively solved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

FIG. 1 is a schematic flow chart of a baking method according to an embodiment of the present invention;

FIG. 2 is a schematic diagram illustrating positions of a first set of pins during a baking process according to an embodiment of the present invention;

FIG. 3 is a schematic flow chart of a baking method according to an embodiment of the present invention;

FIG. 4 is a schematic view of a toasting apparatus according to an embodiment of the present invention;

FIG. 5 is a schematic view of a toasting apparatus according to an embodiment of the present invention;

fig. 6 is a schematic view of a baking apparatus according to an embodiment of the present invention.

Detailed Description

In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

As used in this specification and the appended claims, the term "if" may be interpreted contextually as "when", "upon" or "in response to a determination" or "in response to a detection". Similarly, the phrase "if it is determined" or "if a [ described condition or event ] is detected" may be interpreted contextually to mean "upon determining" or "in response to determining" or "upon detecting [ described condition or event ]" or "in response to detecting [ described condition or event ]".

In order to explain the technical means of the present invention, the following description will be given by way of specific examples.

Before describing the specific embodiments, a PI (Polyimide Film) Film is introduced. The PI film has outstanding high temperature resistance, radiation resistance, chemical corrosion resistance and electrical insulation performance, can be used in air at 250-280 ℃ for a long time, is stable in chemical property, and can prevent combustion without adding a flame retardant. Therefore, the PI film is particularly suitable for being used as a base material of a flexible printed circuit board and insulating materials of various high-temperature resistant electric machines and electric appliances.

Commonly, it is applied to the preparation of liquid crystal display panels. The PI liquid pre-baking is a key step in the liquid crystal display panel preparation process, and after the PI liquid is uniformly coated on a glass substrate, the glass substrate coated with the PI is pre-baked until a PI film is formed. The PI film is an alignment film or an orientation film that enables liquid crystal molecules in the liquid crystal display panel to be aligned in a pretilt angle. However, in the process of forming the film by the PI liquid, the film shrinkage rate of the PI liquid changes according to the change of the heated temperature, so whether the PI liquid is uniformly heated directly influences whether the film shrinkage rate is consistent when the PI liquid is formed into the film, and further influences whether the brightness of the liquid crystal display panel is uniform and mura (screen mottle) occurs.

The embodiment of the invention provides a baking method, a baking device and a baking oven aiming at the problem that the film shrinkage rate is influenced by temperature during PI liquid film forming, so as to solve the problem of non-uniform temperature in the baking process.

Of course, the embodiment of the invention can solve the problem of uneven heating in the PI solution film forming process, and can also solve the problem of uneven baking temperature in other baking processes, such as the photoresist baking process, but not limited to solving the problem of uneven heating in the PI solution film forming process.

Fig. 1 shows a schematic flow chart of an implementation of a baking method provided by an embodiment of the present invention, where the method as shown in the figure may include the following steps:

in step S101, a predetermined command is acquired, and the following steps are started and executed in a loop.

The preset instruction is specifically an instruction for starting baking, and the timing starting is specifically timing after the instruction for starting baking is acquired; the loop execution of the following steps means that the step S102 is continuously executed after the step S102 to the step S105 are sequentially executed.

Step S102, controlling the first group of thimbles to ascend from the initial position to support the substrate, and recording the ascending times of the first group of thimbles.

The initial position may be a position where the first set of pins is not in contact with the substrate, and the substrate is supported by the second set of pins. Before the baking program is carried out, a certain key on the baking oven can be used for triggering the first group of ejector pins to return to the initial position.

In a specific application, the initial value of the number of times of the first group of ejector pins rising can be set to be 0, the first group of ejector pins rising once, and the number of times of the first group of ejector pins plus 1, and in an actual application, the first group of ejector pins can be set to circularly execute once, rise, translate, descend and return to the initial position from the initial position, and then the number of times of the first group of ejector pins circulating is automatically plus 1; of course, the number of times of translation can be set to be increased by 1; alternatively, the number of drops is increased by 1.

Step S103, when the first group of lift pins rises to a first preset position, controlling the first group of lift pins to move a first preset distance in a first preset direction, so that the substrate moves the first preset distance in the first preset direction, where the first preset distance is related to the rising times of the first group of lift pins.

The first preset position refers to a position where the first group of ejector pins rises to support the substrate, and when the first group of ejector pins are located at the first preset position, the substrate is not in contact with the second group of ejector pins any more.

Referring to fig. 2, in one embodiment, the PI solution 21 is uniformly coated on the glass substrate 22, the hot plate 23 is located below the glass substrate 22, and the hot plate 23 is provided with a second set of pins 24 and a first set of pins 25, wherein the first set of pins 25 can move up and down and left and right.

FIG. 2-A shows the first set of lift pins 25 raised to a first predetermined position P1, wherein the glass substrate 22 is supported by the first set of lift pins 25 and the glass substrate 22 is separated from the second set of lift pins 24.

Fig. 2-B shows the first set of ejector pins 25 moving a first predetermined distance L in a first predetermined direction, so that the glass substrate 22 moves the first predetermined distance L in the first predetermined direction.

In a specific application, the correlation between the first preset distance and the rising times of the first group of thimbles is as follows:

L_i＝x，(i＝1)

L_i＝2x，(i＝2,3,4,…)

wherein, L is_iAnd a first preset distance is represented, and the i represents the ascending times of the first group of ejector pins.

For example, when the number of times of the first group of ejector pins rises is 1, the first group of ejector pins are controlled to move x millimeters in a first preset direction; and when the ascending times of the first group of ejector pins are 2, 3, 4, … …, n-1 and n, controlling the first group of ejector pins to move 2x millimeters in the first preset direction. Wherein n is any natural number greater than 1. Of course, in practical application, the unit of the first preset distance can be set to other distance measurement units; other corresponding relations between the first preset distance and the ascending times of the first group of ejector pins can be set, for example, the first movement x, the second movement 2x and the third movement x are set, and the distances of each movement are also set to be equal, which is not limited herein.

Step S104, controlling the first group of thimbles to descend so that the second group of thimbles support the substrate.

In a specific application, the first group of ejector pins can be a movable ejector pin group, and the second group of ejector pins can be an immovable ejector pin group; the first group of ejector pins and the second group of ejector pins have a heating function; and the first group of ejector pins and the second group of ejector pins can be arranged, and only one group of ejector pins has a heating function.

And S105, when the first group of thimbles descends to a second preset position, controlling the first group of thimbles to return to the initial position.

Referring to FIG. 2, in one embodiment, FIG. 2-C illustrates the first set of lift pins 25 lowered to a second predetermined position P2 such that the second set of lift pins 24 support the glass substrate 22.

The second preset position refers to that the first group of ejector pins are descended to be not in contact with the substrate any more, and the substrate is supported by the second group of ejector pins at the moment.

In a specific application, a distance that the first group of ejector pins ascend from the initial position to the first preset position may be equal to a distance that the first group of ejector pins descend from the first preset position to the second preset position.

Referring to FIG. 2, in one embodiment, FIG. 2-D illustrates the first set of ejector pins 25 returning to the initial position P0.

In a specific application, the second group of ejector pins can be an ejector pin group capable of moving up and down. When the first group of ejector pins are controlled to descend, the second group of ejector pins are controlled to ascend, so that the substrate is supported by the second group of ejector pins.

In a specific application, the second group of ejector pins can be controlled to descend, so that the first group of ejector pins can support the substrate; controlling the first group of thimbles to move a first preset distance from the initial position to a first preset direction so as to enable the substrate to move the first preset distance to the first preset direction; controlling the second group of thimbles to ascend to support the substrate; and controlling the first group of ejector pins to return to the initial position.

In one embodiment, referring to fig. 3, after the first set of ejector pins is returned to the initial position, the method further comprises:

step S301, acquiring timing time, resetting the timing time and the rising times of the first group of thimbles as initial values when the timing time is equal to or greater than preset time, restarting timing and circularly executing the following steps.

In a specific application, the preset time may be 1/2 times of the baking time. The baking time refers to the total time from the beginning of timing to the end of baking. The baking time may be set manually.

In a specific application, the timing time and the number of times of the first group of ejector pins are reset to initial values, and the initial values may be 0.

In a specific application, after the timing time is obtained, if the timing time is equal to or greater than a preset time, resetting the timing time and the rising times of the first group of ejector pins as initial values, starting to time and executing the following steps in a circulating manner, wherein the step of executing the following steps in the circulating manner is executed from step S302 to step S306 sequentially, and then continuing to execute from step S302; if the timing time is less than the preset time, the execution is continued from step S102.

In one embodiment, the substrate is moved 1/2 for a baking time in a first predetermined direction and then moved 1/2 for a baking time in a second predetermined direction. Therefore, if the timing time is less than the preset time, it means that the first set of pins has not moved 1/2 for the toasting time in the first preset direction, then the process is executed continuously from step S102, and if the timing time is equal to or greater than the preset time, it means that the first set of pins has moved 1/2 for the toasting time in the first preset direction, then the process is executed continuously in the opposite direction, that is, the timing time and the number of times the first set of pins is lifted are reset to the initial values, the current position is used as the starting point for moving in the second preset direction again, and then the timing is started and the process is executed from step S302.

In a specific application, the number of times of the first group of ejector pins rising can also be acquired, if the number of times is equal to a preset number of times, the number of times of the first group of ejector pins rising is reset to an initial value, and the following steps are executed in a circulating manner. The preset number of times can be set as the number of times that the first group of ejector pins needs to be lifted in the baking time of 1/2.

Step S302, controlling the first set of lift pins to lift from the initial position to support the substrate, and recording the number of times the first set of lift pins lift.

The step is identical to step S102, and the description of step S102 may be specifically referred to, which is not repeated herein.

Step S303, when the first group of ejector pins rises to the first preset position, controlling the first group of ejector pins to move a second preset distance in a second preset direction, so that the substrate moves the second preset distance in the second preset direction, where the second preset direction is opposite to the first preset direction, and the second preset distance is related to the rising frequency of the first group of ejector pins.

In a specific application, the initial value is 0, and the correlation between the second preset distance and the rising times of the first group of thimbles is as follows:

R_i＝x，(i＝1)

R_i＝2x，(i＝2,3,4,…)

wherein, R is_iAnd a second preset distance is represented, and the i represents the ascending times of the first group of ejector pins.

For example, when the number of times of the first group of ejector pins rises is 1, the first group of ejector pins are controlled to move x millimeters in a first preset direction; and when the ascending times of the first group of ejector pins are 2, 3, 4, … …, n-1 and n, controlling the first group of ejector pins to move 2x millimeters in the first preset direction. Wherein n is any natural number greater than 1. Of course, in practical application, the unit of the first preset distance can be set to other distance measurement units; other corresponding relations between the first preset distance and the ascending times of the first group of ejector pins can be set, for example, if the first movement x, the second movement 2x and the third movement x are carried out along the first preset direction, the first movement 2x, the second movement x and the third movement 2x are carried out along the second preset direction, so that the same ejector pin and the substrate can be prevented from repeatedly contacting at the same position or contacting for a long time; it is also possible to set the distance of each movement along the second preset direction to be equal, and the specific movement distance is not limited herein, but it is required to ensure that the distance of the last movement along the first preset direction is different from the distance of the first movement along the second preset direction.

In a specific application, the second preset direction opposite to the first preset direction may refer to that the first preset direction is horizontal leftward, and the second preset direction is horizontal rightward; or the first preset direction is horizontal rightward, and the second preset direction is horizontal leftward; it can also mean that the first preset direction is horizontal forward and the second preset direction is horizontal backward, or the first preset direction is horizontal backward and the second preset direction is horizontal forward. The horizontal may refer to being parallel to the substrate.

Step S304, controlling the first set of needles to descend so that the second set of needles support the substrate.

Step S305, when the first group of pins descends to the second preset position, controlling the first group of pins to return to the initial position.

Step S306, acquiring timing time, and discharging the substrate when the timing time is equal to or greater than the preset time.

In a specific application, controlling the first group of thimbles to return to the initial position, obtaining timing time, if the timing time is equal to or greater than the preset time, removing the substrate, ending timing and ending baking; if the timing time is less than the preset time, the step S302 is continuously executed.

As can be seen from the above, the steps S102 to S105 and the steps S302 to S305 are actually the processes of moving the substrate in the opposite direction. In the process of moving to the first preset direction, steps S102 to S105 are executed in a loop, and after step S105 is executed each time, step S301 (actually, steps S102, S103, S104, S105, and S301 are executed in a loop) is required to determine whether the substrate moves to the first preset direction for a preset time, if step S102 to step S105 is not executed for the preset time, if the substrate moves to the first preset direction for the preset time, the step S302 to step S305 are executed again and moves to the opposite direction, and after step S305 is executed each time, step S306 (actually, steps S302, S303, S304, S305, and S306 are executed in a loop) is required to determine whether the substrate moves to the second preset direction for the preset time, and if the substrate moves to the second preset direction for the preset time, the substrate is excluded.

In addition, the contact time of the second group of ejector pins and the contact time of the first group of ejector pins with the substrate can be the same when the first group of ejector pins and the first group of ejector pins move for the first preset distance or the second preset distance each time. Thus, the time for contacting a certain contact point in the liquid crystal display panel with a certain thimble is actually as follows: the total baking time is divided by the total number of moves.

The baking method in the embodiment of the invention starts timing and executes the following steps circularly after acquiring the preset instruction: controlling a first group of thimbles to ascend from an initial position to support the substrate, and recording the ascending times of the first group of thimbles; when the first group of ejector pins rises to a first preset position, controlling the first group of ejector pins to move a first preset distance towards a first preset direction so as to enable the substrate to move the first preset distance towards the first preset direction, wherein the first preset distance is related to the rising times of the first group of ejector pins; controlling the first group of ejector pins to descend so that the second group of ejector pins support the substrate; and when the first group of ejector pins descends to a second preset position, controlling the first group of ejector pins to return to the initial position. This technical scheme makes same thimble and base plate same position only once contact, has prevented that same thimble and base plate same position from contacting repeatedly or long-time contact, makes the heating time of each position of base plate unanimous, has effectively overcome the uneven problem of being heated among the baking process.

It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

Fig. 4 is a schematic block diagram of a toasting apparatus according to an embodiment of the present invention, which is only shown for convenience of illustration. The baking apparatus includes:

a first obtaining unit 41, configured to obtain a predetermined instruction, start timing, and control the following units to work cyclically:

and a first lift control unit 42, configured to control the first set of lift pins to lift and support the substrate from the initial position, and record the number of times that the first set of lift pins lift.

The first moving control unit 43 is configured to control the first group of ejector pins to move the first preset distance in the first preset direction when the first group of ejector pins rises to the first preset position, so that the substrate moves the first preset distance in the first preset direction, where the first preset distance is related to the rising times of the first group of ejector pins.

L_i＝x，(i＝1)

L_i＝2x，(i＝2,3,4,…)

wherein, L is_iAnd the first preset distance is represented, and the i represents the ascending times of the first group of thimbles.

A first descending control unit 44, configured to control the first group of lift pins to descend so that the second group of lift pins supports the substrate.

And a first return control unit 45, configured to control the first group of ejector pins to return to the initial position when the first group of ejector pins descends to the second preset position.

In one embodiment, referring to fig. 5, the toasting device further comprises:

the second obtaining unit 51 is further configured to obtain a timing time after the first group of ejector pins return to the initial position, reset the timing time and the number of times that the first group of ejector pins ascend to initial values when the timing time is equal to or greater than the preset time, restart timing, and control the following units to work in a cycle:

the second lift control unit 52 is configured to control the first set of lift pins to lift and support the substrate from the initial position, and record the number of times that the first set of lift pins lift.

The second moving control unit 53 is further configured to control the first set of ejector pins to move in the second preset direction by the second preset distance when the first set of ejector pins rises to the first preset position, so that the substrate moves in the second preset direction by the second preset distance, the second preset direction is opposite to the first preset direction, and the second preset distance is related to the rising times of the first set of ejector pins.

R_i＝x，(i＝1)

R_i＝2x，(i＝2,3,4,…)

wherein, R is_iAnd the second preset distance is represented, and the i represents the ascending times of the first group of thimbles.

And a second descending control unit 54 configured to control the first group of lift pins to descend so that the second group of lift pins supports the substrate.

The second return control unit 55 is further configured to control the first group of ejector pins to return to the initial position when the first group of ejector pins descends to the second preset position.

A discharge control unit 56 for acquiring a timed time, and discharging the substrate when the timed time is equal to or greater than the preset time.

In a specific application, the preset time is 1/2 times the baking time.

It will be clear to those skilled in the art that, for convenience and simplicity of description, the foregoing division of the functional units is merely illustrated, and in practical applications, the above distribution of functions may be performed by different functional units according to needs, that is, the internal structure of the apparatus may be divided into different functional units to perform all or part of the functions described above. Each functional unit in the embodiments may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit, and the integrated unit may be implemented in a form of hardware, or in a form of software functional unit. In addition, specific names of the functional units are only used for distinguishing one functional unit from another, and are not used for limiting the protection scope of the application. The specific working process of the units in the system may refer to the corresponding process in the foregoing method embodiment, and is not described herein again.

Fig. 6 is a schematic view of a baking apparatus according to an embodiment of the present invention. As shown in fig. 6, the baking apparatus 6 of this embodiment includes: a processing unit 60, a storage unit 61 and a computer program 62, such as a program for a baking method, stored in said storage unit 61 and executable on said processing unit 60. The processing unit 60, when executing the computer program 62, implements the steps in the various baking method embodiments described above, such as the steps S101 to S105 shown in fig. 1. Alternatively, the processing unit 60, when executing the computer program 62, implements the functions of the units in the above-described device embodiments, such as the functions of the units 41 to 45 shown in fig. 4.

For example, the computer program 62 may be divided into one or more units, which are stored in the storage unit 61 and executed by the processing unit 60 to accomplish the present invention. The one or more units may be a series of computer program instruction segments capable of performing specific functions, which are used to describe the execution of the computer program 62 in the toasting device 6. For example, the computer program 62 may be divided into a first acquisition unit, a first ascending control unit, a first movement control unit, a first descending control unit, and a first returning control unit (unit in the virtual device), and the specific functions of each unit are as follows:

and the first lifting control unit is used for controlling the first group of ejector pins to lift and support the substrate from the initial position and recording the lifting times of the first group of ejector pins.

The first mobile control unit is used for controlling the first group of thimbles to move towards the first preset direction by the first preset distance when the first group of thimbles ascend to the first preset position, so that the substrate moves towards the first preset direction by the first preset distance, and the first preset distance is related to the ascending times of the first group of thimbles.

L_i＝x，(i＝1)

L_i＝2x，(i＝2,3,4,…)

And the first descending control unit is used for controlling the first group of ejector pins to descend so that the second group of ejector pins support the substrate.

In one embodiment, the toasting device further comprises:

the second obtaining unit is further configured to obtain a timing time after the first group of ejector pins return to the initial position, reset the timing time and the number of times that the first group of ejector pins ascend to initial values when the timing time is equal to or greater than the preset time, restart timing, and control the following units to work in a cycle:

and the second lifting control unit is used for controlling the first group of ejector pins to lift from the initial position to support the substrate and recording the lifting times of the first group of ejector pins.

The second mobile control unit is further used for controlling the first group of ejector pins to move towards the second preset direction by the second preset distance when the first group of ejector pins rise to the first preset position, so that the substrate moves towards the second preset direction by the second preset distance, the second preset direction is opposite to the first preset direction, and the second preset distance is related to the rising times of the first group of ejector pins.

R_i＝x，(i＝1)

R_i＝2x，(i＝2,3,4,…)

And the second descending control unit is used for controlling the first group of ejector pins to descend so that the second group of ejector pins support the substrate.

And the second return control unit is also used for controlling the first group of ejector pins to return to the initial position when the first group of ejector pins descends to the second preset position.

And the discharge control unit is used for acquiring timing time and discharging the substrate when the timing time is equal to or greater than the preset time.

In a specific application, the preset time is 1/2 times the baking time.

The baking device 6 may be a desktop computer, a notebook, a palm computer, a cloud server, or other computing devices. The baking device may include, but is not limited to, a processing unit 60, a storage unit 61. It will be understood by those skilled in the art that fig. 6 is merely an example of the toasting apparatus 6, and does not constitute a limitation of the toasting apparatus 6, and may include more or less components than those shown, or some components in combination, or different components, for example, the toasting apparatus may also include input output devices, network access devices, buses, etc.

The Processing Unit 60 may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), an off-the-shelf Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic, discrete hardware components, etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.

The storage unit 61 may be an internal storage unit of the toasting device 6, such as a hard disk or a memory of the toasting device 6. The storage unit 61 may also be an external storage unit of the baking apparatus 6, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), and the like, which are provided on the baking apparatus 6. Further, the storage unit 61 may also include both an internal storage unit and an external storage device of the baking apparatus 6. The storage unit 61 is used for storing the computer program and other programs and data required by the oven. The storage unit 61 may also be used to temporarily store data that has been output or is to be output. In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.

In the embodiments provided in the present invention, it should be understood that the disclosed apparatus/terminal device and method may be implemented in other ways. For example, the above-described embodiments of the apparatus/terminal device are merely illustrative, and for example, the division of the modules or units is only one logical division, and there may be other divisions when actually implemented, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.

The integrated modules/units, if implemented in the form of software functional units and sold or used as separate products, may be stored in a computer readable storage medium. Based on such understanding, all or part of the flow of the method according to the embodiments of the present invention may also be implemented by a computer program, which may be stored in a computer-readable storage medium, and when the computer program is executed by a processor, the steps of the method embodiments may be implemented. Wherein the computer program comprises computer program code, which may be in the form of source code, object code, an executable file or some intermediate form, etc. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, usb disk, removable hard disk, magnetic disk, optical disk, computer Memory, Read-Only Memory (ROM), Random Access Memory (RAM), electrical carrier wave signals, telecommunications signals, software distribution medium, and the like. It should be noted that the computer readable medium may contain other components which may be suitably increased or decreased as required by legislation and patent practice in jurisdictions, for example, in some jurisdictions, computer readable media which may not include electrical carrier signals and telecommunications signals in accordance with legislation and patent practice.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.

Claims

1. A baking method, comprising the steps of:

2. The toasting method of claim 1, wherein after said first set of pins are returned to said initial position, said method further comprises:

acquiring timing time, resetting the timing time and the rising times of the first group of thimbles as initial values when the timing time is equal to or greater than preset time, restarting timing and circularly executing the following steps:

controlling the first group of thimbles to ascend from the initial position to support the substrate, and recording the ascending times of the first group of thimbles;

when the first group of ejector pins rises to the first preset position, controlling the first group of ejector pins to move towards a second preset direction by a second preset distance so as to enable the substrate to move towards the second preset direction by the second preset distance, wherein the second preset direction is opposite to the first preset direction, and the second preset distance is related to the rising times of the first group of ejector pins;

when the first group of ejector pins descends to the second preset position, controlling the first group of ejector pins to return to the initial position;

and acquiring timing time, and discharging the substrate when the timing time is equal to or greater than the preset time.

3. The toasting method according to claim 1, wherein the first predetermined distance is related to the number of times the first set of pins are raised by:

wherein, the

Represents the first preset distance, the

And the ascending times of the first group of thimbles are shown.

4. The toasting method according to claim 2 wherein said initial value is 0 and said second predetermined distance is related to the number of times said first set of pins is raised by:

wherein, the

Represents the second preset distance, the

And the ascending times of the first group of thimbles are shown.

5. The baking method of claim 2 wherein the predetermined time is 1/2 times the baking time.

6. A toasting apparatus, comprising:

the first lifting control unit is used for controlling the first group of thimbles to lift the support substrate from the initial position and recording the lifting times of the first group of thimbles;

the first moving control unit is used for controlling the first group of ejector pins to move a first preset distance to a first preset direction when the first group of ejector pins ascend to a first preset position, so that the substrate moves the first preset distance to the first preset direction, and the first preset distance is related to the ascending times of the first group of ejector pins;

the first descending control unit is used for controlling the first group of thimbles to descend so that the second group of thimbles support the substrate;

and the first return control unit is used for controlling the first group of ejector pins to return to the initial position when the first group of ejector pins descends to a second preset position.

7. The toasting apparatus of claim 6, further comprising:

the second obtaining unit is further configured to obtain a timing time after the first group of ejector pins return to the initial position, reset the timing time and the number of times that the first group of ejector pins ascend to initial values when the timing time is equal to or greater than a preset time, restart timing, and control the following units to work in a cycle:

the second lifting control unit is used for controlling the first group of ejector pins to lift from the initial position to support the substrate and recording the lifting times of the first group of ejector pins;

the second movement control unit is further configured to control the first group of ejector pins to move a second preset distance in a second preset direction when the first group of ejector pins ascend to the first preset position, so that the substrate moves the second preset distance in the second preset direction, the second preset direction is opposite to the first preset direction, and the second preset distance is related to the ascending times of the first group of ejector pins;

the second descending control unit is used for controlling the first group of ejector pins to descend so that the second group of ejector pins support the substrate;

the second return control unit is also used for controlling the first group of ejector pins to return to the initial position when the first group of ejector pins descends to the second preset position;

8. The toasting apparatus as claimed in claim 7, wherein said first predetermined distance is related to the number of times said first set of pins is:

wherein, the

Represents the first preset distance, the

Represents the first group of thimblesThe number of rises;

the initial value is 0, and the correlation between the second preset distance and the rising times of the first group of thimbles is specifically as follows:

wherein, the

Represents the second preset distance, the

And the ascending times of the first group of thimbles are shown.

9. The toasting apparatus of claim 7 wherein said predetermined time is 1/2 times the toasting time.

10. A toasting apparatus comprising a memory unit, a processing unit and a computer program stored in the memory unit and executable on the processing unit, characterized in that the processing unit realizes the steps of the method according to any of the claims 1 to 5 when executing the computer program.