CN108024481B - A kind of radiator structure for solving the problems, such as heater element thermal conduction path and blocking - Google Patents
A kind of radiator structure for solving the problems, such as heater element thermal conduction path and blocking Download PDFInfo
- Publication number
- CN108024481B CN108024481B CN201711286588.1A CN201711286588A CN108024481B CN 108024481 B CN108024481 B CN 108024481B CN 201711286588 A CN201711286588 A CN 201711286588A CN 108024481 B CN108024481 B CN 108024481B
- Authority
- CN
- China
- Prior art keywords
- heater element
- heat
- radiator
- conducting plate
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Abstract
The present invention relates to a kind of radiator structure schemes for solving the problems, such as heater element thermal conduction path and blocking, heater element installation base plate, heat-conducting plate, heater element and the mutual matching relationship of radiator are related generally in scheme, radiator is located above heater element, the inner bottom surface of radiator and the upper surface (heating surface) of heater element fit closely, and the inner sidewall of radiator is bonded fastening with the lateral wall of heat-conducting plate vertical plate；The height of the level board of heat-conducting plate is L1, and the whole height of heat-conducting plate is L4, and the height of heater element is L3, and the height of radiator is L2, and above-mentioned size requires L4<L3, L3>L1+L2.The present invention is a kind of radiator structure scheme that can effectively solve heater element thermal conduction path and block problem, fast and effeciently the heat of heater element can be shed completely using this radiator structure scheme, guarantee that heater element operating temperature does not transfinite, internal system operating temperature is reduced simultaneously, good operating ambient temperature is provided for internal components, the precision and service life for guaranteeing device, to improve the output accuracy and reliability of system.
Description
Technical field
The invention belongs to inertial navigation system technical field, it is related in inertial navigation system how passing for heater element foundation is effective
Hot path reduces internal system space temperature, and in particular to a kind of heat dissipation for solving the problems, such as heater element thermal conduction path and blocking
Organization plan.
Background technique
The operating temperature of inertial navigation system interior space temperature and heater element is always to be badly in need of examining in system design process
The problem of considering and need to being effectively treated.If the heat of heater element can not be exported effectively, its own temperature can be increased, while make system
Interior space temperature integrally increases, and internal components is caused to always work at the condition of high temperature, influences device precision and service life；Together
When, excessively high internal temperature also will increase system temperature control difficulty, reduce system output accuracy.
The heater element radiating surface of inertial navigation system installation is normally at its housing upper surface, it usually needs installing radiator additional will
In the heat derives to radiator of surface of shell, then a part of heat is scattered in surrounding air by air-cooled, a part of heat
It passes on heat-conducting plate, is finally again exported heat completely by certain mode, to guarantee heater element again by conduction
Operating temperature is in claimed range, as shown in Figure 1.So heater element shell is to radiator, radiator between heat-conducting plate
The thermal resistance of heat passage has to small, and forbidding occurring thermal conduction path blocking just can be such that heat smoothly exports completely, thus
Realize the temperature control of internal system low temperature, the reliability of lifting system work.At this time, it may be necessary to which L1+L2=L3, L1 are thermally conductive in heat passage
Plate thickness, L2 are that radiator relevant thickness, L3 are heater element thickness in heat passage.Make L1+L2=L3, needs accurate measurement
Heater element thickness L3, thermally conductive plate thickness L1 and heat sink thickness L2 need assignment sizes tolerance and carry out strict control.
It is usually logical in this heat but since heater element, radiator and heat-conducting plate relative dimensions are difficult to exactly match
Road can have gap, block thermal conduction path, and thermal resistance substantially increases, and form thermal cut-out, lead to heater element operating temperature
Rise even overtemperature, device failure.At this point, if heater element thickness be less than the sum of thermally conductive plate thickness and heat sink thickness when,
That is L1+L2=L3+ δ 1 forms gap δ 1 between heater element and radiator, thermal conduction path blocks, as shown in Figure 2；If hair
When thermal element thickness is greater than the sum of thermally conductive plate thickness and heat sink thickness, i.e. L1+L2+ δ 2=L3, between heat-conducting plate and radiator
Gap δ 2 is formed, thermal conduction path blocks, as shown in Figure 3.
Summary of the invention
In place of making up the deficiencies in the prior art, providing one kind can effectively solve heater element heat biography
Pathway block problem radiator structure scheme, evade gage work, reduce machining difficulty and can thoroughly eliminate heater element,
Radiator and this heat passage of heat-conducting plate thermal conduction path that may be present block problem, avoid thermal resistance from substantially increasing, guarantee
The operating temperature of heater element, while internal system overall work temperature is reduced, lifting system accuracy of temperature control, to improve system
Output accuracy.
The purpose of the present invention is what is realized by following technological means:
A kind of radiator structure for solving the problems, such as heater element thermal conduction path and blocking relates generally to heater element installation base
Plate, heat-conducting plate, heater element and the mutual matching relationship of radiator, heater element and heat-conducting plate are installed in heater element
On installation base plate, and heat-conducting plate is located at the outside of heater element, it is characterised in that: the heat-conducting plate is by level board and vertical plate structure
At level board is mounted on heater element installation base plate；Radiator is located above heater element, the inner bottom surface and hair of the radiator
The upper surface (heating surface) of thermal element fits closely, and the inner sidewall of the radiator is bonded fastening with the lateral wall of heat-conducting plate vertical plate；
The height of the level board of heat-conducting plate is L1, and the whole height of heat-conducting plate is L4, and the height of heater element is L3, the height of radiator
For L2, above-mentioned size requires L4 < L3, L3 > L1+L2.
Moreover, the heater element installation base plate is metal or non-metal base plate.
Moreover, the thermal coefficient of the thermally conductive plate material requires greatly, itself have good heat conductivity；Heat-conducting plate is most
It is integral structure well, specific constructive form can be set according to heater element shape.
Moreover, the whole height of the heat-conducting plate is the elevation of heat-conducting plate.
Moreover, the height of the radiator refers to the bottom surface of radiator to the height between inner bottom surface.
The advantages and positive effects of the present invention are:
1, the present invention is improved by the structure to heat-conducting plate, is made heat-conducting plate L shape and is closed with sink side face paste, and
It is required that heater element thickness is greater than the sum of heat-conducting plate and radiator relevant thickness, it is desirable that the L shape elevation of heat-conducting plate is less than hair
Thermal element thickness can guarantee thermal conduction path connection, transmit heat, reduce heater element operating temperature, improves device
Part precision and service life.
2, a kind of radiator structure scheme for solving the problems, such as heater element thermal conduction path and blocking of the present invention, requires nothing more than
Rough measure heater element thickness L3, heat-conducting plate and radiator relevant thickness L1 and L2 evade without size tolerance requirements
Gage work reduces machining difficulty, shortens machining time, reduces machining cost.
3, the present invention is a kind of radiator structure scheme that can effectively solve heater element thermal conduction path and block problem, is used
This radiator structure scheme can fast and effeciently shed the heat of heater element completely, guarantee that heater element operating temperature does not surpass
Limit, while reducing internal system operating temperature, provides good operating ambient temperature for internal components, guarantee the precision of device with
Service life, to improve the output accuracy and reliability of system.
Detailed description of the invention
Fig. 1 is desired heater element thermal dissipating path；
Fig. 2 is that a kind of thermal conduction path actually generally occurred within blocks form；
Fig. 3 is that another thermal conduction path actually generally occurred within blocks form；
Fig. 4 is effective radiator structure shape for solving the problems, such as heater element thermal conduction path and blocking of innovative design of the present invention
Formula.
Numbering in the drawing: 1. heater element installation base plates, 2. heat-conducting plates, 3. heater elements, 4. radiators.
Specific embodiment
With reference to the accompanying drawing in detail narration the embodiment of the present invention, it should be noted that the present embodiment be it is narrative, no
It is restrictive, this does not limit the scope of protection of the present invention.
A kind of radiator structure for solving the problems, such as heater element thermal conduction path and blocking, including heater element installation base plate 1, lead
Hot plate 2, heater element 3 and radiator 4.Heater element installation base plate is metal or non-metal base plate, heater element and thermally conductive
Plate is installed on heater element installation base plate, and heat-conducting plate is located at the outside of heater element.The thermal coefficient of thermally conductive plate material
It is required that it is big, itself have good heat conductivity；Heat-conducting plate is preferably an overall structure, and specific constructive form can be according to fever
Component shape setting.
The heat-conducting plate is made of level board and vertical plate, forms L-shaped structure, and level board is mounted on heater element installation base
On plate.Radiator is located above heater element, and the inner bottom surface of the radiator and the upper surface (heating surface) of heater element are closely pasted
It closes, the inner sidewall of the radiator is bonded fastening with the lateral wall of heat-conducting plate vertical plate.
The height of the level board of heat-conducting plate is L1, and the whole height (that is: the elevation of heat-conducting plate) of heat-conducting plate is L4, hair
The height of thermal element is L3, and the height (that is: the bottom surface of radiator to the height between inner bottom surface) of radiator is L2, above-mentioned
Size requires L4 < L3, L3 > L1+L2.
Manufacturing process and working principle of the invention are as follows:
It is required that measuring heater element thickness L3 first, the size L1 and L4 and radiator of heat-conducting plate are then distributed according to L3
Size L2, it is desirable that L4 < L3, L3 > L1+L2.
L shape heat-conducting plate and radiator are made according to relative dimensions, and heater element is mounted on heater element first by when installation
On installation base plate, then heat-conducting plate is also mounted on heater element installation base plate, it is finally that radiator is close with heater element
Fitting is bonded fastening with the L shape facade of heat-conducting plate simultaneously.Heat conduction path is as shown in arrow in Fig. 4.
It can avoid making heat-conducting plate and heat spreader structures part to avoid heater element Dimensions metrology by such radiator structure
Size tolerance requirements reduce machining difficulty, shorten machining time, while reducing machining cost；Radiator structure installation letter
It is single easy, it can effectively avoid thermal conduction path that problem is blocked to occur, can effectively carry out heat transfer, reduce heater element work temperature
Degree, it is ensured that device precision and service life.
Claims (1)
1. it is a kind of solve the problems, such as heater element thermal conduction path block radiator structure, relate generally to heater element installation base plate,
Heat-conducting plate, heater element and the mutual matching relationship of radiator, heater element and heat-conducting plate are installed in heater element peace
It fills on substrate, and heat-conducting plate is located at the outside of heater element, it is characterised in that: the heat-conducting plate is by level board and vertical plate structure
At level board is mounted on heater element installation base plate；Radiator is located above heater element, radiator have inner bottom surface and
The side wall extended from inner bottom surface, the inner bottom surface of the radiator and the upper surface (heating surface) of heater element fit closely, the heat dissipation
The inner sidewall of device is bonded fastening with the lateral wall of heat-conducting plate vertical plate；The height of the level board of heat-conducting plate is L1, the entirety of heat-conducting plate
Height is L4, and the height of heater element is L3, and the height of radiator is L2, above-mentioned requirement for height L4 < L3, L3 > L1+L2；
The whole height of the heat-conducting plate is the elevation of heat-conducting plate；
The height of the radiator refers to the bottom surface of radiator to the height between inner bottom surface；
The heater element installation base plate is metal or non-metal base plate；
The thermal coefficient of the thermally conductive plate material requires greatly, itself have good heat conductivity；Heat-conducting plate is integral knot
Structure, specific constructive form can be set according to heater element shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711286588.1A CN108024481B (en) | 2017-12-07 | 2017-12-07 | A kind of radiator structure for solving the problems, such as heater element thermal conduction path and blocking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711286588.1A CN108024481B (en) | 2017-12-07 | 2017-12-07 | A kind of radiator structure for solving the problems, such as heater element thermal conduction path and blocking |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108024481A CN108024481A (en) | 2018-05-11 |
| CN108024481B true CN108024481B (en) | 2019-11-26 |
Family
ID=62078993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711286588.1A Active CN108024481B (en) | 2017-12-07 | 2017-12-07 | A kind of radiator structure for solving the problems, such as heater element thermal conduction path and blocking |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108024481B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109936971A (en) * | 2019-04-18 | 2019-06-25 | 成都智明达电子股份有限公司 | It is a kind of for reducing the method for thermal contact resistance, structure and component heat dissipation equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104713394A (en) * | 2015-03-24 | 2015-06-17 | 华为技术有限公司 | Heat radiator and heat pipe heat radiation system |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101202528B (en) * | 2006-12-11 | 2012-10-10 | 丹佛斯传动有限公司 | Electronic device and electric motor frequency converter |
| CN202993120U (en) * | 2012-11-08 | 2013-06-12 | 李文元 | Novel radiator for LED lamps |
| CN204425869U (en) * | 2015-01-12 | 2015-06-24 | 启碁科技股份有限公司 | Electronic installation |
| CN205946480U (en) * | 2016-08-09 | 2017-02-08 | 广东美的生活电器制造有限公司 | Heat radiation structure and food processor |
-
2017
- 2017-12-07 CN CN201711286588.1A patent/CN108024481B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104713394A (en) * | 2015-03-24 | 2015-06-17 | 华为技术有限公司 | Heat radiator and heat pipe heat radiation system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108024481A (en) | 2018-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MX2015002743A (en) | Electronic control apparatus. | |
| CN107104086B (en) | Liquid-cooling heat radiator and electric machine controller | |
| US20150084182A1 (en) | Cooling assembly using heatspreader | |
| CN108024481B (en) | A kind of radiator structure for solving the problems, such as heater element thermal conduction path and blocking | |
| WO2020103147A1 (en) | Chip heat dissipation structure, chip structure, circuit board and supercomputing device | |
| CN106550587A (en) | A kind of air flows through the radiator structure inside sealed machine box | |
| CN208940087U (en) | Radiator and video camera | |
| CN205902303U (en) | Electrical apparatus heat radiation structure | |
| JP2016111249A (en) | Electronic unit | |
| CN111370378B (en) | Chip radiator | |
| JP6419125B2 (en) | Electronic control unit | |
| CN108633217A (en) | Radiating fin group | |
| CN207518922U (en) | A kind of system for radiator to be installed to printed circuit board | |
| JP2010237078A (en) | Mounting structure for temperature sensor | |
| CN105185804B (en) | The encapsulating structure and packaging method of focal plane array device | |
| WO2015107892A1 (en) | Electronic device provided with electrical element and temperature detector | |
| CN105722371B (en) | Heat transfer assembly and heat abstractor | |
| CN209283643U (en) | A kind of radiator structure of underwater electronic compartment | |
| CN209215964U (en) | A kind of CT detector temperature control mechanism | |
| CN208387167U (en) | A kind of cooling fin | |
| CN208141275U (en) | Sealed computer cabinet | |
| CN207706617U (en) | A kind of radiator and the furnace body with the radiator and stem body temperature checker | |
| CN207529926U (en) | A kind of semiconductor heat-dissipating system | |
| CN108257927A (en) | A kind of semiconductor storage unit | |
| CN209709962U (en) | A kind of heat radiating type AC-DC power module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |