CN108010851A - Device for producing electronic assemblies and method, the manufacture method of three dimensional mold interconnecting device - Google Patents
Device for producing electronic assemblies and method, the manufacture method of three dimensional mold interconnecting device Download PDFInfo
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- CN108010851A CN108010851A CN201610934073.7A CN201610934073A CN108010851A CN 108010851 A CN108010851 A CN 108010851A CN 201610934073 A CN201610934073 A CN 201610934073A CN 108010851 A CN108010851 A CN 108010851A
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- table top
- metal
- electronic assemblies
- producing electronic
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- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 238000000429 assembly Methods 0.000 title claims abstract description 36
- 230000000712 assembly Effects 0.000 title claims abstract description 36
- 230000007246 mechanism Effects 0.000 claims abstract description 151
- 239000000463 material Substances 0.000 claims abstract description 85
- 238000007493 shaping process Methods 0.000 claims abstract description 47
- 239000011469 building brick Substances 0.000 claims abstract description 24
- 230000005540 biological transmission Effects 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims description 120
- 229910052751 metal Inorganic materials 0.000 claims description 120
- 239000004033 plastic Substances 0.000 claims description 95
- 229920003023 plastic Polymers 0.000 claims description 95
- 230000033001 locomotion Effects 0.000 claims description 36
- 230000015271 coagulation Effects 0.000 claims description 29
- 238000005345 coagulation Methods 0.000 claims description 29
- 238000004064 recycling Methods 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 24
- 230000007480 spreading Effects 0.000 claims description 21
- 238000003892 spreading Methods 0.000 claims description 21
- 238000001914 filtration Methods 0.000 claims description 15
- 238000000149 argon plasma sintering Methods 0.000 claims description 14
- 239000010931 gold Substances 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 230000005855 radiation Effects 0.000 claims description 9
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- 239000002002 slurry Substances 0.000 claims description 5
- 238000011084 recovery Methods 0.000 claims description 4
- 238000005286 illumination Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 abstract description 23
- 230000008569 process Effects 0.000 abstract description 8
- 239000000126 substance Substances 0.000 abstract description 7
- 238000009740 moulding (composite fabrication) Methods 0.000 description 35
- 239000000843 powder Substances 0.000 description 20
- 238000007747 plating Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000002309 gasification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- -1 laser active Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000013212 metal-organic material Substances 0.000 description 1
- 238000006263 metalation reaction Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
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- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Powder Metallurgy (AREA)
Abstract
Device for producing electronic assemblies provided by the invention and manufacture method, the manufacture method of three dimensional mold interconnecting device, by feed mechanism, shaping mechanism and transmission material mechanism combine, controlled by control system, whether the insulated part of metallic circuit or electronic building brick is made, all materials are all made all to be molded on shaping mechanism, so without using chemical constitution, without cumbersome moulding process, need to make the electronic building brick formed with regard to metallic circuit and insulated part can be molded into, it is simple with technique, it is easy to operate, required equipment is few, the characteristics of production efficiency is high.
Description
Technical field
The present invention relates to field of semiconductor fabrication, more particularly to a kind of device for producing electronic assemblies and method and three-dimensional mould
Mould the manufacture method of interconnection devices.
Background technology
With the raising of electronic equipment integrated level, equipment volume is also less and less, and at this moment electronic building brick is for whole equipment
Just seem excessive, and need to reduce own dimensions.By the way that on the surface of the curved plastic housing of injection molding, making has electrically
The conducting wire of function, figure manufacture and mounting related components, so that the electric interconnection function that common circuit board is had, support member
The functions such as the support of device function and plastic casing, protection and by mechanical entities and conductive pattern with reference to and produce shielding,
The functions such as antenna are integrated in one.
There is the manufacture that various ways can realize the structure at present, but all there are its limitation and deficiency.Mainstream at present
Manufacture craft is LDS (Laser Direct Structure laser direct formings) technique, refer to Fig. 1, the technological process of LDS
It is to be fabricated to plastic casing by the way of a kind of synthetic plastic grain containing metal structure is using injection.The shell of the technique
Body material needs to use the synthetic plastic grain containing metal structure, by way of injection molding, is fabricated to the modeling of needs
Material shell body.The shape of plastic casing needs to be formed by way of molding and manufacturing mould；Using laser direct forming equipment, in shell
Body surface face carries out laser scanning according to the path of regulation, defines metal interconnecting layer, by golden in the region of laser scanning on housing
Belong to tissue to be activated, become the Seed Layer of plating (chemical plating)；According to different operating modes, plated using plating (chemical plating) equipment
Smithcraft, since the only metal structure region that is activated can plate metal layer on housing, can form in limited area
Metal interconnecting layer.
Following problem is faced with using LDS techniques：
1st, metal conducting layer can only be produced on surface of shell, easily damaged and oxidation.
2nd, LDS techniques need to use the synthetic plastic containing metal structure, there is material limitation.
3rd, technological process complexity is, it is necessary to complete by the multiple devices such as injection, laser active, chemical plating (plating) and technique
Into.
4th, chemical plating (plating) can produce substantial amounts of pollution waste liquid, and post-processing is of high cost.
The content of the invention
To solve the above problems, the present invention proposes a kind of device for producing electronic assemblies and method, three dimensional mold interconnecting device
The manufacture method of part, for solving the above problems.
To reach above-mentioned purpose, the present invention provides a kind of device for producing electronic assemblies, including：
One feed mechanism, for providing the material needed for electronic building brick manufacture；
One shaping mechanism, place is provided for material shaping；
A coagulation system is further included, the material solidification in the shaping mechanism is molded；
One transmits material mechanism, for the material on the feed mechanism to be transferred to the shaping mechanism；
One control system, with the feed mechanism, the shaping mechanism, the coagulation system, the transmission material mechanism
All circuit connects, for controlling the feed mechanism, the shaping mechanism, the coagulation system, the material mechanism of transmitting
Mobile and parameter setting.
Preferably, setting a forming cavity, the shaping mechanism includes a workbench, the workbench be exposed to it is described into
In cavity, the material is molded on the workbench table top.
Preferably, the workbench is arranged in the first moving mechanism, first moving mechanism drives the shaping
Platform is moved up perpendicular to the side of the workbench table top.
Preferably, the feed mechanism is a metal feed system, it includes a metal deposit nozzle, positioned at it is described into
Above type platform, for the metal paste after liquefaction to be sprayed into the table top of the workbench.
Preferably, the metal feed system further includes
One metal paste bearing cavity, outside the forming cavity, for accommodating the metal paste after liquefying；
One filtration system, is connected outside the forming cavity and with the metal paste bearing cavity pipeline, for filtering
State metal paste；
One connection linkage, one end are connected with the filtration system pipeline, the other end and the metal deposit pipe-line
Connection, for the metal paste in the filtration system to be delivered in the metal deposit nozzle.
Preferably, the coagulation system includes heating unit.
Preferably, the heating unit is located at below the workbench, the material is located at the workbench table top.
Preferably, the coagulation system includes laser sintering device.
Preferably, the laser sintering device includes
One lasing light emitter, is arranged on outside the forming cavity, for providing laser；
One galvanometer, is arranged on outside the forming cavity, the illumination path of the laser for changing lasing light emitter offer.
Preferably, the forming cavity has cavity wall, there is laser radiation mirror, the laser sintering device in the cavity wall
Outside the forming cavity, and laser is exposed to by the laser radiation mirror table top of the workbench.
Preferably, the feed mechanism is positioned at shaping mechanism side rollway.
Preferably, be provided with one second moving mechanism below the rollway, second moving mechanism perpendicular to
The side of the rollway table top moves up, and drives the rollway to be moved up perpendicular to the side of the rollway table top,
Mobile scope be from the rollway table top less than the workbench table top to from the rollway table top higher than it is described into
Type platform table top.
Preferably, the feed mechanism is wire feed system, the wire feed system includes
One wire feeder, outside the forming cavity, for providing plastic wire to the plastic wire printhead；
One plastic wire printhead, in the forming cavity in, above the workbench, with the wire feeder pipeline
Connection, for plastic wire to liquefy and is sprayed into the workbench table top.
Preferably, the transmission material mechanism is power spreading device.
Preferably, the feed mechanism is the rollway positioned at the shaping mechanism side, the power spreading device and institute
State feed mechanism, the shaping mechanism, the surface of the recovering mechanism all contact.
Preferably, the power spreading device has cylindrical object, the periphery of the cylindrical object is in the feed
Platform, the shaping mechanism, the recovering mechanism surface on roll.
Preferably, the transmission material mechanism is a motion, it is connected with the feed mechanism, the fitness machine
Structure movement drives the feed mechanism movement.
Preferably, the feed mechanism includes a metal deposit nozzle and a plastic wire printhead, the motion
All it is connected with the metal deposit nozzle and the plastic wire printhead, the motion movement drives the metal deposit spray
Head and plastic wire printhead movement.
Preferably, further including a recovering mechanism, the material mechanism that transmits is by material transmission unnecessary in shaping mechanism
Recycled to the recovering mechanism.
Preferably, the recovering mechanism is a recycling platform, positioned at the side of the workbench.
Preferably, being provided with the 3rd moving mechanism below the recycling platform, the 3rd moving mechanism drives the recycling platform
Moved up perpendicular to the side of the recycling platform table top, the movement travel of the 3rd moving mechanism is from the recycling platform platform
Face is highly equal with the workbench table surface height to the recycling platform table top less than the workbench table top.
The present invention also provides a kind of manufacture method using device for producing electronic assemblies as described above, including following step
Suddenly：
Control system is layered the threedimensional model of electronic building brick, calculates and makes the material needed at each layer and agent
Amount；
Feed mechanism provides the material needed for each layer, and the transmission material mechanism send the material to forming machine
On structure；
Appropriate coagulation system is selected to be molded the material solidification according to the property of every layer of material.
Preferably, the feed mechanism is rollway and metal feed system, the coagulation system is laser sintered dress
Put and heating unit, the shaping mechanism are workbench, the transmission material mechanism is power spreading device, then
Rollway provides the plastics needed for electronic building brick manufacture, and the power spreading device is rolled to institute from the rollway table top
Workbench table top is stated, the plastics on rollway are transmitted to the workbench table top；
The heating unit, which heats the workbench, causes the plastic molting, after being melted using laser sintering device
Plastics coagulation forming；When needing to make metallic circuit, control system controls metal feed system by the metal pulp after liquefaction
Material is delivered to the table top of the workbench, and the metal paste is heated coagulation forming using heating unit.
Preferably, a recovering mechanism is also set up, by material recovery unnecessary on the workbench.
Preferably, the feed mechanism includes wire feed system and metal feed system, the shaping mechanism is shaping
Platform, the coagulation system are heating unit, and the transmission material mechanism is motion, itself and the wire feed system and the gold
Belong to feed system all to connect, then
The motion drives the wire feed system to be moved above workbench, and the wire feed system is by electronic building brick system
Make required plastics liquefaction and be sprayed into workbench table top and solidify, when needing to make metallic circuit, control system control gold
Belong to feed system and the metal paste after liquefaction is sprayed into workbench table top, and using workbench described in heating devices heat, make
Obtain metal paste heating coagulation forming.
Preferably, a recovering mechanism is also set up, by material recovery unnecessary on the workbench.
The present invention also provides a kind of manufacture method of three dimensional mold interconnecting device, manufactured using electronic building brick as described above
Method manufactures, and specifically comprises the following steps：
The design configuration of molded structural member in three dimensional mold interconnecting device is layered, according to the molded structural member
Layering is laid with plastics as a result, first pressing layer on shaping mechanism, forms the base plastic housing of the molded structural member；
The design configuration of interconnection conductive circuit in three dimensional mold interconnecting device is layered, according to the interconnecting electroconductive wires by means
The layering on road on the corresponding position of the base plastic housing as a result, press the metal paste after floor covering liquefaction, described in formation
Interconnection conductive circuit；
According to the layering result of the molded structural member modeling is set in the base plastic housing and interconnection conductive circuit upper berth
Material, forms plastics covering shell, completes the making of the molded structural member.
Compared with prior art, device for producing electronic assemblies provided by the invention and manufacture method and three dimensional mold interconnecting
The manufacture method of device, by feed mechanism, shaping mechanism and transmits the combination of material mechanism, is controlled by control system, no matter
It is the insulated part for making metallic circuit or electronic building brick, all materials is all molded on shaping mechanism, such nothing
Chemical constitution need to be used, without cumbersome moulding process, metallic circuit and insulated part can be just molded into needs making and formed
Electronic building brick, have that technique is simple, easy to operate, the characteristics of required equipment is few, and production efficiency is high.
Brief description of the drawings
Fig. 1 is LDS process flow charts in the prior art；
Fig. 2 is the device for producing electronic assemblies structure diagram that the embodiment of the present invention one provides；
Fig. 3 is the structure diagram for the metal deposit nozzle that the embodiment of the present invention one provides；
Fig. 4 is the electronic assembly manufacturing method flow chart that the embodiment of the present invention one provides；
Fig. 5 is the schematic diagram for the manufacture electronic building brick housing that the embodiment of the present invention one provides；
Fig. 6 is the manufacture metallic circuit schematic diagram on electronic building brick housing that the embodiment of the present invention one provides；
Fig. 7 is the schematic diagram that electronic building brick housing is covered on metallic circuit that the embodiment of the present invention one provides；
Fig. 8 is device for producing electronic assemblies structure diagram provided by Embodiment 2 of the present invention.
In Fig. 2-Fig. 8：1- rollways, 2- shaping mechanisms, 21- workbenches, 22- heating units, 23- forming cavities, 3- recycling
Mechanism, 31- recycling platform, 41- molding powders, 421- base plastics housing, 422- plastic casings coating, 43- metal pastes, 44-
Metallic circuit, 5- laser sintering devices, 51- lasing light emitters, 52- galvanometers, 53- laser radiations mirror, 6- metals feed system, 61- gold
Belong to deposition nozzle, 62- connections linkage, 63- filtration systems, 64- metal pastes bearing cavity, 65- pipelines, 66- suction lines, 7-
Power spreading device, 8- wire feed systems, 81- wire feeders, 82- plastic wires, 83- plastic wires printhead, 9- motions.
Embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Embodiment be described in detail.
Embodiment one
Fig. 2 is refer to, the present embodiment provides a kind of device for producing electronic assemblies, is included successively：
Feed mechanism, is specially plastics and metal for providing the material needed for electronic building brick manufacture, the form of material is
Varied, the form of metal is generally metal paste 43, specially the mixture of nano-metal particle and organic material, plastics
Mechanism offer is provided in the form of molding powder 41 in the present embodiment；
Shaping mechanism 2, for the material shaping place is provided, specifically, shaping mechanism 2 includes a forming cavity 23, into
Workbench 21 is provided with cavity 23, using 21 table top of workbench as X/Y plane, using vertical direction as Z-direction, establishes XYZ three-dimensional coordinates
System, in the forming cavity 23, the material is just molded 21 table top of workbench on 21 table top of workbench.
Preferably, the workbench 21 is arranged in the first moving mechanism (not shown), first moving mechanism band
The workbench 21 is moved to move on the direction of 21 table top of workbench i.e. Z-direction.
In addition, it is not oxidized in material forming process in order to protect in forming cavity 23, pour flowing in forming cavity 23
Inert gas is as protective gas, the forming process for protection materials.
A coagulation system is further included, by the material solidification in feed mechanism；
One transmits material mechanism, for the material on the feed mechanism to be transferred to the shaping mechanism 2；
One control system, with the feed mechanism, the shaping mechanism 2, the coagulation system, the transmission material mechanism
All circuit connects, for controlling the feed mechanism, the shaping mechanism 2, the coagulation system, the material mechanism of transmitting
Mobile and parameter setting.
In the present embodiment, feed mechanism is a metal feed system 6 and rollway 1, is set continuing with referring to Fig. 2, rollway 1
The placement molding powder 41 on the side of workbench 21, rollway 1 is put, the lower section of rollway 1 is provided with one second moving mechanism
(not shown), second moving mechanism move up perpendicular to the side of 1 table top of rollway, drive the rollway 1
Moved up perpendicular to the side of 1 table top of rollway, mobile scope is to be less than the shaping from 1 table top of rollway
The table top of platform 21 from 1 table top of rollway to 21 table top of workbench is greater than, so when 1 table top of rollway is high
Degree is when be less than 21 table surface height of workbench, to rollway 1 on place molding powder 41, the second moving mechanism moves upwards, drives confession
Material platform 1 moves up, until 1 table surface height of rollway is equal to the height of 21 table top of workbench, then using transmission material mechanism
Molding powder 41 on 1 table top of rollway is transferred on 21 table top of workbench.
Fig. 3 is refer to, the central part of metal deposit nozzle 61 has the pipeline 65 of 43 flowing of metal paste, realizes metal pulp
The deposition of material 43.Multiple independent suction lines 66, opening and closing and the gold of suction line 66 are uniformly distributed in the periphery of pipeline 65 for 360 °
Belong to the motion path linkage of deposition nozzle 61, air-breathing intensity is adjustable, can be by plastics unnecessary on metal deposit path on workpiece
Powder 41 is taken away.
Feed mechanism further includes a metal feed system 6 in the present embodiment, continues referring to Fig. 2,
The metal feed system 6 includes successively
One metal paste bearing cavity 64, outside the forming cavity 23, for accommodating the metal paste 43 after liquefying；
One filtration system 63, is connected outside the forming cavity 23 and with 64 pipeline of metal paste bearing cavity, works as gold
Belong to slurry carried chamber 64 by pipeline to metal deposit nozzle 61 convey metal paste 43 when, flow in 63 filter pipe of filtration system
The dynamic metal paste 43；
One connection linkage 62, one end are connected with 63 pipeline of filtration system, the other end and the metal deposit nozzle
61 pipelines connect, for the metal paste 43 filtered in the filtration system 63 to be delivered to the metal deposit nozzle 61
Interior, which can be in X to moving in, Y-direction and Z-direction；
One metal deposit nozzle 61, in the forming cavity 23 and above the workbench 21, for by connecting rod machine
Metal paste 43 after liquefaction in structure 62 is sprayed on the table top of the workbench 21.
Coagulation system includes heating unit 22 and laser sintering device 5 in the present embodiment.
The heating unit 22 can heat metal paste 43 on workbench 21 below the workbench 21,
Heating-up temperature is 100~200 DEG C, and the organic material in metal paste 43 is evaporated, the curing of metal paste 43 is realized, on basis
Metallic circuit 44 is formed on plastic casing 421.
Laser sintering device 5 includes：
One lasing light emitter 51, is arranged on outside the forming cavity 23, for providing laser；
One galvanometer 52, is arranged on outside the forming cavity 23, the illumination path of the laser for changing the offer of lasing light emitter 51；
One laser radiation mirror 53, the forming cavity 23 have cavity wall, and laser radiation mirror 53 is located in cavity wall, laser radiation mirror
53 are used to protect the lasing light emitter 51 and galvanometer 52 outside the forming cavity 23, and laser is sent from lasing light emitter 51, through galvanometer 52 with
And laser radiation mirror 53, laser is exposed on the table top of the workbench 21, the molding powder 41 on 21 table top of workbench is added
Heat fusing, and coagulation forming.
It is power spreading device 7 that material mechanism is transmitted in the present embodiment, and power spreading device 7 is cylinder, its periphery is in the X direction
Roll, power spreading device 7 will be rolled to 21 table top of workbench on the table top of rollway 1, by the molding powder 41 on 1 table top of rollway
Push on 21 table top of workbench.
It is preferred that further including a recovering mechanism 3, the recycling platform 31 of 21 side of workbench is specially arranged on, recycles platform 31
It is arranged on above the 3rd moving mechanism, the 3rd moving mechanism drives the recycling platform 31 perpendicular to recycling 31 table top of platform
Moved in direction i.e. Z-direction, the movement travel of the 3rd moving mechanism is is less than institute from recycling 31 table surface height of platform
It is equal with 31 table surface height of workbench to recycling 31 table top of platform to state 21 table top of workbench, then power spreading device 7 is from confession
Material 1 table top of platform rolls to 21 table top of workbench and then proceedes to roll to the table top of recycling platform 31, so by 21 table top of workbench
Unnecessary material is pushed on recycling 31 table top of platform and recycled.
Fig. 4 is refer to, the present invention also provides a kind of manufacture method using device for producing electronic assemblies as described above, bag
Include following steps：
Control system is layered the threedimensional model of electronic building brick, calculates and makes the material needed at each layer and agent
Amount；
Feed mechanism provides the material needed for each layer, and the transmission material mechanism send the material to forming machine
On structure 2；
Appropriate coagulation system is selected to be molded the material solidification according to the property of every layer of material.
Specially：
Step 1：The STL formatted files of three-dimensional stereo model hierarchy slicing are imported, control system, which can be read, to be used three
Dimension three-dimensional model is converted into that " * .STL " formatted files, " * .STL " formatted files can be by the three-dimensional stereo model root of electronic building brick
Hierarchy slicing is carried out according to actual demand；
Step 2：Control system controls power spreading device 7 that molding powder 41 tiles from 1 table top of rollway according to lift height
Onto 21 table top of workbench；
Step 3：41 basis of formation plastic casing 421 of molding powder on 5 sinter molding platform of laser sintering device, 21 table top,
Layering sintering is carried out to carrying molding powder 41 on 21 table top of workbench to form, sinter path and figure by laser sintering device 5
According to " figure after the specific layering of * .STL " formatted files is consistent, and sinter layer thickness is up to 0.06mm.Often complete one layer of sintering
Afterwards, workbench 21 is moved down in Z-direction, and displacement distance is suitable with sinter layer thickness.Workbench 21 leads to after Z-direction moves down
Power spreading device 7 is crossed molding powder 41 tiles onto 21 table top of workbench from rollway 1.Unnecessary plastics on 21 table top of workbench
Powder 41 will be transferred to by power spreading device 7 on recycling 31 table top of platform, after recycling platform 31 completes one layer of recycling of molding powder 41, in Z-direction
Move down, last power spreading device 7 returns to initial position.As above step operates repeatedly, base plastic as shown in Figure 4 is formed
Housing 421；
Step 4：According to " the layering of * .STL " formatted files, when needs make metal wire on base plastic housing 421
During road 44, using metal feed system 6 on 421 corresponding position of base plastic housing deposited metal lines, and pass through heating
Cure.Specifically, Fig. 6 is refer to, after the manufacture of base plastic housing 421 is completed, using metal feed system 6 according to " *
.STL " layering of the formatted file to metal layer makes metal interconnecting layer on base plastic housing 421.Metal feed system 6 will
Metal paste 43 in metal paste bearing cavity 64 is sprayed on base plastic housing 421, and spraying method can pass through temperature-sensitive or sound
The power of the form injectors such as control is ejected into metal paste 43 on base plastic housing 421, can also pass through metal paste 43
Have the function of that the metal paste bearing cavity 64 of gasification generator is ejected into base plastic housing 421 after metal paste 43 is gasified
On.Filtration system 63 can filter the metal paste 43 after molten metal or gasification, to ensure the uniformity of metal deposit, gold
It is 5~150um to belong to 44 width of circuit.Metal deposit nozzle 61 can be made of multiple independent sprayers, to improve metal deposit efficiency.
After completing deposition of metal technique, the heating unit 22 of the lower section of workbench 21 can be on 21 base plastic housing 421 of workbench
Metal paste 43 is heated, and heating-up temperature is 100~200 DEG C so that the organic material volatilization in metal paste 43, realizes gold
Belong to the curing of circuit 44, metallic circuit 44 as shown in Figure 6 is formed on base plastic housing 421.
Step 5：According to " layering of * .STL " formatted files, using power spreading device 7 according to lift height from rollway 1
Molding powder 41 is tiled onto workbench 21；Molding powder 41 on 5 sinter molding platform of laser sintering device, 21 table top, is moulded on basis
Material shell body 421 and metallic circuit 44 form plastic casing coating 422 as shown in Figure 7.Then by power spreading device 7 from feed
Molding powder 41 is tiled onto 21 table top of workbench on 1 table top of platform.Unnecessary molding powder 41 will pass through paving on 21 table top of workbench
Powder device 7 is transferred on recycling 31 table top of platform, after recycling platform 31 completes one layer of recycling of molding powder 41, is moved down in Z-direction, finally
Power spreading device 7 is rolled back to initial position.
Step 6：As above step operates repeatedly, until each layer of electronic building brick all completes, forms required electronics
Component.
Embodiment two
Fig. 8 is refer to, the difference between this embodiment and the first embodiment lies in：
Preferably, the feed mechanism is wire feed system 8, the wire feed system 8 includes：
One wire feeder 81, outside the forming cavity 23, for providing plastic wire 82 to plastic wire printhead 83；
One plastic wire printhead 83, in the forming cavity 23, above the workbench 21, with the wire feeder
81 pipelines connect, and in plastic wire printhead 83, the plastic wire 82 of pipeline are liquefied and is sprayed into the workbench 21
Face.It is a motion 9 to transmit material mechanism, in forming cavity 23, with the metal deposit nozzle 61 and the plastic wire
Printhead 83 all connects, and the movement of motion 9 drives the metal deposit nozzle 61 and the plastic wire printhead 83 to move
It is dynamic, there is the device that motion 9 can be driven to be moved in X-direction, Y-direction in motion 9.
The metal deposit nozzle 61 and the plastic wire printhead 83 all can independent Z-direction movements.
The motion 9 drives the wire feed system 8 mobile above workbench 21, and the wire feed system 8 is by electronics
Component manufacture needed for plastic wire 82 liquefy after and be sprayed into 21 table top of workbench and solidify, when need make metallic circuit 44
When, the metal paste 43 after liquefaction is sprayed into 21 table top of workbench by control system control metal feed system 6, and uses heating
Device 22 heats the workbench 21 so that metal paste 43 heats coagulation forming.
It is specially using the manufacture method of above-mentioned device for producing electronic assemblies in the present embodiment：
Step 1：Import three-dimensional stereo model hierarchy slicing " * .STL " formatted files, control system can read use
Three-dimensional stereo model is converted into " * .STL " formatted files, STL formatted files can be by three-dimensional stereo models according to the actual requirements
Carry out hierarchy slicing；
Step 2：According to " layering of * .STL " formatted files, motion 9 and plastic wire printhead 83 realize that six axis are transported
It is dynamic.Plastic casing part by the wire feed system 8 of plastic wire 82 by plastic wire 82 by plastic wire printhead 83 in workbench 21
Base plastic housing 421 is manufactured on table top, after often completing one layer, workbench 21 is in the corresponding height of Z-direction descending motion, as more than
Step operates repeatedly, forms base plastic housing 421 as shown in Figure 5.
Step 3：According to " layering of * .STL " formatted files, motion 9 and metal deposit nozzle 61 realize that six axis are transported
It is dynamic, the deposited metal circuit 44 on corresponding position, and by being heating and curing.Specifically, base plastic housing 421 is completed
After manufacture, according to " layering of the * .STL " formatted files to metal layer makes metal interconnecting layer on base plastic housing 421.Gold
The metal paste 43 belonged in slurry carried chamber 64 is ejected on base plastic housing 421, and spray regime can pass through temperature-sensitive or acoustic control
Etc. form injector power on liquid metal spraying to base plastic housing 421, also can be by metal paste 43 by with gas
Change the metal paste bearing cavity 64 of generator function, be ejected on base plastic housing 421.Filtration system 63 can to molten metal or
Metal paste 43 after gasification is filtered, and to ensure the uniformity of metal deposit, 44 width of metallic circuit is 5~150um, often
After completing one layer, workbench 21 is in the corresponding height of Z-direction descending motion, after completing deposition of metal technique, the lower section of workbench 21
Heating unit 22 metallic circuit 44 on 21 table top of workbench can be heated, heating-up temperature is
100~200 DEG C, realize the curing of metallic circuit 44, gold as shown in Figure 6 is formed on base plastic housing 421
Belong to circuit 44.
Step 4：According to " layering of * .STL " formatted files, motion 9 and plastic wire printhead 83 realize that six axis are transported
It is dynamic, form plastic casing coating 422.Plastic casing coating 422 is manufactured by plastic wire printhead 83 on workbench 21,
After often completing one layer, workbench 21 operates repeatedly in the corresponding height of Z-direction descending motion, such as above step, in base plastic shell
Plastic casing coating 422 as shown in Figure 7 is formed on body 421 and metallic circuit 44.
In conclusion device for producing electronic assemblies provided by the invention and manufacture method, by feed mechanism, shaping mechanism 2
And transmit material mechanism and combine, controlled by control system, whether make the insulation of metallic circuit 44 or electronic building brick
Part, all materials are all molded on shaping mechanism 2, so without using chemical constitution, without cumbersome moulding process, just
Metallic circuit 44 and insulated part can be molded into needs to make the electronic building brick formed, easy to operate, institute simple with technique
Need the characteristics of equipment is few, and production efficiency is high.
The present invention also provides a kind of manufacture method of three dimensional mold interconnecting device, manufactured using electronic building brick as described above
Method manufactures, and specifically comprises the following steps：
The design configuration of molded structural member in three dimensional mold interconnecting device is layered, according to the molded structural member
Layering is laid with plastics as a result, first pressing layer on shaping mechanism, forms the base plastic housing of the molded structural member；
The design configuration of interconnection conductive circuit in three dimensional mold interconnecting device is layered, according to the interconnecting electroconductive wires by means
The layering on road on the corresponding position of the base plastic housing as a result, press the metal paste after floor covering liquefaction, described in formation
Interconnection conductive circuit；
According to the layering result of the molded structural member modeling is set in the base plastic housing and interconnection conductive circuit upper berth
Material, forms plastics covering shell, completes the making of the molded structural member.
Above-described embodiment is described in the present invention, but the present invention is not limited only to above-described embodiment, it is clear that this area
Technical staff can carry out various modification and variations without departing from the spirit and scope of the present invention to invention.If in this way, this hair
These bright modifications and variations belong within the scope of the claims in the present invention and its equivalent technologies, then the present invention is also intended to include
Including these modification and variations.
Claims (27)
- A kind of 1. device for producing electronic assemblies, it is characterised in that including：One feed mechanism, for providing the material needed for electronic building brick manufacture；One shaping mechanism, place is provided for material shaping；A coagulation system is further included, the material solidification in the shaping mechanism is molded；One transmits material mechanism, for the material on the feed mechanism to be transferred to the shaping mechanism；One control system, it is all electric with the feed mechanism, the shaping mechanism, the coagulation system, the transmission material mechanism Road connects, for controlling the feed mechanism, the shaping mechanism, the coagulation system, the movement for transmitting material mechanism And parameter setting.
- 2. device for producing electronic assemblies as claimed in claim 1 a, it is characterised in that forming cavity, the shaping mechanism are set Including a workbench, in the forming cavity, the material is molded the workbench on the workbench table top.
- 3. device for producing electronic assemblies as claimed in claim 2, it is characterised in that the workbench is arranged on the first moving machine On structure, first moving mechanism drives the workbench to be moved up perpendicular to the side of the workbench table top.
- 4. device for producing electronic assemblies as claimed in claim 2, it is characterised in that the feed mechanism includes a metal feeding System, the metal feed system includes a metal deposit nozzle, above the workbench, for by the metal after liquefaction Slurry is sprayed into the table top of the workbench.
- 5. device for producing electronic assemblies as claimed in claim 4, it is characterised in that the metal feed system further includes：One metal paste bearing cavity, outside the forming cavity, for accommodating the metal paste after liquefying；One filtration system, is connected outside the forming cavity and with the metal paste bearing cavity pipeline, for filtering the gold Belong to slurry；One connection linkage, one end are connected with the filtration system pipeline, and the other end is connected with the metal deposit pipe-line, For the metal paste in the filtration system to be delivered in the metal deposit nozzle.
- 6. device for producing electronic assemblies as claimed in claim 2, it is characterised in that the coagulation system includes heating unit.
- 7. device for producing electronic assemblies as claimed in claim 6, it is characterised in that the heating unit is located at the workbench Lower section, the material are located at the workbench table top.
- 8. device for producing electronic assemblies as claimed in claim 2, it is characterised in that the coagulation system includes laser sintered dress Put.
- 9. device for producing electronic assemblies as claimed in claim 8, it is characterised in that the laser sintering device includes：One lasing light emitter, is arranged on outside the forming cavity, for providing laser；One galvanometer, is arranged on outside the forming cavity, the illumination path of the laser for changing lasing light emitter offer.
- 10. device for producing electronic assemblies as claimed in claim 9, it is characterised in that the forming cavity has cavity wall, the chamber There is laser radiation mirror, the laser sintering device is located at outside the forming cavity, and will by the laser radiation mirror on wall Laser exposes to the table top of the workbench.
- 11. the device for producing electronic assemblies as described in claim 2 or 4, it is characterised in that the feed mechanism is positioned at described The rollway of shaping mechanism side.
- 12. device for producing electronic assemblies as claimed in claim 11, it is characterised in that one the is provided with below the rollway Two moving mechanisms, second moving mechanism move up perpendicular to the side of the rollway table top, drive the rollway Moved up perpendicular to the side of the rollway table top, mobile scope is to be less than the workbench from the rollway table top Table top to the rollway table top be higher than the workbench table top.
- 13. the device for producing electronic assemblies as described in claim 2 or 4, it is characterised in that the feed mechanism includes a wire feed System, the wire feed system include：One wire feeder, outside the forming cavity, for providing plastic wire to plastic wire printhead；One plastic wire printhead, in the forming cavity in, above the workbench, with the wire feeder pipeline connect Connect, for plastic wire to liquefy and is sprayed into the workbench table top.
- 14. device for producing electronic assemblies as claimed in claim 1, it is characterised in that the transmission material mechanism fills for powdering Put.
- 15. device for producing electronic assemblies as claimed in claim 14, it is characterised in that the feed mechanism be positioned at it is described into The rollway of type mechanism side, the power spreading device and the feed mechanism, the shaping mechanism, the surface of the recovering mechanism All contact.
- 16. device for producing electronic assemblies as claimed in claim 14, it is characterised in that the power spreading device has cylinder Body, the periphery of the cylindrical object the rollway, the shaping mechanism, the recovering mechanism surface on roll.
- 17. device for producing electronic assemblies as claimed in claim 1, it is characterised in that the transmission material mechanism is a movement Mechanism, it is connected with the feed mechanism, and the motion drives the feed mechanism movement.
- 18. device for producing electronic assemblies as claimed in claim 17, it is characterised in that the feed mechanism sinks including a metal Product nozzle and a plastic wire printhead, the motion all connect with the metal deposit nozzle and the plastic wire printhead Connect, the motion movement drives the metal deposit nozzle and plastic wire printhead movement.
- 19. device for producing electronic assemblies as claimed in claim 2, it is characterised in that further include a recovering mechanism, the transmission Material unnecessary in shaping mechanism is transferred to the recovering mechanism and is recycled by material mechanism.
- 20. device for producing electronic assemblies as claimed in claim 19, it is characterised in that the recovering mechanism is a recycling platform, Positioned at the side of the workbench.
- 21. device for producing electronic assemblies as claimed in claim 20, it is characterised in that be provided with the 3rd below the recycling platform Moving mechanism, the 3rd moving mechanism drive the recycling platform to be moved up perpendicular to the side of the recycling platform table top, and described the The movement travel of three moving mechanisms is less than the workbench table top to the recycling platform table top from the recycling platform table surface height It is equal with the workbench table surface height.
- 22. a kind of manufacture method using device for producing electronic assemblies as claimed in claim 1, it is characterised in that including such as Lower step：Control system is layered the threedimensional model of electronic building brick, calculates the material and dosage for making and being needed at each layer；Feed mechanism provides the material needed for each layer, and the transmission material mechanism send the material to shaping mechanism On；Appropriate coagulation system is selected to be molded the material solidification according to the property of every layer of material.
- 23. manufacture method as claimed in claim 22, it is characterised in that the feed mechanism is rollway and metal feeding system System, the coagulation system is laser sintering device and heating unit, and the shaping mechanism is workbench, the transmission material mechanism For power spreading device, then：The rollway provides the plastics needed for electronic building brick manufacture, and the power spreading device is rolled to institute from the rollway table top Workbench table top is stated, the plastics on rollway are transmitted to the workbench table top；The heating unit heats the workbench so that the plastic molting, using laser sintering device by the modeling after fusing Expect coagulation forming；When needing to make metallic circuit, control system control metal feed system is defeated by the metal paste after liquefaction Send to the table top of the workbench, the metal paste is heated into coagulation forming using heating unit.
- 24. manufacture method as claimed in claim 23 a, it is characterised in that recovering mechanism is also set up, by the workbench Unnecessary material recovery.
- 25. manufacture method as claimed in claim 22, it is characterised in that the feed mechanism includes wire feed system and metal is sent Material system, the shaping mechanism are workbench, and the coagulation system is heating unit, and the transmission material mechanism is fitness machine Structure, it is all connected with the wire feed system with the metal feed system, then：The motion drives the wire feed system to be moved above workbench, and electronic building brick is manufactured institute by the wire feed system The plastics liquefaction of need is simultaneously sprayed into workbench table top and solidifies, and when needing to make metallic circuit, control system control metal is sent Metal paste after liquefaction is sprayed into workbench table top by material system, and uses workbench described in heating devices heat so that gold Belong to slurry heating coagulation forming.
- 26. manufacture method as claimed in claim 25 a, it is characterised in that recovering mechanism is also set up, by the workbench Unnecessary material recovery.
- 27. a kind of manufacture method of three dimensional mold interconnecting device, it is characterised in that use electronics group as claimed in claim 22 Part manufacture method manufactures, and specifically comprises the following steps：The design configuration of molded structural member in three dimensional mold interconnecting device is layered, according to the layering of the molded structural member As a result, being first laid with plastics by layer on shaping mechanism, the base plastic housing of the molded structural member is formed；The design configuration of interconnection conductive circuit in three dimensional mold interconnecting device is layered, according to the interconnection conductive circuit Layering forms the interconnection as a result, by the metal paste after layer covering liquefaction on the corresponding position of the base plastic housing Conducting wire；According to the layering result of the molded structural member plastics, shape are set in the base plastic housing and interconnection conductive circuit upper berth Shell is covered into plastics, completes the making of the molded structural member.
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| CN201610934073.7A CN108010851B (en) | 2016-10-31 | 2016-10-31 | Electronic component manufacturing apparatus and method, and method for manufacturing three-dimensional molding interconnection device |
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| CN201610934073.7A CN108010851B (en) | 2016-10-31 | 2016-10-31 | Electronic component manufacturing apparatus and method, and method for manufacturing three-dimensional molding interconnection device |
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| CN103341625A (en) * | 2013-07-10 | 2013-10-09 | 湖南航天工业总公司 | 3D printing manufacturing device and method of metal parts |
| CN204018721U (en) * | 2014-07-09 | 2014-12-17 | 山东科技大学 | A kind of laser sintering metallic powder three-dimensional printer |
| CN104708809A (en) * | 2013-12-12 | 2015-06-17 | 三纬国际立体列印科技股份有限公司 | Three-dimensional printing device |
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|---|---|---|---|---|
| US20120162314A1 (en) * | 2010-12-22 | 2012-06-28 | Stratasys, Inc. | Print head assembly for use in fused deposition modeling system |
| CN103341625A (en) * | 2013-07-10 | 2013-10-09 | 湖南航天工业总公司 | 3D printing manufacturing device and method of metal parts |
| CN104708809A (en) * | 2013-12-12 | 2015-06-17 | 三纬国际立体列印科技股份有限公司 | Three-dimensional printing device |
| CN204018721U (en) * | 2014-07-09 | 2014-12-17 | 山东科技大学 | A kind of laser sintering metallic powder three-dimensional printer |
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