CN108012458B - 一种柔性电路桥接工艺 - Google Patents
一种柔性电路桥接工艺 Download PDFInfo
- Publication number
- CN108012458B CN108012458B CN201711315347.5A CN201711315347A CN108012458B CN 108012458 B CN108012458 B CN 108012458B CN 201711315347 A CN201711315347 A CN 201711315347A CN 108012458 B CN108012458 B CN 108012458B
- Authority
- CN
- China
- Prior art keywords
- flexible circuit
- subplate
- bridge
- mainboard
- pilot pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711315347.5A CN108012458B (zh) | 2017-12-12 | 2017-12-12 | 一种柔性电路桥接工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711315347.5A CN108012458B (zh) | 2017-12-12 | 2017-12-12 | 一种柔性电路桥接工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108012458A CN108012458A (zh) | 2018-05-08 |
CN108012458B true CN108012458B (zh) | 2019-10-25 |
Family
ID=62058296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711315347.5A Active CN108012458B (zh) | 2017-12-12 | 2017-12-12 | 一种柔性电路桥接工艺 |
Country Status (1)
Country | Link |
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CN (1) | CN108012458B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111511109B (zh) * | 2019-01-30 | 2021-11-23 | 京东方科技集团股份有限公司 | 柔性电路板及制作方法、电子装置模组及电子装置 |
US11500489B2 (en) | 2019-01-30 | 2022-11-15 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof |
CN112684939B (zh) * | 2019-02-01 | 2021-12-03 | 华为技术有限公司 | 用于窄边框电子设备的触控屏和电子设备 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201153348Y (zh) * | 2007-09-12 | 2008-11-19 | 中兴通讯股份有限公司 | 电路板互联结构 |
CN102378497A (zh) * | 2010-08-10 | 2012-03-14 | 冈业科技(东莞)有限公司 | 电路软板与硬板连结的制作方法及其电路板结构 |
CN201937946U (zh) * | 2011-01-17 | 2011-08-17 | 浪新微电子系统(上海)有限公司 | 印制电路板 |
CN102686027A (zh) * | 2012-04-28 | 2012-09-19 | 华为终端有限公司 | 柔性电路板及其制造方法 |
CN204634161U (zh) * | 2015-05-18 | 2015-09-09 | 夏普株式会社 | 分段式柔性线路板 |
CN106304688B (zh) * | 2016-08-24 | 2019-03-08 | 广州明美新能源有限公司 | Pcb和fpcb的焊接结构及其焊接方法 |
CN107278027A (zh) * | 2017-07-12 | 2017-10-20 | 武汉华星光电技术有限公司 | 电路板及移动终端 |
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2017
- 2017-12-12 CN CN201711315347.5A patent/CN108012458B/zh active Active
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Publication number | Publication date |
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CN108012458A (zh) | 2018-05-08 |
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GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 523000, Dongguan, Guangdong province Dongcheng District sand science and Technology Industrial Park Patentee after: Yidong Electronic Technology Co.,Ltd. Address before: 523000, Dongguan, Guangdong province Dongcheng District sand science and Technology Industrial Park Patentee before: DONGGUAN YIDONG TECHNOLOGY Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220624 Address after: 523000 Tongsha Science and Technology Industrial Park, Dongcheng District, Dongguan City, Guangdong Province Patentee after: Yidong Electronic Technology Co.,Ltd. Patentee after: Hubei Yihong Precision Manufacturing Co., Ltd Address before: 523000 Tongsha Science and Technology Industrial Park, Dongcheng District, Dongguan City, Guangdong Province Patentee before: Yidong Electronic Technology Co.,Ltd. |
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TR01 | Transfer of patent right |