CN205750182U - Bonding device - Google Patents
Bonding device Download PDFInfo
- Publication number
- CN205750182U CN205750182U CN201620725232.8U CN201620725232U CN205750182U CN 205750182 U CN205750182 U CN 205750182U CN 201620725232 U CN201620725232 U CN 201620725232U CN 205750182 U CN205750182 U CN 205750182U
- Authority
- CN
- China
- Prior art keywords
- baffle
- pressing head
- head seat
- pedestal
- propping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
Abstract
nullThis utility model relates to bonding techniques field，Particularly relate to a kind of bonding device，Including attaching assembly and this pressure assembly，Described attaching assembly includes for propping up FPC(1) the first baffle plate (2) and be used for propping up the pressing head seat (4) of infrabasal plate (3)，Described pressing head seat (4) is connected fixing with the first baffle plate (2)，Described pressure assembly includes for propping up FPC(1) second baffle (5) and be used for propping up the pedestal (6) of infrabasal plate (3)，Described pedestal (6) is connected with second baffle (5)，Wherein，Described pressing head seat (4) is provided with the first breach (8) for preventing pressing head seat (4) from contacting with a line glue (7) near the first baffle plate (2) side，Described pedestal (6) is provided with the second breach (9) for preventing pedestal (6) from contacting with a line glue (7) near second baffle (5) side.This bonding device infrabasal plate in the case of guarantee gluing efficiency is constant is not easy fragmentation.
Description
Technical field
This utility model relates to bonding techniques field, particularly relates to a kind of bonding device.
Background technology
Need bonding IC and FPC on the infrabasal plate of TFT display module, and IC bonding complete after need to coat an aspect glue and enter
Row protection, FPC bonding well after need the crevice place between FPC and infrabasal plate to coat a line glue to protect, and existing skill
The bonding device of art includes the attaching assembly for attaching on infrabasal plate by FPC by conducting resinl and is used for FPC by leading
This pressure assembly that electricity glue is fastened on infrabasal plate, and prior art is in order to improve gluing efficiency, typically all face glue and a line
Glue is beaten together, is so placed into by the infrabasal plate accomplishing fluently glue on attaching assembly when attaching, because attaching the pressure head of assembly
Seat width is relatively big, generally 12mm, and a line glue exceeds infrabasal plate, and which results in a line glue can be with pressure head seated connection
Touch, when pressing under such pressure head, although strength is not very big, is intended merely to fit together FPC, conducting resinl and infrabasal plate,
But a line glue still can extrude infrabasal plate, and then may cause infrabasal plate fragmentation, in like manner, because the quartz bar base of this pressure assembly
Seat width is relatively big, generally 6mm, such line glue also can with quartz bar base into contact, pressure head under press time, a line glue can extrude down
Substrate, and then infrabasal plate fragmentation may be caused.
Summary of the invention
Technical problem to be solved in the utility model is: provide a kind of lower base in the case of guarantee gluing efficiency is constant
Plate is not easy the bonding device of fragmentation.
This utility model be the technical scheme is that a kind of bonding device, including attaching assembly and this pressure assembly, institute
State attaching assembly and include the first baffle plate for propping up FPC and for propping up the pressing head seat of infrabasal plate, described pressing head seat and the
One baffle plate connects fixing, and described pressure assembly includes the second baffle for propping up FPC and for propping up the pedestal of infrabasal plate,
Described pedestal is connected with second baffle, and wherein, described pressing head seat is provided with for preventing pressing head seat and near the first baffle plate side
Line glueds joint the first breach touched, and described pedestal is provided with near second baffle side for preventing pedestal and a line from glueing joint second touched
Breach.
Described first breach is rectangle, and the second breach is also rectangle.
Described pressing head seat uses ceramic material to make.
Described pedestal uses quartz material to make.
Using above structure compared with prior art, this utility model has the advantage that and arranges first on pressing head seat
Breach, after infrabasal plate is so placed into attaching assembly, a line glue is in the first breach, i.e. will not be with pressure head seated connection
Touching, so when carrying out slight squeeze, a line glue would not give infrabasal plate pressure, and then makes infrabasal plate be not easy fragmentation；With
Reason, because being provided with the second breach on pedestal, after being so placed into by infrabasal plate on this pressure assembly, a line glue is in second
In breach, can't contact with substrate, so when carrying out this pressure, one line glue would not give infrabasal plate pressure, and then also makes
Infrabasal plate is not easy fragmentation, i.e. on the premise of not reducing and disturbing efficiency so that infrabasal plate is not easy fragmentation.
And it is by the most rectangular to the first breach and the second breach, the most easy to process.
Pressing head seat uses ceramic material to make, and is so well suited for laminating and slight squeeze, and pedestal uses quartz material
Making, intensity is higher, is appropriate to this pressure.
Accompanying drawing explanation
Fig. 1 is that in this utility model bonding device, infrabasal plate is placed on the schematic diagram attaching assembly.
Fig. 2 is the schematic diagram that in this utility model bonding device, infrabasal plate is placed on this pressure assembly.
As shown in the figure: 1, FPC；2, the first baffle plate；3, infrabasal plate；4, pressing head seat；5, second baffle；6, pedestal；7, a line
Glue；8, the first breach；9, the second breach；10, conducting resinl.
Detailed description of the invention
With detailed description of the invention, this utility model is described further below in conjunction with accompanying drawing, but this utility model is not only
It is limited to detailed description below.
A kind of bonding device, including attaching assembly and this pressure assembly, described attaching assembly includes for propping up FPC1's
First baffle plate 2 and for propping up the pressing head seat 4 of infrabasal plate 3, described pressing head seat 4 is connected with the first baffle plate 2 to be fixed, described pressure
Assembly includes the second baffle 5 for propping up FPC1 and for propping up the pedestal 6 of infrabasal plate 3, described pedestal 6 and second baffle
5 connect, it is characterised in that: described pressing head seat 4 is provided with for preventing pressing head seat 4 from contacting with a line glue 7 near the first baffle plate 2 side
The first breach 8, described pedestal 6 be provided with near second baffle 5 side for prevent pedestal 6 from contacting with a line glue 7 second lack
Mouth 9.It is provided with conducting resinl 10 between infrabasal plate 3 and FPC1.
Described first breach 8 is rectangle, and the second breach 9 is also rectangle.And because being provided with the first breach, so pressure
The width that headstock contacts with infrabasal plate just becomes present 3mm, in like manner, the width that pedestal contacts with pressing head seat from original 12mm
Spend and become present 3mm from original 5mm.
Described pressing head seat 4 uses ceramic material to make.
Described pedestal 6 uses quartz material to make.
Claims (4)
1. a bonding device, including attaching assembly and this pressure assembly, described attaching assembly includes for propping up FPC(1)
First baffle plate (2) and be used for propping up the pressing head seat (4) of infrabasal plate (3), described pressing head seat (4) is connected solid with the first baffle plate (2)
Fixed, described pressure assembly includes for propping up FPC(1) second baffle (5) and be used for propping up the pedestal (6) of infrabasal plate (3),
Described pedestal (6) is connected with second baffle (5), it is characterised in that: described pressing head seat (4) is provided with near the first baffle plate (2) side
For the first breach (8) preventing pressing head seat (4) from contacting with a line glue (7), described pedestal (6) is near second baffle (5) side
It is provided with the second breach (9) for preventing pedestal (6) from contacting with a line glue (7).
Bonding device the most according to claim 1, it is characterised in that: described first breach (8) is rectangle, and the second breach
(9) also it is rectangle.
Bonding device the most according to claim 1, it is characterised in that: described pressing head seat (4) uses ceramic material to make.
Bonding device the most according to claim 1, it is characterised in that: described pedestal (6) uses quartz material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620725232.8U CN205750182U (en) | 2016-07-12 | 2016-07-12 | Bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620725232.8U CN205750182U (en) | 2016-07-12 | 2016-07-12 | Bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205750182U true CN205750182U (en) | 2016-11-30 |
Family
ID=57378893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620725232.8U Active CN205750182U (en) | 2016-07-12 | 2016-07-12 | Bonding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205750182U (en) |
-
2016
- 2016-07-12 CN CN201620725232.8U patent/CN205750182U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |