CN108072215A - Use the circulation fluid temprature control method of cooler - Google Patents

Use the circulation fluid temprature control method of cooler Download PDF

Info

Publication number
CN108072215A
CN108072215A CN201710826912.8A CN201710826912A CN108072215A CN 108072215 A CN108072215 A CN 108072215A CN 201710826912 A CN201710826912 A CN 201710826912A CN 108072215 A CN108072215 A CN 108072215A
Authority
CN
China
Prior art keywords
cooler
circulation fluid
control
circulation
compressor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710826912.8A
Other languages
Chinese (zh)
Inventor
酒井豊
谷口啓旨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China House Co Ltd
Nakaya Co Ltd
Original Assignee
China House Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by China House Co Ltd filed Critical China House Co Ltd
Publication of CN108072215A publication Critical patent/CN108072215A/en
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00Arrangement or mounting of control or safety devices
    • F25B49/02Arrangement or mounting of control or safety devices for compression type machines, plants or systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67248Temperature monitoring
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00Control issues
    • F25B2600/02Compressor control
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00Control issues
    • F25B2600/25Control of valves
    • F25B2600/2513Expansion valves
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Drying Of Semiconductors (AREA)
  • Control Of Temperature (AREA)
  • Other Air-Conditioning Systems (AREA)
  • Air Conditioning Control Device (AREA)

Abstract

A kind of circulation fluid temprature control method using cooler, including providing a circulation loop, for cycling a refrigerant;The compressor of an inverter control is provided, for by refrigerant compression to high pressure;A condenser is provided, for condensating refrigerant;Pressure of one electric expansion valve for reducing refrigerant is provided;There is provided includes a refrigerator unit of a heat exchanger;And provide include a circulation fluid circulation loop at least one it is remote controlled and can state modulator cooler, be controlled in the circulation fluid of predetermined temperature to control object for supply.The predetermined temperature of advance partition loops liquid is multiple regions, and parameterizes and set an aperture of an operation frequency of the compressor of inverter control and electric expansion valve according to each region.

Description

Use the circulation fluid temprature control method of cooler
Technical field
The invention relates to a kind of circulation fluid temprature control method and its maintaining method using cooler, for controlling Such as the various devices of semiconductor manufacturing apparatus and the temperature of processing procedure, and can be remote come use by network in particular to one kind Process control and can state modulator cooler circulation fluid temprature control method and its maintaining method.
Background technology
In the prior art, in semiconductor manufacturing, it is necessary to control the constant temperature in each step.Therefore, cooler Fluid temperature is controlled by cycling circulation fluid.
Usual cooler has refrigerator unit, for the temperature of control loop liquid to supply to processing procedure and control loop liquid Temperature to predetermined temperature.In refrigerator unit, when refrigerant follows between compressor, condenser, expansion valve and evaporator During ring, controlled by refrigerant and from the heat exchange between the circulation fluid that processing procedure returns into trip temperature.The temperature drop of circulation fluid Low to arrive required temperature or lower, afterwards, circulation fluid is heated to required temperature by heater.
At this point, the processing procedure of etching semiconductor is, for example, using three species of polymer, metal and oxide as representative.Due to every The temperature of a required circulation fluid of processing procedure is different, in existing refrigerator, uses constant speed compressor and mechanical swollen Swollen valve.No matter the design temperature of circulation fluid, by operating the compressor of maximum capacity, the cooling capacity of maximizing cooler and Cooling circulation liquid.Afterwards, increase the temperature of circulation fluid by heater, the temperature of circulation fluid is increased into predetermined temperature.
However, in many processing procedures of semiconductor manufacturing, the cooling capacity of cooler can be substantially beyond the refrigeration of needs Capacity, in this case, in foregoing existing method, circulation fluid is cooled to the temperature significantly lower than required cooling temperature Degree.Circulation fluid is cooled excessively, and then, circulation fluid is heated excessively, so as to cause the waste of energy.Therefore, in recent years, endeavour In energy saving, to avoid aforementioned circumstances.
In addition, as described above, constant-speed compressor cannot be adjusted subtly used in existing refrigerator, because constant speed The operation frequency of compressor is constant and its capacity is fixed.Further, since expansion valve used in existing refrigerator It is mechanical and its aperture and capacity are fixed, therefore as compressor, it is impossible to subtly adjusted.Therefore, it is existing Refrigerator variation etc. of environment can not be adapted to original ability, usually adapt to the variation of environment by replacing cooler Deng causing the increase of cost.
Prior art literature
Patent document
Patent document 1:Japanese Unexamined Patent Publication 2015-59726 publications
Patent document 2:Japanese Unexamined Patent Publication 2013-20509 publications
Patent document 3:Japanese Unexamined Patent Publication 2011-114279 publications
Patent document 4:Japanese Unexamined Patent Publication 2003-148852 publications
The content of the invention
It is an object of the invention to provide a kind of circulation fluid temprature control methods using cooler, easily carry out cooler Adjustment and maintenance.
To achieve the above object, the embodiment of the present invention provides a kind of circulation fluid temprature control method using cooler, For keeping the control object in a predetermined temperature, bag by cycling a circulation fluid to a temperature controlled control object is needed It includes:
A circulation loop is provided, for cycling a refrigerant;
The compressor for being arranged on the inverter control in the circulation loop is provided, for the refrigerant compression that will gasify To high pressure;
One condenser is provided, for pass through heat exchange with condense by the compressor compresses of the inverter control to high pressure should Refrigerant;
An electric expansion valve is provided, for reducing the pressure of the liquefied refrigerant in the condenser;
There is provided includes a refrigerator unit of a heat exchanger, and pressure will be reduced by the electric expansion valve for passing through heat exchange The refrigerant of power is converted into gas;And
There is provided at least one remote control and can be capable of the cooler of state modulator, this at least one being capable of remote control and energy The cooler of enough state modulators includes a circulation fluid circulation loop, at least one being capable of remote control and being capable of state modulator using this Cooler be controlled in this for circulating in the circulation fluid between the refrigerator unit and the control object and supply The circulation fluid of predetermined temperature to the control object,
The predetermined temperature of the circulation fluid is wherein divided in advance as multiple regions, and according to each region parameterizing and An operation frequency of the compressor of the inverter control and an aperture of the electric expansion valve are set,
The refrigerator unit is operated, the circulation fluid is adjusted in the heat exchanger to the predetermined temperature,
The running of the compressor of the inverter control is adjusted by the circulation fluid circulation loop and according to a predefined parameter The aperture of frequency and the electric expansion valve to cycle the circulation fluid to the control object,
This at least one remote control and can be capable of the cooler of state modulator and be connected to an operating terminal by network Or enable an at least remote control and be capable of the cooler of state modulator for can connection status,
When this at least one can remote control and be capable of state modulator cooler an operating environment change and need change When becoming the predefined parameter, in the operating terminal, the operation frequency and the electronics for changing the compressor of the inverter control are swollen The predefined parameter of the aperture of swollen valve.
Further, it is multiple remote control and the cooler of state modulator is capable of to be connected to the operating terminal, and should Operating terminal, which can control, the plurality of remote control and can be capable of the cooler of state modulator.
Further, this at least one can remote control and be capable of state modulator cooler include a second heat exchanger And a second circulation liquid circulation loop, the second heat exchanger will be for will be arranged in the refrigerator unit and will be supplied to this The circulation fluid of control object is controlled in the predetermined temperature, the second circulation liquid circulation loop for cycle the circulation fluid in this The circulation fluid of the predetermined temperature is controlled in the control object between two heat exchangers and control object and for supplying.
In one of present invention embodiment, using it is remote controlled and can state modulator cooler circulation fluid temperature control In method processed and maintaining method, compressor and the state modulator of the specific region of electric expansion valve with inverter control are used Type cooler, the design temperature of circulation fluid are divided into multiple regions in advance.In the temprature control method of circulation fluid and maintenance side The state modulator type cooler of specific region, according in each region, the operation frequency and electric expansion valve of compressor are used in method Aperture be parameterized and in advance according to each region set.Cooler is made to be connected to operating terminal or makes cooler by network For the state that can be connected, parameter is when operating terminal changes, it is necessary to change the operation frequency and electric expansion valve of compressor Aperture parameter is to adapt to the change of the operating environment of cooler.
In the temprature control method of circulation fluid, using the state modulator type cooler of specific region, when being set or changed During the aperture of the operation frequency of compressor and electric expansion valve, it is necessary to manually or automatically set cooler.
Therefore, when installing substantial amounts of cooler and changing parameter value, the problem of may also indicate that in running.
As described above, according to an embodiment of the invention, present inventors have proposed a kind of control of using area and state modulators The temprature control method of the circulation fluid of the cooler of type.As a result, even if because of environmental change etc., the cooling capacity of cooler declines Or it is similar happen, without replace cooler.Since cooler can be with remote control, It is not necessary to go to cooling Device is mounted for the place safeguarded, therefore can reduce staff cost.
This means, the method that the temperature for the circulation fluid that people proposes adjusts according to the present invention, the operation frequency and electronics of compressor The aperture of expansion valve is parameterized and is set in advance according to the region divided in advance, and the cooling capacity of cooler can pass through change Pre-set parameter changes.Therefore, though because the operating environment of cooler change when, and cannot be taken with preset parameter value The target temperature of the circulation fluid obtained, such as variation at room temperature.Cooler copes with parameter correction, freezes without replacing Machine, to significantly decrease cost.
Description of the drawings
Fig. 1 be one embodiment of the invention using it is remote controlled and can state modulator cooler circulation fluid temperature control The schematic diagram of method processed and its maintaining method.
Fig. 2 be one embodiment of the invention using it is remote controlled and can state modulator cooler circulation fluid temperature control The schematic block diagram of the cooler of specific region state modulator type in method processed and its maintaining method.
Wherein, reference numeral:
1 cooler
2 refrigerator units
3 circulation loops
4 compressors
5 condensers
6 electric expansion valves
7 heat exchangers (evaporator)
8 cooling water circulation loops
801 cooling water supply passages
802 cooling water backward channels
9 circulation fluid circulation loops
901 circulation fluid feed paths
902 circulation fluid backward channels
903 heaters
904 pumps
11 hot gas feed paths
12 electric expansion valves
13 cooling refrigerant feed paths
14 electric expansion valves
15 second heat exchangers
16 second circulating chilled water circuits
1601 second cold water supply passages
1602 second chilled(cooling) water return (CWR)s
17 second circulation liquid circulation loops
1701 second circulation liquid feed paths
1702 second circulation liquid backward channels
18a, 18a, 18a, 18d solenoid valve
19 control valves
20 Xun Huan liquid baths
21 switches
22 solenoid valves
23 pressure sensors
24 temperature sensors
25 pressure sensors
26 drain valves
27 control devices
31 routers
32 cooler terminals
33 operating terminals
34 networks
Specific embodiment
According to an embodiment of the invention, in the temprature control method and maintaining method of the circulation fluid of remote control, use The state modulator type cooler of specific region, and cooler includes refrigerator unit, between refrigerator unit and control object The circulation fluid for cycling and circulation fluid circulation loop.Circulation fluid circulation loop is controlled to the cycling of predetermined temperature to supply Liquid is to control object.
The refrigerator unit of the embodiment of the present invention has to make following for refrigerant circulation such as general refrigerator unit Loop back path includes compressor, condenser, expansion valve and heat exchanger in circulation loop.Compressor is used for the refrigeration that will gasify Agent is compressed to high pressure.Condenser is used to be compressed by the compressor the refrigerant of high pressure by heat exchange to condense.Expansion valve is used for Reduce the pressure of liquefied refrigerant within the condenser.Heat exchanger is used to reduce inflated valve by heat exchange the system of pressure Cryogen is converted into gas.Compressor can be inverter control, and expansion valve uses electronic expansion valve.
In an embodiment of the present invention, the temperature of circulation fluid is divided into multiple regions in advance.Multiple regions use foregoing The cooler that mode configures.The operation frequency of compressor and electric expansion valve are parameterized and set according to each region.
Then, the parameter in the region according to belonging to the temperature corresponding to the circulation fluid circulated in control object, setting pressure The operation frequency and electric expansion valve of contracting machine.Afterwards, start refrigerator unit, and circulation fluid is adjusted to predetermined temperature.By following Ring liquid circulation loop, makes circulation fluid be cycled in control object.
In addition, in an embodiment of the present invention, if necessary, cooler is connected in a wired or wireless fashion by network It is connected to operating terminal.When cooler operating environment change and need change predefined parameter when, in operating terminal, change compression The operation frequency of machine and the aperture of electric expansion valve, so that the temperature of circulation fluid reaches predetermined temperature.
In the present embodiment, multiple coolers are connected to operating terminal, and operating terminal can control multiple coolers.
[embodiment 1]
In an embodiment of the present invention, using it is remote controlled and can the cooler of state modulator (hereinafter referred to as cool down Device) circulation fluid temprature control method and its maintaining method (hereinafter referred to as the circulation fluid temprature control method of remote control and Its maintaining method) in, it is explained with reference to the embodiment of the present invention.Fig. 1 is the temprature control method for being used to implement circulation fluid With the schematic diagram of the whole system of method for maintaining.
In Fig. 1, label 33 represent operating terminal, the temprature control method of the circulation fluid of the remote control of the present embodiment and Maintaining method, multiple coolers 1 are connected to an operating terminal 33 by network 34, and operating terminal 33 can control it is multiple cold But the start of device 1.
In other words, in order to implement system in the present embodiment, multiple coolers 1 are connected to via router 31 as cooler The computer 32 of the terminal of side.The terminal 32 of cooler side is connected to via network 34 on the computer as operating terminal 33. Then, operating terminal 33 monitors the state of each cooler 1, and when it is necessary to change each cooler 1 predetermined parameter, Each cooler is controlled to change parameter.
With reference to Fig. 2, illustrate the cooler used in the present embodiment.Fig. 2 shows the cooling used in the present embodiment The schematic block diagram of device.Label 1 in figure is used cooler in the present embodiment.
The cooler 1 of the present embodiment includes refrigerator unit.Label 2 namely in figure is refrigerator unit.The present invention The refrigerator unit 2 of the cooler 1 of embodiment has to make being recycled back to for refrigerant circulation such as general refrigerator unit Road 3 includes compressor 4, condenser 5, expansion valve 6 and heat exchanger 7 in circulation loop 3.Compressor 4 is used for what will be gasified Refrigerant compression is to high pressure.Condenser 5 is used to be compressed to the refrigerant of high pressure by compressor 4 by heat exchange to condense.Expansion Valve 6 for reducing the liquefied refrigerant in condenser 5 pressure.Heat exchanger 7 is used to drop inflated valve 6 by heat exchange The refrigerant of low-pressure is converted into gas.
Compressor 4 can be inverter control, and expansion valve 6 uses electronic expansion valve.
Then, label 8 is cooling water circulation loop in the figure, is compressed to for passing through heat exchange with condensing by compressor 4 The gaseous refrigerant of high pressure and high temperature.
In other words, cooling water circulation loop 8 includes cooling water supply passage 801 and cooling water backward channel 802.It is cold But water feed path 801 is as cooling tower etc. is for supplying cooled cooling water into condenser 5.Cooling water backward channel After 802 are used for the refrigerant progress heat exchange in cooling water and condenser 5, cooling water is returned into cooling tower etc..Cooling water Backward channel 802 is the circulating path that cooling water is cycled in cooling tower etc. between condenser.However, condenser 5 is not limited to Water cooled condenser or air cooled condenser.It can be passed through in the gaseous refrigerant of high pressure-temperature by compressor 4 It is condensed with air heat exchange.
Label 9 represents a circulation fluid circulation loop in the figure, i.e. used cooler 1 has in the present embodiment Circulation fluid circulation loop 9 is to make circulation fluid be circulated between control object and heat exchanger 7, and control object is for example with semiconductor Etch process into trip temperature control.Cooler 1 is to control loop liquid to predetermined temperature and provides circulation fluid to control pair As.
In other words, circulation fluid circulation loop 9 includes circulation fluid feed path 901 and circulating liquid backward channel 902.It follows Ring liquid feed path 901 reduces the circulation fluid of temperature to control object to provide by heat exchanger 7.Circulation fluid backward channel 902 to make in control object improve temperature circulation fluid be back to heat exchanger 7.In circulation fluid feed path 901, if Heater 903 is put to heat by the circulation fluid of heat exchanger reduction temperature to design temperature.In circulation fluid backward channel 902, 904 and solenoid valve 18c of pump is set.
Label 11 is that hot gas feed path is used to provide hot gas in the front of heat exchanger 7 in the figure.Label 12 is For adjusting the electric expansion valve of the flow of hot gas etc..Label 13 is cooling refrigerant feed path to carry in the figure For refrigerant to compressor 4 to cool down compressor 4.Label 14 is for adjusting the cooling refrigerant for being provided to compressor 4 The electric expansion valve of flow etc..
Label 20 is Xun Huan liquid bath in the figure, and label 21 is switch, and label 18,18b, 18c and 18d are electromagnetism Valve, label 24 are temperature sensors, and label 23,25 is pressure sensor, and label 19 is control valve, and label 26 is drain valve.
Then, the label 27 in figure is control device, i.e. there is used cooler control to fill in the present embodiment Put 27.Control device 27, such as general control device have control base board and panel-switch.Control base board includes such as micro computer Control unit.Panel-switch is providing instructions to control unit.It can be set by operation panel switch and change compressor 4 Operation frequency and electric expansion valve 6 aperture.Or the start of control solenoid valve 18a, 18a, 18a, 18d can control it is entire cold But the start of device.
Label 15 is second heat exchanger in the figure.That is, in the cooler 1 of the present embodiment, except include for reducing The heat exchanger 7 of the temperature of circulation fluid when compressor 4 operates also has the refrigerator unit 2 for including second heat exchanger 15. Second heat exchanger 15 for compressor it is inoperative when, make cooling water by reduce the temperature of circulation fluid.It is provided to control pair The design temperature of the circulation fluid of elephant can be reduced to predetermined temperature.In the high temperature that need not be operated in compressor 4, compressor 4 is not transported Turn and cooling water by the temperature of circulation fluid in second heat exchanger 15 by being reduced to predetermined temperature.
Second heat exchanger 15 includes the second cooling water circulation loop 16 and second circulation liquid circulation loop 17.Second cooling Water-flow circuit 16 is used to provide cooling water to second heat exchanger 15 by cooling tower.Second circulation liquid circulation loop 17 to Circulation fluid is made to be circulated between the controlled control object of temperature and second heat exchanger 15.
Second cooling water circulation loop 16 includes the second cooling water supply passage 1601 and the second cooling water backward channel 1602.Second cooling water supply passage 1601 is used to provide cooling water to second heat exchanger 15 by cooling tower.In the second heat In exchanger 15, rise from the cooling water that the control object higher than design temperature returns and temperature after circulation fluid heat exchange, second Cooling water is returned to cooling tower by cooling water backward channel 1602.Second cooling water backward channel 1602 is handed over for cooling tower and the second heat Circulation canal between parallel operation 15.
Second circulation liquid circulation loop 17 includes second circulation liquid feed path 1701 and second circulation liquid backward channel 1702.Second circulation liquid feed path 1701 for provide via second heat exchanger 15 reduce temperature circulation fluid to control pair As.Second circulation liquid backward channel 1702 to by control object temperature rise circulation fluid return second heat exchanger 15。
In this configuration, it is higher than predetermined temperature to be provided to the temperature of the circulation fluid of control object, in second heat exchanger In 15, the cooling water that circulation fluid and the second cooling water supply passage 1601 provide carries out heat exchange, and the temperature of circulation fluid is reduced to Predetermined temperature.
Therefore, in the cooler of the present embodiment, the predetermined temperature of the circulation fluid of control object is provided to, in compressor 4 not It needs in the high temperature operated, the temperature of circulation fluid can be reduced in second heat exchanger 15.Therefore compressor 4 can be not required Operating, it is energy saving to realize.
In the present embodiment, as shown in drawings, branch's cooling water supply passage 801 is to form the second cooling water supply passage 1601.Second cooling water backward channel 1602 is connected to cooling water backward channel 802 and the second cooling water supply passage 1601 of ratio Cooling water supply passage 801 bifurcation closer to the one side of condenser 5.Electricity is set in the second cooling water supply passage 1601 Magnet valve 18a, 18b.By switching solenoid valve 18a, 18b, thus the supply destination of cooling water can be transformed into condenser 5 or Second heat exchanger 15.Label 19 represents control valve, and the flow of cooling water is adjusted for the pressure according to compressor 4.
In addition, in the second circulation liquid circulation loop 17 of the present embodiment, from pump 904 to the one side branch of heat exchanger 7 Circulating liquid backward channel 902, to form second circulation liquid backward channel 1702.Second circulation liquid feed path 1701 is cycling The front side of heater 903 is connected in liquid feed path 901 and is returned than second circulation liquid backward channel 1702 in circulation fluid and is led to The bifurcation in road 902 is closer to the one side of heat exchanger 7.Solenoid valve 18c, 18d are set in second circulation liquid backward channel 1702. By switching solenoid valve 18c, 18d, therefore the return destination of circulation fluid can be transformed into 7 or second heat exchange of heat exchanger Device 15.Therefore, in the cooler 1 of the present embodiment, pump 904 and heater 903 can be operated in compressor 4 and stopped with compressor 4 Running is shared in both cases, so as to reduce cost.
It is returned however, it is not necessary to configure the second cooling water circulation from cooling water circulation loop 8 and circulation fluid circulation loop 9 respectively Road 16 and second circulation liquid circulation loop 17.In addition, second heat exchanger 15 and second circulation liquid circulation loop 16 are not necessary , second heat exchanger 15 and second circulation liquid circulation loop 16 can be not used.In addition, use 15 He of second heat exchanger In the case of second circulation liquid circulation loop 16, the not necessarily water-cooled heat exchanger of second heat exchanger 15 or Air cooling heat exchanger.
Then, the running of cooler is as described above, be design temperature using cooler control loop liquid, and provide circulation fluid To control object.In advance, the design temperature of partition loops liquid is multiple regions.According to each region parameter and setting compressor 4 operation frequency and the aperture of electric expansion valve 6,12,14.The operation frequency of compressor 4 and electric expansion valve 6,12,14 The setting of aperture etc. is necessary to realize the design temperature in each region.
Hereafter, when operating chiller unit 2, transfer tube 904 is with the cycle cycle between heat exchanger 7 and control object Liquid.Circulation fluid is lowered to predetermined temperature in heat exchanger 7.Circulation fluid is supplied to by control by circulation fluid circulation loop 9 Object, and the circulation fluid of predetermined temperature is reduced to, design temperature is increased to by heater 903.
In the case where configuration includes second heat exchanger 15, the design temperature of circulation fluid of control object is supplied in height Warm scope and compressor 4 need not operate.Compressor 4 is reduced without the temperature of running and circulation fluid by second heat exchanger 15 To predetermined temperature.The design temperature (fiducial temperature) of circulation fluid is according to the situation for using compressor 4 and without using compressor 4 The border of situation is set.When be provided to the design temperature of circulation fluid of control object it is higher than fiducial temperature when, inoperative compression Machine 4, switching solenoid valve 18c, 18d so that circulation fluid is circulated between second heat exchanger 15 and control object.Transfer tube 904 To cycle the circulation fluid between second heat exchanger 15 and control object.In second heat exchanger 15, circulation fluid is reduced to pre- Constant temperature degree, and the circulation fluid for being reduced to predetermined temperature is provided to control object, and pass through heater 903 and adjust temperature to setting Temperature.
Then, the circulation fluid temprature control method of cooler and the temperature of maintaining method circulation fluid are used according to the present embodiment Degree control method illustrates.As described above, when the circulation fluid temprature control method and maintaining method of remote control the present embodiment When, possess operating terminal 33, and one or more coolers 1 are connected to operating terminal 33 by router 31 and network 34.
In addition, the design temperature of circulation fluid be automatically or manually divided by each cooler or operating terminal 33 it is multiple Region.According to each region, aperture of operation frequency and electric expansion valve 6,12,14 of parametrization and setting compressor 4 etc..
Then, in each cooler, when refrigerator unit 2 operates, circulation fluid is adjusted to predetermined in heat exchanger 7 Temperature.By circulation fluid circulation loop 9 circulation fluid is made to be cycled in control object.The operation frequency and electronic expansion of compressor 4 The aperture of valve 6 is according to preset parameter adjustment.Operating terminal 33 monitors the operating status of each cooler, passes through temperature Sensor 24 senses temperature of circulation fluid etc..
It on the other hand, can not be with predetermined when the operating environment of any connection to the cooler in operating terminal 33 changes Parameter realizes the design temperature of circulation fluid.If parameter needs to change, in other words, when monitoring circulation fluid temperature without When method reaches set temperature, in operating terminal 33, automatically or manually realize the design temperature of circulation fluid, and change pressure The operation frequency of contracting machine 4 and the aperture of electric expansion valve 6 etc..
In the present embodiment, the parameter of the aperture of the operation frequency of compressor 4 and electric expansion valve 6 is followed it is necessary to be set as The temperature of ring liquid is the temperature in each region divided, and according to experiment and experience setup parameter.However, the operating environment of cooler It may change, and the temperature of circulation fluid may not be design temperature in some cases.Therefore, in this case, originally Embodiment changes the operation frequency of compressor 4 and electric expansion valve 6 according to the corresponding parameter value of operating environment after variation The parameter value of aperture.
In addition, in the present embodiment, the operating status of each cooler 1 is monitored in real time in operating terminal 33, if cooling When the operating environment of device changes and can not achieve the design temperature of circulation fluid, in corresponding cooler, the running frequency of compressor 4 The parameter value of rate and the aperture of electric expansion valve 6, the manually or automatically remote control in operating terminal 33.Therefore, according to this Embodiment even if the field maintenance that substantial amounts of cooler is set also to be not necessarily to set cooler, can be easy to control refrigeration but Device and reduction personnel costs.
As described above, in the temprature control method of the circulation fluid of the present embodiment and the method for maintenance, inverter control is used The compressor of system and the cooler for being provided with electric expansion valve.The design temperature of advance partition loops liquid is multiple regions.In advance According to the aperture of the operation frequency and electric expansion valve of each region parameter and setting compressor.When the operating environment of cooler , it is necessary to when changing the parameter of the operation frequency of compressor and the aperture of electric expansion valve, network remote can be used in cooler for variation Control and change parameter value, therefore, the adjustment and maintenance of cooler can be realized easily.
In the temprature control method of the circulation fluid of the present embodiment and the method for maintenance, the compressor of inverter control is used With the cooler for being provided with electric expansion valve.The design temperature of advance partition loops liquid is multiple regions.According to each region, determine The parameter of the operation frequency of compressor and the aperture of electric expansion valve is determined to realize the temperature of circulation fluid.Therefore, it is possible to avoid Degree cooling circulation liquid and the output for avoiding increasing heater, can be energy saving.
In cooler 1 used in the present embodiment, hot gas feed path 11 is arranged on the front of heat exchanger 7, is used for Hot gas is supplied to heat exchanger 7.Electric expansion valve 12 is used to adjust the flow rate of hot gas etc..When can not only pass through adapt to compression Machine 4 when operation frequency come when adjusting cooling capacity to desirable cooling capacity, pass through electric expansion valve 12 and control hot gas The flow of inflow heat exchanger 7 can adjust cooling capacity to desirable cooling capacity.
In addition, in the present embodiment, when the operating environment variation of cooler, it will be unable to realize the setting temperature of circulation fluid Degree.Due to it is possible that change compressor operation frequency and electric expansion valve aperture parameter, with use constant speed compressor and The existing cooler of mechanical expansion valve is different, even if, when use environment etc. become can not show the original of cooler Ability need not also replace cooler, therefore can reduce the cost replaced needed for cooler.
[industry applications]
An embodiment of the present invention provides circulation fluid temprature control method and maintaining method, by cycling circulation fluid to needing temperature The control object of control is spent to maintain control object in predetermined design temperature.Using inverter control compressor and be provided with The cooler of electric expansion valve.The design temperature of advance partition loops liquid is multiple regions.Previously according to each region parameter And set the operation frequency of compressor and the aperture of electric expansion valve.When the operating environment of cooler changes, it is necessary to change compression During the parameter of the operation frequency of machine and the aperture of electric expansion valve, cooler can be used network remote control and change parameter value. The embodiment of the present invention is suitable for the general circulation fluid temprature control method and maintaining method for using cooler, and according to running ring The variation in border changes the operation frequency of compressor and the aperture of electric expansion valve.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe Various corresponding changes and deformation, but these corresponding changes and deformation can be made according to the present invention by knowing those skilled in the art The protection domain of the claims in the present invention should all be belonged to.

Claims (3)

1. a kind of circulation fluid temprature control method using cooler, which is characterized in that for passing through one circulation fluid of cycle to need A temperature controlled control object is wanted to keep the control object in a predetermined temperature, including:
A circulation loop is provided, for cycling a refrigerant;
The compressor for being arranged on an inverter control in the circulation loop is provided, for the refrigerant compression that will gasify to high Pressure;
A condenser is provided, for passing through heat exchange to condense by the refrigeration of the compressor compresses of the inverter control to high pressure Agent;
An electric expansion valve is provided, for reducing the pressure of the liquefied refrigerant in the condenser;
There is provided includes a refrigerator unit of a heat exchanger, and pressure will be reduced by the electric expansion valve for passing through heat exchange The refrigerant is converted into gas;And
There is provided at least one remote control and can be capable of the cooler of state modulator, this at least one remote control and can join The coolers of number control include a circulation fluid circulation loop, at least one remote control and can be capable of the cold of state modulator using this But device for circulate in the circulation fluid between the refrigerator unit and the control object and supply to be controlled in this predetermined The circulation fluid of temperature to the control object,
The predetermined temperature of the circulation fluid is wherein divided in advance as multiple regions, and parameterize and set according to each region One operation frequency of the compressor of the inverter control and an aperture of the electric expansion valve,
The refrigerator unit is operated, the circulation fluid is adjusted in the heat exchanger to the predetermined temperature,
The operation frequency of the compressor of the inverter control is adjusted by the circulation fluid circulation loop and according to a predefined parameter With the aperture of the electric expansion valve to cycle the circulation fluid to the control object,
This at least one remote control and can be capable of the cooler of state modulator and be connected to an operating terminal or make by network This at least one can remote control and be capable of the cooler of state modulator for can connection status,
When this at least one can remote control and be capable of state modulator cooler an operating environment change and need change should During predefined parameter, in the operating terminal, change the operation frequency and the electric expansion valve of the compressor of the inverter control The aperture the predefined parameter.
2. the circulation fluid temprature control method according to claim 1 using cooler, which is characterized in that it is multiple can be remote Process control and be capable of the cooler of state modulator and be connected to the operating terminal, and the operating terminal can control it is the plurality of can be remote Process control and the cooler for being capable of state modulator.
3. the circulation fluid temprature control method according to claim 1 or 2 using cooler, which is characterized in that this is at least One can remote control and be capable of state modulator cooler include a second heat exchanger and a second circulation liquid circulation loop, The second heat exchanger is used to be arranged in the refrigerator unit and controls the circulation fluid for being supplied to the control object In the predetermined temperature, the second circulation liquid circulation loop for cycle the circulation fluid in the second heat exchanger and control object it Between and for supplying be controlled in the circulation fluid of the predetermined temperature to the control object.
CN201710826912.8A 2016-11-08 2017-09-14 Use the circulation fluid temprature control method of cooler Pending CN108072215A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-218462 2016-11-08
JP2016218462A JP2018076995A (en) 2016-11-08 2016-11-08 Circulation liquid temperature control method using parameter control-by-area type chiller by remote control, and maintenance method

Publications (1)

Publication Number Publication Date
CN108072215A true CN108072215A (en) 2018-05-25

Family

ID=62150241

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710826912.8A Pending CN108072215A (en) 2016-11-08 2017-09-14 Use the circulation fluid temprature control method of cooler

Country Status (4)

Country Link
JP (1) JP2018076995A (en)
KR (1) KR20180051423A (en)
CN (1) CN108072215A (en)
TW (1) TW201818039A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110926064A (en) * 2019-12-10 2020-03-27 北京京仪自动化装备技术有限公司 Control method and device of electronic expansion valve, electronic equipment and storage medium
CN114442693A (en) * 2021-12-31 2022-05-06 北京京仪自动化装备技术股份有限公司 Coupling temperature control system and method
CN115727579A (en) * 2022-11-28 2023-03-03 江苏拓米洛环境试验设备有限公司 Control method and device of refrigeration system

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6570390B2 (en) * 2015-09-24 2019-09-04 東京エレクトロン株式会社 Temperature control apparatus and substrate processing apparatus
JP2020020412A (en) * 2018-08-01 2020-02-06 レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード Device and method of supplying pressurized gas to container
JP6624623B1 (en) * 2019-06-26 2019-12-25 伸和コントロールズ株式会社 Temperature control device and temperature control device
KR102403661B1 (en) * 2020-02-19 2022-05-31 (주)피티씨 Chiller apparatus for semiconductor process
KR102345640B1 (en) * 2020-02-21 2021-12-31 (주)피티씨 Chiller apparatus for semiconductor process

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231595A (en) * 2001-01-31 2002-08-16 Hitachi Ltd Semiconductor manufacturing equipment managing system
CN101410190A (en) * 2006-03-28 2009-04-15 东京毅力科创株式会社 Multi-zone substrate temperature control system and method of operating
CN102080897A (en) * 2010-01-15 2011-06-01 日月光半导体制造股份有限公司 Cooling system for semiconductor manufacturing and testing processes
CN102081412A (en) * 2009-10-21 2011-06-01 惠而浦股份公司 Data and commands communication system and method between variable capacity compressor and electronic thermostat for a cooling system
CN103216279A (en) * 2012-01-19 2013-07-24 通用电气公司 Condenser cooling system and method including solar absorption chiller
JP2015059726A (en) * 2013-09-20 2015-03-30 株式会社ナカヤ Area-specific parameter-base controlling hybrid chiller and circulatory fluid temperature regulation method using the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231595A (en) * 2001-01-31 2002-08-16 Hitachi Ltd Semiconductor manufacturing equipment managing system
CN101410190A (en) * 2006-03-28 2009-04-15 东京毅力科创株式会社 Multi-zone substrate temperature control system and method of operating
CN102081412A (en) * 2009-10-21 2011-06-01 惠而浦股份公司 Data and commands communication system and method between variable capacity compressor and electronic thermostat for a cooling system
CN102080897A (en) * 2010-01-15 2011-06-01 日月光半导体制造股份有限公司 Cooling system for semiconductor manufacturing and testing processes
CN103216279A (en) * 2012-01-19 2013-07-24 通用电气公司 Condenser cooling system and method including solar absorption chiller
JP2015059726A (en) * 2013-09-20 2015-03-30 株式会社ナカヤ Area-specific parameter-base controlling hybrid chiller and circulatory fluid temperature regulation method using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110926064A (en) * 2019-12-10 2020-03-27 北京京仪自动化装备技术有限公司 Control method and device of electronic expansion valve, electronic equipment and storage medium
CN110926064B (en) * 2019-12-10 2020-08-07 北京京仪自动化装备技术有限公司 Control method and device of electronic expansion valve, electronic equipment and storage medium
CN114442693A (en) * 2021-12-31 2022-05-06 北京京仪自动化装备技术股份有限公司 Coupling temperature control system and method
CN115727579A (en) * 2022-11-28 2023-03-03 江苏拓米洛环境试验设备有限公司 Control method and device of refrigeration system
CN115727579B (en) * 2022-11-28 2023-09-29 江苏拓米洛高端装备股份有限公司 Control method and device of refrigerating system

Also Published As

Publication number Publication date
JP2018076995A (en) 2018-05-17
TW201818039A (en) 2018-05-16
KR20180051423A (en) 2018-05-16

Similar Documents

Publication Publication Date Title
CN108072215A (en) Use the circulation fluid temprature control method of cooler
JP3972860B2 (en) Refrigeration equipment
JP4411870B2 (en) Refrigeration equipment
EP3228951B1 (en) Refrigeration cycle apparatus
JP6707189B2 (en) Air conditioner and fan speed control method for air conditioner
JP2010071639A (en) Refrigerating device
EP3385642B1 (en) Exhaust heat recovery system
KR101354474B1 (en) Chiller apparatus for working process equipment
JP2014214954A (en) Cold/hot water supply system and air conditioner
JP2011058663A (en) Refrigerating air-conditioning device
JP5762493B2 (en) Circulating fluid temperature control method using area-specific parameter control hybrid chiller
JP2018044716A (en) Liquid temperature adjustment device and temperature control system
CN107735625B (en) Refrigerating machine system
CN112437858A (en) Temperature control device and temperature control device
JP7174502B2 (en) Temperature control device using multi-stage refrigeration cycle and temperature control method using the same
GB2578533A (en) Refrigeration cycle device
CN112460755B (en) Frequency converter thermal management system of air conditioning unit, air conditioning unit and control method
CN113531790A (en) Communication control circuit, multi-connected air conditioner and control method
KR101426884B1 (en) Controlling method and system for temperature of gas chiller for semiconductor and LCD manufacturing process
JP2017067320A (en) Air conditioner
KR101402588B1 (en) a semiconductor chiller exchanging heat directly through refrigerant and chilling method and driving method thereof
KR101426886B1 (en) Controlling method and system for temperature of gas chiller for semiconductor and LCD manufacturing process
US11976857B2 (en) Refrigeration cycle device
WO2022224689A1 (en) Refrigeration-type chiller
CN212057583U (en) Intelligent energy-saving cooling system controller

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20180525

WD01 Invention patent application deemed withdrawn after publication