CN108633217A - Radiating fin group - Google Patents
Radiating fin group Download PDFInfo
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- CN108633217A CN108633217A CN201710182926.0A CN201710182926A CN108633217A CN 108633217 A CN108633217 A CN 108633217A CN 201710182926 A CN201710182926 A CN 201710182926A CN 108633217 A CN108633217 A CN 108633217A
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 132
- 238000001816 cooling Methods 0.000 claims description 71
- 239000000758 substrate Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
技术领域technical field
本发明涉及一种散热鳍片组,尤其是涉及一种具空心散热柱的散热鳍片组。The invention relates to a cooling fin group, in particular to a cooling fin group with a hollow cooling column.
背景技术Background technique
随着电子科技的发展,电子元件的效能相对提高。伴随而来的是电子元件在单位时间内所发出的热量越来越多。因此,为了避免电子元件温度过高而导致电子元件的效能降低或当机,常见的散热方式为加装一散热器于电子元件上方。如此一来,可借助散热器将电子元件发出的热量散出,进而降低电子元件的温度。With the development of electronic technology, the efficiency of electronic components has been relatively improved. Accompanying it is that electronic components emit more and more heat per unit time. Therefore, in order to prevent the performance of the electronic components from being reduced or crashed due to overheating of the electronic components, a common cooling method is to install a heat sink above the electronic components. In this way, the heat emitted by the electronic components can be dissipated by means of the heat sink, thereby reducing the temperature of the electronic components.
传统的散热器主要分为主动式散热与被动式散热。主动式散热一般包括风扇与散热鳍片。散热鳍片贴附于电子元件上,使电子元件发出的热量能够传导至散热鳍片。当风扇运转时,风扇引导气流吹向散热鳍片,以将传导至散热鳍片的热量带走,进而达到散热的效果。被动式散热一般仅借助散热鳍片贴附于电子元件上,并通过自然对流的方式将传导至散热鳍片的热量带走。然而,因为传统散热器采用实心的散热鳍片,仅散热鳍片的外部单一散热途径能够进行散热,故传统散热器应用于高发热量的电子元件时,其散热效能恐跟不上高发热量的电子元件的热量产生速度。Traditional radiators are mainly divided into active cooling and passive cooling. Active cooling generally includes fans and cooling fins. The cooling fins are attached to the electronic components, so that the heat emitted by the electronic components can be conducted to the cooling fins. When the fan is running, the fan guides the airflow to blow to the heat dissipation fins, so as to take away the heat conducted to the heat dissipation fins, thereby achieving the effect of heat dissipation. Passive heat dissipation is generally attached to electronic components only by means of heat dissipation fins, and the heat conducted to the heat dissipation fins is taken away by natural convection. However, because traditional heat sinks use solid heat dissipation fins, only a single heat dissipation path outside the heat dissipation fins can dissipate heat. Therefore, when traditional heat sinks are applied to electronic components with high calorific value, their heat dissipation performance may not be able to keep up with electronic components with high calorific value. The rate at which heat is generated by the component.
发明内容Contents of the invention
本发明所要解决的技术问题在于,针对现有技术的不足提供一种散热鳍片组,以解决实心散热鳍片散热方向单一,散热器的散热效率跟不上电子元件发热效能的问题。The technical problem to be solved by the present invention is to provide a heat dissipation fin group to solve the problem that the solid heat dissipation fin has a single heat dissipation direction and the heat dissipation efficiency of the radiator cannot keep up with the heating performance of electronic components.
本发明所要解决的技术问题是通过如下技术方案实现的:The technical problem to be solved by the present invention is achieved through the following technical solutions:
本发明提出一种散热鳍片组。此散热鳍片组包括一基部以及多个空心散热柱。基部具有一第一表面、一第二表面及多个组装孔。第一表面与第二表面相对。组装孔自第一表面延伸至第二表面。各空心散热柱分别嵌设于基部的组装孔。每一空心散热柱具有一散热通道。散热通道分别连通组装孔。The invention provides a cooling fin group. The heat dissipation fin set includes a base and a plurality of hollow heat dissipation columns. The base has a first surface, a second surface and a plurality of assembly holes. The first surface is opposite to the second surface. The assembly hole extends from the first surface to the second surface. Each hollow cooling column is respectively embedded in the assembly hole of the base. Each hollow heat dissipation column has a heat dissipation channel. The heat dissipation channels communicate with the assembly holes respectively.
换句话说,本发明提供一种散热鳍片组包括:一基部,该基部具有一第一表面、一第二表面及多个组装孔,该第二表面相对于该第一表面,多个所述组装孔自该第一表面延伸至该第二表面;以及多个空心散热柱,分别嵌设于该基部的多个所述组装孔,每一空心散热柱具有一散热通道,多个所述散热通道分别连通多个所述组装孔。In other words, the present invention provides a heat dissipating fin assembly including: a base, the base has a first surface, a second surface and a plurality of assembly holes, the second surface is opposite to the first surface, and the plurality of The assembly holes extend from the first surface to the second surface; and a plurality of hollow heat dissipation columns are respectively embedded in the plurality of assembly holes of the base, each hollow heat dissipation column has a heat dissipation channel, and a plurality of the heat dissipation columns The heat dissipation channels respectively communicate with the plurality of assembly holes.
优选的,多个所述空心散热柱的其中一端面与该第一表面切齐,多个所述空心散热柱的相对一端面与该第二表面切齐。Preferably, one end surface of the plurality of hollow cooling columns is aligned with the first surface, and an opposite end surface of the plurality of hollow cooling columns is aligned with the second surface.
优选的,多个所述空心散热柱的其中一端面与该第一表面切齐,多个所述空心散热柱的相对一端凸出该第二表面。Preferably, one end surface of the plurality of hollow cooling columns is flush with the first surface, and the opposite end of the plurality of hollow cooling columns protrudes from the second surface.
优选的,多个所述空心散热柱的其中一端面介于该第一表面与该第二表面之间,多个所述空心散热柱的相对一端凸出该第二表面。Preferably, one end surface of the plurality of hollow heat dissipation columns is interposed between the first surface and the second surface, and the opposite end of the plurality of hollow heat dissipation columns protrudes from the second surface.
优选的,该基部具有一侧表面,该侧表面连接该第一表面与该第二表面,且该基部具有多个侧连接道,多个所述侧连接道自该侧表面向内延伸连通多个所述组装孔。Preferably, the base has a side surface, the side surface connects the first surface and the second surface, and the base has a plurality of side connection channels, and the plurality of side connection channels extend inward from the side surface to communicate with the assembly holes.
优选的,多个所述空心散热柱的其中一端凸出该第一表面,多个所述空心散热柱的相对一端凸出该第二表面。Preferably, one end of the plurality of hollow cooling columns protrudes from the first surface, and the opposite end of the plurality of hollow cooling columns protrudes from the second surface.
优选的,多个所述空心散热柱的导热系数与该基板的导热系数相异。Preferably, the thermal conductivity of the plurality of hollow cooling columns is different from the thermal conductivity of the substrate.
优选的,多个所述空心散热柱的导热系数大于该基板的导热系数。Preferably, the thermal conductivity of the plurality of hollow cooling columns is greater than the thermal conductivity of the substrate.
优选的,多个所述空心散热柱间彼此间隔。Preferably, the plurality of hollow cooling columns are spaced apart from each other.
本发明的散热鳍片组采用了空心散热柱取代现有的实心散热鳍片,且空心散热柱的散热通道与基部的组装孔连通,因此散热气流除了可流经空心散热柱的外部空间,还可流经空心散热柱内部的散热通道,通过双重散热途径上的散热气流将传导至空心散热柱的热量排出,从而提升散热鳍片组散热速率。The radiating fin group of the present invention adopts the hollow radiating column to replace the existing solid radiating fin, and the radiating channel of the hollow radiating column communicates with the assembly hole of the base, so the radiating air flow can not only flow through the external space of the hollow radiating column, but also It can flow through the heat dissipation channel inside the hollow heat dissipation column, and the heat conducted to the hollow heat dissipation column is discharged through the heat dissipation airflow on the double heat dissipation path, thereby improving the heat dissipation rate of the heat dissipation fin group.
以上关于本发明内容的说明及以下实施方式的说明用来示范与解释本发明的原理,并且提供本发明的保护范围提供更进一步的解释。The above descriptions about the content of the present invention and the following descriptions of the embodiments are used to demonstrate and explain the principle of the present invention, and provide further explanations of the protection scope of the present invention.
附图说明Description of drawings
图1为本发明实施例一散热鳍片组的立体示意图;FIG. 1 is a three-dimensional schematic diagram of a heat dissipation fin group according to an embodiment of the present invention;
图2a为图1散热鳍片组与电子元件贴附方式的剖面示意图;Fig. 2a is a schematic cross-sectional view of the attachment method of the cooling fin group and the electronic components in Fig. 1;
图2b为图1散热鳍片组与电子元件另一贴附方式的剖面示意图;Fig. 2b is a schematic cross-sectional view of another attachment method between the cooling fin group and the electronic component in Fig. 1;
图3为利用图1散热鳍片组搭配风扇对电子元件进行散热而测得的电子元件的温度时间曲线示意图;FIG. 3 is a schematic diagram of the temperature-time curve of the electronic components measured by using the heat dissipation fin set in FIG. 1 with a fan to dissipate heat from the electronic components;
图4为本发明实施例二散热鳍片组的剖面示意图;FIG. 4 is a schematic cross-sectional view of a heat dissipation fin group according to Embodiment 2 of the present invention;
图5为本发明实施例三散热鳍片组的剖面示意图;5 is a schematic cross-sectional view of a heat dissipation fin group according to Embodiment 3 of the present invention;
图6为本发明实施例四散热鳍片组的剖面示意图。FIG. 6 is a schematic cross-sectional view of a fourth heat dissipation fin group according to an embodiment of the present invention.
【附图标记说明】[Description of Reference Signs]
10a、10b、10c、10d 散热鳍片组10a, 10b, 10c, 10d Heat sink fin set
20 电子元件20 electronic components
100 基部100 base
101 第一表面101 First Surface
102 第二表面102 Second Surface
104 侧表面104 side surface
110 组装孔110 assembly hole
120 侧连接道120 side connection road
200 空心散热柱200 Hollow Cooling Columns
201 第一端201 First End
202 第二端202 second end
203 第一端面203 first end face
204 第二端面204 Second end face
210 散热通道210 cooling channels
具体实施方式Detailed ways
实施例一Embodiment one
图1为本发明实施例一散热鳍片组的立体示意图。请参阅图1,本实施例散热鳍片组10a包括一基部100与多个空心散热柱200。其中基部100具有一第一表面101、一第二表面102及多个组装孔110。第二表面102相对于第一表面101。组装孔110自第一表面101延伸至第二表面102。空心散热柱200分别嵌设于基部100的组装孔110。每一空心散热柱200具有一散热通道210。散热通道210分别连通组装孔110。每一空心散热柱200具有一第一端201与相对的第二端202,两者分别对应有一第一端面203与一第二端面204。在本实施例中,空心散热柱200的第一端201凸出于基部100的第一表面101。空心散热柱200的第二端面204与基部100的第二表面102切齐。FIG. 1 is a three-dimensional schematic diagram of a heat dissipation fin set according to an embodiment of the present invention. Please refer to FIG. 1 , the heat dissipation fin set 10 a of the present embodiment includes a base 100 and a plurality of hollow heat dissipation columns 200 . The base 100 has a first surface 101 , a second surface 102 and a plurality of assembly holes 110 . The second surface 102 is opposite to the first surface 101 . The assembly hole 110 extends from the first surface 101 to the second surface 102 . The hollow cooling posts 200 are respectively embedded in the assembly holes 110 of the base 100 . Each hollow cooling column 200 has a cooling channel 210 . The heat dissipation channels 210 communicate with the assembly holes 110 respectively. Each hollow cooling column 200 has a first end 201 and an opposite second end 202 , which respectively correspond to a first end surface 203 and a second end surface 204 . In this embodiment, the first end 201 of the hollow cooling post 200 protrudes from the first surface 101 of the base 100 . The second end surface 204 of the hollow cooling post 200 is flush with the second surface 102 of the base 100 .
此实施例中,电子元件20的热量可经由热管导送至本散热鳍片组10a进行散热,也可将发热的电子元件20直接贴附于本散热鳍片组10a进行散热。下面以电子元件20直接贴附于本散热鳍片组10a为例,图2a为图1散热鳍片组与电子元件贴附方式的剖面示意图,图2b为图1散热鳍片组与电子元件另一贴附方式的剖面示意图,请参阅图2a与图2b。如图2a所述,散热鳍片组10a可通过基部100的第二表面102与发热电子元件20热接触。如图2b所述,散热鳍片组10a通过空心散热柱200的第一端面203与发热电子元件20热接触。In this embodiment, the heat of the electronic component 20 can be conducted to the heat dissipation fin set 10a via the heat pipe for heat dissipation, or the heat-generating electronic component 20 can be directly attached to the heat dissipation fin set 10a for heat dissipation. Taking the electronic component 20 directly attached to the cooling fin group 10a as an example, FIG. 2a is a schematic cross-sectional view of the attachment method of the cooling fin group and the electronic component in FIG. 1, and FIG. Please refer to FIG. 2a and FIG. 2b for a schematic cross-sectional view of an attachment method. As shown in FIG. 2 a , the heat dissipation fin set 10 a can be in thermal contact with the heat generating electronic component 20 through the second surface 102 of the base 100 . As shown in FIG. 2 b , the heat dissipation fin set 10 a is in thermal contact with the heat generating electronic component 20 through the first end surface 203 of the hollow heat dissipation column 200 .
另外,此实施例中,由于空心散热柱200的散热通道210与基部100的组装孔110连通,因此除空心散热柱200外部空间可供热气流通外,气流还可流经空心散热柱200内部的散热通道210,通过双重散热途径的散热气流将传导至空心散热柱200的热量排出,达到提升散热鳍片组10a散热速率的技术效果。In addition, in this embodiment, since the heat dissipation channel 210 of the hollow heat dissipation column 200 communicates with the assembly hole 110 of the base 100, in addition to the space outside the hollow heat dissipation column 200 for the circulation of hot air, the airflow can also flow through the interior of the hollow heat dissipation column 200. The heat dissipation channel 210 of the heat dissipation channel 210 discharges the heat conducted to the hollow heat dissipation column 200 through the heat dissipation air flow of the double heat dissipation path, so as to achieve the technical effect of increasing the heat dissipation rate of the heat dissipation fin set 10a.
图3为利用图1散热鳍片组搭配风扇对电子元件进行散热而测得的电子元件的温度时间曲线示意图;下表一为利用图1的散热鳍片组搭配风扇对电子元件进行散热而测得的电子元件温度随时间变化的纪录表。请参阅图3与表一,根据图3与表一所述,传统的散热鳍片组的基部并未嵌设空心散热柱,即如表一的空心散热柱数量为零个的状态。当传统的散热鳍片组搭配风扇对温度为80摄氏度的电子元件20进行散热时,电子元件20的温度在风扇开启24分钟后自80摄氏度降至62摄氏度。Figure 3 is a schematic diagram of the temperature-time curve of the electronic component measured by using the heat dissipation fin set in Figure 1 with a fan to dissipate heat from the electronic component; the following table 1 is the measurement of the heat dissipation of the electronic component by using the heat dissipation fin set in Figure 1 with a fan The record table of the obtained electronic component temperature change with time. Please refer to FIG. 3 and Table 1. According to FIG. 3 and Table 1, the base of the conventional cooling fin set does not have hollow heat dissipation columns embedded, that is, the number of hollow heat dissipation columns in Table 1 is zero. When the traditional cooling fin set is used with a fan to dissipate heat from the electronic component 20 at a temperature of 80 degrees Celsius, the temperature of the electronic component 20 drops from 80 degrees Celsius to 62 degrees Celsius 24 minutes after the fan is turned on.
此外,在表一中,分别将散热鳍片组10a分成空心散热柱200数量为33、57、81根三种状况。当空心散热柱200数量为33根的散热鳍片组10a搭配风扇对温度为80摄氏度的电子元件20进行散热时,电子元件20的温度在风扇开启24分钟后自80摄氏度降至56摄氏度。与基部100未嵌设空心散热柱200相比,基部100嵌设33根空心散热柱200时,电子元件20的温度多降低了6摄氏度。In addition, in Table 1, the heat dissipation fin group 10a is divided into three situations where the number of hollow heat dissipation columns 200 is 33, 57, and 81. When the hollow cooling column 200 with 33 cooling fins 10a is used with the fan to dissipate heat from the electronic component 20 at a temperature of 80 degrees Celsius, the temperature of the electronic component 20 drops from 80 degrees Celsius to 56 degrees Celsius 24 minutes after the fan is turned on. Compared with the base 100 not embedded with the hollow heat dissipation pillars 200 , when the base 100 is embedded with 33 hollow heat dissipation pillars 200 , the temperature of the electronic component 20 is reduced by 6 degrees Celsius more.
而当空心散热柱200数量为57的散热鳍片组10a对温度为80摄氏度的电子元件20进行散热时,电子元件20的温度在风扇开启24分钟后自80摄氏度降至51摄氏度,与基部100未嵌设空心散热柱200相比,基部100嵌设57根空心散热柱200时,电子元件20的温度多降低了11摄氏度。And when the number of hollow cooling columns 200 is 57 and the cooling fin group 10a is cooling the electronic component 20 with a temperature of 80 degrees Celsius, the temperature of the electronic component 20 drops from 80 degrees Celsius to 51 degrees Celsius after the fan is turned on for 24 minutes. Compared with no hollow heat dissipation pillars 200 embedded, when the base 100 is embedded with 57 hollow heat dissipation pillars 200 , the temperature of the electronic component 20 is lowered by 11 degrees Celsius more.
而当空心散热柱200数量为81的散热鳍片组10a对温度为80摄氏度的电子元件20进行散热时,电子元件20的温度在风扇开启24分钟后自80摄氏度降至49摄氏度,与基部100未嵌设空心散热柱200相比,基部100嵌设81根空心散热柱200时,电子元件20的温度多降低了13摄氏度。And when the number of hollow cooling columns 200 is 81 and the cooling fin group 10a is radiating heat to the electronic component 20 with a temperature of 80 degrees Celsius, the temperature of the electronic component 20 drops from 80 degrees Celsius to 49 degrees Celsius after the fan is turned on for 24 minutes. Compared with no hollow heat dissipation pillars 200 embedded, when the base 100 is embedded with 81 hollow heat dissipation pillars 200 , the temperature of the electronic component 20 is reduced by 13 degrees Celsius more.
一般而言,当温度介于45摄氏度至55摄氏度时,电子元件20的运作效能最佳。而根据散热测试结果可知散热鳍片组10a基部100嵌设空心散热柱200后进行散热,电子元件20的降温速度变快,且可使电子元件20的温度较快降温至接近或是落于工作效能较佳的温度区间。Generally speaking, when the temperature is between 45 degrees Celsius and 55 degrees Celsius, the performance of the electronic device 20 is the best. According to the heat dissipation test results, it can be seen that the base 100 of the heat dissipation fin group 10a is embedded with the hollow heat dissipation column 200 to dissipate heat, the cooling speed of the electronic component 20 becomes faster, and the temperature of the electronic component 20 can be quickly cooled to close to or fall below the working temperature. The temperature range with better performance.
表一Table I
实施例二Embodiment two
图4为本发明实施例二散热鳍片组的剖面示意图。请参阅图4,实施例二的散热鳍片组10b包括一基部100与多个空心散热柱200。其中基部100具有一第一表面101、一第二表面102及多个组装孔110。第二表面102相对于第一表面101。组装孔110自第一表面101延伸至第二表面102。空心散热柱200分别嵌设于基部100的组装孔110。每一空心散热柱200具有一散热通道210。散热通道210分别连通组装孔110。每一空心散热柱200具有一第一端201与相对的第二端202,两者分别对应有一第一端面203与一第二端面204。空心散热柱200的第一端面203与基部100的第一表面101切齐。空心散热柱200的第二端面204与基部100的第二表面102切齐。FIG. 4 is a schematic cross-sectional view of a heat dissipation fin group according to Embodiment 2 of the present invention. Referring to FIG. 4 , the heat dissipation fin set 10 b of the second embodiment includes a base 100 and a plurality of hollow heat dissipation columns 200 . The base 100 has a first surface 101 , a second surface 102 and a plurality of assembly holes 110 . The second surface 102 is opposite to the first surface 101 . The assembly hole 110 extends from the first surface 101 to the second surface 102 . The hollow cooling posts 200 are respectively embedded in the assembly holes 110 of the base 100 . Each hollow heat dissipation column 200 has a heat dissipation channel 210 . The heat dissipation channels 210 communicate with the assembly holes 110 respectively. Each hollow cooling post 200 has a first end 201 and an opposite second end 202 , which respectively correspond to a first end surface 203 and a second end surface 204 . The first end surface 203 of the hollow cooling column 200 is aligned with the first surface 101 of the base 100 . The second end surface 204 of the hollow cooling post 200 is aligned with the second surface 102 of the base 100 .
实施例三Embodiment three
图5为本发明实施例三散热鳍片组的剖面示意图。请参阅图5,实施例三的散热鳍片组10c包括一基部100与多个空心散热柱200。其中基部100具有一第一表面101、一第二表面102及多个组装孔110。第二表面102相对于第一表面101。组装孔110自第一表面101延伸至第二表面102。空心散热柱200分别嵌设于基部100的组装孔110。每一空心散热柱200具有一散热通道210。散热通道210分别连通组装孔110。每一空心散热柱200具有一第一端201与相对的第二端202,两者分别对应有一第一端面203与一第二端面204。空心散热柱200的第一端201凸出第一表面101。空心散热柱200的第二端面204介于第一表面101与第二表面102之间。FIG. 5 is a schematic cross-sectional view of a heat dissipation fin group according to Embodiment 3 of the present invention. Please refer to FIG. 5 , the heat dissipation fin set 10 c of the third embodiment includes a base 100 and a plurality of hollow heat dissipation columns 200 . The base 100 has a first surface 101 , a second surface 102 and a plurality of assembly holes 110 . The second surface 102 is opposite to the first surface 101 . The assembly hole 110 extends from the first surface 101 to the second surface 102 . The hollow cooling posts 200 are respectively embedded in the assembly holes 110 of the base 100 . Each hollow cooling column 200 has a cooling channel 210 . The heat dissipation channels 210 communicate with the assembly holes 110 respectively. Each hollow cooling column 200 has a first end 201 and an opposite second end 202 , which respectively correspond to a first end surface 203 and a second end surface 204 . The first end 201 of the hollow cooling post 200 protrudes from the first surface 101 . The second end surface 204 of the hollow cooling post 200 is located between the first surface 101 and the second surface 102 .
另外,请参阅图1与图5。实施例三的散热鳍片组10c的基部100更包括有一侧表面104与多个侧连接道120。侧表面104连接第一表面101与第二表面102。此些侧连接道120自侧表面104向内延伸连通组装孔110。除能增加散热表面积外,还可使热量由侧方向消散或使空气由侧方向进入将热量由上方或下方带离。Also, please refer to Figure 1 and Figure 5. The base 100 of the heat dissipation fin set 10 c of the third embodiment further includes a side surface 104 and a plurality of side connecting channels 120 . The side surface 104 connects the first surface 101 and the second surface 102 . The side connecting channels 120 extend inward from the side surface 104 to communicate with the assembly hole 110 . In addition to increasing the heat dissipation surface area, it can also dissipate heat from the side or allow air to enter from the side to take heat away from above or below.
实施例四Embodiment Four
图6为本发明实施例四散热鳍片组的剖面示意图。请参阅图6,实施例四的散热鳍片组10d包括一基部100与多个空心散热柱200。其中基部100具有一第一表面101、一第二表面102及多个组装孔110。第二表面102相对于第一表面101。组装孔110自第一表面101延伸至第二表面102。空心散热柱200分别嵌设于基部100的组装孔110。每一空心散热柱200具有一散热通道210。散热通道210分别连通组装孔110。每一空心散热柱200具有一第一端201与相对的第二端202,两者分别对应有一第一端面203与一第二端面204。空心散热柱200的第一端201凸出第一表面101。空心散热柱200的第二端202凸出第二表面102。FIG. 6 is a schematic cross-sectional view of a fourth heat dissipation fin group according to an embodiment of the present invention. Referring to FIG. 6 , the heat dissipation fin set 10 d of the fourth embodiment includes a base 100 and a plurality of hollow heat dissipation columns 200 . The base 100 has a first surface 101 , a second surface 102 and a plurality of assembly holes 110 . The second surface 102 is opposite to the first surface 101 . The assembly hole 110 extends from the first surface 101 to the second surface 102 . The hollow cooling posts 200 are respectively embedded in the assembly holes 110 of the base 100 . Each hollow cooling column 200 has a cooling channel 210 . The heat dissipation channels 210 communicate with the assembly holes 110 respectively. Each hollow cooling column 200 has a first end 201 and an opposite second end 202 , which respectively correspond to a first end surface 203 and a second end surface 204 . The first end 201 of the hollow cooling post 200 protrudes from the first surface 101 . The second end 202 of the hollow cooling post 200 protrudes from the second surface 102 .
再者,本发明的散热鳍片组10a、10b、10c与10d的基部100与空心散热柱200的材质可为相同或相异。为加强热传导,本散热鳍片组10可采用导热系数较大的空心散热柱200与导热系数较小的基部100的复合式材质组成。例如:空心散热柱200采用金属铜搭配基部100采用金属铝。Furthermore, the materials of the base portion 100 and the hollow heat dissipation column 200 of the heat dissipation fin sets 10a, 10b, 10c, and 10d of the present invention may be the same or different. In order to enhance heat conduction, the heat dissipation fin set 10 can be composed of a composite material of a hollow heat dissipation column 200 with a relatively high thermal conductivity and a base portion 100 with a relatively low thermal conductivity. For example: the hollow heat dissipation column 200 is made of metal copper and the base 100 is made of metal aluminum.
根据上述实施例的散热鳍片组,由于本发明采用空心散热柱取代传统常见的实心散热鳍片,且将空心散热柱分别嵌设于基部的组装孔。空心散热柱的散热通道以及侧连接道连通基部的组装孔。因此除散热面积增加外,本发明的散热鳍片组除空心散热柱外部空间可供热气流通外,另气流还可流经空心散热柱内部的散热通道。使散热气流可经由双重散热途径将传导至空心散热柱的热量排出。此外,本发明的散热鳍片组与热源接触的表面可以是凸出空心散热柱的一端面或是基部的任一表面。再者,本发明可借助空心散热柱与基部的相异材质组成加强热传导增强散热效果。According to the heat dissipation fin set of the above embodiment, the present invention uses hollow heat dissipation columns instead of conventional solid heat dissipation fins, and the hollow heat dissipation columns are respectively embedded in the assembly holes of the base. The heat dissipation channel of the hollow heat dissipation column and the side connection channel communicate with the assembly hole of the base. Therefore, in addition to increasing the heat dissipation area, the heat dissipation fin assembly of the present invention not only allows hot air to circulate in the space outside the hollow heat dissipation column, but also allows air to flow through the heat dissipation channel inside the hollow heat dissipation column. The heat dissipation airflow can discharge the heat conducted to the hollow heat dissipation column through double heat dissipation paths. In addition, the surface of the heat dissipation fin group of the present invention in contact with the heat source may be an end surface of the protruding hollow heat dissipation column or any surface of the base. Furthermore, the present invention can enhance heat conduction and heat dissipation effect by virtue of different material compositions of the hollow heat dissipation column and the base.
Claims (9)
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WO2022121476A1 (en) * | 2020-12-10 | 2022-06-16 | 中兴通讯股份有限公司 | Heat dissipation apparatus and electronic device |
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