CN108040419B - Preparation method of electronic product shell with surface additive combined with 3D-SMT - Google Patents
Preparation method of electronic product shell with surface additive combined with 3D-SMT Download PDFInfo
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- CN108040419B CN108040419B CN201711290887.2A CN201711290887A CN108040419B CN 108040419 B CN108040419 B CN 108040419B CN 201711290887 A CN201711290887 A CN 201711290887A CN 108040419 B CN108040419 B CN 108040419B
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- copper
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- plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
Abstract
The invention relates to the field of electronic products, in particular to a method for preparing a shell of an electronic product with a surface additive combined with 3D-SMT, which comprises the following steps of firstly forming the shell to obtain a product shell, then activating the surface to obtain an active surface, and then carrying out circuit metallization treatment to form a three-dimensional circuit; the shell manufactured by the method saves the shell space, is convenient for installing other electronic elements in the shell, and promotes the electronic product to reach high integration level.
Description
Technical Field
The invention relates to the field of electronic products, in particular to a method for preparing a shell of an electronic product with a surface additive combined with 3D-SMT.
Background
With the progress of society, there is a new demand for various consumer products, since they are 3C type electronic products, and the consumption of 3C products has become an indispensable part of people's physical life, and in the manufacturing process of electronic products, the manufacturing of product cases has become more and more important, in which integrated electronic circuits on the cases have become more and more popular, in the prior art, the longest adopted method is to attach a single-sided PCB or a double-sided PCB to the surface of the case, the method uses a composite material of epoxy resin, glass fiber and copper foil on the circuit board portion, and then pattern transfer and development are performed to etch and remove the unnecessary copper layer on the surface to obtain a circuit, the adopted method is a subtractive method, the processing process has a long circuit, and due to the performance of the case, electronic devices or chips need to be attached to the PCB and then assembled inside the case, the integration degree of the method is low, the requirements of miniaturization, light weight and high integration of electronic products are not easy to realize.
Disclosure of Invention
The invention aims to provide a method for preparing a shell of an electronic product with a surface additive combined with a 3D-SMT, wherein the shell of the electronic product manufactured by the method has high integration level, and can meet the requirements of miniaturization, light weight and high integration level of the electronic product.
In order to solve the technical problems, the invention provides a method for preparing a shell of an electronic product with a surface additive combined with a 3D-SMT, which comprises the following steps: s1, forming a shell, and processing the thermoplastic material substrate modified by the LDP additive to obtain a product shell; s2, surface activation, namely, carrying out chemical or laser treatment on the surface of the product shell to obtain an active shell surface; s3, carrying out circuit metallization, carrying out metallization treatment on the surface of the active shell, and forming a three-dimensional circuit on the surface of the active shell; s4, 3D-SMT, welding or mounting a passive element on the surface of the three-dimensional line to obtain a three-dimensional mounted assembly; and S5, assembling, namely, after the surface of the three-dimensional mounting component is mounted with an electronic device, assembling into a shell finished product.
Optionally, the thermoplastic material includes one or more of PBT, PA, LCP, PEEK, PBT fiber-reinforced composite material, PA fiber-reinforced composite material, LCP fiber-reinforced composite material, PEEK fiber-reinforced composite material, PBT multi-element alloy composite material, PA multi-element alloy composite material, LCP multi-element alloy composite material, and PEEK multi-element alloy composite material.
Optionally, the LDP additive is a Co-Ti-O mixed oxide or a Co-AL-O mixed oxide. The product shell is obtained by injection molding, 3D printing or CNC machining of the thermoplastic material matrix.
Optionally, the metallization process comprises spraying, 3DP, printing, PVD, LDS, or LDP.
Optionally, a passive component is welded or mounted on the surface of the three-dimensional circuit in a CAM manner.
Optionally, the chemical for surface activation is absolute ethyl alcohol or white cooking oil, the laser for surface activation is a glass fiber laser with a wavelength of 1064nm, the laser processing frequency is 60K Hz, the power is 6.0W-12.0W, and the speed is 1.5m/min-3.0 m/min.
Optionally, the three-dimensional circuit is a copper-nickel-gold, copper-nickel, copper-silver, nano-silver or nano-copper circuit, and the thickness of the three-dimensional circuit is 12-35 um.
Optionally, the passive component includes a resistor, a capacitor, an inductor, or an electronic component directly prepared on the surface of the electronic product housing.
Optionally, the surface mounting process is to perform 3D spray printing by using solder, and then perform reflow soldering on the three-dimensional circuit surface mounted passive component.
Optionally, after the step of assembling, the shell finished product is tested and then packaged, wherein the testing includes functional testing and AOI detection.
After the method for preparing the electronic product shell by combining the surface additive with the 3D-SMT is adopted, the conductive circuit is directly prepared on the surface of the shell of the electronic product, the electronic device is directly attached to the surface of the shell, and then the device, the circuit and the shell are integrated without assembly, so that the manufacturing process is saved, the electronic circuit is directly manufactured on the surface of the shell, the space of the shell is saved, the installation of other electronic elements in the shell is facilitated, and the electronic product is promoted to achieve high integration level.
Detailed Description
The following describes in detail specific embodiments of the present invention. It should be understood that the detailed description and specific examples, while indicating the present invention, are intended for purposes of illustration and explanation only and are not intended to limit the scope of the invention.
Example one
The invention discloses a method for preparing a shell of an electronic product by combining surface additive with 3D-SMT, which comprises the following steps of;
s1: forming a shell, namely processing the thermoplastic material substrate modified by the LDP additive to obtain a product shell;
specifically, the thermoplastic material comprises one or more of PBT, PA, LCP, PEEK, PBT fiber reinforced composite material, PA fiber reinforced composite material, LCP fiber reinforced composite material, PEEK fiber reinforced composite material, PBT multi-element alloy composite material, PA multi-element alloy composite material, LCP multi-element alloy composite material and PEEK multi-element alloy composite material, an LDP additive is disclosed in Chinese patent with the patent application number of 2014105298356, specifically Co-Ti-O mixed oxide or Co-AL-O mixed oxide, a thermoplastic material matrix modified by the LDP additive can withstand the subsequent wave soldering and reflow soldering treatment processes, and a product shell is processed by the thermoplastic material matrix through injection molding, 3D printing or CNC.
S2: surface activation, namely obtaining a stably activated active surface with certain surface micro roughness by adopting a chemical or laser treatment mode;
specifically, the chemicals for surface activation are surface detergents such as absolute alcohol, white gasoline and the like, or the laser activation for surface activation adopts a glass fiber laser with the wavelength of 1064nm, wherein the processing frequency of the laser activation treatment is 60K Hz, the activation treatment power is 6.0-12.0W, and the activation treatment speed is 1.5m/min-3.0 m/min.
S3: and (4) line metallization, namely performing metallization treatment on the active surface to form a three-dimensional line on the active surface.
In this embodiment, metallization is performed by using 3DP, printing, PVD, LDS or LDP, and the present invention is specifically illustrated by taking LDP (laser direct patterning) as an example, in order to ensure the quality of the metallization process of the LDP, ultrasonic waves may be first used to clean polymer dust on the active surface, wherein the ultrasonic waves have a frequency of 28KHz and a power of not more than 20KW, and the cleaning solution is sodium hydroxide (NaOH) and 20-40g/L sodium carbonate (Na) such as sodium hydroxide (NaOH) and sodium carbonate (Na) with a concentration of 20-40g/L2CO3) And 0.2-0.5% (wt) of surfactant, the processing time is not longer, generally not more than ten minutes; then plating copper on the active surface subjected to ultrasonic treatment, specifically, the copper plating comprises two steps of pre-plating copper and thick copper plating, wherein the pre-plating copper adopts the reaction conditions that the component composition is that the concentration of copper ions is 2.0-3.0g/l, the concentration of alkali is 5.0-9.0g/l, the concentration of formaldehyde is 3.0-5.0g/l, and the concentration of a complexing agent is 32-42g/l, and the first copper is plated with copper chemically under the reaction conditions that the temperature is 52-62 ℃ and the time is 20-40 min; the thick copper plating adopts copper ion concentration of 2.0-3.0g/l and alkali concentration of 4.5-5.5 g/l; carrying out chemical copper plating on a second copper-metallized liquid medicine with formaldehyde concentration of 4.5-5.5g/l and complexing agent of 22-32g/l under the reaction conditions of temperature of 50-56 ℃ and time of 60-180min, wherein the thickness of the pre-plated copper is as follows: 2-4um, thick copper plating: 6-15 um. And secondly, carrying out chemical nickel plating, chemical nickel gold plating or chemical silver plating on the copper plating position, wherein the thickness is as follows: 2-4um, namely a three-dimensional line can be formed on the active surface.
Wherein the chemical Nickel plating (Electro-less Nickel) is to firstly carry out Nickel activation treatment on the surface of the three-dimensional circuit and then deposit a Ni-P plating layer with the weight percentage of 2-4 mu m and less than 8% to obtain the copper-Nickel conducting circuit; the electroless Nickel-Gold plating is to obtain a copper-Nickel-Gold plating layer by adopting ENIG (Electro-less Nickel and Immersion Gold), and the electroless Silver plating is to obtain a copper-Silver conductive circuit by adopting ES (Electro-less Silver). The thickness of the conductive line is preferably controlled to be 12-20um in total thickness.
S4: 3D-SMT, welding or pasting a passive element on the surface of the three-dimensional line to obtain a three-dimensional pasting assembly, and pasting an electronic device on the surface of the three-dimensional pasting assembly;
the passive element comprises a resistor, a capacitor and an inductor or an electronic element directly prepared on the surface of the shell of the electronic product, the surface mounting process is to adopt solder to carry out 3D spray printing and then adopt reflow soldering to mount the passive element on the surface of the three-dimensional circuit, the CAM mode is adopted to weld or mount the passive element on the surface of the three-dimensional circuit in the embodiment, and the Surface Mounting Technology (SMT) is the most popular technology and process in the current electronic assembly industry, and is not described in more detail here.
S5, assembling, namely assembling the three-dimensional mounting component mounted with the electronic device into a shell finished product;
and testing and packaging the finished product of the electronic product after SMT, wherein the testing comprises functional testing and AOI (automated optical inspection), and the AOI is a detection process for detecting whether the surface of the shell meets the three-dimensional surface vision.
After the manufacturing method of the electronic product shell provided by the invention is adopted, the conductive circuit is directly prepared on the surface of the electronic product shell, the electronic device is directly pasted on the surface of the electronic product shell, and then the device, the circuit and the shell are integrated without being assembled, so that the manufacturing process is saved, the electronic circuit is directly manufactured on the surface of the shell, the space of the shell is saved, the installation of other electronic elements in the shell is convenient, and the electronic product is promoted to reach high integration level.
Example two
The second embodiment is different from the first embodiment in that the stereoscopic circuit is prepared by spraying at S3.
Specifically, first, the coal is minedCleaning the active surface with white electric oil or alcohol. Then spraying silver paste material with solid content of 60-70% and granularity below 600 μm on the active surface, wherein the conductivity of the silver paste material is not lower than 1.6X10-5ohm/cm2Wherein the silver paste material is semi-cured at normal temperature for 30-60 minutes or at 70 ℃ for 5-10 minutes, and then is finally cured at 120-150 ℃.
After the manufacturing method of the electronic product shell provided by the invention is adopted, the conductive circuit is directly prepared on the surface of the electronic product shell, the electronic device is directly pasted on the surface of the electronic product shell, and then the device, the circuit and the shell are integrated without being assembled, so that the manufacturing process is saved, the electronic circuit is directly manufactured on the surface of the shell, the space of the shell is saved, the installation of other electronic elements in the shell is convenient, and the electronic product is promoted to reach high integration level.
Claims (1)
1. A surface additive combined 3D-SMT electronic product shell preparation method comprises the following steps;
s1: the shell is molded, a thermoplastic material matrix modified by an LDP additive is processed to obtain a product shell, the LDP additive is Co-Ti-O mixed oxide or Co-AL-O mixed oxide, the product shell is obtained by injection molding, 3D printing or CNC processing of the thermoplastic material matrix, and the thermoplastic material comprises one or more of PBT, PA, LCP, PEEK, PBT fiber reinforced composite material, PA fiber reinforced composite material, LCP fiber reinforced composite material, PEEK fiber reinforced composite material, PBT multi-element alloy composite material, PA multi-element alloy composite material, LCP multi-element alloy composite material and PEEK multi-element alloy composite material;
s2: performing surface activation, namely performing chemical treatment on the surface of the product shell to obtain an active shell surface, wherein the chemical for surface activation is absolute alcohol or white electric oil;
s3: and (2) line metallization, wherein the surface of the active shell is metallized by adopting LDP (laser direct deposition), and a three-dimensional line is formed on the surface of the active shell, and the line metallization specifically comprises the following steps:
firstly, cleaning polymer dust on an active surface by adopting ultrasonic waves, wherein the ultrasonic frequency is 28KHz, the power is not more than 20KW, and the cleaning solution is a mixed solution of sodium hydroxide, 20-40g/L sodium carbonate and 0.2-0.5 wt% of surfactant; then plating copper on the active surface subjected to ultrasonic treatment, wherein the copper plating comprises two steps of pre-plating copper and thick copper plating, the pre-plating copper adopts a first copper chemical plating solution with the components of copper ion concentration of 2.0-3.0g/L, alkali concentration of 5.0-9.0g/L, formaldehyde concentration of 3.0-5.0g/L and complexing agent of 32-42g/L, and the first copper chemical plating solution is used for chemically plating copper under the reaction conditions that the temperature is 52-62 ℃ and the time is 20-40 min; the thick copper plating is characterized in that copper ions with the concentration of 2.0-3.0g/L, alkali with the concentration of 4.5-5.5g/L, formaldehyde with the concentration of 4.5-5.5g/L and a complexing agent with the concentration of 22-32g/L are adopted for chemical copper plating under the reaction conditions that the temperature is 50-56 ℃ and the time is 60-180min, and the thickness of the pre-plated copper is as follows: 2-4 μm, thick copper plating: 6-15 μm, then performing chemical nickel plating, chemical nickel gold plating or chemical silver plating on the copper plating position, wherein the thickness is as follows: 2-4 μm, namely a three-dimensional line can be formed on the active surface;
wherein, the chemical nickel plating is to firstly carry out nickel activation treatment on the surface of the three-dimensional circuit and then deposit a Ni-P plating layer with the weight percentage of 2-4 mu m and less than 8 percent to obtain the copper-nickel conducting circuit; the chemical nickel gold plating is to obtain a copper nickel gold plating layer by adopting ENIG, and the chemical silver plating is to obtain a copper silver conducting circuit by adopting ES; the total thickness of the conducting circuit is controlled to be 12-20 μm;
s4: the surface mounting process is that after 3D jet printing is carried out on the surface of the three-dimensional circuit by adopting welding flux, the surface of the three-dimensional circuit is mounted with a passive element by adopting reflow soldering, the surface of the three-dimensional circuit is welded or mounted with the passive element in a CAM mode, and the passive element comprises a resistor, a capacitor and an inductor or an electronic element directly prepared on the surface of the shell of the electronic product;
s5: and assembling, namely assembling the three-dimensional mounting assembly into a shell finished product after an electronic device is mounted on the surface of the three-dimensional mounting assembly, and testing and packaging the shell finished product after the step of assembling, wherein the testing comprises function testing and AOI (automated optical inspection).
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| CN201711290887.2A CN108040419B (en) | 2017-12-08 | 2017-12-08 | Preparation method of electronic product shell with surface additive combined with 3D-SMT |
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| CN201711290887.2A CN108040419B (en) | 2017-12-08 | 2017-12-08 | Preparation method of electronic product shell with surface additive combined with 3D-SMT |
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| CN108040419B true CN108040419B (en) | 2021-03-02 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103898484A (en) * | 2014-04-09 | 2014-07-02 | 永星化工(上海)有限公司 | Novel metallization technique for directly forming workpiece by laser |
| CN104277442A (en) * | 2014-10-09 | 2015-01-14 | 深圳市鑫方上科技有限公司 | Thermoplastic composition as well as preparation method and application thereof |
| CN205015541U (en) * | 2010-03-10 | 2016-02-03 | 比亚迪股份有限公司 | Electromagnetic shield window |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102751568A (en) * | 2011-04-22 | 2012-10-24 | 深圳富泰宏精密工业有限公司 | Antenna and manufacture method of antenna |
| KR20140091029A (en) * | 2011-10-31 | 2014-07-18 | 티코나 엘엘씨 | Thermoplastic composition for use in forming a laser direct structured substrate |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205015541U (en) * | 2010-03-10 | 2016-02-03 | 比亚迪股份有限公司 | Electromagnetic shield window |
| CN103898484A (en) * | 2014-04-09 | 2014-07-02 | 永星化工(上海)有限公司 | Novel metallization technique for directly forming workpiece by laser |
| CN104277442A (en) * | 2014-10-09 | 2015-01-14 | 深圳市鑫方上科技有限公司 | Thermoplastic composition as well as preparation method and application thereof |
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Effective date of registration: 20210204 Address after: Room 309-8, 3 / F, building 2, 116 Shiyang Road, Qinhuai District, Nanjing City, Jiangsu Province, 210000 Applicant after: Nanjing Maide Material Co.,Ltd. Address before: Room 1903, baolicheng garden office building, dongchuangye Road, Nanhai Avenue, Nanshan District, Shenzhen, Guangdong 518000 Applicant before: SHENZHEN SPHONSUN TECHNOLOGY Co.,Ltd. |
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