CN108010851B - Electronic component manufacturing apparatus and method, and method for manufacturing three-dimensional molding interconnection device - Google Patents
Electronic component manufacturing apparatus and method, and method for manufacturing three-dimensional molding interconnection device Download PDFInfo
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- CN108010851B CN108010851B CN201610934073.7A CN201610934073A CN108010851B CN 108010851 B CN108010851 B CN 108010851B CN 201610934073 A CN201610934073 A CN 201610934073A CN 108010851 B CN108010851 B CN 108010851B
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 74
- 238000000465 moulding Methods 0.000 title claims description 54
- 230000007246 mechanism Effects 0.000 claims abstract description 195
- 239000002184 metal Substances 0.000 claims abstract description 130
- 229910052751 metal Inorganic materials 0.000 claims abstract description 130
- 239000000463 material Substances 0.000 claims abstract description 79
- 229920003023 plastic Polymers 0.000 claims description 121
- 239000004033 plastic Substances 0.000 claims description 121
- 239000000843 powder Substances 0.000 claims description 47
- 239000002002 slurry Substances 0.000 claims description 39
- 238000001465 metallisation Methods 0.000 claims description 35
- 238000004064 recycling Methods 0.000 claims description 30
- 238000010438 heat treatment Methods 0.000 claims description 28
- 230000007480 spreading Effects 0.000 claims description 22
- 238000003892 spreading Methods 0.000 claims description 22
- 238000011084 recovery Methods 0.000 claims description 18
- 238000000149 argon plasma sintering Methods 0.000 claims description 16
- 238000001914 filtration Methods 0.000 claims description 15
- 238000007639 printing Methods 0.000 claims description 14
- 239000007921 spray Substances 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 abstract description 14
- 239000000126 substance Substances 0.000 abstract description 7
- 239000011257 shell material Substances 0.000 description 34
- 238000007747 plating Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 2
- 238000002309 gasification Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000013212 metal-organic material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
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Abstract
The feeding mechanism, the forming mechanism and the material transferring mechanism are combined, and all materials are formed on the forming mechanism under the control of the control system no matter the metal circuit or the insulating part of the electronic component is manufactured, so that the metal circuit and the insulating part can be formed into the electronic component to be manufactured and formed without using a chemical structure and a complex forming process.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to an electronic component manufacturing device and method and a three-dimensional molding interconnection device manufacturing method.
Background
With the increase of the integration level of the electronic device, the device volume is smaller and smaller, and the electronic component is too large for the whole device, so that the size of the electronic component is required to be reduced. The device is manufactured and installed by manufacturing the conducting wire and the graph with the electric function on the surface of the curved plastic shell which is molded by injection, so that the electric interconnection function, the function of supporting the device, the functions of supporting and protecting the plastic shell and the functions of shielding, antenna and the like which are generated by combining a mechanical entity and the conducting graph are integrated into a whole.
There are several ways in which this can be achieved, but there are limitations and disadvantages. Currently, the mainstream manufacturing process is the LDS (Laser Direct Structure Laser Direct structuring) process, and referring to fig. 1, the process flow of the LDS is to manufacture a plastic shell by using a plastic particle of a composition containing a metal Structure and by using an injection molding method. The shell material of the process needs to be made into the needed plastic shell by adopting composite plastic particles containing metal tissues and adopting an injection molding mode. The shape of the plastic shell needs to be formed by a mode of opening a mold to manufacture a mold; laser direct forming equipment is adopted, laser scanning is carried out on the surface of the shell according to a specified path, a metal interconnection layer is defined, and metal structures in the area scanned by the laser on the shell are activated to become a seed layer of electroplating (chemical plating); according to different working conditions, the metal plating process is carried out by adopting electroplating (chemical plating) equipment, and since only the activated area of the metal structure on the shell can be plated with the metal layer, the metal interconnection layer can be formed in the limited area.
The use of the LDS process faces several problems:
1. the metal conductive layer can only be manufactured on the surface of the shell and is easy to damage and oxidize.
2. The LDS process requires the use of synthetic plastics containing metallic structures, which has material limitations.
3. The process flow is complex and needs to be completed by a plurality of devices and processes such as injection molding, laser activation, chemical plating (electroplating) and the like.
4. Chemical plating (electroplating) can produce a large amount of polluted waste liquid, and the post-treatment cost is high.
Disclosure of Invention
In order to solve the above problems, the present invention proposes an electronic component manufacturing apparatus and method, and a three-dimensional molded interconnect device manufacturing method, which are used to solve the above problems.
To achieve the above object, the present invention provides an electronic component manufacturing apparatus, comprising:
the feeding mechanism is used for providing materials required by manufacturing the electronic component;
the forming mechanism provides a place for forming the material;
the material in the forming mechanism is solidified and formed by a solidifying device;
the material conveying mechanism is used for conveying the material on the feeding mechanism to the forming mechanism;
and the control system is in circuit connection with the feeding mechanism, the forming mechanism, the solidifying device and the material conveying mechanism and is used for controlling the movement and parameter setting of the feeding mechanism, the forming mechanism, the solidifying device and the material conveying mechanism.
Preferably, a molding cavity is provided, the molding mechanism comprises a molding table, the molding table is exposed in the molding cavity, and the material is molded on the table top of the molding table.
Preferably, the forming table is arranged on a first moving mechanism, and the first moving mechanism drives the forming table to move in a direction perpendicular to the table surface of the forming table.
Preferably, the feeding mechanism is a metal feeding system, which includes a metal deposition nozzle located above the forming table for spraying the liquefied metal slurry onto the table top of the forming table.
Preferably, the metal feeding system further comprises
The metal slurry bearing cavity is positioned outside the forming cavity and is used for containing the liquefied metal slurry;
the filtering system is positioned outside the forming cavity and connected with the metal slurry bearing cavity pipeline and is used for filtering the metal slurry;
and one end of the connecting rod mechanism is connected with the filtering system pipeline, and the other end of the connecting rod mechanism is connected with the metal deposition nozzle pipeline and is used for conveying the metal slurry in the filtering system into the metal deposition nozzle.
Preferably, the solidifying means comprises heating means.
Preferably, the heating device is located below the forming table, and the material is located on the table top of the forming table.
Preferably, the solidification device comprises a laser sintering device.
Preferably, the laser sintering apparatus includes
The laser source is arranged outside the molding cavity and used for providing laser;
and the vibrating mirror is arranged outside the molding cavity and is used for changing the irradiation light path of the laser provided by the laser source.
Preferably, the molding cavity is provided with a cavity wall, the cavity wall is provided with a laser protection lens, the laser sintering device is positioned outside the molding cavity, and laser is irradiated to the table top of the molding table through the laser protection lens.
Preferably, the feeding mechanism is a feeding table positioned on one side of the forming mechanism.
Preferably, a second moving mechanism is arranged below the feeding table, and the second moving mechanism moves in a direction perpendicular to the table surface of the feeding table to drive the feeding table to move in a direction perpendicular to the table surface of the feeding table, and the moving range is from the table surface of the feeding table lower than the forming table to the table surface of the feeding table higher than the forming table.
Preferably, the feeding mechanism is a wire feeding system, and the wire feeding system comprises
The wire feeding device is positioned outside the molding cavity and used for supplying the plastic wires to the plastic wire printing head;
and the plastic wire printing head is positioned above the forming table in the forming cavity, is connected with the wire feeder pipeline, and is used for liquefying and spraying the plastic wire to the table top of the forming table.
Preferably, the material transferring mechanism is a powder spreading device.
Preferably, the feeding mechanism is a feeding table positioned on one side of the forming mechanism, and the powder spreading device is in contact with the surfaces of the feeding mechanism, the forming mechanism and the recovery mechanism.
Preferably, the powder spreading device has a cylindrical object, and the circumferential surface of the cylindrical object rolls on the surfaces of the feeding table, the forming mechanism and the recovery mechanism.
Preferably, the material transferring mechanism is a moving mechanism, and is connected with the feeding mechanism, and the moving mechanism moves to drive the feeding mechanism to move.
Preferably, the feeding mechanism comprises a metal deposition nozzle and a plastic wire printing head, the moving mechanism is connected with both the metal deposition nozzle and the plastic wire printing head, and the moving mechanism drives the metal deposition nozzle and the plastic wire printing head to move.
Preferably, the molding machine further comprises a recycling mechanism, and the material conveying mechanism conveys the redundant material in the molding mechanism to the recycling mechanism for recycling.
Preferably, the recycling mechanism is a recycling table located on one side of the forming table.
Preferably, a third moving mechanism is arranged below the recovery table, the third moving mechanism drives the recovery table to move in a direction perpendicular to the table top of the recovery table, and the moving stroke of the third moving mechanism is from the position where the table top of the recovery table is lower than that of the molding table to the position where the table top of the recovery table is equal to that of the molding table.
The present invention also provides a manufacturing method using the electronic component manufacturing apparatus as described above, including the steps of:
the control system carries out layering on the three-dimensional model of the electronic component and calculates the materials and dosage required by manufacturing each layer;
the feeding mechanism provides the material needed by each layer, and the material conveying mechanism conveys the material to the forming mechanism;
and selecting a proper solidifying device according to the property of each layer of the material to solidify and shape the material.
Preferably, the feeding mechanism is a feeding table and a metal feeding system, the solidifying device is a laser sintering device and a heating device, the forming mechanism is a forming table, and the material transferring mechanism is a powder spreading device, so that
The powder spreading device rolls from the table top of the supply table to the table top of the forming table, and the plastic on the supply table is conveyed to the table top of the forming table;
the heating device heats the forming table to melt the plastic, and the melted plastic is solidified and formed by using a laser sintering device; when a metal circuit needs to be manufactured, the control system controls the metal feeding system to convey the liquefied metal slurry to the table top of the forming table, and the heating device is used for heating, solidifying and forming the metal slurry.
Preferably, a recovery mechanism is further provided for recovering excess material from the forming table.
Preferably, the feeding mechanism comprises a wire feeding system and a metal feeding system, the forming mechanism is a forming table, the solidifying device is a heating device, and the material transferring mechanism is a moving mechanism which is connected with the wire feeding system and the metal feeding system, so that
The moving mechanism drives the wire feeding system to move above the forming table, the wire feeding system liquefies and sprays plastic required by manufacturing of the electronic assembly to the table top of the forming table and solidifies, and when a metal circuit needs to be manufactured, the control system controls the metal feeding system to spray liquefied metal slurry to the table top of the forming table and uses the heating device to heat the forming table, so that the metal slurry is heated, solidified and formed.
Preferably, a recovery mechanism is further provided for recovering excess material from the forming table.
The invention also provides a manufacturing method of the three-dimensional molding interconnection device, which is manufactured by using the manufacturing method of the electronic component, and comprises the following steps:
layering design patterns of a molded structural part in a three-dimensional molded interconnection device, and paving plastics on a forming mechanism according to layers according to a layering result of the molded structural part to form a basic plastic shell of the molded structural part;
layering design patterns of an interconnection conductive circuit in a three-dimensional molding interconnection device, and covering liquefied metal slurry on a position corresponding to the basic plastic shell according to a layering result of the interconnection conductive circuit to form the interconnection conductive circuit;
and paving plastic on the basic plastic shell and the interconnection circuit according to the layering result of the molded structural part to form a plastic covering shell, and finishing the manufacture of the molded structural part.
Compared with the prior art, the manufacturing device and the manufacturing method of the electronic component and the manufacturing method of the three-dimensional molding interconnection device, which are provided by the invention, combine the feeding mechanism, the forming mechanism and the material transfer mechanism, and form all materials on the forming mechanism under the control of the control system no matter the metal circuit or the insulating part of the electronic component is manufactured, so that the metal circuit and the insulating part can be formed into the electronic component which needs to be manufactured and formed without using a chemical structure and a complex forming process.
Drawings
FIG. 1 is a flow chart of an LDS process in the prior art;
FIG. 2 is a schematic structural diagram of an apparatus for manufacturing electronic devices according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a metal deposition showerhead according to an embodiment of the present invention;
FIG. 4 is a flowchart of a method for manufacturing an electronic device according to an embodiment of the present invention;
FIG. 5 is a schematic view illustrating a method for manufacturing an electronic device housing according to an embodiment of the invention;
FIG. 6 is a schematic diagram illustrating a metal circuit fabricated on an electronic device housing according to an embodiment of the present invention;
fig. 7 is a schematic view illustrating a metal circuit covered with an electronic device housing according to an embodiment of the invention;
fig. 8 is a schematic structural diagram of an apparatus for manufacturing an electronic device according to a second embodiment of the present invention.
In fig. 2-8: 1-feeding table, 2-forming mechanism, 21-forming table, 22-heating device, 23-forming cavity, 3-recovering mechanism, 31-recovering table, 41-plastic powder, 421-basic plastic shell, 422-plastic shell covering layer, 43-metal slurry, 44-metal circuit, 5-laser sintering device, 51-laser source, 52-vibrating mirror, 53-laser protective mirror, 6-metal feeding system, 61-metal deposition nozzle, 62-connecting rod mechanism, 63-filtering system, 64-metal slurry bearing cavity, 65-pipeline, 66-air suction pipeline, 7-powder laying device, 8-wire feeding system, 81-wire feeding device, 82-plastic wire, 83-plastic wire printing head, 22-heating device, 23-forming cavity, 3-recovering mechanism, 31-recovering table, 21-plastic powder, 421-basic plastic shell, 422-plastic shell covering layer, 43-metal slurry bearing cavity, 65, 9-movement mechanism.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
Example one
Referring to fig. 2, the present embodiment provides an apparatus for manufacturing an electronic device, which sequentially includes:
the feeding mechanism is used for providing materials required by electronic component manufacturing, specifically plastics and metals, the materials are in various forms, the metal is generally in the form of metal slurry 43, specifically a mixture of nano metal particles and organic materials, and the plastics are provided by the feeding mechanism in the form of plastic powder 41 in the embodiment;
the forming mechanism 2 provides a place for forming the material, and specifically, the forming mechanism 2 includes a forming cavity 23, a forming table 21 is arranged in the forming cavity 23, an XYZ three-dimensional coordinate system is established by taking the table surface of the forming table 21 as an XY plane and the vertical direction as a Z direction, the table surface of the forming table 21 is exposed in the forming cavity 23, and the material is formed on the table surface of the forming table 21.
Preferably, the forming table 21 is disposed on a first moving mechanism (not shown), and the first moving mechanism drives the forming table 21 to move in a direction perpendicular to the top surface of the forming table 21, i.e., in the Z direction.
In addition, in order to protect the material in the molding cavity 23 from oxidation during the molding process, inert gas flowing in the molding cavity 23 is injected as a shielding gas for protecting the material from the molding process.
The material conveying device also comprises a solidifying device for solidifying the material in the feeding mechanism;
a material transfer mechanism for transferring the material on the feeding mechanism to the forming mechanism 2;
and the control system is in circuit connection with the feeding mechanism, the forming mechanism 2, the solidifying device and the material conveying mechanism and is used for controlling the movement and parameter setting of the feeding mechanism, the forming mechanism 2, the solidifying device and the material conveying mechanism.
In this embodiment, the feeding mechanism is a metal feeding system 6 and a feeding table 1, please refer to fig. 2 again, the feeding table 1 is disposed at one side of the forming table 21, the plastic powder 41 is disposed on the feeding table 1, a second moving mechanism (not shown) is disposed below the feeding table 1, the second moving mechanism moves in a direction perpendicular to the top surface of the feeding table 1 to drive the feeding table 1 to move in a direction perpendicular to the top surface of the feeding table 1, the moving range is from the top surface of the feeding table 1 being lower than the top surface of the forming table 21 to the top surface of the feeding table 1 being higher than or equal to the top surface of the forming table 21, so that when the top surface of the feeding table 1 is lower than the top surface of the forming table 21, the plastic powder 41 is disposed on the feeding table 1, the second moving mechanism moves upward to drive the feeding table 1 to move upward until the top surface of the feeding table 1 is equal to the top surface of the forming table 21, the plastic powder 41 on the top of the supply table 1 is then transferred to the top of the forming table 21 using a transfer material mechanism.
Referring to fig. 3, the metal deposition nozzle 61 has a pipe 65 for flowing the metal paste 43 at the center thereof to deposit the metal paste 43. A plurality of independent air suction pipelines 66 are uniformly distributed on the periphery of the pipeline 65 at 360 degrees, the opening and closing of the air suction pipelines 66 are linked with the movement path of the metal deposition nozzle 61, the air suction strength is adjustable, and redundant plastic powder 41 on the metal deposition path on a workpiece can be pumped away.
In this embodiment, the feeding mechanism further includes a metal feeding system 6, please refer to fig. 2,
the metal feeding system 6 comprises
A metal paste carrying cavity 64 located outside the forming cavity 23 for containing the liquefied metal paste 43;
a filtering system 63, which is located outside the forming chamber 23 and is connected with the metal slurry bearing chamber 64 through a pipeline, and when the metal slurry bearing chamber 64 conveys the metal slurry 43 to the metal deposition nozzle 61 through the pipeline, the filtering system 63 filters the metal slurry 43 flowing in the pipeline;
a connecting rod mechanism 62 having one end connected to the filtering system 63 and the other end connected to the metal deposition nozzle 61, for delivering the metal slurry 43 filtered in the filtering system 63 to the metal deposition nozzle 61, wherein the connecting rod mechanism 62 is movable in the X-direction, the Y-direction and the Z-direction;
and the metal deposition spray head 61 is positioned in the forming cavity 23 and above the forming table 21, and is used for spraying the liquefied metal slurry 43 in the connecting rod mechanism 62 onto the table surface of the forming table 21.
The solidifying device in this embodiment includes a heating device 22 and a laser sintering device 5.
The heating device 22 is located below the forming table 21 and can heat the metal paste 43 on the forming table 21 at a temperature of 100-200 ℃, so that organic materials in the metal paste 43 are evaporated, the metal paste 43 is solidified, and the metal circuit 44 is formed on the basic plastic shell 421.
The laser sintering apparatus 5 includes:
a laser source 51 disposed outside the molding cavity 23 for providing laser light;
a galvanometer 52 arranged outside the molding cavity 23 for changing the irradiation light path of the laser provided by the laser source 51;
and the laser protective mirror 53 is used for protecting the laser source 51 and the vibration mirror 52 which are positioned outside the molding cavity 23, laser is emitted from the laser source 51, penetrates through the vibration mirror 52 and the laser protective mirror 53, irradiates the laser onto the table top of the molding table 21, heats and melts the plastic powder 41 on the table top of the molding table 21, and is solidified and molded.
In this embodiment, the material transferring mechanism is a powder spreading device 7, the powder spreading device 7 is a cylinder, the circumferential surface of the powder spreading device 7 rolls in the X direction, the powder spreading device 7 rolls on the table top of the feeding table 1 to the table top of the forming table 21, and the plastic powder 41 on the table top of the feeding table 1 is pushed to the table top of the forming table 21.
Preferably, the powder spreading device further comprises a recycling mechanism 3, specifically a recycling table 31 disposed on one side of the forming table 21, the recycling table 31 is disposed above a third moving mechanism, the third moving mechanism drives the recycling table 31 to move in a direction perpendicular to the table surface of the recycling table 31, i.e., in a Z direction, the third moving mechanism has a moving stroke from the position where the table surface of the recycling table 31 is lower than the table surface of the forming table 21 to the position where the table surface of the recycling table 31 is equal to the height of the table surface of the forming table 31, and then the powder spreading device 7 rolls from the table surface of the feeding table 1 to the table surface of the forming table 21 and then continues to roll to the table surface of the recycling table 31, so that the redundant materials on the table surface of the forming table 21 are pushed to the table surface of the recycling table 31.
Referring to fig. 4, the present invention further provides a manufacturing method using the electronic device manufacturing apparatus, including the following steps:
the control system carries out layering on the three-dimensional model of the electronic component and calculates the materials and dosage required by manufacturing each layer;
the feeding mechanism provides the material required by each layer, and the material conveying mechanism feeds the material to the forming mechanism 2;
and selecting a proper solidifying device according to the property of each layer of the material to solidify and shape the material.
The method specifically comprises the following steps:
the method comprises the following steps: the STL format file of the three-dimensional model layered slice is imported, the control system can read and convert the three-dimensional model into a star STL format file, and the star STL format file can perform layered slice on the three-dimensional model of the electronic component according to actual requirements;
step two: the control system controls the powder laying device 7 to lay the plastic powder 41 on the table top of the forming table 21 from the table top of the feeding table 1 according to the layering thickness;
step three: the laser sintering device 5 sinters the plastic powder 41 on the table top of the forming table 21 to form a basic plastic shell 421, the laser sintering device 5 carries out layered sintering on the plastic powder 41 on the table top of the forming table 21, the sintering path and the graph are consistent according to the specific layered graph of the star STL format file, and the thickness of the sintering layer can reach 0.06 mm. After each layer of sintering is completed, the forming table 21 is moved downward in the Z-direction by a distance corresponding to the thickness of the sintered layer. After the forming table 21 is moved downward in the Z direction, the plastic powder 41 is spread on the surface of the forming table 21 from the supply table 1 by the powder spreading device 7. The redundant plastic powder 41 on the table top of the forming table 21 is transferred to the table top of the recovery table 31 through the powder spreading device 7, after the recovery table 31 finishes the recovery of one layer of plastic powder 41, the plastic powder moves downwards in the Z direction, and finally the powder spreading device 7 returns to the initial position. Repeating the above steps to form a basic plastic shell 421 as shown in fig. 4;
step four: according to the layering of the "STL" format file, when it is required to fabricate the metal wiring 44 on the base plastic case 421, metal lines are deposited on the corresponding positions of the base plastic case 421 using the metal feeding system 6, and cured by heating. Specifically, referring to fig. 6, after the manufacturing of the base plastic housing 421 is completed, a metal interconnection layer is formed on the base plastic housing 421 by layering metal layers according to the "STL" format file using the metal feeding system 6. The metal feeding system 6 sprays the metal paste 43 in the metal paste bearing cavity 64 onto the base plastic shell 421, the metal paste 43 can be sprayed onto the base plastic shell 421 by the power of a thermal or acoustic ejector, or the metal paste 43 can be sprayed onto the base plastic shell 421 after being gasified by the metal paste bearing cavity 64 with the function of a gasification generator. The filtering system 63 can filter the molten metal or the gasified metal slurry 43 to ensure the uniformity of metal deposition, and the width of the metal line 44 is 5-150 um. The metal deposition showerhead 61 may be composed of a plurality of independent showerheads to improve metal deposition efficiency. After the metal layer deposition process is completed, the heating device 22 below the forming table 21 can heat the metal paste 43 on the basic plastic shell 421 of the forming table 21 at a heating temperature of 100 to 200 ℃, so that the organic material in the metal paste 43 is volatilized, the metal line 44 is cured, and the metal line 44 shown in fig. 6 is formed on the basic plastic shell 421.
Step five: according to the layering of the STL format file, plastic powder 41 is flatly paved on a forming table 21 from a feeding table 1 according to the layering thickness by a powder paving device 7; the laser sintering device 5 sinters the plastic powder 41 on the surface of the molding table 21 to form a plastic housing cover 422 as shown in fig. 7 on the base plastic housing 421 and the metal wiring 44. The plastic powder 41 is then spread flat from the top of the supply table 1 onto the top of the forming table 21 by means of the powder spreading device 7. The redundant plastic powder 41 on the table top of the forming table 21 is transferred to the table top of the recovery table 31 through the powder spreading device 7, after the recovery table 31 finishes recovering a layer of plastic powder 41, the plastic powder moves downwards in the Z direction, and finally the powder spreading device 7 rolls back to the initial position.
Step six: the above steps are repeated until each layer of the electronic component is manufactured, and the required electronic component is formed.
Example two
Referring to fig. 8, the difference between the present embodiment and the first embodiment is:
preferably, the feeding mechanism is a wire feeding system 8, and the wire feeding system 8 includes:
a wire feeder 81 located outside the molding chamber 23 for supplying a plastic wire 82 to a plastic wire print head 83;
and the plastic wire printing head 83 is positioned above the forming table 21 in the forming cavity 23 and is connected with the wire feeder 81 through a pipeline, and the plastic wire 82 conveyed by the pipeline is liquefied and sprayed on the table surface of the forming table 21 in the plastic wire printing head 83. The material transferring mechanism is a moving mechanism 9, is positioned in the molding cavity 23 and is connected with the metal deposition nozzle 61 and the plastic wire printing head 83, the moving mechanism 9 moves to drive the metal deposition nozzle 61 and the plastic wire printing head 83 to move, and a device capable of driving the moving mechanism 9 to move in the X direction and the Y direction is arranged in the moving mechanism 9.
The metal deposition nozzle 61 and the plastic filament print head 83 are both independently movable in the Z-direction.
The moving mechanism 9 drives the wire feeding system 8 to move above the forming table 21, the wire feeding system 8 liquefies the plastic wires 82 required by the electronic component manufacturing and sprays the plastic wires onto the table top of the forming table 21 for solidification, when the metal circuit 44 needs to be manufactured, the control system controls the metal feeding system 6 to spray the liquefied metal slurry 43 onto the table top of the forming table 21, and the heating device 22 is used for heating the forming table 21, so that the metal slurry 43 is heated, solidified and formed.
The manufacturing method using the electronic component manufacturing apparatus in this embodiment specifically includes:
the method comprises the following steps: the STL format file of the three-dimensional model hierarchical slice is imported, the control system can read and convert the three-dimensional model into the STL format file, and the STL format file can hierarchically slice the three-dimensional model according to actual requirements;
step two: according to the layering of the ". STL" format file, the movement mechanism 9 and the plastic filament print head 83 realize six-axis movement. Plastic housing part the plastic wire 82 is fed by the wire feeding system 8 of the plastic wire 82 to pass through the plastic wire printing head 83 to manufacture the basic plastic housing 421 on the table top of the forming table 21, after each layer is finished, the forming table 21 is lowered in Z to move by a corresponding height, and the above steps are repeated to form the basic plastic housing 421 shown in fig. 5.
Step three: according to the layering of the ". STL" format file, the moving mechanism 9 and the metal deposition nozzle 61 perform six-axis movement, deposit the metal wiring 44 on the corresponding position, and cure by heating. Specifically, after the manufacture of the base plastic case 421 is completed, the layering of the metal layers according to the ". STL" format file makes metal interconnection layers on the base plastic case 421. The metal paste 43 in the metal paste bearing cavity 64 is sprayed onto the base plastic shell 421 in a manner that the metal liquid can be sprayed onto the base plastic shell 421 by the power of a thermal or acoustic sprayer, or the metal paste 43 can be sprayed onto the base plastic shell 421 through the metal paste bearing cavity 64 with a function of a gasification generator. The filtering system 63 can filter the molten metal or the gasified metal slurry 43 to ensure the uniformity of metal deposition, the width of the metal line 44 is 5-150 um, after each layer is finished, the forming table 21 moves downwards at a corresponding height in the Z direction, after the metal layer deposition process is finished, the heating device 22 below the forming table 21 can heat the metal line 44 on the table top of the forming table 21, and the heating temperature is
The metal circuit 44 is cured at 100-200 ℃, and the metal circuit 44 as shown in fig. 6 is formed on the base plastic shell 421.
Step four: according to the layering of the "STL" format file, the movement mechanism 9 and the plastic filament print head 83 realize six-axis movement, forming the plastic housing cover 422. The plastic housing cover 422 is manufactured on the forming table 21 by the plastic wire printing head 83, and after each layer is finished, the forming table 21 is moved downward in Z by a corresponding height, and the above steps are repeated to form the plastic housing cover 422 as shown in fig. 7 on the base plastic housing 421 and the metal wires 44.
In summary, the electronic component manufacturing apparatus and the manufacturing method provided by the present invention combine the feeding mechanism, the forming mechanism 2 and the material transferring mechanism, and all the materials are formed on the forming mechanism 2 under the control of the control system, no matter the metal circuit 44 or the insulating part of the electronic component is manufactured, so that the metal circuit 44 and the insulating part can be formed into the electronic component to be manufactured without using a chemical structure and a complicated forming process.
The invention also provides a manufacturing method of the three-dimensional molding interconnection device, which is manufactured by using the manufacturing method of the electronic component, and comprises the following steps:
layering design patterns of a molded structural part in a three-dimensional molded interconnection device, and paving plastics on a forming mechanism according to layers according to a layering result of the molded structural part to form a basic plastic shell of the molded structural part;
layering design patterns of an interconnection conductive circuit in a three-dimensional molding interconnection device, and covering liquefied metal slurry on a position corresponding to the basic plastic shell according to a layering result of the interconnection conductive circuit to form the interconnection conductive circuit;
and paving plastic on the basic plastic shell and the interconnection circuit according to the layering result of the molded structural part to form a plastic covering shell, and finishing the manufacture of the molded structural part.
The above embodiments are described in the present invention, but the present invention is not limited to the above embodiments, and it is apparent that those skilled in the art can make various changes and modifications to the invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (27)
1. An electronic component manufacturing apparatus, comprising:
the feeding mechanism is used for providing materials required by manufacturing the electronic component;
the forming mechanism provides a place for forming the material;
the material in the forming mechanism is solidified and formed by a solidifying device;
the material conveying mechanism is used for conveying the material on the feeding mechanism to the forming mechanism;
the control system is in circuit connection with the feeding mechanism, the forming mechanism, the solidifying device and the material conveying mechanism and is used for controlling the movement and parameter setting of the feeding mechanism, the forming mechanism, the solidifying device and the material conveying mechanism;
the feeding mechanism comprises a metal feeding system, the metal feeding system comprises a metal deposition nozzle, a pipeline for metal slurry flow is arranged in the center of the metal deposition nozzle, a plurality of independent air suction pipelines are uniformly distributed on the periphery of the pipeline for 360 degrees, and the air suction pipelines are opened and closed and linked with the movement path of the metal deposition nozzle.
2. The electronic assembly manufacturing apparatus of claim 1 wherein a mold cavity is provided, said molding mechanism comprising a mold table, said mold table exposed within said mold cavity, said material being molded on said mold table top.
3. The electronic component manufacturing apparatus of claim 2, wherein the molding table is disposed on a first moving mechanism, and the first moving mechanism moves the molding table in a direction perpendicular to a table surface of the molding table.
4. The electronic assembly manufacturing apparatus of claim 2, wherein the feed mechanism comprises a metal feed system including a metal deposition nozzle positioned above the forming table for spraying the liquefied metal slurry onto the table top of the forming table.
5. The electronic component manufacturing apparatus of claim 4, wherein the metal feed system further comprises:
the metal slurry bearing cavity is positioned outside the forming cavity and is used for containing the liquefied metal slurry;
the filtering system is positioned outside the forming cavity and connected with the metal slurry bearing cavity pipeline and is used for filtering the metal slurry;
and one end of the connecting rod mechanism is connected with the filtering system pipeline, and the other end of the connecting rod mechanism is connected with the metal deposition nozzle pipeline and is used for conveying the metal slurry in the filtering system into the metal deposition nozzle.
6. The electronic assembly manufacturing apparatus of claim 2, wherein the solidifying means includes a heating means.
7. The electronic assembly manufacturing apparatus of claim 6, wherein the heating device is located below the molding table and the material is located on the molding table top.
8. The electronic component manufacturing apparatus of claim 2, wherein the solidifying means comprises a laser sintering device.
9. The electronic component manufacturing apparatus of claim 8, wherein the laser sintering apparatus comprises:
the laser source is arranged outside the molding cavity and used for providing laser;
and the vibrating mirror is arranged outside the molding cavity and is used for changing the irradiation light path of the laser provided by the laser source.
10. The electronic component manufacturing apparatus according to claim 9, wherein the molding chamber has a chamber wall having a laser protection lens thereon, and the laser sintering device is located outside the molding chamber and irradiates the laser to the stage surface of the molding table through the laser protection lens.
11. The electronic component manufacturing apparatus as claimed in claim 2 or 4, wherein the feeding mechanism is a supply table located at a side of the forming mechanism.
12. The electronic component manufacturing apparatus of claim 11, wherein a second moving mechanism is disposed below the supply table, the second moving mechanism moving in a direction perpendicular to the supply table surface to move the supply table in a direction perpendicular to the supply table surface, the movement ranging from the supply table surface being below the forming table surface to the supply table surface being above the forming table surface.
13. The electronic assembly manufacturing apparatus of claim 2 or 4, wherein the feed mechanism includes a wire feed system, the wire feed system including:
the wire feeding device is positioned outside the molding cavity and used for supplying the plastic wires to the plastic wire printing head;
and the plastic wire printing head is positioned above the forming table in the forming cavity, is connected with the wire feeder pipeline, and is used for liquefying and spraying the plastic wire to the table top of the forming table.
14. The electronic assembly manufacturing apparatus of claim 1, wherein the transfer material mechanism is a powder spreading device.
15. The electronic device manufacturing apparatus of claim 14, further comprising a recycling mechanism, wherein the material transfer mechanism transfers excess material from the molding mechanism to the recycling mechanism for recycling; the feeding mechanism is a feeding table positioned on one side of the forming mechanism, and the powder spreading device is in contact with the surfaces of the feeding mechanism, the forming mechanism and the recovery mechanism.
16. The electronic device manufacturing apparatus of claim 14, further comprising a recycling mechanism, wherein the material transfer mechanism transfers excess material from the molding mechanism to the recycling mechanism for recycling; the feeding mechanism is a feeding table positioned on one side of the forming mechanism, the powder spreading device is provided with a cylindrical object, and the circumferential surface of the cylindrical object rolls on the surfaces of the feeding table, the forming mechanism and the recovery mechanism.
17. The electronic assembly manufacturing apparatus of claim 1, wherein the material transfer mechanism is a motion mechanism coupled to the feeding mechanism, the motion mechanism moving the feeding mechanism.
18. The apparatus of claim 17, wherein the feed mechanism comprises a metal deposition nozzle and a plastic filament printhead, and wherein the motion mechanism is coupled to both the metal deposition nozzle and the plastic filament printhead, the motion of the motion mechanism moving the metal deposition nozzle and the plastic filament printhead.
19. The electronic component manufacturing apparatus of claim 2, further comprising a recycling mechanism, wherein the material transfer mechanism transfers excess material in the molding mechanism to the recycling mechanism for recycling.
20. The electronic device manufacturing apparatus of claim 19, wherein the recycling mechanism is a recycling station located on a side of the forming station.
21. The electronic component manufacturing apparatus according to claim 20, wherein a third moving mechanism is disposed below the recycling table, the third moving mechanism moves the recycling table in a direction perpendicular to the top surface of the recycling table, and the third moving mechanism has a moving stroke from a position where the top surface of the recycling table is lower than the top surface of the molding table to a position where the top surface of the recycling table is equal to the top surface of the molding table.
22. A manufacturing method using the electronic component manufacturing apparatus according to claim 1, comprising the steps of:
the control system carries out layering on the three-dimensional model of the electronic component and calculates the materials and dosage required by manufacturing each layer;
the feeding mechanism provides the material needed by each layer, and the material conveying mechanism conveys the material to the forming mechanism;
selecting a proper solidifying device according to the property of each layer of material to solidify and shape the material;
the feeding mechanism comprises a metal feeding system, the metal feeding system comprises a metal deposition nozzle, wherein a pipeline for metal slurry flow is arranged at the center of the metal deposition nozzle, a plurality of independent air suction pipelines are uniformly distributed on the periphery of the pipeline for 360 degrees, and the air suction pipelines are opened and closed and linked with the movement path of the metal deposition nozzle.
23. The manufacturing method of claim 22, wherein the feeding mechanism is a feeding table and a metal feeding system, the solidifying device is a laser sintering device and a heating device, the forming mechanism is a forming table, and the material transferring mechanism is a powder spreading device, then:
the powder spreading device rolls from the table top of the feeding table to the table top of the forming table, and the plastic on the feeding table is conveyed to the table top of the forming table;
the heating device heats the forming table to melt the plastic, and the melted plastic is solidified and formed by using a laser sintering device; when a metal circuit needs to be manufactured, the control system controls the metal feeding system to convey the liquefied metal slurry to the table top of the forming table, and the heating device is used for heating, solidifying and forming the metal slurry.
24. The method of claim 23, further comprising providing a recovery mechanism to recover excess material from the forming table.
25. The method of claim 22, wherein the feeding mechanism comprises a wire feeding system and a metal feeding system, the forming mechanism is a forming table, the solidifying device is a heating device, the transfer material mechanism is a moving mechanism coupled to both the wire feeding system and the metal feeding system, such that:
the moving mechanism drives the wire feeding system to move above the forming table, the wire feeding system liquefies and sprays plastic required by manufacturing of the electronic assembly to the table top of the forming table and solidifies, and when a metal circuit needs to be manufactured, the control system controls the metal feeding system to spray liquefied metal slurry to the table top of the forming table and uses the heating device to heat the forming table, so that the metal slurry is heated, solidified and formed.
26. The method of claim 25, further comprising providing a recovery mechanism to recover excess material from the forming table.
27. A method of manufacturing a three-dimensional molded interconnect device, comprising the method of manufacturing of claim 22, comprising the steps of:
layering design patterns of a molded structural part in a three-dimensional molded interconnection device, and paving plastics on a forming mechanism according to layers according to a layering result of the molded structural part to form a basic plastic shell of the molded structural part;
layering design patterns of an interconnection conductive circuit in a three-dimensional molding interconnection device, and covering liquefied metal slurry on a position corresponding to the basic plastic shell according to a layering result of the interconnection conductive circuit to form the interconnection conductive circuit;
and paving plastic on the basic plastic shell and the interconnection circuit according to the layering result of the molded structural part to form a plastic covering shell, and finishing the manufacture of the molded structural part.
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| US8419996B2 (en) * | 2010-12-22 | 2013-04-16 | Stratasys, Inc. | Print head assembly for use in fused deposition modeling system |
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| CN103341625A (en) * | 2013-07-10 | 2013-10-09 | 湖南航天工业总公司 | 3D printing manufacturing device and method of metal parts |
| CN104708809A (en) * | 2013-12-12 | 2015-06-17 | 三纬国际立体列印科技股份有限公司 | Three-dimensional printing device |
| CN204018721U (en) * | 2014-07-09 | 2014-12-17 | 山东科技大学 | A kind of laser sintering metallic powder three-dimensional printer |
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