CN108055786A - The treatment process of residue glue on a kind of flexible PCB - Google Patents
The treatment process of residue glue on a kind of flexible PCB Download PDFInfo
- Publication number
- CN108055786A CN108055786A CN201711226330.2A CN201711226330A CN108055786A CN 108055786 A CN108055786 A CN 108055786A CN 201711226330 A CN201711226330 A CN 201711226330A CN 108055786 A CN108055786 A CN 108055786A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible pcb
- residue glue
- treatment process
- aqueous slkali
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Abstract
The invention discloses a kind for the treatment of process of residue glue on flexible PCB, are related to flexible PCB preparing technical field.The treatment process includes：Circuit board after pressing is washed；Cleaning showers are carried out with the residue glue on removing circuit plate to circuit board with containing aqueous slkali；It will be through removing remaining lye containing the circuit board progress high-pressure washing after alkaline solution treatment；The cleaning showers of large area are carried out to circuit board with acid-containing solution again come the remaining lye of neutralizing circuit plate surface；Repeat above-mentioned washing and high-pressure washing；Finally by blotting, drying up, drying and cooling down, cure into subsequent processing.The beneficial effects of the invention are as follows the residue glue that can effectively remove flexible PCB and generated in pressing working procedure, the present invention treated circuit board so that the bonding area at welding finger and pad can reach 95%, reduce the fraction defective of flexible PCB in production.
Description
Technical field
The present invention relates to flexible PCB preparing technical fields, and in particular to the processing work of residue glue on a kind of flexible PCB
Skill.
Background technology
Flexible PCB (FPC) is that have height reliability to be a kind of made of base material using polyimides or polyester film,
The printed circuit board (PCB) of excellent pliability has the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good thus wide
General is applied to various fields.
The process route of production flexibility wiring board includes at present：Blanking → patch light-sensitive surface → exposure → development → etching → patch
Positive and negative facial mask → pressing → curing → nog plate → sandblasting → heavy nickel gold → electrical measurement → SMT etc., wherein can cause to weld in pressing working procedure
Catcher refer to and pad at have a residue glue, weld the residue glue generated at finger and pad and can not thoroughly disappear after rear process nog plate and sandblasting
It removes, can not be also completely covered after heavy nickel gold, so as to seriously reduce the face of finger pad component when rear process SMT is welded
Product causes the area of SMT welding components to seriously affect the function of flexible circuit board less than 20%.
The content of the invention
The technical problems to be solved by the invention are the shortcomings that overcoming the more than prior art：A kind of flexible PCB is provided
The treatment process of upper residue glue, the technique can remove the residue glue of pressing working procedure generation, rear process SMT be welded so as to reducing residue glue
It influences.
The technical solution of the present invention is as follows：
The treatment process of residue glue, comprises the following steps on a kind of flexible PCB：
(1) circuit board after pressing is washed with deionized water；
(2) with cleaning showers are carried out to circuit board containing aqueous slkali with the residue glue on removing circuit plate, cleaning showers method is：
Multiple rows of Conic nozzle is uniformly arranged above and below circuit board, arrangement is mutually staggered between the Conic nozzle of adjacent two rows,
Cleaning showers are carried out by the upper and lower surface of Conic nozzle alignment circuit plate containing aqueous slkali, the pressure of the spray containing aqueous slkali
For 0.1~0.15Mpa；
(3) high-pressure washing is carried out to circuit board with deionized water to remove remaining lye, the pressure of high-pressure washing is 0.2
~0.3Mpa；
(4) cleaning showers of large area are carried out to circuit board with acid-containing solution come the remaining lye of neutralizing circuit plate surface,
The pH of circuit board surface after cleaning showers is 6.8~7.2；
(5) circuit board is repeated into above-mentioned washing and high-pressure washing；
(6) by circuit board by blotting, drying up, drying and cooling down, cure subsequently into subsequent processing.
Preferably, in the step (2), the preparation method containing aqueous slkali is：By the NaOH of 20~30kg, 4~6L
Alkaline antifoaming agent is mixed with the deionized water of 400~600L.
Preferably, in the step (2), circuit board carries out horizontal at the uniform velocity mobile cleaning, circuit board in containing aqueous slkali
Mobile speed is 1.5~2.1m/min, is 2~3m to the spray effective length of circuit board containing aqueous slkali.For flexible electricity
Road slat production line production, to improve production efficiency.
Preferably, in the step (2), the vertical range between adjacent two rows of Conic nozzles is adjacent with same row
The distance between Conic nozzle is identical, and distance is 4~6cm.For making flexible PCB surface clean more uniform, so as to have
Effect removes the residue glue on its surface.
Preferably, in the step (4), acid-containing solution is the H that mass percent concentration is 4~6%2SO4Solution.With
In the lye for neutralizing flexible PCB remained on surface.
Preferably, in the step (6), three pairs of PU water suction idler wheels of selection, first pair of PU water suction are blotted to circuit board
Idler wheel is used to carry out circuit board water blocking, and second pair of PU water suction idler wheel is for absorbing water to circuit board, the 3rd pair of PU water suction rolling
It takes turns to blot the moisture on circuit board.
Preferably, in the step (6), the temperature of drying is 70~80 DEG C.
Preferably, the washing of the step (1) and step (5) uses secondary washing, to clean up.
Preferably, the high-pressure washing of the step (3) and step (5) uses high-pressure washing three times, to clean up.
The beneficial effects of the invention are as follows：Compared with prior art, technique of the invention can effectively remove flexible PCB and exist
The residue glue that pressing working procedure generates carries out residue glue cleaning so that welding finger after pressing in flexible PCB through present invention process
And the bonding area at pad can reach 95%, solving the residue glue generated after pressing in the prior art causes to weld finger and weldering
The problem of bonding area of Pan Chu is less than 20%, reduce the fraction defective of flexible PCB in production.
Description of the drawings
Fig. 1 is the electron microscope of the flexible PCB pad after pressing；
Fig. 2 is the electron microscope through embodiment treated flexible PCB pad；
Fig. 3 is the electron microscope through embodiment treated flexible PCB welding finger.
Specific embodiment
The present invention is described in further details with specific embodiment below, but the present invention is not only limited in detail below in fact
Apply example.
Embodiment
Circuit board after pressing is subjected to secondary washing with deionized water, then above and below circuit board uniformly
Multiple rows of Conic nozzle is set, mutually staggers arrangement between the Conic nozzle of adjacent two rows, between adjacent two rows of Conic nozzles
It is 5cm that vertical range, which is equal to the distance between 5cm, the adjacent Conic nozzle of same row, is aligned containing aqueous slkali by Conic nozzle
The upper and lower surface of circuit board carries out cleaning showers, and the pressure of the spray containing aqueous slkali is 0.12Mpa, and circuit board is in production line
On move horizontally, mobile speed is 1.8m/min, is 2.5m to the spray effective length of circuit board containing aqueous slkali, until by electricity
Residue glue removal on the plate of road；High-pressure washing three times is carried out with deionized water to circuit board and removes remaining lye, high-pressure washing
Pressure be 0.2Mpa；Cleaning showers are carried out to circuit board with acid-containing solution again come the remaining lye of neutralizing circuit plate surface, are adopted
The acid-containing solution for carrying out large area to circuit board with circular or fan-shaped nozzle sprays so that the pH of the circuit board surface after spray
For 7；Circuit board is repeated into above-mentioned secondary washing and three times high-pressure washing again；Then circuit board is blotted, blots and adopt
Absorbed water idler wheels with three couples of PU, first pair of PU water suction idler wheel is used to carry out circuit board water blocking, second pair of PU water suction idler wheel for pair
Circuit board absorbs water, and the 3rd pair of PU water suction idler wheel is used to blot the moisture on circuit board；Then circuit board is dried up
And drying, the temperature of drying is 75 DEG C, then cools down circuit board, is welded with socket part position after residue glue is purged to finger
Cleaning is carried out, enters back into subsequent processing curing, cured temperature is 160 DEG C, hardening time 60min, to circuit after having cured
Plate carries out nog plate sandblasting, and surface is carried out after oxide on surface removing and sinks nickel gold processing, then carries out SMT welding etc. to circuit board
Process.
The preparation method containing aqueous slkali of the present embodiment is：By the alkaline antifoaming agent of NaOH, 5L of 25kg and going for 5000L
Ionized water is uniformly mixed, and alkaline antifoaming agent is selected from the alkaline antifoaming agent of Dongguan City De Feng antifoaming agent Co., Ltd production, from
And it obtains containing aqueous slkali.
The acid-containing solution of the present embodiment is the H that mass percent concentration is 5%2SO4Solution.
By the present embodiment, through removing glue, treated that flexible PCB is placed under Electronic Speculum is scanned, and obtains attached drawing 2 and attached drawing
3。
Attached drawing 2 and attached drawing 1 not processed by the invention are compared, it can be seen that after the technique of the present invention is to pressing
Flexible PCB carries out residue glue processing, and the residue glue on flexible PCB pad is substantially eliminated, after not interfering with flexible PCB
The production of process.
Measure bonding area of the flexible PCB at the welding finger and pad when SMT is welded, area in the present embodiment
For 96%.
It the above is only the feature implementation example of the present invention, the scope of the present invention be not limited in any way.It is all to use together
The technical solution formed Deng exchange or equivalence replacement, all falls within rights protection scope of the present invention.
Claims (7)
1. a kind for the treatment of process of residue glue on flexible PCB, it is characterised in that：Comprise the following steps：
(1) first the circuit board after pressing is washed with deionized water；
(2) cleaning showers are carried out to circuit board with containing aqueous slkali, cleaning showers method is：Above and below circuit board uniformly
Multiple rows of Conic nozzle is set, arrangement is mutually staggered between the Conic nozzle of adjacent two rows, is aligned containing aqueous slkali by Conic nozzle
The upper and lower surface of circuit board carries out cleaning showers, and the pressure of the spray containing aqueous slkali is 0.1~0.15Mpa；
(3) high-pressure washing is carried out to circuit board with deionized water to remove remaining lye, the pressure of high-pressure washing for 0.2~
0.3Mpa；
(4) cleaning showers of large area are carried out to circuit board with acid-containing solution to neutralize remaining lye, the circuit board after spray
The pH on surface is 6.8~7.2；
(5) circuit board is repeated into washing and high-pressure washing；
(6) by circuit board by blotting, drying up, drying and cooling down, cure subsequently into subsequent processing.
2. the treatment process of residue glue on flexible PCB according to claim 1, it is characterised in that：In the step (2),
Preparation method containing aqueous slkali is：By the NaOH of 20~30kg, the alkaline antifoaming agent of 4~6L and the deionized water of 400~600L
It is mixed.
3. the treatment process of residue glue on flexible PCB according to claim 1, it is characterised in that：In the step (2),
Circuit board carries out horizontal at the uniform velocity mobile cleaning in containing aqueous slkali, and the speed of circuit board movement is 1.5~2.1m/min, containing alkali soluble
Liquid is 2~3m to the spray effective length of circuit board.
4. the treatment process of residue glue on flexible PCB according to claim 1, it is characterised in that：In the step (2),
The distance between vertical range between the adjacent two rows of Conic nozzles Conic nozzle adjacent with same row is equal, and distance is
4~6cm.
5. the treatment process of residue glue on flexible PCB according to claim 1, it is characterised in that：In the step (4),
Acid-containing solution is the H that mass percent concentration is 4~6%2SO4Solution.
6. the treatment process of residue glue on flexible PCB according to claim 1, it is characterised in that：In the step (6),
Three pairs of PU water suction idler wheels of selection are blotted to circuit board, first pair of PU water suction idler wheel is used to carry out water blocking, second couple of PU to circuit board
For absorbing water to circuit board, the 3rd pair of PU water suction idler wheel is used to blot the moisture on circuit board water suction idler wheel.
7. the treatment process of residue glue on flexible PCB according to claim 1, it is characterised in that：In the step (6),
The temperature of drying is 70~80 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711226330.2A CN108055786A (en) | 2017-11-29 | 2017-11-29 | The treatment process of residue glue on a kind of flexible PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711226330.2A CN108055786A (en) | 2017-11-29 | 2017-11-29 | The treatment process of residue glue on a kind of flexible PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108055786A true CN108055786A (en) | 2018-05-18 |
Family
ID=62121260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711226330.2A Pending CN108055786A (en) | 2017-11-29 | 2017-11-29 | The treatment process of residue glue on a kind of flexible PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108055786A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111192816A (en) * | 2018-11-15 | 2020-05-22 | 东莞新科技术研究开发有限公司 | Semiconductor workpiece cleaning method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4635666A (en) * | 1985-04-22 | 1987-01-13 | Daley Frank E | Batch cleaning apparatus |
| CN103347365A (en) * | 2013-06-07 | 2013-10-09 | 东莞生益电子有限公司 | Method for removing laminated flowing glue on PCB surface |
| CN103369849A (en) * | 2013-08-02 | 2013-10-23 | 高德（无锡）电子有限公司 | Window-opening processing technology for covering layer of flexible circuit board |
| CN103458622A (en) * | 2012-05-30 | 2013-12-18 | 深南电路有限公司 | Circuit board processing method |
| CN105282989A (en) * | 2015-10-14 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Manufacturing method of windowed rigid-flex PCB |
-
2017
- 2017-11-29 CN CN201711226330.2A patent/CN108055786A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4635666A (en) * | 1985-04-22 | 1987-01-13 | Daley Frank E | Batch cleaning apparatus |
| CN103458622A (en) * | 2012-05-30 | 2013-12-18 | 深南电路有限公司 | Circuit board processing method |
| CN103347365A (en) * | 2013-06-07 | 2013-10-09 | 东莞生益电子有限公司 | Method for removing laminated flowing glue on PCB surface |
| CN103369849A (en) * | 2013-08-02 | 2013-10-23 | 高德（无锡）电子有限公司 | Window-opening processing technology for covering layer of flexible circuit board |
| CN105282989A (en) * | 2015-10-14 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Manufacturing method of windowed rigid-flex PCB |
Non-Patent Citations (1)
| Title |
|---|
| 顾江: "《电子设计与制造实训教程》", 30 September 2016 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111192816A (en) * | 2018-11-15 | 2020-05-22 | 东莞新科技术研究开发有限公司 | Semiconductor workpiece cleaning method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180518 |