CN108063110B - Silicon wafer floating supporting mechanism - Google Patents
Silicon wafer floating supporting mechanism Download PDFInfo
- Publication number
- CN108063110B CN108063110B CN201810021335.XA CN201810021335A CN108063110B CN 108063110 B CN108063110 B CN 108063110B CN 201810021335 A CN201810021335 A CN 201810021335A CN 108063110 B CN108063110 B CN 108063110B
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- supporting
- rod
- wedge block
- guide rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 46
- 239000010703 silicon Substances 0.000 title claims abstract description 46
- 230000007246 mechanism Effects 0.000 title claims abstract description 32
- 238000007599 discharging Methods 0.000 claims abstract description 23
- 238000003466 welding Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 30
- 238000004140 cleaning Methods 0.000 description 6
- 238000005201 scrubbing Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a silicon wafer floating supporting mechanism which comprises a bracket, an air cylinder, an inclined plane pushing head, a connecting rod, a discharging plate, a positioning piece, an avoidance groove and a supporting clamping mechanism, wherein a silicon wafer is manually placed on the discharging plate, the positioning piece limits the silicon wafer, then the air cylinder returns, 4 supporting clamping mechanisms which are symmetrically arranged work simultaneously, a spring returns to push a wedge block to move towards the inclined plane pushing head along a sliding rail, so that a supporting rod is driven to move, the supporting rod is driven to shrink and fold, the supporting rod moves upwards along the avoidance groove until the silicon wafer is supported by the supporting rod which is symmetrically arranged, and the spring further returns to drive the supporting rod which is symmetrically arranged 4 to clamp the silicon wafer along with further downward movement of the inclined plane pushing head. The device has a simple structure, automatically supports and clamps the silicon wafer, and is in a floating state when the silicon wafer is clamped, so that the silicon wafer is prevented from being contacted with the clamp or the supporting part in a large area, and secondary pollution of the silicon wafer is prevented.
Description
Technical Field
The invention relates to a mechanical device, in particular to a silicon wafer floating support mechanism.
Background
In the production of semiconductor devices, silicon wafers are subjected to strict cleaning, trace pollution can also cause device failure, the cleaning aim is to remove surface pollution impurities, the method for removing the pollution comprises physical cleaning and chemical cleaning, the physical cleaning mainly adopts a scrubbing or scrubbing method to remove the surface impurities of the silicon wafers, in the actual production, the upper surface and the lower surface of the silicon wafers are cleaned respectively no matter the scrubbing or the scrubbing, and the silicon wafers are placed on a supporting mechanism during cleaning, and when the upper surface is cleaned, the lower surface is cleaned by turning over 180 degrees, and secondary pollution is easy to occur after the cleaned upper surface is contacted with the supporting mechanism. In view of the above drawbacks, it is necessary to design a silicon wafer floating support mechanism.
Disclosure of Invention
The invention aims to provide a silicon wafer floating supporting mechanism which automatically supports and clamps a silicon wafer, and the silicon wafer is in a floating state when clamped, so that the silicon wafer is prevented from being contacted with a clamp or a supporting part in a large area, and secondary pollution of the silicon wafer is prevented.
In order to solve the technical problems, the technical scheme of the invention is as follows: the silicon wafer floating supporting mechanism comprises a bracket, an air cylinder, an inclined push head, a connecting rod, a discharging plate, a locating plate, avoidance grooves and a supporting and clamping mechanism, wherein the number of the supporting and clamping mechanism is 4, the inclined push head is symmetrically arranged along the inclined push head, the air cylinder is positioned at the lower end of the bracket, the air cylinder is connected with the bracket through bolts, the inclined push head is positioned at the upper end of the air cylinder and penetrates through the bracket, the inclined push head is connected with air cylinder threads, the connecting rod is positioned at the upper end of the inclined push head, the connecting rod is connected with the inclined push head threads, the discharging plate is positioned at the upper end of the connecting rod, the discharging plate is connected with the connecting plate threads, the locating plate is positioned on the side face of the discharging plate, the number of the avoidance grooves is 4, and the locating plate is symmetrically arranged along the discharging plate;
the supporting and clamping mechanism further comprises a guide sleeve, a first guide rod, a wedge block, a spring, a supporting rod and an L-shaped sheath, wherein the guide sleeve is positioned at the upper end of the support, the guide sleeve is connected with the support through a bolt, the first guide rod penetrates through the guide sleeve, the first guide rod can slide left and right along the guide sleeve, the wedge block is positioned at the outer side of the first guide rod and is positioned at the upper end of the support, the wedge block is connected with the first guide rod through a thread and is connected with the support through the bolt, the spring is positioned at the outer side of the first guide rod and is positioned between the wedge block and the guide sleeve, the supporting rod is positioned at the upper end of the wedge block, the supporting rod is connected with the wedge block through welding, the L-shaped sheath is positioned at the top of the supporting rod, the L-shaped sheath is connected with the supporting rod through bonding, and 4 symmetrically arranged L-shaped sheaths form a clamping and positioning area for accurately positioning and clamping the silicon wafer.
The invention is further improved as follows:
furthermore, the number of the connecting rods is 3, and the connecting rods are uniformly distributed on the inclined plane push heads.
Further, the inclined plane pushing head is also provided with a second guide rod, the second guide rod is positioned at the lower end of the inclined plane pushing head and penetrates through the support, the second guide rod is connected with the inclined plane pushing head through threads, and the second guide rod can slide up and down along the support.
Further, the wedge block is also provided with a sliding rail, the sliding rail is positioned at the upper end of the support and penetrates through the wedge block, the sliding rail is connected with the support through bolts, and the wedge block can slide left and right along the sliding rail.
Furthermore, the first guide rod is also provided with a limiting head, and the limiting head is integrally connected with the first guide rod.
Furthermore, the limiting head is also provided with an anti-collision pad, and the anti-collision pad is bonded and connected with the limiting head.
Compared with the prior art, the silicon wafer floating supporting mechanism is in an extending state in an initial state, the outer side of the inclined push head is in contact with the supporting rod, the height of the discharging plate is higher than that of the supporting rod, the silicon wafer is manually placed on the discharging plate, the positioning piece limits the silicon wafer to prevent the silicon wafer from sliding off, then, the cylinder returns, after the inclined push head is in contact with the wedge-shaped block, along with the continuous return of the cylinder, the supporting clamping mechanism with 4 symmetrical arrangement works simultaneously, the spring returns to push the wedge-shaped block to move towards the inclined push head along the sliding rail, so that the supporting rod is driven to move, and then the supporting clamping mechanism with 4 symmetrical arrangements is driven to shrink and fold. The device has a simple structure, automatically supports and clamps the silicon wafer, and is in a floating state when the silicon wafer is clamped, so that the silicon wafer is prevented from being contacted with the clamp or the supporting part in a large area, and secondary pollution of the silicon wafer is prevented.
Drawings
FIG. 1 shows a front view of the present invention
FIG. 2 is a schematic view showing the structure of the supporting and clamping mechanism of the present invention
In the figure: the device comprises a bracket 1, a cylinder 2, an inclined push head 3, a connecting rod 4, a discharging plate 5, a positioning sheet 6, an avoidance groove 7, a supporting and clamping mechanism 8, a second guide rod 301, a guide sleeve 801, a first guide rod 802, a wedge 803, a spring 804, a support rod 805, an L-shaped sheath 806, a sliding rail 807, a limiting head 808 and an anti-collision pad 809.
Detailed Description
As shown in figures 1 and 2, the silicon wafer floating supporting mechanism comprises a bracket 1, an air cylinder 2, an inclined push head 3, a connecting rod 4, a discharging plate 5, a positioning sheet 6, an avoidance groove 7 and a supporting and clamping mechanism 8 which is symmetrically arranged along the inclined push head 3 and has 4 parts, wherein the air cylinder 2 is positioned at the lower end of the bracket 1, the air cylinder 2 is connected with the bracket 1 through bolts, the inclined push head 3 is positioned at the upper end of the air cylinder 2 and penetrates through the bracket 1, the inclined push head 3 is connected with the air cylinder 2 through threads, the connecting rod 4 is positioned at the upper end of the inclined push head 3, the connecting rod 4 is connected with the inclined push head 3 through threads, the discharging plate 5 is positioned at the upper end of the connecting rod 4, the discharging plate 5 is connected with the connecting plate 4 through threads, the positioning sheet 6 is positioned at the side surface of the discharging plate 5, the number of the avoidance groove 7 is 4 parts, the supporting and clamping mechanism 8 also comprises a guide sleeve 801, a first guide rod 802, a wedge block 803, a spring 804, a support rod 805 and an L-shaped sheath 806, wherein the guide sleeve 801 is positioned at the upper end of the support 1, the guide sleeve 801 is connected with the support 1 through bolts, the first guide rod 802 penetrates through the guide sleeve 801, the first guide rod 802 can slide left and right along the guide sleeve 801, the wedge block 803 is positioned at the outer 802 side of the first guide rod and is positioned at the upper end of the support 1, the wedge block 803 is connected with the first guide rod 802 through threads and is connected with the support 1 through bolts, the spring 804 is positioned at the outer side of the first guide rod 802 and is positioned between the wedge block 803 and the guide sleeve 801, the support rod 805 is positioned at the upper end of the wedge block 803, the support rod 805 is connected with the wedge block 803 through welding, the L-shaped sheath 806 is positioned at the top of the support rod 805, the L-shaped sheath 806 is adhered to the supporting rod 805, 4 symmetrically arranged L-shaped sheaths 806 form a clamping positioning area, a silicon wafer is precisely positioned and clamped, the number of the connecting rods 4 is 3, the connecting rods are uniformly distributed on the inclined push heads 3, the inclined push heads 3 are further provided with second guide rods 301, the second guide rods 301 are positioned at the lower ends of the inclined push heads 3 and penetrate through the support 1, the second guide rods 301 are connected with the inclined push heads 3 in a threaded manner, the second guide rods 301 can slide up and down along the support 1, the wedge blocks 803 are further provided with sliding rails 807, the sliding rails 807 are positioned at the upper ends of the support 1 and penetrate through the wedge blocks 803, the sliding rails 807 are connected with the support 1 through bolts, the wedge blocks 803 can slide left and right along the sliding rails 807, the first guide rods 802 are further provided with limit heads 808, the limit heads 808 are integrally connected with the first guide rods 802, the limit head 808 is also provided with an anti-collision pad 809, the anti-collision pad 809 is connected with the limit head 808 in an adhering way, the silicon chip floating support mechanism is in an extending state, the outer side of the inclined push head 3 is contacted with the support rod 805 in an initial state, the height of the discharging plate 5 is higher than that of the support rod 805, the silicon chip is manually placed on the discharging plate 5, the positioning sheet 6 limits the silicon chip to prevent the silicon chip from sliding down, then, the cylinder 2 returns, after the inclined push head 3 is contacted with the wedge block 803, along with the continuous return stroke of the cylinder 2, the 4 symmetrically arranged support clamping mechanisms 8 work simultaneously, the spring 804 resets and pushes the wedge block 803 to move towards the inclined push head 3 along the slide rail 807, thereby driving the support rod 805 to move, and driving the 4 symmetrically arranged support clamping mechanisms 8 to shrink and fold, and as the discharging plate 5 moves downwards along with the inclined push head 3, the supporting rod 805 moves up along the avoiding groove 7 until the silicon wafer is supported by the 4 symmetrically arranged supporting rods 805, and along with the further downward movement of the inclined plane pushing head 3, the spring 804 further resets to drive the 4 symmetrically arranged supporting rods 805 to clamp the silicon wafer. The device has a simple structure, automatically supports and clamps the silicon wafer, and is in a floating state when the silicon wafer is clamped, so that the silicon wafer is prevented from being contacted with the clamp or the supporting part in a large area, and secondary pollution of the silicon wafer is prevented.
The present invention is not limited to the above-described specific embodiments, and various modifications may be made by those skilled in the art without inventive effort from the above-described concepts, and are within the scope of the present invention.
Claims (4)
1. The silicon wafer floating supporting mechanism is characterized by comprising a bracket, an air cylinder, an inclined push head, a connecting rod, a discharging plate, a positioning plate, avoidance grooves and supporting clamping mechanisms, wherein the number of the supporting clamping mechanisms is 4, the inclined push head is symmetrically arranged along the inclined push head, the air cylinder is positioned at the lower end of the bracket, the air cylinder is connected with the bracket through bolts, the inclined push head is positioned at the upper end of the air cylinder and penetrates through the bracket, the inclined push head is connected with air cylinder threads, the connecting rod is positioned at the upper end of the inclined push head, the connecting rod is connected with the inclined push head threads, the discharging plate is positioned at the upper end of the connecting rod, the discharging plate is connected with the connecting plate threads, the positioning plate is positioned at the side surface of the discharging plate, the positioning plate is connected with the discharging plate through bolts, the number of the avoidance grooves is 4, and the positioning plate is symmetrically arranged along the discharging plate; the supporting and clamping mechanism further comprises a guide sleeve, a first guide rod, a wedge block, a spring, a supporting rod and an L-shaped sheath, wherein the guide sleeve is positioned at the upper end of the support, the guide sleeve is connected with the support through a bolt, the first guide rod penetrates through the guide sleeve, the first guide rod can slide left and right along the guide sleeve, the wedge block is positioned at the outer side of the first guide rod and is positioned at the upper end of the support, the wedge block is in threaded connection with the first guide rod and is connected with the support through the bolt, the spring is positioned at the outer side of the first guide rod and is positioned between the wedge block and the guide sleeve, the supporting rod is positioned at the upper end of the wedge block, the supporting rod is connected with the wedge block in a welding mode, the L-shaped sheath is positioned at the top of the supporting rod, and the L-shaped sheath is connected with the supporting rod in an adhesive mode; the number of the connecting rods is 3, and the connecting rods are uniformly distributed on the inclined plane push heads; the first guide rod is also provided with a limiting head, and the limiting head is integrally connected with the first guide rod.
2. The floating support mechanism of claim 1, wherein the bevel pusher is further provided with a second guide rod, the second guide rod is located at the lower end of the bevel pusher and penetrates through the bracket, the second guide rod is connected with the bevel pusher through threads, and the second guide rod can slide up and down along the bracket.
3. The silicon wafer floating support mechanism according to claim 1, wherein the wedge block is further provided with a sliding rail, the sliding rail is located at the upper end of the support and penetrates through the wedge block, the sliding rail is connected with the support through a bolt, and the wedge block can slide left and right along the sliding rail.
4. The floating support mechanism of claim 1, wherein the spacing head is further provided with a crash pad, said crash pad being adhesively attached to the spacing head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810021335.XA CN108063110B (en) | 2018-01-10 | 2018-01-10 | Silicon wafer floating supporting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810021335.XA CN108063110B (en) | 2018-01-10 | 2018-01-10 | Silicon wafer floating supporting mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108063110A CN108063110A (en) | 2018-05-22 |
| CN108063110B true CN108063110B (en) | 2023-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810021335.XA Active CN108063110B (en) | 2018-01-10 | 2018-01-10 | Silicon wafer floating supporting mechanism |
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| CN (1) | CN108063110B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109023234B (en) * | 2018-08-09 | 2020-08-28 | 深圳市华星光电半导体显示技术有限公司 | Mask plate replacing device and replacing method |
| CN109367983B (en) * | 2018-09-26 | 2024-05-31 | 中国工程物理研究院激光聚变研究中心 | Spring locking target box |
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| TW296864U (en) * | 1994-06-15 | 1997-01-21 | Hon Hai Prec Ind Co Ltd | Connector for chip components |
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|---|---|
| CN108063110A (en) | 2018-05-22 |
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Effective date of registration: 20231020 Address after: 247100 Building D1, Environmental Protection Industrial Park, High tech Zone, Chizhou City, Anhui Province Applicant after: CHIZHOU HAILIN CLOTHING CO.,LTD. Applicant after: SUZHOU JUKING TECHNOLOGY Co.,Ltd. Address before: 215000 Shunle Road, Jujin Industrial Park, Taiping Street, Xiangcheng District, Suzhou City, Jiangsu Province Applicant before: SUZHOU JUKING TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20240119 Address after: Building D1, Environmental Protection Industry Park, High tech Zone, Suzhou City, Jiangsu Province Patentee after: CHIZHOU HAILIN CLOTHING CO.,LTD. Address before: 247100 Building D1, Environmental Protection Industrial Park, High tech Zone, Chizhou City, Anhui Province Patentee before: CHIZHOU HAILIN CLOTHING CO.,LTD. Patentee before: SUZHOU JUKING TECHNOLOGY Co.,Ltd. |