CN221176250U - Laminating tool and laminating equipment - Google Patents

Abstract

The application is applicable to the technical field of laminating equipment, and provides a laminating jig and laminating equipment, wherein the laminating jig comprises: the LED lamp comprises a supporting part and a fitting part, wherein the supporting part comprises a supporting main body, and the supporting main body is used for supporting an LED product to be processed; the laminating part can be movably arranged on the supporting part, the laminating part comprises a laminating component and a buffer component, the laminating component is used for connecting the optical diaphragm, and the laminating part can drive the optical diaphragm to be laminated with the LED product to be processed on the supporting main body under the driving of external equipment; the buffer component is arranged on the attaching component and is used for enabling the acting force applied by external equipment to the attaching part to be uniformly distributed on the optical film. By using the bonding jig provided by the application to bond the optical film and the LED product to be processed, the bonding effect between the optical film and the LED product to be processed can be effectively improved.

Description

Laminating tool and laminating equipment

Technical Field

The application belongs to the technical field of laminating equipment, and particularly relates to a laminating jig and laminating equipment.

Background

The LED display screen adopting COB (Chip On Borad) packaging technology has the characteristics of high brightness, bright color, high luminous efficiency, high contrast ratio, short response time, wide working temperature range, low energy consumption, collision prevention and the like, and is widely applied to data visual display equipment and commercial display equipment as an emerging display technology in recent years.

The COB abandons the bonding mode of the LED lamp beads and the PCB board which are independently packaged in the traditional LED display panel, removes the single lamp package, directly bonds the LED light-emitting chip with the PCB board through a die bonding process, molds the whole panel surface to complete the lamp board package, and finally, a plurality of COB display panels are spliced to form the COB LED display screen.

However, while this advantage is achieved, other negative problems such as the problem of black screen modularization of the COB display screen due to the problem of color difference between the lamp panels are also derived from this packaging process, and the surface treatment process of the COB display panel is a key factor affecting this problem, so that the process of attaching an optical film after molding the lamp panels is generally adopted in the industry to reduce the color difference between the panels, thereby improving the consistency of black screens.

At present, the laminating is completed by matching the roller laminating machine with the manual diaphragm positioning, and the laminating mode is simple and convenient to operate, low in cost and high in efficiency, but when the area of the lamp panel and the area of the optical film are large, the optical film is easy to bear uneven force in the laminating process with the lamp panel, so that the laminating yield and stability are affected.

Disclosure of utility model

The embodiment of the application aims to provide a bonding jig and bonding equipment, and aims to solve the technical problems that in the prior art, an optical film and a lamp panel are easy to bear uneven stress in the bonding process, and the bonding yield and stability are affected.

To achieve the above object, according to one aspect of the present application, there is provided a bonding jig including: the LED lamp comprises a supporting part and a fitting part, wherein the supporting part comprises a supporting main body, and the supporting main body is used for supporting an LED product to be processed; the laminating part can be movably arranged on the supporting part, the laminating part comprises a laminating component and a buffer component, the laminating component is used for connecting the optical diaphragm, and the laminating part can drive the optical diaphragm to be laminated with the LED product to be processed on the supporting main body under the driving of external equipment; the buffer component is arranged on the attaching component and is used for enabling the acting force applied by external equipment to the attaching part to be uniformly distributed on the optical film.

Optionally, the attaching part is movably installed on the supporting part, the LED product to be processed is installed on one side of the supporting main body close to the attaching component, and the optical film is installed on one side of the attaching component close to the supporting main body; the laminating assembly is provided with a first position for enabling the optical film on the laminating assembly to avoid the LED product to be processed on the supporting main body and a second position for enabling the optical film on the laminating assembly to be laminated with the LED product to be processed on the supporting main body, and the laminating assembly can be switched from the first position to the second position under the driving of external equipment; the supporting part also comprises an elastic resetting component which is arranged on the supporting main body and used for applying elastic force to the attaching component so that the attaching component can maintain the first position under the condition of not being affected by external force.

Optionally, the laminating subassembly includes diaphragm carrier plate and sets up the bonding colloid layer that is close to support main part one side at the diaphragm carrier plate, and the one side that is close to support main part of bonding colloid layer is used for bonding optical film.

Optionally, the buffer assembly includes the buffering colloid layer, and the buffering colloid layer sets up in the one side that is close to the support main part of diaphragm support plate to can with optics diaphragm butt, the circumference along the buffering colloid layer of bonding colloid layer extends, the one side of keeping away from the diaphragm support plate of bonding colloid layer and the one side parallel and level of keeping away from the diaphragm support plate of buffering colloid layer, the diaphragm support plate can exert effort to the optics diaphragm through the buffering colloid layer.

Optionally, the laminating subassembly includes location frame and adhesive film, is provided with the opening of stepping down on the location frame, and the adhesive film lid is established on the opening of stepping down, and the one side that is close to the support main part of adhesive film is used for bonding the optical film piece.

Optionally, the cushion assembly includes an elastic cushion disposed on a side of the adhesive film remote from the support body, the external device being capable of applying a force to the adhesive film through the elastic cushion.

Optionally, a yielding groove is arranged on one side of the supporting body, which is close to the attaching part, and the position of the yielding groove corresponds to the position of the component on the LED product to be processed, so that the component on the LED product to be processed is yielded.

Optionally, an elastic support body is arranged in the yielding groove and is used for supporting components in the yielding groove.

According to another aspect of the present application, there is provided a bonding apparatus, the bonding apparatus including a bonding jig, the bonding jig being the bonding jig described above; the laminating equipment still includes equipment main part and vacuum portion, is provided with the vacuum cavity in the equipment main part, and laminating tool is installed in the vacuum cavity, and vacuum portion sets up in the equipment main part to communicate with the vacuum cavity for vacuole to the vacuum cavity.

Optionally, the external device is laminating equipment, and laminating equipment still includes the pressfitting portion, and the pressfitting portion sets up on the equipment main part for apply effort to laminating tool, so that optical film piece can laminate with waiting to process the LED product.

The bonding jig provided by the application has the beneficial effects that: compared with the prior art, the laminating jig provided by the application has the advantages that the laminating part is movably arranged on the supporting part, so that the laminating part can drive the optical film arranged on the laminating component to be laminated with the LED product to be processed arranged on the supporting main body under the driving of external equipment, and meanwhile, the buffer component is arranged on the laminating component, so that the external equipment can apply acting force to the laminating part, and the buffer component can uniformly act on the optical film, so that the laminating effect between the optical film and the LED product to be processed is effectively improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a bonding fixture according to an embodiment of the present application;

Fig. 2 is a schematic structural diagram of a bonding jig with a bonding portion removed according to an embodiment of the present application;

FIG. 3 is a schematic cross-sectional view of a bonding tool according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of a bonding tool according to another embodiment of the present application;

FIG. 5 is a schematic cross-sectional view of a bonding tool according to another embodiment of the present application;

Reference numerals related to the above figures are as follows:

10. A support part; 11. a support body; 111. an elastic support body; 12. an elastic reset assembly; 121. a support column; 1211. a positioning pin; 122. an elastic reset piece;

20. a bonding part; 21. a fitting assembly; 211. a membrane carrier plate; 212. bonding the colloid layer; 213. positioning the outer frame; 214. an adhesive film; 22. a buffer assembly; 221. a buffer gel layer; 222. an elastic cushion;

30. An LED product to be processed;

40. An optical film.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element. Embodiments of the application and features of the embodiments may be combined with each other without conflict. The application will be described in detail below with reference to the drawings in connection with embodiments.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

As described in the background art, the LED display screen adopting the COB (Chip On Borad) packaging technology has the characteristics of high brightness, bright color, high luminous efficiency, high contrast, short response time, wide operating temperature range, low energy consumption, collision prevention and the like, and is widely applied to data visual display devices and commercial display devices as an emerging display technology in recent years. The COB abandons the bonding mode of the LED lamp beads and the PCB board which are independently packaged in the traditional LED display panel, removes the single lamp package, directly bonds the LED light-emitting chip with the PCB board through a die bonding process, molds the whole panel surface to complete the lamp board package, and finally, a plurality of COB display panels are spliced to form the COB LED display screen. However, while this advantage is achieved, other negative problems such as the problem of black screen modularization of the COB display screen due to the problem of color difference between the lamp panels are also derived from this packaging process, and the surface treatment process of the COB display panel is a key factor affecting this problem, so that the process of attaching an optical film after molding the lamp panels is generally adopted in the industry to reduce the color difference between the panels, thereby improving the consistency of black screens. At present, the laminating is completed by matching the roller laminating machine with the manual diaphragm positioning, and the laminating mode is simple and convenient to operate, low in cost and high in efficiency, but when the area of the lamp panel and the area of the optical film are large, the optical film is easy to bear uneven force in the laminating process with the lamp panel, so that the laminating yield and stability are affected.

Referring to fig. 1 to 5, in order to solve the above-mentioned problems, according to an aspect of the present application, an embodiment of the present application provides a bonding jig including: the LED lamp comprises a supporting part 10 and a fitting part 20, wherein the supporting part 10 comprises a supporting main body 11, and the supporting main body 11 is used for supporting an LED product 30 to be processed; the attaching part 20 can be movably arranged on the supporting part 10, the attaching part 20 comprises an attaching component 21 and a buffer component 22, the attaching component 21 is used for connecting the optical film 40, and the attaching part 20 can drive the optical film 40 to attach to the LED product 30 to be processed on the supporting main body 11 under the driving of external equipment; the buffer assembly 22 is disposed on the bonding assembly 21, so that the force applied to the bonding portion 20 by the external device can be uniformly distributed on the optical film 40. The laminating jig provided in this embodiment is through setting up laminating portion 20 to mobilizable installation on supporting part 10, make laminating portion 20 can drive under external equipment's drive that install the optics diaphragm 40 on laminating subassembly 21 and install the LED product 30 of waiting to process on supporting body 11 laminating, meanwhile, through setting up buffer unit 22 on laminating subassembly 21, make external equipment apply effort to laminating portion 20, can be through the even effect of buffer unit 22 on optics diaphragm 40, thereby effectually improved the laminating effect between optics diaphragm 40 and the LED product 30 of waiting to process.

Referring to fig. 1 to 5, in a specific embodiment, the attaching portion 20 in this embodiment is movably mounted on the supporting portion 10, the LED product 30 to be processed is mounted on a side of the supporting body 11 near the attaching assembly 21, and the optical film 40 is mounted on a side of the attaching assembly 21 near the supporting body 11; the attaching assembly 21 is provided with a first position for enabling the optical film 40 on the attaching assembly 21 to avoid the LED product 30 to be processed on the supporting body 11 and a second position for enabling the optical film 40 on the attaching assembly 21 to attach to the LED product 30 to be processed on the supporting body 11, and the attaching assembly 21 can be switched from the first position to the second position under the drive of external equipment; the support portion 10 further includes an elastic restoring component 12, where the elastic restoring component 12 is disposed on the support main 11 and is used to apply an elastic force to the fitting component 21, so that the fitting component 21 can maintain the first position without being acted by an external force. By providing the elastic restoring assembly 12 on the supporting body 11 provided in this embodiment, the attaching assembly 21 provided in this embodiment can maintain the first position by the elastic force applied by the elastic restoring assembly 12 to the attaching assembly 21 under the condition of not being affected by external force.

In an alternative embodiment, the elastic restoring assembly 12 provided in this embodiment includes a support column 121 and an elastic restoring member 122, where the support body 11 provided in this embodiment is provided with a mounting hole, the support column 121 provided in this embodiment is movably inserted into the mounting hole, the support column 121 has an initial position and a working position that moves a preset distance toward the support body 11, and the elastic restoring member 122 is disposed between the support column 121 and the support body 11 and is used for applying an elastic force to the support column 121 so that the support column 121 maintains the initial position without being acted by an external force.

In an alternative embodiment, the resilient return member 122 provided in this embodiment is a compression spring.

In an alternative embodiment, a positioning pin 1211 is disposed at one end of the support column 121 near the attaching component 21, a positioning hole is disposed at one end of the attaching component 21 near the supporting body 11, the position of the positioning hole corresponds to the position of the positioning pin 1211, and the attaching component 21 can be positioned and mounted on the support column 121 through cooperation of the positioning hole and the positioning pin 1211, so that the attaching portion 20 provided in this embodiment is movably mounted on the supporting portion 10.

In an alternative embodiment, in order to stably mount the fitting portion 20 on the support portion 10, a plurality of elastic restoring assemblies 12 are provided in this embodiment, and the plurality of elastic restoring assemblies 12 are disposed at intervals along the circumferential direction of the fitting portion 20.

In an alternative embodiment, the supporting portion 10 provided in this embodiment further includes a locking assembly, where the locking assembly is disposed on the supporting body 11, and in the case where the supporting column 121 provided in this embodiment is switched from the initial position to the working position, the locking assembly can lock the supporting column 121 that is in the working position and is not acted by an external force, so that the supporting column 121 maintains the working position, and in the case where a force is applied to the supporting column 121 in a direction away from the supporting body 11, the locking assembly cannot maintain the locking of the supporting column 121 in the working position, and the supporting column 121 is switched from the working position to the initial position under the action of the elastic force applied by the elastic restoring member 122.

Referring to fig. 1 to 3, in a specific embodiment, in order to facilitate the installation of the optical film 40 provided in this embodiment, the attaching assembly 21 in this embodiment includes a film carrier 211 and an adhesive layer 212 disposed on a side of the film carrier 211 near the supporting body 11, where a side of the adhesive layer 212 near the supporting body 11 is used for adhering the optical film 40. By providing the adhesive layer 212 on the side of the film carrier plate 211 near the support body 11, the optical film 40 provided in this embodiment can be quickly mounted on the film carrier plate 211 through the adhesive layer.

In a specific embodiment, the positioning hole provided in this embodiment is disposed on a side of the membrane carrier plate 211 near the support body 11.

In an alternative embodiment, the membrane carrier plate 211 provided in this embodiment is an acrylic plate, and in other embodiments, the membrane carrier plate 211 provided in this embodiment may be a hard cover plate such as a glass cover plate or an aluminum plate.

In an alternative embodiment, the thickness of the membrane carrier plate 211 provided in this embodiment is greater than 3mm.

In an alternative embodiment, the surface flatness of the membrane carrier plate 211 provided in this embodiment is less than 10um.

In an alternative embodiment, the warpage of the membrane carrier 211 provided in this embodiment is less than 500um.

In an alternative embodiment, the adhesive layer 212 provided in this embodiment is made of adhesive silica gel, and in other embodiments, the adhesive layer 212 provided in this embodiment may be made of adhesive rubber, adhesive sponge mat, or the like, which can adhere to the optical film 40.

In an alternative embodiment, the adhesive gel layer 212 provided in this embodiment has an adhesive strength greater than 5N/25mm and less than 15N/25mm.

Referring to fig. 1 to 3, in a specific embodiment, in order to enable the film carrier plate 211 to uniformly apply a force to the optical film 40, the buffer assembly 22 in this embodiment includes a buffer gel layer 221, the buffer gel layer 221 is disposed on a side of the film carrier plate 211 near the support body 11 and can abut against the optical film 40, the adhesive gel layer 212 extends along a circumferential direction of the buffer gel layer 221, and a side of the adhesive gel layer 212 away from the film carrier plate 211 is flush with a side of the buffer gel layer 221 away from the film carrier plate 211, and the film carrier plate 211 can apply a force to the optical film 40 through the buffer gel layer 221. By arranging the buffer colloid layer 221 on the side, close to the supporting body 11, of the membrane carrier plate 211 provided in this embodiment, and enabling the side, far away from the membrane carrier plate 211, of the buffer colloid layer 221 to be flush with the side, far away from the membrane carrier plate 211, of the adhesive colloid layer 212, the optical membrane 40 provided in this embodiment can be attached to the buffer colloid layer 221 while being connected to the membrane carrier plate 211 through the adhesive colloid layer 212, and since the buffer colloid layer 221 has a certain elasticity, the membrane carrier plate 211 applies an acting force to the optical membrane 40 in the attaching process of the optical membrane 40 and the LED product 30 to be processed, and can uniformly act on the attaching surface of the optical membrane 40 and the LED product 30 to be processed through the buffer colloid layer 221, so that the attaching effect between the optical membrane 40 and the LED product 30 to be processed is effectively improved.

In an alternative embodiment, the optical film 40 provided in this embodiment can be sized to completely cover the buffer gel layer 221 and have the same size as the area surrounded by the adhesive gel layer 212.

In an alternative embodiment, the thickness of the adhesive gel layer 212 and the buffer gel layer 221 provided in this embodiment is between 5mm and 100 mm.

In an alternative embodiment, the surface flatness of the buffer glue layer 221 provided in this embodiment is less than 10um, and the joint between the adhesive glue layer 212 and the buffer glue layer 221 is less than 50um.

Referring to fig. 4 and 5, in another embodiment, in order to facilitate the installation of the optical film 40 provided in this embodiment, the attaching assembly 21 in this embodiment includes a positioning outer frame 213 and an adhesive film 214, a yielding opening is disposed on the positioning outer frame 213, the adhesive film 214 is covered on the yielding opening, and a side of the adhesive film 214 close to the supporting body 11 is used for connecting the optical film 40. By covering the adhesive film 214 on the relief opening of the positioning frame 213 provided in the present embodiment, the optical film 40 provided in the present embodiment can be quickly mounted on the positioning frame 213 through the adhesive film 214.

In a specific embodiment, the positioning hole provided in this embodiment is provided on a side of the positioning frame 213 near the support body 11.

In a specific embodiment, the yielding opening provided in this embodiment is used to yield the LED product 30 to be processed.

In an alternative embodiment, the adhesive film 214 provided in this embodiment is an adhesive stretch film, although in other embodiments, the adhesive film 214 provided in this embodiment may be an adhesive blue film or the like.

In an alternative embodiment, the adhesive film 214 provided in this embodiment has a thickness of less than 50um.

In an alternative embodiment, the adhesive film 214 provided in this embodiment has an adhesive property greater than 5N/25mm and less than < 15N/25mm.

Referring to fig. 4 and 5, in another embodiment, in order to enable the external device provided in the present embodiment to uniformly apply a force to the optical film 40, the buffer assembly 22 in the present embodiment includes an elastic cushion 222, the elastic cushion 222 being disposed at a side of the adhesive film 214 remote from the support body 11, and the external device being capable of applying a force to the adhesive film 214 through the elastic cushion 222. By arranging the elastic cushion 222 on the side of the adhesive film 214 far away from the supporting body 11, which is provided in the present embodiment, the external device can apply an acting force to the adhesive film 214 through the elastic cushion 222, and, because the elastic cushion 222 provided in the present embodiment has a certain elasticity, the acting force applied by the external device can uniformly act on the adhesive film 214 through the elastic cushion 222 in the process of adhering the optical film 40 to the LED product 30 to be processed, meanwhile, because of a specific flexibility of the adhesive film 214, the acting force of the elastic cushion 222 to the adhesive film 214 can be uniformly transferred to the adhering surface of the optical film 40 to the LED product 30 to be processed, thereby effectively improving the adhering effect between the optical film 40 and the LED product 30 to be processed.

In an alternative embodiment, the elastic cushion 222 provided in this embodiment is made of non-adhesive silica gel, and in other embodiments, the elastic cushion 222 provided in this embodiment may be made of non-adhesive rubber, non-adhesive sponge cushion, or the like.

In an alternative embodiment, the resilient cushion 222 is provided with a thickness of greater than 3mm.

In an alternative embodiment, the positioning frame 213 is used to stretch and flatten the adhesive film 214, so that the surface flatness of the adhesive film 214 is less than 10um.

In an alternative embodiment, the optical film 40 provided in this embodiment is sized to completely cover the elastomeric pad 222.

Referring to fig. 3 and 5, in order to facilitate the installation of the LED product 30 to be processed provided in this embodiment, a yielding groove is disposed on a side of the supporting body 11 near the attaching component 21 in this embodiment, where the position of the yielding groove corresponds to the position of a component on the LED product 30 to be processed, and is used for yielding the component on the LED product 30 to be processed. By arranging the abdication groove on the side, close to the attaching assembly 21, of the support body 11 provided by the embodiment, and enabling the position of the abdication groove to correspond to the position of the component on the LED product 30 to be processed, the support body 11 provided by the embodiment can abdy the component on the LED product 30 to be processed through the abdication groove, so that the LED product 30 to be processed provided by the embodiment can be stably mounted on the support body 11.

Referring to fig. 3 and 5, in order to improve the supporting effect of the supporting body 11 on the LED product 30 to be processed, an elastic supporting body 111 is disposed in the yielding groove in this embodiment, and the elastic supporting body 111 is used for supporting components located in the yielding groove. Through set up the elastic support body 111 in the recess of stepping down that this embodiment provided, make the components and parts on the LED product 30 that wait to process can obtain effectual support through the elastic support body 111, simultaneously, support the components and parts on the LED product 30 that wait to process through setting up the elastic support body 111, can make the atress of the LED product 30 that wait to process that this embodiment provided in the in-process of laminating with the optical diaphragm 40 more even to the effectual LED product 30 that waits to process has been improved is in laminating effect with the optical diaphragm 40.

In an alternative embodiment, the elastic support body 111 provided in this embodiment is made of soft silica gel, and in other embodiments, the elastic support body 111 provided in this embodiment may be made of rubber, foam-rubber, or the like.

In an alternative embodiment, the present embodiment provides a single point support area between the LED product 30 to be processed and the support body 11 of 0.25cm2 or more.

According to another aspect of the present application, there is provided a bonding apparatus, the bonding apparatus including a bonding jig, the bonding jig being the bonding jig described above; the laminating equipment still includes equipment main part and vacuum portion, is provided with the vacuum cavity in the equipment main part, and laminating tool is installed in the vacuum cavity, and vacuum portion sets up in the equipment main part to communicate with the vacuum cavity for vacuole to the vacuum cavity. Through the laminating tool setting that provides this embodiment dress is in the vacuum cavity to make vacuum portion and vacuum cavity intercommunication, make the laminating tool that this embodiment provided can laminate optical diaphragm 40 on waiting to process LED product 30 under the vacuum environment, thereby effectually avoided optical diaphragm 40 and wait to process the LED product 30 laminating after, the phenomenon of bubble appears between optical diaphragm 40 and waiting to process LED product 30.

In an alternative embodiment, the vacuum degree in the vacuum cavity in the present embodiment is less than-95 Mpa during the process of attaching the optical film 40 to the LED product 30 to be processed.

In a specific embodiment, the external device in this embodiment is a bonding device, and the bonding device further includes a pressing portion, where the pressing portion is disposed on the device body and is used to apply a force to the bonding fixture, so that the optical film 40 can be bonded with the LED product 30 to be processed.

In a specific embodiment, the laminating equipment further comprises a driving part, the driving part is arranged on the equipment main body, the pressing part provided by the embodiment comprises an upper cover plate and a lower cover plate, the upper cover plate provided by the embodiment is movably arranged in the vacuum cavity and is in driving connection with the driving part, the lower cover plate is fixedly arranged in the vacuum cavity and corresponds to the position of the upper cover plate, and the upper cover plate can move towards a direction close to or far away from the lower cover plate under the driving of the driving part.

In a specific embodiment, the attaching jig provided in this embodiment is mounted on one side of the lower cover plate, which is close to the upper cover plate, and the upper cover plate provided in this embodiment can drive the attaching portion 20 of the attaching jig under the driving of the driving portion, so that the attaching portion 20 moves in a direction close to the supporting body 11, and further the optical film 40 on the attaching assembly 21 is attached to the LED product 30 to be processed on the supporting body 11.

In an alternative embodiment, the pressing pressure applied by the upper cover plate provided by this embodiment is greater than 0.2Mpa and less than 0.8Mpa.

In an alternative embodiment, before the vacuum cavity provided in this embodiment completes the vacuum pumping, the upper cover plate provided in this embodiment does not apply pressure to the bonding jig, and after the vacuum cavity completes the vacuum pumping, the upper cover plate applies pressure to the bonding jig in a vacuum environment.

In a specific embodiment, when the bonding apparatus provided in this embodiment is used to bond the optical film 40 to the LED product 30 to be processed, the optical film 40 is first fixed on the bonding assembly 21, after the optical film 40 is fixed on the bonding assembly 21, the release film on the back adhesive surface of the optical film 40 can be torn off, after the release film on the back adhesive surface of the optical film 40 is torn off, the bonding portion 20 can be mounted on the supporting portion 10 through the cooperation of the positioning pin 1211 on the supporting column 121 and the positioning hole on the bonding assembly 21, after the bonding portion 20 is mounted, the vacuum cavity can be evacuated through the vacuum portion, after the vacuum cavity is evacuated, the upper cover plate can be driven by the driving portion, so that the upper cover plate moves towards the direction close to the lower cover plate, and pressure is applied to the bonding portion 20, after the bonding portion 20 contacts with the upper cover plate, the optical film 40 mounted on the bonding assembly 21 is driven to move towards the LED product 30 to be processed, which is mounted on the supporting body 11, until the optical film 40 contacts with the LED product 30 to be processed, and the LED product 30 is fully removed from the surface of the supporting column, and after the bonding portion is completely bonded to the LED product 30, and the vacuum cavity is completely removed from the bonding assembly 21.

In brief, implementing the laminating tool and laminating equipment that this embodiment provided has following beneficial technical effect at least: the laminating jig provided in this embodiment is through setting up laminating portion 20 to mobilizable installation on supporting part 10, make laminating portion 20 can drive under external equipment's drive that install the optics diaphragm 40 on laminating subassembly 21 and install the LED product 30 of waiting to process on supporting body 11 laminating, meanwhile, through setting up buffer unit 22 on laminating subassembly 21, make external equipment apply effort to laminating portion 20, can be through the even effect of buffer unit 22 on optics diaphragm 40, thereby effectually improved the laminating effect between optics diaphragm 40 and the LED product 30 of waiting to process.

The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the application.

Claims (10)

1. Laminating tool, its characterized in that, laminating tool includes:

A support portion (10), the support portion (10) comprising a support body (11), the support body (11) being for supporting an LED product (30) to be processed;

The laminating part (20), the laminating part (20) can be movably arranged on the supporting part (10), the laminating part (20) comprises a laminating component (21) and a buffer component (22), the laminating component (21) is used for connecting an optical film (40), and the laminating part (20) can drive the optical film (40) to be laminated with the LED product (30) to be processed on the supporting main body (11) under the driving of external equipment;

The buffer assembly (22) is arranged on the attaching assembly (21) and is used for enabling the acting force applied by external equipment to the attaching part (20) to be uniformly distributed on the optical film (40).

2. The bonding jig according to claim 1, wherein the bonding portion (20) is movably mounted on the supporting portion (10), the LED product (30) to be processed is mounted on a side of the supporting body (11) close to the bonding assembly (21), and the optical film (40) is mounted on a side of the bonding assembly (21) close to the supporting body (11);

The attaching assembly (21) is provided with a first position for enabling the optical film (40) on the attaching assembly (21) to avoid the LED product (30) to be processed on the supporting main body (11), and a second position for enabling the optical film (40) on the attaching assembly (21) to attach to the LED product (30) to be processed on the supporting main body (11), and the attaching assembly (21) can be switched from the first position to the second position under the drive of the external equipment;

The support part (10) further comprises an elastic reset component (12), wherein the elastic reset component (12) is arranged on the support main body (11) and is used for applying elastic force to the attaching component (21), so that the attaching component (21) can maintain the first position under the condition of not being affected by external force.

3. The bonding jig according to claim 2, wherein the bonding assembly (21) comprises a film carrier plate (211) and an adhesive gel layer (212) disposed on a side of the film carrier plate (211) close to the supporting body (11), and a side of the adhesive gel layer (212) close to the supporting body (11) is used for bonding the optical film (40).

4. A bonding jig according to claim 3, wherein the buffer assembly (22) comprises a buffer colloid layer (221), the buffer colloid layer (221) is disposed on one side of the membrane carrier plate (211) close to the support body (11) and can be abutted against the optical membrane (40), the adhesive colloid layer (212) extends along the circumferential direction of the buffer colloid layer (221), one side of the adhesive colloid layer (212) far away from the membrane carrier plate (211) is flush with one side of the buffer colloid layer (221) far away from the membrane carrier plate (211), and the membrane carrier plate (211) can apply a force to the optical membrane (40) through the buffer colloid layer (221).

5. The bonding jig according to claim 2, wherein the bonding assembly (21) comprises a positioning outer frame (213) and an adhesive film (214), a yielding opening is formed in the positioning outer frame (213), the adhesive film (214) is covered on the yielding opening, and one side of the adhesive film (214) close to the supporting body (11) is used for bonding the optical film (40).

6. The fitting jig according to claim 5, wherein the buffer assembly (22) comprises an elastic cushion (222), the elastic cushion (222) being provided on a side of the adhesive film (214) remote from the support body (11), the external device being capable of exerting a force on the adhesive film (214) through the elastic cushion (222).

7. The bonding jig according to any one of claims 2 to 6, wherein a yielding groove is provided on a side of the supporting body (11) close to the bonding assembly (21), and the yielding groove corresponds to a position of a component on the LED product (30) to be processed, and is used for yielding the component on the LED product (30) to be processed.

8. The fitting jig according to claim 7, wherein an elastic support body (111) is disposed in the relief groove, and the elastic support body (111) is used for supporting the component in the relief groove.

9. A bonding apparatus, characterized in that the bonding apparatus comprises a bonding jig according to any one of claims 1 to 8;

The laminating equipment further comprises an equipment main body and a vacuum part, wherein a vacuum cavity is arranged in the equipment main body, the laminating jig is arranged in the vacuum cavity, and the vacuum part is arranged on the equipment main body and communicated with the vacuum cavity and is used for vacuumizing the vacuum cavity.

10. The bonding apparatus of claim 9, wherein the external apparatus is the bonding apparatus, the bonding apparatus further comprising a nip disposed on the apparatus body for applying a force to the bonding jig to enable the optical film (40) to be bonded with the LED product (30) to be processed.