CN108008500A - A kind of wide temperature low-power consumption integrates light emission component - Google Patents
A kind of wide temperature low-power consumption integrates light emission component Download PDFInfo
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- CN108008500A CN108008500A CN201711429530.8A CN201711429530A CN108008500A CN 108008500 A CN108008500 A CN 108008500A CN 201711429530 A CN201711429530 A CN 201711429530A CN 108008500 A CN108008500 A CN 108008500A
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- layer
- huyashi
- chuuka
- style noodles
- cold chinese
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of wide temperature low-power consumption to integrate light emission component, it is characterised in that：Including heat-sensitive element, TEC (8), shell, pin is provided with the shell；The TEC (8) includes the second layer huyashi-chuuka (cold chinese-style noodles) (16) being from top to bottom arranged in order, second layer semiconductor refrigerating element (17), first layer huyashi-chuuka (cold chinese-style noodles) (18), first layer semiconductor refrigerating element (19), the double-deck refrigerator unit of the hot faces of TEC (20) composition, the heat-sensitive element is fixed on the second layer huyashi-chuuka (cold chinese-style noodles) (16) of TEC (8), insulator is provided with the first layer huyashi-chuuka (cold chinese-style noodles) (18), the insulator respectively with second layer huyashi-chuuka (cold chinese-style noodles) (16), pin connects, first layer semiconductor refrigerating element (19) is connected by electrode with second layer semiconductor refrigerating element (17)；Apparatus of the present invention use bilayer TEC structures, and relatively existing similar device encapsulation structure, cooling and warming is more efficient in unit area, and power consumption is lower, can be operated in broader temperature range.
Description
Technical field
- 40 DEG C~85 DEG C light emission components with thermoelectric cooling can be operated in the present invention relates to a kind of, are mainly used in
In 100G optical modules, the invention belongs to communicate and optoelectronic areas.
Background technology
As 4G enters scale commercial stage, the 5th following third-generation mobile communication (5G) becomes global development hot spot.From
The main application scenarios of following mobile Internet and Internet of Things, business demand and challenge are set out, and the major technique scene of 5G has four big
Feature：Continuous wide area covering, hot spot high power capacity, the big connection of low-power consumption and low time delay are highly reliable.The wherein big connection scene of low-power consumption
Be mainly directed towards smart city, environmental monitoring, reading intelligent agriculture, forest fire protection etc. using sense and data acquisition as target applied field
Scape, has the characteristics that small data packets, low-power consumption, magnanimity connection.This Terminal Type has a very wide distribution, is large number of, does not require nothing more than net
Network possesses the tenability for surpassing hundred billion connections, meets 100G connection number density index requests, but also to ensure the ultralow of terminal
Power consumption and Ultra Low Cost, under this overall situation, the emitting module to meeting wide warm (- 40 DEG C~85 DEG C) has substantial amounts of market
Demand.
Under conditions of the prior art, the application environment for integrating EML light emission components is mainly -5 DEG C~70 DEG C, as Fig. 1,
Fig. 2, it is impossible to meet the job requirement under harsh temperature conditions.Cause in the main reason for wide temperature work to have：By gold
The passive heat that silk heat transfer is brought carries too big；Multiple material solders or it is gluing be connected together, thermal resistance is larger, causes operating temperature
It is limited；TEC unit area refrigerating efficiencies are limited so that device can not work under the conditions of wide warm (- 40 DEG C~85 DEG C).It is comprehensive
On, it is a kind of can meet wide temperature low-power consumption integrate light emission component application prospect it is quite varied.
The content of the invention
The technical problems to be solved by the invention are to overcome the shortcomings of present technology, there is provided a kind of wide temperature low-power consumption Integrated Light
Emitting module.
A kind of wide temperature low-power consumption integrates light emission component, including heat-sensitive element, TEC, shell, is provided with the shell
Pin；The TEC include from top to bottom be arranged in order second layer huyashi-chuuka (cold chinese-style noodles), second layer semiconductor refrigerating element, first layer huyashi-chuuka (cold chinese-style noodles),
The double-deck refrigerator unit of first layer semiconductor refrigerating element, TEC hot face composition, the heat-sensitive element are fixed on the of TEC
On two layers of huyashi-chuuka (cold chinese-style noodles), insulator is provided with the first layer huyashi-chuuka (cold chinese-style noodles), which is connected with second layer huyashi-chuuka (cold chinese-style noodles), pin respectively, the
Layer of semiconductor cooling module is connected by electrode with second layer semiconductor refrigerating element.
Further comprise collimating optics unit, multiplex component, shell, output unit, heat-sensitive element, back light detector,
Semiconductor laser chip, thermistor, the back light detector, semiconductor laser chip, thermistor are fixed on TEC's
On second layer huyashi-chuuka (cold chinese-style noodles), the transmitting light of the semiconductor laser chip is transmitted to multiplex component by optical alignment unit.
The insulator uses heat-insulating cushion block, and heat-insulating cushion block is arranged on second layer huyashi-chuuka (cold chinese-style noodles).
The back light detector, semiconductor laser chip, thermistor are fixed on second layer huyashi-chuuka (cold chinese-style noodles), second layer huyashi-chuuka (cold chinese-style noodles)
One end is connected to shell, and the other end is connected in transition block.
The semiconductor laser chip is installed in transition block, and transition block is fixed with second layer huyashi-chuuka (cold chinese-style noodles).
The heat-insulating cushion block is using the low material of thermal conductivity factor.
The optical alignment unit is arranged on the first layer huyashi-chuuka (cold chinese-style noodles) of TEC.
Further comprise optoisolator, convergence optical module, contact pin component, tube cover, the multiplex optical element is fixed on
Tube shell bottom, isolator are fixed on the optical window of shell；Converges optical element is fixed on shell, and contact pin component is fixed on convergence
On optical element.
The shell uses the shell with high-frequency transmission cable architecture, and housing use can cut down material, and tube shell bottom uses tungsten
Copper, is provided with sapphire seal optical window on shell.
The second layer huyashi-chuuka (cold chinese-style noodles) uses AL2O3Or ALN, the huyashi-chuuka (cold chinese-style noodles) are provided with layout.
Apparatus of the present invention have the following advantages that：
1) present invention accurately controls the operating temperature of whole active chip, and it is -40 DEG C~85 DEG C wide to be operated in it
In warm scope；
2) apparatus of the present invention use bilayer TEC structures, relatively existing similar device encapsulation structure, refrigerated medium in unit area
Thermal efficiency higher, power consumption is lower, can be operated in broader temperature range；
3) present invention uses bilayer TEC structures, reduces the metal heat sink for height control and heat conduction, reduces device
Assembling element, technique is simpler.
4) the passive heat of the structure of the whole component of apparatus of the present invention is carried to compare with traditional structure and declined to a great extent；, thermal resistance is with passing
System structure, which is compared, to be greatly reduced.
5) device integration is higher, and the effect that apparatus of the present invention reduce power consumption is more obvious.
6) present invention employs for heat-insulated transition block, reduce the passive heat that spun gold conduction band is come and carry.
Brief description of the drawings
Fig. 1 is that a kind of parts transversely of the optical device internal structure heat sink with individual layer TEC and individual layer of the prior art cuts open
View；
Fig. 2 is that a kind of parts transversely with bilayer TEC and double-deck heat sink optical device internal structure of the prior art cuts open
View；
Fig. 3 is that the present invention is a kind of to be cutd open with bilayer TEC and the transverse direction without the optical device overall package structure of tungsten copper heat-sink
View；
Fig. 4 is that the present invention is a kind of to be cutd open with bilayer TEC and the longitudinal direction without the optical device overall package structure of tungsten copper heat-sink
View；
Fig. 5 is a kind of horizontal section view with bilayer TEC and the optical device overall package structure with tungsten copper heat-sink of the present invention
Figure；
Fig. 6 is a kind of longitudinal section view with bilayer TEC and the optical device overall package structure with tungsten copper heat-sink of the present invention
Figure；
Fig. 7 is the double-deck TEC structures that the present invention uses；
Fig. 8 is prior art individual layer TEC structures；
Wherein：
1st, heat-insulating cushion block；2nd, tungsten copper heat-sink；
3rd, thermistor；4th, back light detector；
5th, semiconductor laser chip；6th, transition block；
7th, collimating optics unit；8th, refrigerator；
9th, multiplex component；10th, optoisolator；
11st, optical module is converged；12nd, contact pin component；
13rd, shell；14th, tube cover；
15th, metal heat sink；16th, second layer huyashi-chuuka (cold chinese-style noodles)；
17th, second layer semiconductor refrigerating element；18th, first layer huyashi-chuuka (cold chinese-style noodles)；
19th, first layer semiconductor refrigerating element；20th, the hot faces of TEC；
Embodiment
Elaborate with reference to example and attached drawing to the device encapsulation principle encapsulating structure of the present invention.
Apparatus of the present invention are needed comprising the functional unit for possessing following cores：Double-deck refrigerator temperature conditioning unit, the refrigerator
First layer and the second layer have temperature difference.The second layer huyashi-chuuka (cold chinese-style noodles) of refrigerator uses aluminium oxide ceramics or aluminium nitride ceramics, directly upper
The huyashi-chuuka (cold chinese-style noodles) layout of layer refrigerator, chip placement and high-frequency circuit, or placement surface have mounted chip, back light detector and table
ALN transition block of the bread containing high-frequency circuit, to reduce the metal heat sink for matched and heat conduction；In second layer refrigerator
A heat-insulating cushion block with heat insulating function is added on huyashi-chuuka (cold chinese-style noodles), is carried for reducing the passive heat that spun gold heat transfer is brought；This knot
Structure reduces metal heat sink, reduces the thermal capacitance and thermal resistance of component, and reduces passive heat load caused by spun gold heat transfer.Double-deck TEC
Temperature conditioning unit make it that the amount of crystals that heat is carried that is used for of TEC in effective area is increased, and component is had the work of bigger
The reduction that temperature difference, thermal capacitance thermal resistance and passive heat carry also reduces the power consumption of black box.
Embodiment one：If Fig. 3, Fig. 4, Fig. 5, Fig. 6 are the sectional views of the optical device overall package of the present invention.As Fig. 3, Fig. 4,
Shown in Fig. 5, Fig. 6, in apparatus of the present invention structure, including heat-insulating cushion block 1, tungsten copper heat-sink 2, thermistor 3, back light detector 4, half
Conductor laser chip 5, transition block 6, collimating optics unit 7, refrigerator 8 (TEC), multiplex component 9, optoisolator 10, convergence
Optical module 11, contact pin component 12, shell 13, tube cover 14, shell 13 refer to the shell with high-frequency transmission cable architecture, and housing is adopted
With that can cut down material, tube shell bottom is tungsten copper, and transmission line structure forms for multilayer high-temperature co-fired-ceramic, and shell includes sapphire seal
Optical window；The mode that tube cover 14 is welded with thermal resistance is fixed on shell 13, plays sealing effect.Refrigerator 8 is to use double-decker
Refrigerator, the refrigerator include double-deck refrigerator second layer huyashi-chuuka (cold chinese-style noodles) 16, second layer semiconductor refrigerating element 17, first layer huyashi-chuuka (cold chinese-style noodles)
18th, the hot face 20 of first layer semiconductor refrigerating element 19, TEC.The refrigerator is fixed on shell 13 by solder or epoxy glue, this
Invention device makes double-deck TEC in first layer huyashi-chuuka (cold chinese-style noodles) 18 and bilayer TEC second layers huyashi-chuuka (cold chinese-style noodles) 16 by adaptively producing one by design
Fixed temperature difference, by adjusting the quantity of the second semiconductor refrigerating element 17 and the first semiconductor refrigerating element 19, can adjust TEC
Second layer huyashi-chuuka (cold chinese-style noodles) 16 and first layer huyashi-chuuka (cold chinese-style noodles) 18 temperature difference.The double-deck TEC structures that the present invention uses are as shown in Figure 7.The temperature
Difference is related with two layers of semiconductor refrigerating element quantity of refrigerator and area, change the quantity of two layers of semiconductor refrigerating element up and down and
Area, can effectively change the temperature difference of first layer huyashi-chuuka (cold chinese-style noodles) and second layer huyashi-chuuka (cold chinese-style noodles).Back light detector 4, semiconductor laser chip 5,
Thermistor 3 is fixed on the second layer huyashi-chuuka (cold chinese-style noodles) 16 of TEC8 by solder or epoxy glue, or is first fixed with solder or epoxy glue
Onto transition heat sink 2, on by the second layer huyashi-chuuka (cold chinese-style noodles) 16 of solder or epoxy glue fixed to TEC8；Heat-insulating cushion block 1 be have every
The cushion block of thermal effect, the cushion block use the material with heat insulation to be made, high-frequency transmission cable architecture are included on the cushion block, with pipe
Core forms high-frequency circuit circuit together.1 one end of heat-insulating cushion block is connected to shell 13 by spun gold, and another section is connected to by spun gold
On the second layer huyashi-chuuka (cold chinese-style noodles) 16 of refrigerator 8 or on the tungsten copper heat-sink 2 that is connected on first layer huyashi-chuuka (cold chinese-style noodles) 18；Optical alignment unit 7 is placed
On the first layer huyashi-chuuka (cold chinese-style noodles) 18 of refrigerator 8；Multiplex optical element 9 is fixed on 13 bottom of shell.Isolator 10 is fixed on shell 13
Seal on optical window；Converges optical element 11 is fixed on shell 13, and contact pin component 12 is fixed in converges optical element 11.This reality
Applying semiconductor laser chip 5 in example can also be installed in transition block 6, and transition block 6 is fixed with second layer huyashi-chuuka (cold chinese-style noodles) 16.
Heat-insulating cushion block 1 is the cushion block of the relatively low material of thermal conductivity factor in Fig. 4, has high-frequency circuit on the cushion block, is assembled to refrigeration
On the first layer huyashi-chuuka (cold chinese-style noodles) 18 of device 8, the heat-insulating cushion block is using the relatively low material of thermal conductivity factor, it is therefore an objective to prevents heat the from TEC
One huyashi-chuuka (cold chinese-style noodles) 18 is transmitted to the surface of transition block 6 or the surface of tungsten copper heat-sink 2 by spun gold, increases passive heat and carries.The heat-insulating cushion block
One end is connected by spun gold with shell, and the other end is connected with TEC second layers huyashi-chuuka (cold chinese-style noodles) 16.In this structure, in the high situation of environment temperature
Under, spun gold is the good conductor of heat, and the heat on shell 13 is transmitted to TEC surfaces and causes passive heat to carry, effectively reduced by spun gold
The temperature difference at spun gold both ends, can effectively reduce hot load, and in this structure, heat-insulating cushion block 1 is placed on the second layer huyashi-chuuka (cold chinese-style noodles) of TEC,
Second layer temperature is higher than first layer, compares with common individual layer TEC structures, effectively reduces the temperature difference at spun gold both ends, effectively
Reduce device it is passive heat carry.This adaptive structure make up and down two layers TEC surface produce temperature difference, lower floor TEC is upper warm
Degree is higher than upper strata.In this structure, with traditional devices compared to metal heat sink 15 is reduced, reduce thermal resistance, reaching reduces power consumption
Effect.Collimating optics unit 7 is placed on the first layer huyashi-chuuka (cold chinese-style noodles) 18 of refrigerator 8, is compared with traditional structure, apparatus of the present invention
The effect of greatly reducing thermal capacitance, effectively reducing device.
Embodiment two：
In the embodiment of the present invention, back light detector 4, semiconductor laser chip 5 pass through a system of being installed to of tungsten copper heat-sink 2
On the first layer huyashi-chuuka (cold chinese-style noodles) 18 of cooler 8, the heat that semiconductor laser chip 5 is sent when working is directly by upper strata TEC pumps to lower floor TEC
On.
The present invention utilizes bilayer TEC structures, by chip of laser or is mounted with chip of laser and the ALN of back light detector
Transition block is directly placed on first layer TEC, is compared with traditional encapsulating structure, the advantage of the invention is that：Firstth, is utilized
One layer and second layer TEC of difference in height, directly eliminates the metal tungsten copper heat sink component for height control and heat conduction, reduces
The element of laser assembly, eliminates the assembly technology of the element, is conducive to improve the producing efficiency of component, decreases at the same time
The thermal capacitance and thermal resistance of component, substantially reduce the power consumption of component.Secondth, present invention utilization bilayer TEC encapsulating structures, are incited somebody to action or other have
The transition block for having the material of heat insulation is assemblied in the second layer of TEC, because TEC first layers and the second layer have temperature self-adaptation work(
Can, the temperature of the second Rotating fields of TEC is higher than first layer, which is connected to shell by spun gold one end, and the other end is connected to TEC
The chip of first Rotating fields or the transition block of chip.Spun gold is the good conductor of heat, because TEC second layers structure temperature is higher than the
One layer, compared with traditional handicraft, such as the individual layer TEC structures of Fig. 8.This structure is greatly reduced due to caused by spun gold heat conduction
Passive heat carries, and substantially reduces the overall power of component.The higher device of integrated level, the effect for reducing power consumption are more obvious.
Although the present invention detailed example and has described relevant specific embodiment and has made reference, to the technology of this area
It is particularly above-mentioned in the thought without departing substantially from the present invention and scope after the specification and drawings are read and understood for personnel
Device is implemented functionally, to be variously modified on device form and details.These changes fall within the present invention's
Protection domain required by claim.
Claims (10)
1. a kind of wide temperature low-power consumption integrates light emission component, it is characterised in that：Including heat-sensitive element, refrigerator (8), shell,
Pin is provided with the shell；The refrigerator (8) includes second layer huyashi-chuuka (cold chinese-style noodles) (16), the second layer being from top to bottom arranged in order
Semiconductor refrigerating element (17), first layer huyashi-chuuka (cold chinese-style noodles) (18), first layer semiconductor refrigerating element (19), the hot faces of TEC (20) form
Double-deck refrigerator unit, the heat-sensitive element are fixed on the second layer huyashi-chuuka (cold chinese-style noodles) (16) of refrigerator (8), the first layer huyashi-chuuka (cold chinese-style noodles)
(18) insulator is provided with, which is connected with second layer huyashi-chuuka (cold chinese-style noodles) (16), pin respectively, first layer semiconductor refrigerating element
(19) it is connected by electrode with second layer semiconductor refrigerating element (17).
2. a kind of wide temperature low-power consumption according to claim 1 integrates light emission component, it is characterised in that：Further comprise standard
Straight optical unit (7), multiplex component (9), shell (13), output unit, heat-sensitive element, back light detector (4), semiconductor swash
Light device chip (5), thermistor (3), the back light detector (4), semiconductor laser chip (5), thermistor (3) are fixed
In on the second layer huyashi-chuuka (cold chinese-style noodles) (16) of TEC (8), the transmitting light of the semiconductor laser chip (5) passes through optical alignment unit (7)
It is transmitted to multiplex component (9).
3. a kind of wide temperature low-power consumption according to claim 2 integrates light emission component, it is characterised in that：The insulator is adopted
With heat-insulating cushion block (1), heat-insulating cushion block (1) is arranged on second layer huyashi-chuuka (cold chinese-style noodles) (16).
4. a kind of wide temperature low-power consumption according to claim 2 or claim 3 integrates light emission component, it is characterised in that：
The back light detector (4), semiconductor laser chip (5), thermistor (3) are fixed on second layer huyashi-chuuka (cold chinese-style noodles) (16), and second
Layer huyashi-chuuka (cold chinese-style noodles) (16) one end is connected to shell (13), and the other end is connected in transition block (6).
5. a kind of wide temperature low-power consumption according to claim 4 integrates light emission component, it is characterised in that：The semiconductor swashs
Light device chip (5) is installed in transition block (6), and transition block (6) is fixed with second layer huyashi-chuuka (cold chinese-style noodles) (16).
6. a kind of wide temperature low-power consumption according to claim 3 integrates light emission component, it is characterised in that：The heat-insulating cushion block
(1) using the low material of thermal conductivity factor.
7. a kind of wide temperature low-power consumption according to claim 2 or claim 3 integrates light emission component, it is characterised in that：
The optical alignment unit (7) is arranged on the first layer huyashi-chuuka (cold chinese-style noodles) (18) of refrigerator (8).
8. a kind of wide temperature low-power consumption according to claim 2 integrates light emission component, it is characterised in that：Further comprise light
Isolator (10), convergence optical module (11), contact pin component (12), tube cover (14), the multiplex optical element (9) are fixed on pipe
Shell (13) bottom, isolator (10) are fixed on the optical window of shell (13)；Converges optical element (11) is fixed on shell (13),
Contact pin component (12) is fixed in converges optical element (11).
9. a kind of wide temperature low-power consumption according to claim 8 integrates light emission component, it is characterised in that：The shell (13)
Using the shell with high-frequency transmission cable architecture, housing use can cut down material, and tube shell bottom uses tungsten copper, indigo plant is provided with shell
Jewel seals optical window.
10. a kind of wide temperature low-power consumption according to claim 2 integrates light emission component, it is characterised in that：The second layer
Huyashi-chuuka (cold chinese-style noodles) (16) uses AL2O3Or ALN, the huyashi-chuuka (cold chinese-style noodles) are provided with layout.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/118665 WO2019127025A1 (en) | 2017-12-26 | 2017-12-26 | Integrated light-emitting assembly with wide temperature range and low power consumption |
| CN201711429530.8A CN108008500B (en) | 2017-12-26 | 2017-12-26 | A kind of integrated light emission component of wide temperature low-power consumption |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711429530.8A CN108008500B (en) | 2017-12-26 | 2017-12-26 | A kind of integrated light emission component of wide temperature low-power consumption |
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| Publication Number | Publication Date |
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| CN108008500A true CN108008500A (en) | 2018-05-08 |
| CN108008500B CN108008500B (en) | 2019-09-10 |
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| CN201711429530.8A Active CN108008500B (en) | 2017-12-26 | 2017-12-26 | A kind of integrated light emission component of wide temperature low-power consumption |
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| WO (1) | WO2019127025A1 (en) |
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| CN108614332A (en) * | 2018-07-24 | 2018-10-02 | 大连优迅科技有限公司 | A kind of multichannel light high-speed transmission sending device |
| CN108957645A (en) * | 2018-07-06 | 2018-12-07 | 江苏奥雷光电有限公司 | A kind of single mode parallel optical module |
| CN109586797A (en) * | 2018-11-16 | 2019-04-05 | 武汉电信器件有限公司 | A kind of laser emitting module and corresponding optical module |
| WO2020042484A1 (en) * | 2018-08-28 | 2020-03-05 | 武汉电信器件有限公司 | Dual-carrier integrated optical device and photoelectric module |
| CN111610603A (en) * | 2019-02-26 | 2020-09-01 | 晶连股份有限公司 | Improved structure of light emission sub-module |
| CN111708131A (en) * | 2020-06-22 | 2020-09-25 | 武汉光迅科技股份有限公司 | Light emitting module and optical module |
| WO2021031330A1 (en) * | 2019-08-20 | 2021-02-25 | 武汉联特科技有限公司 | Multi-channel parallel emission optical device and thermoelectric cooler |
| CN113219600A (en) * | 2021-04-20 | 2021-08-06 | 武汉光迅科技股份有限公司 | Optical transmitter sub-module |
| CN114783711A (en) * | 2022-04-20 | 2022-07-22 | 中国电子科技集团公司第三十八研究所 | Method for manufacturing resistor on surface of aluminum nitride high-temperature co-fired ceramic substrate |
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