CN108022755A - The capacitor packaging structure and its wound-type module of negative conductive paillon foil is not required - Google Patents
The capacitor packaging structure and its wound-type module of negative conductive paillon foil is not required Download PDFInfo
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- CN108022755A CN108022755A CN201610941218.6A CN201610941218A CN108022755A CN 108022755 A CN108022755 A CN 108022755A CN 201610941218 A CN201610941218 A CN 201610941218A CN 108022755 A CN108022755 A CN 108022755A
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- Prior art keywords
- conductive
- wound
- takeup type
- paillon foil
- barrier paper
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
- H01G9/151—Solid electrolytic capacitors with wound foil electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
- H01G9/153—Skin fibre
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
Abstract
The present invention discloses a kind of capacitor packaging structure and its wound-type module that negative conductive paillon foil is not required.Capacitor packaging structure includes a wound-type module, a package assembling and a conductive component.Wound-type module includes a takeup type positive conductive paillon foil and a takeup type barrier paper to cooperate with takeup type positive conductive paillon foil, and the inside of takeup type barrier paper is adsorbed with multiple conductive materials.Wound-type module is covered by the inside of package assembling.Conductive component includes the first conductive connecting pin of a takeup type positive conductive paillon foil in electrical contact and the second conductive connecting pin of a takeup type barrier paper in electrical contact.Whereby, the internal takeup type barrier paper for being adsorbed with multiple conducting polymer composites can be used as a kind of negative conductive paper.
Description
Technical field
The present invention relates to a kind of capacitor packaging structure and its wound-type module, is not required anode to lead more particularly to one kind
The capacitor packaging structure and its wound-type module of electric paillon foil.
Background technology
Capacitor be used in extensively consumer electrical home appliances, computer motherboard, power supply unit, communication products and
The primary element of automobile etc., its main effect include filtering, bypass, rectification, coupling, decoupling, phase inversion etc., are electronic products
In one of indispensable element.Capacitor has different forms, includes aluminum electrolysis according to different material and purposes
It is capacitance, tantalum matter electrolytic capacitor, laminated ceramic capacitance, convoluted or stack type solid electrolytic capacitor and thin-film capacitor etc..
In the prior art, Winding-type solid electrolytic capacitor includes capacitor element, houses component and closure member.Capacitor member
The Cathode Foil that the anode foils of one jointed anode terminal are connected cathode terminal across insulating part by part with one is wound.House component
With opening portion and capacitor element can be housed.Closure member has one for anode terminal and the perforative through hole of cathode terminal
And one it is salable house component mouth-sealed portion.
However, existing Winding-type solid electrolytic capacitor is needed at the same time using anode foils, Cathode Foil and position in anode
Barrier paper three between paper tinsel and Cathode Foil is carried out at the same time winding, and the way of this prior art still has improvable sky
Between.
The content of the invention
The technical problems to be solved by the invention are, provide one kind in view of the deficiencies of the prior art and negative conductive is not required
The capacitor packaging structure and its wound-type module of paillon foil.
In order to solve above-mentioned technical problem, a wherein technical solution of the present invention is to provide a kind of be not required
The capacitor packaging structure of negative conductive paillon foil, it includes：One wound-type module, a package assembling and a conductive component.Institute
State what wound-type module cooperated including a takeup type positive conductive paillon foil and one with the takeup type positive conductive paillon foil
Takeup type barrier paper, wherein, the inside of the takeup type barrier paper is adsorbed with multiple conducting polymer composites.The takeup type group
Part is covered by the inside of the package assembling.The conductive component includes a takeup type positive conductive paillon foil in electrical contact
The first conductive connecting pin and a takeup type barrier paper in electrical contact the second conductive connecting pin, wherein, described first is conductive
Pin has one to be covered by the inside of the package assembling and the first of the takeup type positive conductive paillon foil in electrical contact
Bury portion and one be connected to and portion buried in described first and exposed in the first exposed portion of the outside of the package assembling, and described
Two conductive connecting pins have one to be covered by the inside of the package assembling and the second of the takeup type barrier paper in electrical contact
Bury portion and one be connected to and portion buried in described second and exposed in the second exposed portion of the outside of the package assembling.
Preferably, the portion of burying has the inside of an insertion wound-type module and is fixed on the takeup type in described first
On positive conductive paillon foil first in bury section and one be connected to and section buried in described first and exposed in the wound-type module
The first exterior naked section, wherein, the portion of burying has the inside of an insertion wound-type module and is fixed on institute in described second
State and section is buried in second on takeup type barrier paper and one is connected in described second and buries section and exposed in the wound-type module
Outside the second naked section.
Preferably, the takeup type positive conductive paillon foil has one to be used to cover in bury portion in described first described first
Bury the first insulating cover of section, and buried in described first portion described first in bury section and the takeup type barrier paper and pass through institute
The first insulating cover is stated to be separated from each other and insulate, wherein, the takeup type barrier paper has one to be used to cover described second
Inside bury the second insulating cover that section is buried in described the second of portion, and buried in described second portion described second in bury section with it is described
Takeup type positive conductive paillon foil is by second insulating cover to be separated from each other and insulate.
Preferably, the portion of burying has the inside of an insertion wound-type module and is fixed on the takeup type in described first
On positive conductive paillon foil first in bury section and one be connected to and section buried in described first and exposed in the wound-type module
The first exterior naked section, wherein, the portion of burying is fixed on the inner surface of the capacitor casing structure and exposed in described second
In the outside of the wound-type module, and the portion of burying has one separably to contact connecing for the takeup type barrier paper in described second
Touch section and one be connected to the contact-segment and non-contact section be separated from each other with the takeup type barrier paper.
Preferably, the package assembling includes a capacitor casing structure and a bottom end closure structure, the capacitor
Shell structure has an accommodating space for being used to house the wound-type module, and the bottom end closure structure setting is in the electricity
The bottom of container casing structure to close the accommodating space, wherein, the inside of the takeup type barrier paper is adsorbed with multiple lead
Electric elargol material or multiple conductive carbon glue materials, to reduce the fissipation factor of the capacitor packaging structure.
In order to solve above-mentioned technical problem, an other technical solution of the present invention is to provide a kind of be not required
The capacitor packaging structure of negative conductive paillon foil, it includes：One wound-type module, a package assembling and a conductive component.Institute
State what wound-type module cooperated including a takeup type positive conductive paillon foil and one with the takeup type positive conductive paillon foil
Takeup type barrier paper, wherein, the inside of the takeup type barrier paper is adsorbed with multiple conductive materials.The wound-type module is wrapped
Overlay on the inside of the package assembling.The conductive component includes the first of a takeup type positive conductive paillon foil in electrical contact
Second conductive connecting pin of conductive connecting pin and a takeup type barrier paper in electrical contact.
In order to solve above-mentioned technical problem, in addition yet another aspect of the present invention is to provide one kind and is not required to
The wound-type module of negative conductive paillon foil is wanted, the wound-type module electrically coordinates each other with a conductive component, described to be not required
The wound-type module of negative conductive paillon foil includes：One takeup type positive conductive paillon foil and a takeup type barrier paper.The winding
Formula positive conductive paillon foil and the takeup type barrier paper cooperate, wherein, the inside of the takeup type barrier paper is adsorbed with more
A conductive material.Wherein, one first conductive connecting pin of the conductive component and one second conductive connecting pin distinguish institute in electrical contact
State takeup type positive conductive paillon foil and the takeup type barrier paper, and the takeup type positive conductive paillon foil and the takeup type every
It is wound onto at the same time from paper together to form the wound-type module.
Preferably, first conductive connecting pin have one be covered by the package assembling inside first in bury portion with
And one is exposed in the first exposed portion of the outside of the package assembling, and second conductive connecting pin have one be covered by it is described
Portion and one exposed in the second exposed portion of the outside of the package assembling is buried in the second of the inside of package assembling, wherein, institute
Stating the portion of burying in first has the inside of an insertion wound-type module and is fixed on the takeup type positive conductive paillon foil
Section is buried in first and one is connected to section and exposed the first naked section in the outside of the wound-type module is buried in described first,
Wherein, the portion of burying has the inside of an insertion wound-type module and is fixed on the takeup type barrier paper in described second
Section is buried in second and one is connected to section and exposed the second naked section in the outside of the wound-type module is buried in described second,
Wherein, the takeup type positive conductive paillon foil has one to be used to cover to bury the first of section in bury in described first portion described first
Insulating cover, and buried in described first portion described first in bury section and insulate with the takeup type barrier paper by described first
Coating to be separated from each other and insulate, wherein, the takeup type barrier paper has one to be used to cover the institute of burying portion in described second
State the second insulating cover that section is buried in second, and buried in described second portion described second in bury section and the takeup type cathode
Conductive foil by second insulating cover to be separated from each other and insulate, wherein, the conductive material is conducting polymer
Material.
Preferably, first conductive connecting pin have one be covered by the package assembling inside first in bury portion with
And one is exposed in the first exposed portion of the outside of the package assembling, and second conductive connecting pin have one be covered by it is described
Portion and one exposed in the second exposed portion of the outside of the package assembling is buried in the second of the inside of package assembling, wherein, institute
Stating the portion of burying in first has the inside of an insertion wound-type module and is fixed on the takeup type positive conductive paillon foil
Section is buried in first and one is connected to section and exposed the first naked section in the outside of the wound-type module is buried in described first,
Wherein, the portion of burying is fixed on the inner surface of the capacitor casing structure and exposed in the wound-type module in described second
Outside, and the portion of burying has one separably to contact the contact-segment of the takeup type barrier paper and one be connected to institute in described second
Contact-segment and non-contact section be separated from each other with the takeup type barrier paper are stated, wherein, the conductive material is conducting polymer
Material.
Preferably, the inside of the takeup type barrier paper is adsorbed with multiple conductive silver glue materials or multiple conductive carbon glue materials
Material, to reduce the fissipation factor of the capacitor packaging structure.
The beneficial effects of the present invention are the capacitor that negative conductive paillon foil is not required that technical solution of the present invention is provided
Encapsulating structure and its wound-type module, it can be by the way that " wound-type module includes a takeup type positive conductive paillon foil and one
The takeup type barrier paper to cooperate with the takeup type positive conductive paillon foil " and " the inside suction of the takeup type barrier paper
With multiple conductive materials " technical characteristic so that the internal winding for being adsorbed with multiple conducting polymer composites
Formula barrier paper can be used as a kind of negative conductive paper.
For the enabled feature and technology contents for being further understood that the present invention, refer to below in connection with the present invention specifically
Bright and attached drawing, however the attached drawing provided be merely provided for refer to explanation, not be used for the present invention is any limitation as.
Brief description of the drawings
Fig. 1 is that the wound-type module of the capacitor packaging structure of first embodiment of the invention is electrically matched somebody with somebody each other with conductive component
The schematic perspective view of conjunction.
Fig. 2 is the takeup type cathode of the one of which wound-type module of the capacitor packaging structure of first embodiment of the invention
Conductive foil and the diagrammatic cross-section of takeup type barrier paper.
Fig. 3 is the schematic side view of the one of which capacitor packaging structure of first embodiment of the invention.
Fig. 4 is the takeup type cathode of another wound-type module of the capacitor packaging structure of first embodiment of the invention
Conductive foil and the diagrammatic cross-section of takeup type barrier paper.
Fig. 5 is the schematic side view of another capacitor packaging structure of first embodiment of the invention.
Fig. 6 is the schematic side view of the capacitor packaging structure of second embodiment of the invention.
Fig. 7 is the takeup type positive conductive paillon foil and the first conductive connecting pin phase of the wound-type module of third embodiment of the invention
The partial schematic diagram mutually coordinated.
Fig. 8 is that the takeup type barrier paper of the wound-type module of third embodiment of the invention and the second conductive connecting pin cooperate
Partial schematic diagram.
Fig. 9 is that the wound-type module of the capacitor packaging structure of third embodiment of the invention is electrically matched somebody with somebody each other with conductive component
The schematic perspective view of conjunction.
Embodiment
It is to illustrate presently disclosed related " negative conductive paillon foil to be not required by particular specific embodiment below
The embodiment of capacitor packaging structure and its wound-type module ", those skilled in the art can be by disclosed in this specification
Hold and understand advantages of the present invention and effect.The present invention can be implemented or applied, this theory by other different specific embodiments
Every details in bright book may be based on different viewpoints and application, in the lower various modifications of progress without departing from the spirit with becoming
More.In addition, the attached drawing of the present invention is only simple schematically illustrate, not according to the description of actual size, stated.Following implementation
The correlation technique content of the present invention, but disclosure of that and the guarantor for being not used to the limitation present invention will be explained in further detail in mode
Protect scope.
[first embodiment]
Shown in please referring to Fig.1 to Fig.3, first embodiment of the invention provides a kind of capacitor that negative conductive paillon foil is not required
Encapsulating structure Z, it includes：One wound-type module 1, a package assembling 2 and a conductive component 3, wherein capacitor packaging structure Z
It can be a kind of convoluted capacitor packaging structure.
First, coordinate shown in Fig. 1 and Fig. 2, wound-type module 1 include a takeup type positive conductive paillon foil 11 and one with
The takeup type barrier paper 12 that takeup type positive conductive paillon foil 11 cooperates.That is, as shown in Figure 1, takeup type cathode is led
Electric paillon foil 11 and takeup type barrier paper 12 are wound into " rolled " from " plane ", and takeup type positive conductive paillon foil 11
Together with helically being wound at the same time with takeup type barrier paper 12, to form wound-type module 1.For example, such as Fig. 2 institutes
Show, takeup type barrier paper 12 can be by way of being impregnated with conducting polymer liquid so that the inside of takeup type barrier paper 12 can inhale
Takeup type barrier paper 12 with multiple conducting polymer composite M1, but the present invention is not limited with Fig. 2 institutes illustrated example.
Furthermore coordinate shown in Fig. 1 and Fig. 3, wound-type module 1 is covered by the inside of package assembling 2.For example,
As shown in figure 3, package assembling 2 includes a capacitor casing structure 21（Such as aluminum hull or other metal shells）And one bottom envelope
Close structure 22.In addition, capacitor casing structure 21 has an accommodating space 210 for being used to house wound-type module 1, and bottom
Enclosed construction 22 is arranged on the bottom of capacitor casing structure 21 to close accommodating space 210.However, the package assembling of the present invention
2 are not limited with Fig. 3 institutes illustrated example.That is, package assembling 2 can also be by any insulating materials（Such as epoxy or
silicone）Made packaging body.
Furthermore coordinate shown in Fig. 1 and Fig. 3, conductive component 3 includes a takeup type positive conductive paillon foil 11 in electrical contact
Second conductive connecting pin 32 of the first conductive connecting pin 31 and a takeup type barrier paper 12 in electrical contact.In other words, as shown in Figure 1,
First embodiment of the invention can provide a kind of wound-type module 1 that negative conductive paillon foil is not required, and wound-type module 1 and one is conductive
Component 3 electrically coordinates each other, and wound-type module 1 includes a takeup type positive conductive paillon foil 11 and a takeup type barrier paper
12.In addition, takeup type positive conductive paillon foil 11 cooperates with takeup type barrier paper 12, and the inside of takeup type barrier paper 12
It is adsorbed with multiple conductive material CM（As shown in Figure 2）.In addition, one first conductive connecting pin 31 and one second of conductive component 3 is led
Electric pin 32 distinguishes takeup type positive conductive paillon foil 11 in electrical contact and takeup type barrier paper 12, and takeup type positive conductive paper tinsel
Together with piece 11 is helically wound at the same time with takeup type barrier paper 12, to form wound-type module 1.
More specifically, coordinate shown in Fig. 1 and Fig. 3, the first conductive connecting pin 31 has one to be covered by package assembling 2
Inside and takeup type positive conductive paillon foil 11 in electrical contact first in bury portion 311 and one and be connected in first portion of burying 311
And it is exposed in the first exposed portion 312 of the outside of package assembling 2, and the second conductive connecting pin 32 has one to be covered by encapsulation group
Portion 321 and one is buried in the second of the inside of part 2 and takeup type barrier paper 12 in electrical contact and is connected in second portion of burying 321 and naked
It is exposed at the second exposed portion 322 of the outside of package assembling 2.
More specifically, as shown in figure 3, burying inside of the portion 311 with an insertion wound-type module 1 and fixation in first
On takeup type positive conductive paillon foil 11 first in bury section 3111 and one and be connected in first and bury section 3111 and exposed rolling up
First naked section 3112 of the outside of wound component 1.In addition, inside of the portion 321 with an insertion wound-type module 1 is buried in second
And section 3211 and one is buried in second be fixed on takeup type barrier paper 12 it is connected in second and bury section 3211 and exposed rolling up
Second naked section 3212 of the outside of wound component 1.
It is worth noting that, refer to shown in Fig. 4, in the first embodiment of the present invention, takeup type barrier paper 12 it is interior
In addition to it can be adsorbed with multiple conducting polymer composite M1, takeup type barrier paper 12 can also be by being impregnated with conductive silver glue in portion
The mode of body or conductive carbon glue body so that the inside of takeup type barrier paper 12 can be adsorbed with multiple conductive silver glue material M2 or
It is multiple conductive carbon glue material M3.Whereby, the present invention can pass through multiple conductive silver glue material M2 or multiple conductive carbon glue materials
The use of M3 is expected, to reduce the fissipation factor of capacitor packaging structure Z (DissipationFactor, DF).That is, according to
According to different use demands, as shown in Fig. 2, the inside of takeup type barrier paper 12 can only be adsorbed with multiple conducting polymer composites
M1, either, as shown in figure 4, the inside of takeup type barrier paper 12 can be adsorbed with the same time multiple conducting polymer composite M1 with
Multiple conductive silver glue material M2（Or multiple conductive carbon glue material M3）.
For example, as shown in Fig. 2, when the inside of takeup type barrier paper 12 is only adsorbed with multiple conducting polymer composite M1
When, the takeup type barrier paper 12 that inside is adsorbed with multiple conducting polymer composite M1 can just make as a kind of negative conductive paper
With.As shown in figure 4, led when the inside of takeup type barrier paper 12 can be adsorbed with multiple conducting polymer composite M1 at the same time with multiple
Electric elargol material M2（Or multiple conductive carbon glue material M3）When, inside is adsorbed with multiple conducting polymer composite M1 and is led with multiple
Electric elargol material M2（Or multiple conductive carbon glue material M3）Takeup type barrier paper 12 can not only be as a kind of negative conductive
Paper uses, and can also be used to reduce the fissipation factor of capacitor packaging structure Z.
Hold and sayed, multiple conductive material CM that takeup type barrier paper 12 can adsorb can be multiple conducting polymers
Material M1, multiple conductive silver glue material M2 or multiple conductive carbon glue material M3, but multiple conductive material CM are not with above-mentioned institute
Illustrated example is limited, as long as it can allow the conduction material that takeup type barrier paper 12 is made into a kind of negative conductive paper to use
Material, can all be applied to the present invention.That is, first embodiment of the invention can provide and a kind of negative conductive paillon foil be not required
Capacitor packaging structure Z, it includes：One wound-type module 1, a package assembling 2 and a conductive component 3.Wound-type module 1 wraps
A takeup type positive conductive paillon foil 11 and a takeup type barrier paper 12 to cooperate with takeup type positive conductive paillon foil 11 are included,
And the inside of takeup type barrier paper 12 is adsorbed with multiple conductive material CM.Wound-type module 1 is covered by the interior of package assembling 2
Portion.The first conductive connecting pin 31 and one that conductive component 3 includes a takeup type positive conductive paillon foil 11 in electrical contact is in electrical contact
Second conductive connecting pin 32 of takeup type barrier paper 12.
It is worth noting that, capacitor packaging structure Z disclosed in Fig. 3 can also be disclosed in Fig. 5 capacitor package knot
Structure Z substitutes.The difference of the capacitor packaging structure Z disclosed in capacitor packaging structure Z and Fig. 3 disclosed in Fig. 5 is：Figure
The second of first exposed 312 and second conductive connecting pin 32 of portion of the first conductive connecting pin 31 of the capacitor packaging structure Z disclosed in 5
Exposed portion 322 can bend about 90 degree towards two opposite directions respectively.
It is specifically intended that as shown in Figure 1, since the wound-type module 1 of the capacitor packaging structure Z of the present invention can be only
Using winding the takeup type positive conductive paillon foil 11 of cooperation and takeup type barrier paper 12 together, and omit takeup type negative conductive paper tinsel
The use of piece, so in the case of the constancy of volume of capacitor packaging structure Z, it will help lifting capacitor packaging structure Z
The capacitance being capable of providing, and in the case where the capacitance of capacitor packaging structure Z is constant, it will help reduce capacitor
The volume of encapsulating structure Z.Furthermore since the capacitor packaging structure Z of the present invention can be omitted takeup type negative conductive paillon foil
Use, thus the total capacitance of capacitor packaging structure Z can depend entirely on the design of takeup type positive conductive paillon foil 11 with
Size.
[second embodiment]
Refer to shown in Fig. 6, second embodiment of the invention provides a kind of capacitor package that negative conductive paillon foil is not required
Structure Z, it includes：One wound-type module 1, a package assembling 2 and a conductive component 3.It is in electrical contact that conductive component 3 includes one
First conductive connecting pin 31 of takeup type positive conductive paillon foil 11 and the second conduction of a takeup type barrier paper 12 in electrical contact connect
Foot 32, the first conductive connecting pin 31, which has in one first, buries 311 and 1 first exposed portion 312 of portion, and the second conductive connecting pin 32
With burying 321 and 1 second exposed portion 322 of portion in one second.In addition, portion 311 is buried in first with an insertion wound-type module
1 inside and be fixed on takeup type positive conductive paillon foil 11 first in bury section 3111 and one and be connected in first and bury section
3111 and exposed the first naked section 3112 in the outside of wound-type module 1.
From the comparison of Fig. 6 and Fig. 3, the difference of second embodiment of the invention and first embodiment maximum is：
Portion 321 is buried in two embodiments, in second to be fixed on the inner surface of capacitor casing structure 21 and exposed in wound-type module 1
Outside, and portion 321 is buried in second with a connection of contact-segment 3213 and one for separably contacting takeup type barrier paper 12
It is separated from each other in contact-segment 3213 and with takeup type barrier paper 12 and non-contact section 3214 discontiguous.That is, conductive group
Second conductive connecting pin 32 of part 3 can be fixed on the inner surface of capacitor casing structure 21 in advance.When wound-type module 1 is put into envelope
During the accommodating space 210 of arrangement 2, the second conductive connecting pin 32 second in bury the contact-segment 3213 in portion 321 can be directly electric
Property contact takeup type barrier paper 12.
[3rd embodiment]
Refer to shown in Fig. 7 to Fig. 9, third embodiment of the invention provides a kind of takeup type that negative conductive paillon foil is not required
Component 1,1 and one conductive component 3 of wound-type module electrically coordinates each other, and wound-type module 1 is led including a takeup type cathode
Electric 11 and one takeup type barrier paper 12 of paillon foil.In addition, one first conductive connecting pin 31 of conductive component 3 and one second conduction connect
Foot 32 distinguishes takeup type positive conductive paillon foil 11 in electrical contact and takeup type barrier paper 12, and takeup type positive conductive paillon foil 11
Together with helically being wound at the same time with takeup type barrier paper 12, to form wound-type module 1.
More specifically, as shown in fig. 7, takeup type positive conductive paillon foil 11 has one to be used to bury portion in covering first
The first insulating cover 110 of section 3111 is buried in the first of 311, and buried in first portion 311 first in bury section 3111 with volume
Wound barrier paper 12 can be by the covering of the first insulating cover 110, to be separated from each other and mutual insulating.In addition, such as Fig. 8 institutes
Show, takeup type barrier paper 12 has one to be used to cover the second insulating cover for burying section 3211 in bury portion 321 in second second
120, and buried in second portion 321 second in bury section 3211 and takeup type positive conductive paillon foil 11 and can be covered by the second insulation
The covering of layer 120, to be separated from each other and mutual insulating.
[beneficial effect of embodiment]
The beneficial effects of the present invention are the capacitor that negative conductive paillon foil is not required that technical solution of the present invention is provided
Encapsulating structure Z and its wound-type module 1, it can be by the way that " wound-type module 1 includes a takeup type positive conductive paillon foil 11 and one
The takeup type barrier paper 12 " to cooperate with takeup type positive conductive paillon foil 11 and " the inside absorption of takeup type barrier paper 12
There is the technical characteristic of multiple conductive material CM ", so that the internal takeup type isolation for being adsorbed with multiple conducting polymer composite M1
Paper 12 can be used as a kind of negative conductive paper.
In addition, led when the inside of takeup type barrier paper 12 can be adsorbed with multiple conducting polymer composite M1 at the same time with multiple
Electric elargol material M2（Or multiple conductive carbon glue material M3）When, inside is adsorbed with multiple conducting polymer composite M1 and is led with multiple
Electric elargol material M2（Or multiple conductive carbon glue material M3）Takeup type barrier paper 12 can not only be as a kind of negative conductive
Paper uses, and can also be used to reduce the fissipation factor of capacitor packaging structure Z.
Furthermore since the capacitor packaging structure Z of the present invention can be omitted the use of takeup type negative conductive paillon foil, so
In the case of the constancy of volume of capacitor packaging structure Z, it will help the electricity that lifting capacitor packaging structure Z is capable of providing
Capacity, and in the case where the capacitance of capacitor packaging structure Z is constant, it will help reduce the body of capacitor packaging structure Z
Product.Further, since the capacitor packaging structure Z of the present invention can be omitted the use of takeup type negative conductive paillon foil, so capacitance
The total capacitance of device encapsulating structure Z can depend entirely on the design and size of takeup type positive conductive paillon foil 11.
Content disclosed above is only the preferred possible embodiments of the present invention, and the application for not thereby limiting to the present invention is special
Sharp scope, so every equivalence techniques change done with description of the invention and accompanying drawing content, is both contained in the present invention's
In claim.
Claims (10)
1. a kind of capacitor packaging structure that negative conductive paillon foil is not required, it is characterised in that described that negative conductive paper tinsel is not required
The capacitor packaging structure of piece includes：
One wound-type module, the wound-type module include a takeup type positive conductive paillon foil and one and the takeup type cathode
The takeup type barrier paper that conductive foil cooperates, wherein, the inside of the takeup type barrier paper is adsorbed with multiple conductive polymers
Sub- material；
One package assembling, the wound-type module are covered by the inside of the package assembling；And
One conductive component, the conductive component include the first conductive connecting pin of a takeup type positive conductive paillon foil in electrical contact
And one the takeup type barrier paper in electrical contact the second conductive connecting pin, wherein, first conductive connecting pin, which has, one to be wrapped
Portion of burying and a connection are overlayed in the first of the inside of the package assembling and the takeup type positive conductive paillon foil in electrical contact
Portion is buried in described first and exposed in the first exposed portion of the outside of the package assembling, and second conductive connecting pin has
One is covered by the second of the inside of the package assembling and the takeup type barrier paper in electrical contact portion of burying and a connection
Portion is buried in described second and exposed in the second exposed portion of the outside of the package assembling.
2. the capacitor packaging structure according to claim 1 that negative conductive paillon foil is not required, it is characterised in that described the
The portion of burying has the inside of an insertion wound-type module and be fixed on the takeup type positive conductive paillon foil first in one
Inside bury section and one be connected to section and exposed the first naked section in the outside of the wound-type module are buried in described first, its
In, the portion of burying has the inside of an insertion wound-type module and be fixed on the takeup type barrier paper the in described second
Section is buried in two and one is connected to section and exposed the second naked section in the outside of the wound-type module is buried in described second.
3. the capacitor packaging structure of negative conductive paillon foil is not required as claimed in claim 2, it is characterised in that the winding
Formula positive conductive paillon foil has one to be used to cover the first insulating cover for burying section in bury in described first portion described first, and
Buried in described first and section and the takeup type barrier paper are buried in described the first of portion by first insulating cover with each other
Separation and insulation, wherein, the takeup type barrier paper has one to be used to cover in bury in described second portion described second to bury section
The second insulating cover, and buried in described second portion described second in bury section and pass through with the takeup type positive conductive paillon foil
Second insulating cover is to be separated from each other and insulate.
4. the capacitor packaging structure of negative conductive paillon foil is not required as claimed in claim 1, it is characterised in that described first
Inside the portion of burying has in the inside for being inserted into the wound-type module and be fixed on the takeup type positive conductive paillon foil first
Bury section and one be connected to section and exposed the first naked section in the outside of the wound-type module are buried in described first, wherein,
The portion of burying is fixed on the inner surface for the capacitor casing structure that the package assembling includes and exposed in the volume in described second
The outside of wound component, and in described second the portion of burying have one separably contact the takeup type barrier paper contact-segment and
One is connected to the contact-segment and non-contact section be separated from each other with the takeup type barrier paper.
5. the capacitor packaging structure of negative conductive paillon foil is not required as claimed in claim 1, it is characterised in that the encapsulation
Component includes a capacitor casing structure and a bottom end closure structure, and the capacitor casing structure has one to be used to house institute
State the accommodating space of wound-type module, and the bottom end closure structure setting in the bottom of the capacitor casing structure to close
The accommodating space, wherein, the inside of the takeup type barrier paper is adsorbed with multiple conductive silver glue materials or multiple conductive carbons
Glue material, to reduce the fissipation factor of the capacitor packaging structure.
6. a kind of capacitor packaging structure that negative conductive paillon foil is not required, it is characterised in that described that negative conductive paper tinsel is not required
The capacitor packaging structure of piece includes：
One wound-type module, the wound-type module include a takeup type positive conductive paillon foil and one and the takeup type cathode
The takeup type barrier paper that conductive foil cooperates, wherein, the inside of the takeup type barrier paper is adsorbed with multiple conductive materials；
One package assembling, the wound-type module are covered by the inside of the package assembling；And
One conductive component, the conductive component include the first conductive connecting pin of a takeup type positive conductive paillon foil in electrical contact
And one the takeup type barrier paper in electrical contact the second conductive connecting pin.
7. a kind of wound-type module that negative conductive paillon foil is not required, the wound-type module are electrically matched somebody with somebody each other with a conductive component
Close, it is characterised in that the wound-type module that negative conductive paillon foil is not required includes：
One takeup type positive conductive paillon foil；And
One takeup type barrier paper, the takeup type positive conductive paillon foil cooperate with the takeup type barrier paper, wherein, it is described
The inside of takeup type barrier paper is adsorbed with multiple conductive materials；
Wherein, one first conductive connecting pin of the conductive component and one second conductive connecting pin distinguish the takeup type in electrical contact
Positive conductive paillon foil and the takeup type barrier paper, and the takeup type positive conductive paillon foil and the takeup type barrier paper are at the same time
It is wound onto together to form the wound-type module.
8. the wound-type module of negative conductive paillon foil is not required as claimed in claim 7, it is characterised in that described first is conductive
Pin, which has, buries portion and one exposed in the outside of the package assembling in the first of the inside for being covered by package assembling
First exposed portion, and second conductive connecting pin have one be covered by the package assembling inside second in bury portion and
One is exposed in the second exposed portion of the outside of the package assembling, wherein, the portion of burying has an insertion winding in described first
The inside of formula component and be fixed on the takeup type positive conductive paillon foil first in bury section and one be connected to described first
Section and exposed the first naked section in the outside of the wound-type module are inside buried, wherein, the portion of burying has an insertion in described second
The inside of the wound-type module and be fixed on the takeup type barrier paper second in bury section and one be connected to described
Section and exposed the second naked section in the outside of the wound-type module are buried in two, wherein, the takeup type positive conductive paillon foil
It is used to cover in bury portion in described first described first with one to bury the first insulating cover of section, and portion is buried in described first
Described first in bury section with the takeup type barrier paper by first insulating cover to be separated from each other and insulate, its
In, the takeup type barrier paper has one to be used to cover the bury section in bury in described second portion described second second insulation covering
Layer, and buried in described second portion described second in bury section and the takeup type positive conductive paillon foil and insulate by described second and cover
Cap rock to be separated from each other and insulate, wherein, the conductive material is conducting polymer composite.
9. the wound-type module of negative conductive paillon foil is not required as claimed in claim 7, it is characterised in that described first is conductive
Pin, which has, buries portion and one exposed in the outside of the package assembling in the first of the inside for being covered by package assembling
First exposed portion, and second conductive connecting pin have one be covered by the package assembling inside second in bury portion and
One is exposed in the second exposed portion of the outside of the package assembling, wherein, the portion of burying has an insertion winding in described first
The inside of formula component and be fixed on the takeup type positive conductive paillon foil first in bury section and one be connected to described first
Section and exposed the first naked section in the outside of the wound-type module are inside buried, wherein, the portion of burying is fixed on described in described second
It is on the inner surface for the capacitor casing structure that package assembling includes and exposed in the outside of the wound-type module, and described second
Inside the portion of burying have one separably contact the contact-segment of the takeup type barrier paper and one be connected to the contact-segment and with institute
Non-contact section that takeup type barrier paper is separated from each other is stated, wherein, the conductive material is conducting polymer composite.
10. the wound-type module of negative conductive paillon foil is not required as claimed in claim 7, it is characterised in that the takeup type
The inside of barrier paper is adsorbed with multiple conductive silver glue materials or multiple conductive carbon glue materials, to reduce capacitor packaging structure
Fissipation factor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610941218.6A CN108022755B (en) | 2016-11-01 | 2016-11-01 | Capacitor packaging structure without negative conductive foil and winding type assembly thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610941218.6A CN108022755B (en) | 2016-11-01 | 2016-11-01 | Capacitor packaging structure without negative conductive foil and winding type assembly thereof |
Publications (2)
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| CN108022755A true CN108022755A (en) | 2018-05-11 |
| CN108022755B CN108022755B (en) | 2020-08-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110895995A (en) * | 2018-09-12 | 2020-03-20 | 钰冠科技股份有限公司 | Capacitor, capacitor packaging structure and manufacturing method thereof |
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| JPS6490517A (en) * | 1987-10-01 | 1989-04-07 | Japan Carlit Co Ltd | Electrolytic capacitor |
| CN101542659A (en) * | 2006-11-22 | 2009-09-23 | 三洋电机株式会社 | Electrolytic capacitor and method for manufacturing the same |
| CN101685708A (en) * | 2008-09-22 | 2010-03-31 | 三洋电机株式会社 | Winding-type electrolytic capacitor and method of manufacturing the same |
| CN201838461U (en) * | 2010-08-26 | 2011-05-18 | 立隆电子工业股份有限公司 | High-tension winding aluminium solid capacitor |
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| CN110895995A (en) * | 2018-09-12 | 2020-03-20 | 钰冠科技股份有限公司 | Capacitor, capacitor packaging structure and manufacturing method thereof |
| CN110895995B (en) * | 2018-09-12 | 2022-07-22 | 钰冠科技股份有限公司 | Capacitor, capacitor packaging structure and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN108022755B (en) | 2020-08-11 |
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