CN108004434B - A kind of LEDbulb lamp - Google Patents
A kind of LEDbulb lamp Download PDFInfo
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- CN108004434B CN108004434B CN201711232399.6A CN201711232399A CN108004434B CN 108004434 B CN108004434 B CN 108004434B CN 201711232399 A CN201711232399 A CN 201711232399A CN 108004434 B CN108004434 B CN 108004434B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/12—Alloys based on aluminium with copper as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0084—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ carbon or graphite as the main non-metallic constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
- C22F1/057—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with copper as the next major constituent
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/66—Details of globes or covers forming part of the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Abstract
The invention belongs to light emitting device technologies fields, and in particular to a kind of LEDbulb lamp.The shell of the LEDbulb lamp is made of aluminum alloy materials, the ingredient and its weight percent of the aluminum alloy materials are as follows: Be:1.0-3.0%, Cu:0.5-1.8%, porous graphite: 0.08-0.58%, nanometer silicon carbide: 0.2-1.0%, surplus Al.
Description
Technical field
The invention belongs to light emitting device technologies fields, and in particular to a kind of LEDbulb lamp.
Background technique
LED is as a kind of new type light source, since with energy-saving and environmental protection, the service life is long, starting speed is fast, can control luminous light
It composes and the size with width is forbidden to make the unrivaled advantage of the more high conventional light source of chroma and developed on an unprecedented scale.It is high-power
LED solid-state lighting has been the most important illumination revolution since incandescent lamp invention.Semiconductor LED material can directly convert electric energy
For luminous energy, have with the maximum difference of conventional illumination sources, luminous efficiency is high, and energy consumption is only ordinary incandescent lamp 1/8th；Longevity
Life length；No stroboscopic, without infrared and ultraviolet radioactive and without mercury element etc., be typical energy conservation, environmentally protective illumination.
Along with the increase of LED current intensity and luminous quantity, the calorific value of LED chip is also risen with it, defeated for LED
Enter the energy 70% is all consumed in the form of heat.If the external world cannot be discharged in these heats in time, the temperature rise of chip is caused to imitate
It answers, the service life of LED and light output can all have a greatly reduced quality；With technological progress and the continuous expansion of market scale, the function of single LED
Rate density and luminous efficiency are being continuously improved, and to LED encapsulation material and technique, higher requirements are also raised.
LED light shell is not only to cover on lamp for the effect for making light flock together, and can also prevent from getting an electric shock, to protection
Eyes also have effect, so can have lamp housing on each lamp.Now many industrial lighting LED lamps be applied to military affairs, space flight and aviation,
The fields such as metallurgy, mining, the mostly of use are the corrosion-resistant high-strength materials such as aluminium alloy.Aluminum shell is easy heat dissipation, exquisite appearance, weight
Amount is light and handy, and many high-end electronic products all use aluminium shell.Such as the apple laptop of Apple Inc. " MacPro " is high
It holds computer series of products to use full aluminium shell, is easy to laptop radiating, such computer even connects fan without dress；
LED can increase the service life of wick using aluminum shell, and LED light is made to seem beautiful.But the thermal expansion coefficient of common aluminum alloy with
LED chip is widely different, when temperature change is very big or packaging operation does not generate heat skew, initiation chip flaw and hair easily at that time
Light efficiency reduces.Since LED luminance increases with the increase of driving current, to the LED of more high brightness, common aluminum alloy shell is
It is unable to satisfy its cooling requirements；Therefore it needs to develop new LED light shell, improves the radiating rate of lamp.
Summary of the invention
The present invention for existing LEDbulb lamp lamp housing there are the shortcomings that, provide it is a kind of it is high heat dissipation, strong mechanical performance aluminium close
Gold production LED light shell, meets the radiating requirements of LED light.
Above-mentioned purpose of the invention can be realized by the following technical scheme: a kind of LEDbulb lamp, the LEDbulb lamp
Shell be made of aluminum alloy materials, the ingredient and its weight percent of the aluminum alloy materials are as follows: Be:1.0-3.0%, Cu:
0.5-1.8%, porous graphite: 0.08-0.58%, nanometer silicon carbide: 0.2-1.0%, surplus Al.
Preferably, the ingredient and its weight percent of the aluminum alloy materials are as follows: Be:1.5-2.3%, Cu:1.0-
1.2%, porous graphite: 0.18-0.32%, nanometer silicon carbide: 0.3-0.5%, surplus Al.
Beryllium element and copper have high heat conductance, and after a small amount of beryllium and copper are added in Al, the thermal conductivity of aluminium alloy is big
Amplitude improves, and the radiating rate as LED light shell also greatly improves.Although the thermal conductivity of beryllium and copper is high, its content is needed
It wants strict control, excessive beryllium and copper to improve the radiating rate of aluminium alloy unhelpful, can also reduce the mechanical property of aluminium alloy.It is more
Hole graphite dispersion is in aluminum alloy materials, and graphite is because the unique crystal grain orientation of its carbon atom is so that material both direction along plane
With very strong thermal conductivity, the heat transfer of material can be realized by the lattice vibration of carbon atom, to improve dissipating for aluminium alloy
It is hot, while porous graphite, the hole of formation, the electronics be conducive in metal move freely, the electronics of high-temperature region carries heat
Amount is moved to low-temperature space, realizes the transfer of heat.Nanometer silicon carbide is highly dispersed in aluminium alloy, improves the mechanical property of material
And thermal diffusivity.
Preferably, the aperture of the porous graphite is 0.5-10nm, specific surface area 500-1000m2/g.Porous graphite
Aperture need it is small and fine and close.
Preferably, the partial size of the nanometer silicon carbide is 50-200nm.
Preferably, the preparation method of the aluminum alloy materials is the following steps are included: weigh raw material mixing by composition proportion
Uniformly, the heating and melting at 700-800 DEG C, slab of casting to obtain, in high-temperature vacuum furnace, slab is heated with the speed of >=20 DEG C/s
To 900-1100 DEG C, it then is heated to 1500-1800 DEG C with the speed of 0.1-0.5 DEG C/s, 45-90min is kept the temperature, is returned after cooling
Fire.
Be, Cu, porous graphite, nanometer silicon carbide and Al heating melting of the present invention, cast after slab, carry out at solid solution
Reason is first heated to 900-1100 DEG C with the speed of >=20 DEG C/s, at this time dissolving metal, then will be warm by the way of slowly heating up
Degree is increased to 1500-1800 DEG C, is formed in raw metal and metal structure because the fusing point of nanometer silicon carbide will be significantly larger than
Hardening constituent, when hardening constituent is dissolved, nanometer silicon carbide still exists in granular form, alloy can be induced respectively to organize raw along particle
It is long, because of nanometer silicon carbide high degree of dispersion in the alloy, so that each mutually homoepitaxial in the alloy, and growing up for crystal grain is hindered, carefully
Change crystal grain.
Preferably, the tempering are as follows: be heated to 250-400 DEG C of heat preservation tempering 2-5h.
Preferably, when being heated to 250-400 DEG C, with the ultrasonication 30-60min of 500-1000w.When tempering, into
On the one hand row ultrasonication, ultrasonication can refine crystal grain, improve toughness of material, and on the other hand, ultrasound is because of its uniqueness
Effect, after being processed, the metal electron degree of being bound of aluminum alloy organization is reduced, and forms more free electrons, heat dissipation performance
It is largely increased.
Compared with prior art, the present invention for LEDbulb lamp shell aluminium alloy contain Be, Cu, porous graphite and
Nanometer silicon carbide ingredient interacts between each ingredient, improves heat dissipation performance, and pass through slow heating solution treatment, nano-sized carbon
SiClx induction hardening constituent is evenly distributed, and further increases the mechanical property and thermal diffusivity of aluminum alloy materials.
Specific embodiment
The following is specific embodiments of the present invention, and technical scheme of the present invention will be further described, but the present invention is simultaneously
It is not limited to these embodiments.If raw material employed in the embodiment of the present invention is commonly used in the art without specified otherwise
Raw material, method employed in embodiment, is the conventional method of this field.
Embodiment 1
The ingredient and its weight percent of the present embodiment aluminum alloy materials are as follows: Be:1.0%, Cu:1.5%, porous graphite:
0.12%, nanometer silicon carbide: 0.6%, surplus Al.Wherein the aperture of porous graphite is 40nm, specific surface area 2000m2/ g,
The partial size of nanometer silicon carbide is 300nm.
It weighs raw material by mentioned component proportion to be uniformly mixed, the heating and melting at 750 DEG C, slab of casting to obtain, in vacuum height
In warm furnace, slab is heated to 1000 DEG C with the speed of 30 DEG C/s, is then heated to 1600 DEG C with the speed of 0.2 DEG C/s, heat preservation
60min is heated to 300 DEG C of heat preservation tempering 3h, obtains aluminum alloy materials after cooling.
Embodiment 2
The ingredient and its weight percent of the present embodiment aluminum alloy materials are as follows: Be:1.0%, Cu:1.5%, porous graphite:
0.12%, nanometer silicon carbide: 0.6%, surplus Al.Wherein the aperture of porous graphite is 5nm, specific surface area 800m2/ g, receives
The partial size of rice silicon carbide is 300nm.
It weighs raw material by mentioned component proportion to be uniformly mixed, the heating and melting at 750 DEG C, slab of casting to obtain, in vacuum height
In warm furnace, slab is heated to 1000 DEG C with the speed of 30 DEG C/s, is then heated to 1600 DEG C with the speed of 0.2 DEG C/s, heat preservation
60min is heated to 300 DEG C of heat preservation tempering 3h, obtains aluminum alloy materials after cooling.
Embodiment 3
The ingredient and its weight percent of the present embodiment aluminum alloy materials are as follows: Be:1.0%, Cu:1.5%, porous graphite:
0.12%, nanometer silicon carbide: 0.6%, surplus Al.Wherein the aperture of porous graphite is 5nm, specific surface area 800m2/ g, receives
The partial size of rice silicon carbide is 100nm.
It weighs raw material by mentioned component proportion to be uniformly mixed, the heating and melting at 750 DEG C, slab of casting to obtain, in vacuum height
In warm furnace, slab is heated to 1000 DEG C with the speed of 30 DEG C/s, is then heated to 1600 DEG C with the speed of 0.2 DEG C/s, heat preservation
60min is heated to 300 DEG C of heat preservation tempering 3h, obtains aluminum alloy materials after cooling.
Embodiment 4
The ingredient and its weight percent of the present embodiment aluminum alloy materials are as follows: Be:1.8%, Cu:1.2%, porous graphite:
0.22%, nanometer silicon carbide: 0.4%, surplus Al.Wherein the aperture of porous graphite is 5nm, specific surface area 800m2/ g, receives
The partial size of rice silicon carbide is 100nm.
It weighs raw material by mentioned component proportion to be uniformly mixed, the heating and melting at 750 DEG C, slab of casting to obtain, in vacuum height
In warm furnace, slab is heated to 1000 DEG C with the speed of 30 DEG C/s, is then heated to 1600 DEG C with the speed of 0.2 DEG C/s, heat preservation
60min is heated to 300 DEG C of heat preservation tempering 3h, obtains aluminum alloy materials after cooling.
Embodiment 5
The ingredient and its weight percent of the present embodiment aluminum alloy materials are as follows: Be:1.8%, Cu:1.2%, porous graphite:
0.22%, nanometer silicon carbide: 0.4%, surplus Al.Wherein the aperture of porous graphite is 5nm, specific surface area 800m2/ g, receives
The partial size of rice silicon carbide is 100nm.
It weighs raw material by mentioned component proportion to be uniformly mixed, the heating and melting at 750 DEG C, slab of casting to obtain, in vacuum height
In warm furnace, slab is heated to 1000 DEG C with the speed of 30 DEG C/s, is then heated to 1600 DEG C with the speed of 0.2 DEG C/s, heat preservation
60min when being heated to 300 DEG C after cooling, with the ultrasonication 90min of 600w, continues heat preservation tempering 90min, obtains aluminium alloy
Material.
Embodiment 6
The ingredient and its weight percent of the present embodiment aluminum alloy materials are as follows: Be:1.8%, Cu:1.2%, porous graphite:
0.22%, nanometer silicon carbide: 0.4%, surplus Al.Wherein the aperture of porous graphite is 5nm, specific surface area 800m2/ g, receives
The partial size of rice silicon carbide is 100nm.
It weighs raw material by mentioned component proportion to be uniformly mixed, the heating and melting at 750 DEG C, slab of casting to obtain, in vacuum height
In warm furnace, slab is heated to 1000 DEG C with the speed of 30 DEG C/s, is then heated to 1600 DEG C with the speed of 0.2 DEG C/s, heat preservation
60min when being heated to 300 DEG C after cooling, with the ultrasonication 50min of 600w, continues heat preservation tempering 130min, obtains aluminium alloy
Material.
Embodiment 7
The ingredient and its weight percent of the present embodiment aluminum alloy materials are as follows: Be:2.0%, Cu:1.1%, porous graphite:
0.20%, nanometer silicon carbide: 0.35%, surplus Al.Wherein the aperture of porous graphite is 5nm, specific surface area 600m2/ g,
The partial size of nanometer silicon carbide is 50nm.
It weighs raw material by mentioned component proportion to be uniformly mixed, the heating and melting at 720 DEG C, slab of casting to obtain, in vacuum height
In warm furnace, slab is heated to 1100 DEG C with the speed of 40 DEG C/s, is then heated to 1700 DEG C with the speed of 0.1 DEG C/s, heat preservation
45min when being heated to 350 DEG C after cooling, with the ultrasonication 60min of 500w, continues heat preservation tempering 120min, obtains aluminium alloy
Material.
Embodiment 8
The ingredient and its weight percent of the present embodiment aluminum alloy materials are as follows: Be:2.3%, Cu:1.0%, porous graphite:
0.32%, nanometer silicon carbide: 0.5%, surplus Al.Wherein the aperture of porous graphite is 5nm, specific surface area 900m2/ g, receives
The partial size of rice silicon carbide is 150nm.
It weighs raw material by mentioned component proportion to be uniformly mixed, the heating and melting at 780 DEG C, slab of casting to obtain, in vacuum height
In warm furnace, slab is heated to 950 DEG C with the speed of 25 DEG C/s, is then heated to 1800 DEG C with the speed of 0.4 DEG C/s, heat preservation
80min when being heated to 400 DEG C after cooling, with the ultrasonication 40min of 900w, continues heat preservation tempering 150min, obtains aluminium alloy
Material.
Comparative example 1
Comparative example 1 and the difference of embodiment 6 be, the Cu content of comparative example 1 is 2.5%, Be 4.0%, it is other with it is real
It is identical to apply example 6.
Comparative example 2
Comparative example 2 and the difference of embodiment 6 are that the aluminum alloy materials of comparative example 2 do not include copper, other and embodiment 6
It is identical.
Comparative example 3
Comparative example 3 and the difference of embodiment 6 are that the aluminum alloy materials of comparative example 3 do not include beryllium, other and embodiment 6
It is identical.
Comparative example 4
Comparative example 4 and the difference of embodiment 6 are that common non-porous graphite replaces porous in the aluminum alloy materials of comparative example 4
Graphite, it is other same as Example 6.
Comparative example 5
Comparative example 5 and the difference of embodiment 6 are that the aluminum alloy materials of comparative example 5 do not include nanometer silicon carbide, Qi Tayu
Embodiment 6 is identical.
Comparative example 6
Comparative example 6 and the difference of embodiment 6 are that slab is in the preparation method of 6 aluminum alloy materials of comparative example with conventional speed
Degree is heated to 1600 DEG C, other same as Example 6.
Comparative example 7
Comparative example 7 and the difference of embodiment 6 are that slab is in the preparation method of 7 aluminum alloy materials of comparative example with 30 DEG C/s
Speed be heated to 1000 DEG C, be then heated to 1600 DEG C with the speed of 1 DEG C/s, it is other same as Example 6.
The aluminum alloy materials of embodiment 1-8 and comparative example 1-7 are prepared into the shell of LEDbulb lamp, measure dissipating for shell
Hot property and mechanical property, the wherein measurement method of skin temperature are as follows: LEDbulb lamp work 2h when, measure case surface
Temperature；The results are shown in Table 1.
The shell performance parameter of table 1 embodiment 1-8 and comparative example 1-7 preparation
From table 1 it follows that the shell of embodiment 6-8 has excellent heat dissipation performance and mechanical property, comparative example
Not within the protection scope of the present invention because of al alloy component, comparative example 6-7 is not because aluminium alloy preparation method is in protection scope by 1-5
It is interior, therefore the performance of comparative example 1-7 has relative to embodiment 6 and largely reduces.
Specific embodiment described in the present invention only illustrate the spirit of the present invention by way of example.The neck of technology belonging to the present invention
The technical staff in domain can make various modifications or additions to the described embodiments or replace by a similar method
In generation, however, it does not deviate from the spirit of the invention or beyond the scope of the appended claims.
It is skilled to this field although present invention has been described in detail and some specific embodiments have been cited
For technical staff, as long as it is obvious for can making various changes or correct without departing from the spirit and scope of the present invention.
Claims (6)
1. a kind of LEDbulb lamp, which is characterized in that the shell of the LEDbulb lamp is made of aluminum alloy materials, the aluminium alloy
The ingredient and its weight percent of material are as follows: Be:1.5-2.3%, Cu:1.0-1.2%, porous graphite: 0.18-0.32%, nano-sized carbon
SiClx: 0.3-0.5%, surplus Al.
2. a kind of LEDbulb lamp according to claim 1, which is characterized in that the aperture of the porous graphite is 0.5-
10nm, specific surface area 500-1000m2/g.
3. a kind of LEDbulb lamp according to claim 1, which is characterized in that the partial size of the nanometer silicon carbide is 50-
200nm。
4. a kind of LEDbulb lamp according to claim 1, which is characterized in that the preparation method packet of the aluminum alloy materials
It includes following steps: weighing raw material by composition proportion and be uniformly mixed, the heating and melting at 700-800 DEG C, slab of casting to obtain, in vacuum
In high temperature furnace, slab is heated to 900-1100 DEG C with the speed of >=20 DEG C/s, is then heated to the speed of 0.1-0.5 DEG C/s
1500-1800 DEG C, 45-90min is kept the temperature, is tempered after cooling.
5. a kind of LEDbulb lamp according to claim 4, which is characterized in that the tempering are as follows: be heated to 250-400 DEG C
Heat preservation tempering 2-5h.
6. a kind of LEDbulb lamp according to claim 5, which is characterized in that when being heated to 250-400 DEG C, use 500-
The ultrasonication 30-60min of 1000w.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU549495A1 (en) * | 1975-12-11 | 1977-03-05 | Московский Ордена Трудового Красного Знамени Институт Стали И Сплавов | Aluminum based foundry alloy |
| CN102839305A (en) * | 2012-09-09 | 2012-12-26 | 广东宏泰照明科技有限公司 | LED (light-emitting diode) light radiating material and preparation method of light housing based on same |
| CN103343265A (en) * | 2013-07-24 | 2013-10-09 | 上海交通大学 | Aluminum matrix composite with low expansion and high thermal conductivity reinforced by mixing graphite and silicon |
| CN103710597A (en) * | 2013-12-17 | 2014-04-09 | 芜湖万润机械有限责任公司 | Preparation method of aluminum alloy profile for high-power LED (light-emitting diode) lamp substrate |
| CN103710589A (en) * | 2013-12-17 | 2014-04-09 | 芜湖万润机械有限责任公司 | Preparation method of high-heat-conductivity aluminum alloy section for motor shell |
| CN106148740A (en) * | 2015-05-13 | 2016-11-23 | 江苏亨通电力特种导线有限公司 | The manufacture method of high strength heat resistant type aluminium alloy rod |
-
2017
- 2017-11-30 CN CN201711232399.6A patent/CN108004434B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU549495A1 (en) * | 1975-12-11 | 1977-03-05 | Московский Ордена Трудового Красного Знамени Институт Стали И Сплавов | Aluminum based foundry alloy |
| CN102839305A (en) * | 2012-09-09 | 2012-12-26 | 广东宏泰照明科技有限公司 | LED (light-emitting diode) light radiating material and preparation method of light housing based on same |
| CN103343265A (en) * | 2013-07-24 | 2013-10-09 | 上海交通大学 | Aluminum matrix composite with low expansion and high thermal conductivity reinforced by mixing graphite and silicon |
| CN103710597A (en) * | 2013-12-17 | 2014-04-09 | 芜湖万润机械有限责任公司 | Preparation method of aluminum alloy profile for high-power LED (light-emitting diode) lamp substrate |
| CN103710589A (en) * | 2013-12-17 | 2014-04-09 | 芜湖万润机械有限责任公司 | Preparation method of high-heat-conductivity aluminum alloy section for motor shell |
| CN106148740A (en) * | 2015-05-13 | 2016-11-23 | 江苏亨通电力特种导线有限公司 | The manufacture method of high strength heat resistant type aluminium alloy rod |
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| CN108004434A (en) | 2018-05-08 |
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