CN108037604A - A kind of PCB compression methods - Google Patents
A kind of PCB compression methods Download PDFInfo
- Publication number
- CN108037604A CN108037604A CN201711350364.2A CN201711350364A CN108037604A CN 108037604 A CN108037604 A CN 108037604A CN 201711350364 A CN201711350364 A CN 201711350364A CN 108037604 A CN108037604 A CN 108037604A
- Authority
- CN
- China
- Prior art keywords
- pin
- pcb
- pressing
- compression methods
- fpc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
Abstract
The invention discloses PCB compression methods, due to main both ends design and the wide sky pin at equal intervals of pressing pin using in PCB pressings pin, ACF conducting resinls are attached to above sky pin than pressing the part of pin long, when treating that FPC and PCB is pressed, hot pressing board also acts on both sides at the same time so that conducting resinl can be fitted closely with both sides sky pin, reduced both sides ACF glue and come off, so that product pressing is more preferable, pressing unfavorable condition is reduced.
Description
Technical field
The present invention relates to PCB to press technical field, and in particular, to a kind of PCB compression methods.
Background technology
The design of PCB pressing structures is the indispensable key link of liquid crystal display die set industry.At present, PCB, which presses FPC, is
After having pasted ACF conducting resinls on PCB pressings pin regions, directly by the contraposition Mark on the FPC both sides in the FOG pressed against PCB
Mark, using ACF conducting resinls as intermediary, under the hot pressing of board so that the golden finger of PCB contacted with the golden finger of FPC so as to
Fit together, pass through the effect of conducting particles in ACF conducting resinls so that PCB and FPC mutual conductions.In conventional design, only
Design golden finger at the pressing position of PCB, golden finger both sides are plate, general AC F conducting resinls can all cut out with pressing pin regions
Equal or more, additional portion is placed directly against above plate, although can be done together at pressing with pressing pin
Reason, but it is attached to that ACF above plate is very weak to the viscous force of plate, and both sides are easily separated from web contact part, cause PCB to press
The both sides of FPC easily press it is bad, ultimately result in product fraction defective height.
The content of the invention
It is an object of the present invention in view of the above-mentioned problems, a kind of PCB compression methods are proposed, to improve the pressure of PCB and FPC
Yield is closed, while improves production efficiency, cost-effective.
To achieve the above object, the technical solution adopted by the present invention is：A kind of PCB compression methods, mainly include：
Step 1：According to the pressing pin positions of the pressing location confirmation pcb board of FPC, PCB pressings Pin is obtained
Step 2：At the both ends of pressing Pin, empty Pin is set respectively；
Step 3：Pcb board in step 2 is positioned on board, ACF conducting resinls is sticked on pressing pin, removes release
Paper, by FPC and PCB to good contraposition Mark, carries out this pressure after carrying out false pressure, golden finger is closely connect with ACF conducting resinls again
Touch.
Further, the hollow Pin of step 2 and pressing pin is wide equidistantly.
Further, empty Pin is arranged within distance pressing Pin 3.0mm.
The both ends of the structure PCB pressings pin of PCB golden fingers a kind of are set and the wide sky pin at equal intervals of pressing pin.
Further, empty Pin is arranged within distance pressing Pin 3.0mm.
A kind of PCB compression methods of various embodiments of the present invention, due to it is main using PCB pressings pin both ends design with
Press the wide sky pin at equal intervals of pin so that ACF conducting resinls can be attached to above sky pin than pressing the part of pin long, treated
When FPC and PCB is pressed, hot pressing board also acts on both sides at the same time so that conducting resinl can be close with both sides sky pin
Fitting, reduces both sides ACF glue and comes off so that product pressing is more preferable, reduces pressing unfavorable condition.
Other features and advantages of the present invention will be illustrated in the following description, also, partly becomes from specification
Obtain it is clear that or being understood by implementing the present invention.
Below by drawings and examples, technical scheme is described in further detail.
Brief description of the drawings
Attached drawing is used for providing a further understanding of the present invention, and a part for constitution instruction, the reality with the present invention
Apply example to be used to explain the present invention together, be not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is traditional Pin structure diagrams；
Fig. 2 is present invention pressing Pin structure diagrams；
Fig. 3 is FPC of the present invention and PCB pressing structure schematic diagrames.
With reference to attached drawing, reference numeral is as follows in the embodiment of the present invention：
1-PCB；2- skies Pin；3- presses Pin；4-FPC；5-ACF conducting resinls；6-PCB opens window；7-FPC is overlapped with PCB
Place.
Embodiment
The preferred embodiment of the present invention is illustrated below in conjunction with attached drawing, it will be appreciated that described herein preferred real
Apply example to be merely to illustrate and explain the present invention, be not intended to limit the present invention.
The research and development of FPC technologies are pressed, are related to a kind of structure design of new PCB golden fingers with reference to Fig. 1-Fig. 3, PCB, this
Technology is utilized in the both ends design and the wide sky pin at equal intervals of pressing pin of PCB pressings pin so that ACF conducting resinls are than pressure
Closing the part of pin long can be attached to above sky pin, and when treating that FPC and PCB is pressed, hot pressing board also acts at the same time
Both sides so that conducting resinl can be fitted closely with both sides sky pin, reduced both sides ACF glue and come off so that product pressing is more preferable, subtracts
Unfavorable condition is pressed less.
First according to the pressing pin positions of the pressing location confirmation PCB of FPC, PCB is then pressed by pin according to design specification
Design because at least 3.0mm on pressing pin peripheries cannot put component, pressing pin both ends 3.0mm with
Interior scope can place pressing pin (if the regional Electronic beyond 3.0mm takes less than, may also be used for putting empty pin), press
Close the design of pin both ends and the wide sky pin at equal intervals of pressing pin.In bonding processes, after first plank is positioned on board,
Then ACF conducting resinls are sticked on pressing pin, then removes release liners above, then by FPC and PCB to good contraposition
Mark, board carry out this pressure again after first carrying out false pressure.Golden finger is in close contact with ACF conducting resinls, lifting product pressing yield.
Following beneficial effect can at least be reached：By way of designing sky pin in pressing pin both sides so that pressing pin
Both sides space is fully used, and reduces idle region；At the same time ACF conducting resinls can be caused more to be come into full contact with plank, improved
The pressing yield of product, in process of production, operation first-pass yield higher, saves cost of labor and bad reprocesses cost
Finally it should be noted that：The foregoing is only a preferred embodiment of the present invention, is not intended to limit the invention,
Although the present invention is described in detail with reference to the foregoing embodiments, for those skilled in the art, it still may be used
To modify to the technical solution described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic.
Within the spirit and principles of the invention, any modification, equivalent replacement, improvement and so on, should be included in the present invention's
Within protection domain.
Claims (6)
1. a kind of PCB compression methods, it is characterised in that include the following steps：
Step 1：According to the pressing pin positions of the pressing location confirmation pcb board of FPC, PCB pressings Pin is obtained
Step 2：At the both ends of pressing Pin, empty Pin is set respectively；
Step 3：Pcb board in step 2 is positioned on board, ACF conducting resinls is sticked on pressing pin, removes release liners, will
Plate to be laminated, to good contraposition Mark, carries out this pressure after carrying out false pressure, golden finger is closely connect with ACF conducting resinls again with PCB
Touch.
2. PCB compression methods according to claim 1, it is characterised in that plate to be laminated described in step 3 is FPC.
3. PCB compression methods according to claim 1, it is characterised in that between the hollow Pin of step 2 and the pressing wide grades of pin
Away from.
4. PCB compression methods according to claim 2, it is characterised in that empty Pin is arranged on distance pressing Pin 3.0mm
Within.
5. a kind of structure of PCB golden fingers, it is characterised in that the both ends of PCB pressings pin set wide equidistantly with pressing pin
Empty pin.
6. the structure of PCB golden fingers according to claim 4, it is characterised in that empty Pin is arranged on distance pressing Pin
Within 3.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711350364.2A CN108037604A (en) | 2017-12-15 | 2017-12-15 | A kind of PCB compression methods |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711350364.2A CN108037604A (en) | 2017-12-15 | 2017-12-15 | A kind of PCB compression methods |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108037604A true CN108037604A (en) | 2018-05-15 |
Family
ID=62103201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711350364.2A Pending CN108037604A (en) | 2017-12-15 | 2017-12-15 | A kind of PCB compression methods |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108037604A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101720171A (en) * | 2009-03-18 | 2010-06-02 | 四川虹欧显示器件有限公司 | Pressing method for flexible circuit board of flat display device |
| CN102858097A (en) * | 2012-09-04 | 2013-01-02 | 深圳市华星光电技术有限公司 | PCB (printed circuit board), laminating method for PCB and COF (chip on FPC (flexible printed circuit)), as well as liquid crystal display device |
| CN206115413U (en) * | 2016-08-28 | 2017-04-19 | 江西合力泰科技有限公司 | On cell module prevents that tearing touching of touch -control FPC from showing integrative module |
| CN106851974A (en) * | 2017-04-14 | 2017-06-13 | 歌尔股份有限公司 | A kind of circuit board and compression method |
-
2017
- 2017-12-15 CN CN201711350364.2A patent/CN108037604A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101720171A (en) * | 2009-03-18 | 2010-06-02 | 四川虹欧显示器件有限公司 | Pressing method for flexible circuit board of flat display device |
| CN102858097A (en) * | 2012-09-04 | 2013-01-02 | 深圳市华星光电技术有限公司 | PCB (printed circuit board), laminating method for PCB and COF (chip on FPC (flexible printed circuit)), as well as liquid crystal display device |
| CN206115413U (en) * | 2016-08-28 | 2017-04-19 | 江西合力泰科技有限公司 | On cell module prevents that tearing touching of touch -control FPC from showing integrative module |
| CN106851974A (en) * | 2017-04-14 | 2017-06-13 | 歌尔股份有限公司 | A kind of circuit board and compression method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190925 Address after: 518101 2nd and 5th Floors of Building B, Xijing Industrial Zone, Gushitang West Team, Xixiang, Baoan District, Shenzhen City, Guangdong Province Applicant after: Star Source Electronic Technology (Shenzhen) Co., Ltd. Address before: 536000 Industrial Park, Beihai City, Guangxi Zhuang Autonomous Region, No. 3, District 4, Gaoke Road (Sanuo Intelligent Industrial Park D02) Applicant before: Beihai Yuan Yuan Electronic Technology Co., Ltd. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180515 |