CN107999458B

CN107999458B - Full-automatic silicon wafer cleaning machine

Info

Publication number: CN107999458B
Application number: CN201711242776.4A
Authority: CN
Inventors: 轩云喜
Original assignee: Beijing Nanxuan Xingda Electronic Technology Co ltd
Current assignee: Beijing Nanxuan Xingda Electronic Technology Co ltd
Priority date: 2017-11-30
Filing date: 2017-11-30
Publication date: 2020-09-22
Anticipated expiration: 2037-11-30
Also published as: CN107999458A

Abstract

The invention discloses a full-automatic silicon wafer cleaning machine, which has the technical scheme that: the silicon wafer cleaning device comprises a frame body, a cleaning layer is arranged in the frame body, a fixing frame is arranged in the cleaning layer, a plurality of cleaning grooves are arranged in the fixing frame, a bearing frame for placing a silicon wafer is arranged in each cleaning groove, and a driving mechanism for driving the bearing frame to swing is arranged on the fixing frame. The invention has the advantages that the silicon wafer can be fully contacted, collided and rubbed with the cleaning solution, and the cleaning effect of the silicon wafer is improved.

Description

Full-automatic silicon wafer cleaning machine

Technical Field

The invention relates to silicon wafer cleaning equipment, in particular to a full-automatic silicon wafer cleaning machine.

Background

With the development of society, the application of silicon chips is more and more extensive, and some silicon chips are applied to solar power generation and some silicon chips are applied to materials for manufacturing semiconductors.

At present, solar silicon wafer manufacturers in China generally use single-groove or multi-groove combined manual cleaning, the silicon wafers are soaked in cleaning liquid, and the silicon wafers are taken out after being soaked for a period of time.

The silicon wafer and the cleaning liquid are relatively static in the cleaning mode, collision and friction among the silicon wafer and the cleaning liquid are very little, and further the silicon wafer cleaning effect is not very good.

Disclosure of Invention

The invention aims to provide a full-automatic silicon wafer cleaning machine which has the advantages that a silicon wafer can be fully contacted, collided and rubbed with cleaning liquid, and the cleaning effect of the silicon wafer is improved.

The technical purpose of the invention is realized by the following technical scheme: the utility model provides a full-automatic silicon chip cleaning machine, includes the support body, washs the layer in the support body, washs the in situ and is equipped with the mount, is equipped with a plurality of washing tank in the mount, is equipped with the accepting frame of putting the silicon chip in the washing tank, is equipped with on the mount to drive and accepts the wobbling actuating mechanism of frame.

Through the technical scheme, the cleaning solution is placed into the cleaning tank, the silicon wafer is placed into the bearing frame in the cleaning tank, the driving mechanism is started at last to drive the bearing frame to swing, the cleaning solution and the silicon wafer are collided and rubbed with each other, and the silicon wafer is cleaned more cleanly.

The invention is further configured to: actuating mechanism includes third motor, dwang, accepts board, slide rail, slide and L type lifting arm, be fixed with on the mount of washing tank both sides accept the board, the slide rail is fixed on accepting the board, slide sliding connection is on the slide rail, L type lifting arm long limit is deepened and is fixed on accepting the frame in the washing tank, the minor face of L type lifting arm is fixed on the upper surface of slide, the dwang is established in one side of washing tank, the bearing frame on the mount is fixed to the dwang, the one end of accepting the pole is connected on the third motor, the both ends of accepting the pole are fixed with the band pulley, the both sides that dwang one end was kept away from to the washing tank are equipped with the fixed station, be equipped with the band pulley on the fixed station, connect through the belt between the band pulley that the washing tank both sides correspond, be equipped with the.

Through above-mentioned technical scheme, when needs drive the accepting frame horizontal hunting, start the second motor, the second motor drives the connecting rod motion, and the connecting rod rotates and drives the band pulley and rotate, and then drives the belt and rotate, and the belt motion will drive curb plate and slide and remove, and then will drive and accept the frame and remove, and then make the silicon chip on the accepting frame better with the washing liquid contact, improve the cleaning performance of silicon chip.

The invention is further configured to: the driving mechanism can simultaneously drive the bearing frames in a group of cleaning tanks to ascend and descend, the power mechanism comprises a guide seat, a guide rod, a first rectangular plate, a second rectangular plate, an L-shaped lifting arm, a hinge part, a first special-shaped hinge plate, a second special-shaped hinge plate, a long hinge column, a first short hinge column, a second short hinge column, a rotating shaft, a third motor, a speed reducer and a rotating rod, the fixing frame is provided with a fixing plate at a position corresponding to the side wall of the first cleaning tank and the last cleaning tank in each group of tanks, the upper parts of the outer surfaces of the fixing plates at two sides of the first cleaning tank are provided with two parallel guide seats, the upper parts of the outer surfaces of the fixing plates at two sides of the last cleaning tank are provided with two parallel guide seats, the guide rod is arranged in the guide seat, the upper end of the guide rod is provided with the first rectangular plate, the upper surface of the first rectangular plate is respectively provided with a bearing piece, the long edge of the L-shaped lifting arm is fixed on a bearing frame, the short edge of the L-shaped lifting arm is fixed on the bearing piece, the hinged part is arranged at the lower end of the outer surface of the fixed plate, the hinged part is hinged with a first special-shaped hinged plate, the upper end of the first special-shaped hinged plate is hinged with a roller which is in conflict with the first rectangular plate, the long hinged column is hinged at the lower part of the first special-shaped hinged plate, the long hinged column connects the two first special-shaped hinged plates at the same side together, the lower end of the first special-shaped hinged column on the first fixed plate is provided with two hinged joints, one above the other is arranged, the long hinged column is hinged in the upper hinged joint, the short hinged column is hinged on the hinged joint at the lower end, the rotary rod is rotatably connected with the fixed frame in, the second short hinged column is horizontally hinged to the upper portion of the second special-shaped hinged plate, the other end of the second short hinged column is hinged to a rotating piece sleeved on an output shaft of the speed reducer, and the speed reducer is connected with the third motor.

Through the technical scheme, when the bearing frame is required to be driven to swing up and down, the third motor is started, the conveying shaft of the speed reducer rotates, and then the quasi rolling rod is driven to rotate, the rotating rod rotates to drive the second short hinge post to tilt up and down, and then the second special-shaped hinge plate is driven to rotate, the second special-shaped hinge plate rotates back and forth to drive the rotating shaft to rotate back and forth, the rotating shaft rotates back and forth to conduct power to the other side of the fixing frame, so that the first special-shaped hinge plate on the fixing plates on the two sides of the fixing frame can rotate, the roller can move up and down by back and forth rotating the first special-shaped hinge plate, and then the rectangular plate can be pushed to move up and down, and then the silicon wafers on the bearing frame and the bearing frame can be driven to move up and down in the groove, so that the.

The invention is further configured to: the driving structure comprises a worm, a turbine, a belt wheel, a leather and a fourth motor, wherein fixing plates are arranged at the positions of the fixing frame corresponding to the two sides of the cleaning tank, three parallel guide seats are arranged on the outer surface of each fixing plate, guide rods are arranged in the guide seats on the two sides of the three guide seats, the worm is arranged in the guide seat in the middle, a driving plate is fixed at the upper ends of the worm and the guide rods, L-shaped lifting arms are fixed on the upper surfaces of the two sides of the bearing frame, the long edges of the L-shaped lifting arms are fixed on the bearing frame, the short edges of the L-shaped lifting arms are fixed on the driving plate, a fixed bearing seat is arranged in the middle of each fixing plate, a rolling shaft is arranged in each bearing seat, the turbine is sleeved on the rolling shaft and meshed with the worm, the belt wheel is sleeved on one side of the rolling shaft, the rotating rod, the rotating shaft is fixed in the speed reducer, and the speed reducer is connected with the fourth motor.

Through the technical scheme, after the silicon chip is put in the washing tank and is washed, the fourth motor is started, the fourth motor rotates to drive the rolling shaft in the speed reducer to rotate, the rotating shaft rotates to drive the belt pulley to rotate, the rolling shaft is driven to rotate, the rolling shaft rotates to drive the turbine to rotate, the turbine rotates to drive the worm to ascend, the worm ascends to drive the bearing frame in the washing tank to ascend, the slowly ascending lifting frame allows water on the silicon chip to slowly flow away, then the silicon chip is put on the conveying mechanism and conveyed to the odd drying mechanism to be dried.

The invention is further configured to: be equipped with a plurality of air exit on the lateral wall on cleaning layer, be equipped with the air door on the air exit.

Through the technical scheme, the gas volatilized from the cleaning tank can be exhausted, and the possibility that the gas is scattered into the air is reduced.

The invention is further configured to: the air door is two, and two air doors are connected in a flange mode.

Through above-mentioned technical scheme, can adjust exhaust area through two air doors of rotation each other, and then control exhaust capacity.

The invention is further configured to: the frame body is coated with a German imported beige PVC layer.

Through the technical scheme, the German imported beige PVC layer has the characteristics of complete non-toxicity, tasteless, corrosion resistance and oxidation resistance, can prolong the service life of the frame body, and is very environment-friendly.

The invention is further configured to: and a drying part for drying the cleaned silicon wafer is arranged on one side of the cleaning part.

Through above-mentioned technical scheme, the silicon chip that the stoving portion can be quick will wash is dried.

The invention is further configured to: one of the cleaning tanks is an alkali tank which is formed by welding NPP materials.

By the technical scheme, the alkali tank made of the NPP material has the advantages of sanitation, no toxicity, corrosion resistance, no scale formation, high temperature resistance, heat preservation, energy conservation, long service life and the like.

The invention is further configured to: and the other cleaning tanks except the alkaline tank are made of stainless steel.

Through above-mentioned technical scheme, stainless steel has corrosion-resistant characteristics, can reduce the corruption of washing liquid to the washing tank.

In conclusion, the invention has the following beneficial effects:

1. the silicon wafer clamping mechanism comprises two clamping parts, each clamping part is provided with 3 pairs of U-shaped clamping rods, each pair of U-shaped clamping rods can clamp one silicon wafer, and the clamping mechanism can clamp six silicon wafers at a time for cleaning, so that the cleaning efficiency of the silicon wafers is greatly improved;

2. the silicon wafer cleaning and drying device comprises a cleaning part and a drying part, and after the silicon wafer is cleaned in the cleaning part, the silicon wafer can be directly conveyed to the drying part for drying;

3. according to the invention, the bearing frame is arranged in the cleaning tank in the cleaning part, and can move up and down under the driving of the driving mechanism, so that the silicon wafer on the bearing frame can be driven to move up and down in the cleaning solution, and the silicon wafer can be better contacted with the cleaning solution, and the cleaning effect of the silicon wafer is better.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view showing a lateral driving structure of the gripping mechanism;

FIG. 3 is a schematic view showing the structure of the gripping mechanism;

FIG. 4 is a schematic view showing a lifting mechanism for driving a lifting rod;

FIG. 5 is a schematic view showing a structure of a clamping portion;

FIG. 6 is a schematic diagram showing the structure of a drive stage;

FIG. 7 is a schematic view showing the structure of the vertical clamping plate and the U-shaped clamping bar;

FIG. 8 is a schematic diagram showing the structure of a cleaning layer;

FIG. 9 is a schematic view showing a first movement structure of the receiving rack in the cleaning tank;

FIG. 10 is a schematic view showing a second movement structure of the receiving rack in the cleaning tank;

FIG. 11 is a schematic view showing a second movement structure of the receiving rack in the cleaning tank;

FIG. 12 is a schematic view showing a third movement structure of the rack in the cleaning tank.

In the figure, 1, a frame body; 11. a cleaning section; 111. cleaning the layer; 112. the silicon wafer clamping and conveying layer; 113. a drive layer; 1131. a receiving table; 11311. a through groove; 114. a fixed mount; 1141. a bearing plate; 1142. a slide rail; 1143. a slide plate; 11431. a side plate; 1144. a bearing seat; 12. a drying section; 13. a PVC layer; 2. a cleaning tank; 21. a feeding trough; 22. an ultrasonic rinsing tank; 23. an AB liquid tank; 24. an alkali tank; 25. a slow pull groove; 26. a receiving frame; 261. an L-shaped lift arm; 3. an air outlet; 31. a damper; 4. the silicon wafer clamping and conveying mechanism; 41. a gripping mechanism; 411. a carrier plate; 412. a clamping portion; 4121. a fixed table; 4122. a rotating rod; 41221. a rotating part; 4123. vertically clamping the plate; 4124. fixing a sleeve; 4125. a U-shaped clamping bar; 4126. a silicon wafer; 4127. a hold down bar; 41271. an elastic member; 42. a power mechanism; 421. a box body; 4211. a cavity; 422. a second guide rail; 423. a rectangular steel plate; 424. a fixed part; 425. a threaded bushing; 426. a screw; 427. a lifting rod; 43. a traction mechanism; 431. channel steel; 4311. a first guide rail; 432. a bearing table; 4321. a right-angle steel plate; 5. a hydraulic cylinder; 51. a drive stage; 511. a drive rod; 6. a first motor; 61. a second motor; 62. rotating the rod; 63. a third motor; 64. a fourth motor; 65. a fifth motor; 7. a pulley; 71. a belt; 72. a supporting seat; 8. a speed reducer; 81. a rotating member; 9. a fixing plate; 91. a hinge portion; 911. a first special-shaped hinged plate; 9111. a roller; 92. a guide seat; 921. a guide bar; 9211. a first rectangular plate; 9212. a second rectangular plate; 9213. a drive plate; 93. a receiving member; 94. a second special-shaped hinged plate; 941. a second short hinged column; 95. a first short hinged column; 96. a long hinge post; 97. a worm; 98. a turbine.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

Example (b): a full-automatic silicon wafer cleaning machine is disclosed, as shown in figure 1 and figure 2, comprising a hollow cuboid frame 1, the frame 1 is covered with a German imported beige PVC layer 13, which is divided into two parts from left to right, namely a cleaning part 11 and a drying part 12, the cleaning part 11 is divided into an upper layer, a middle layer and a lower layer, the lower layer is a cleaning layer 111, the middle layer is a silicon wafer clamping and conveying layer 112, the upper layer is a driving layer 113, a plurality of cleaning baths 2 (see figure 8) are arranged in the cleaning layer 111, a silicon wafer clamping and conveying mechanism 4 is arranged in the silicon wafer clamping and conveying layer 112 and the driving layer 113, the silicon wafer clamping and conveying mechanism 4 comprises a clamping mechanism 41, a driving mechanism 43 for driving the clamping mechanism 41 to move horizontally and a power mechanism 42 for driving the clamping mechanism 41 to ascend and descend, when the silicon wafer 4126 needs to be cleaned, firstly the silicon wafer 4126 is clamped by the clamping mechanism 41 into the first cleaning bath 2, after a period of cleaning, the silicon wafer 4126 is put into the cleaning tank 2 filled with different liquids to be cleaned by the driving mechanism 43, and finally the cleaned silicon wafer 4126 is transferred to the drying section 12 to be dried.

As shown in fig. 8, the cleaning layer 111 is provided with a fixing frame 114, 12 cleaning tanks 2 are arranged in the fixing frame 114, the first one is a feeding tank 21, the second one is an ultrasonic rinsing tank 22, the third one is an a/B tank, the sixth one is an ultrasonic rinsing tank 22, the seventh one is an alkali tank 24, the ninth one is an ultrasonic rinsing tank 22, the 12 th one is a slow-pulling tank 25, the alkali tank 24 is formed by welding NPP materials, the other tanks are formed by welding stainless steel, silicon wafers 4126 are sequentially placed into different tanks from left to right for cleaning, different cleaning liquids are placed into each tank, different cleaning effects can be achieved on groups of silicon wafers 4126, a plurality of air outlets 3 are arranged on the side wall of the cleaning layer 111, the plurality of air outlets 3 are uniformly arranged on the side wall of the cleaning layer 111, air exhausted from the cleaning tanks 2 can be reduced, and the air is prevented from overflowing into the air, two air dampers 31 are arranged on the air outlet 3, the two air dampers 31 are connected in a flange mode, the air exhaust area can be adjusted through mutual rotation, and then the air exhaust capacity is controlled.

As shown in fig. 5 and 7, the clamping and transporting layer is provided with three silicon wafer 4126 clamping mechanisms 41, each clamping mechanism 41 comprises a bearing plate 411, two sets of clamping parts 412 are arranged on the lower surface of the bearing plate 411, each set of clamping parts 412 can clamp three silicon wafers 4126, the two sets of clamping parts 412 are arranged on the lower surface of the bearing plate 411 in parallel, each clamping part 412 comprises a fixed table 4121, a rotating rod 4122, a vertical clamping plate 4123 and a U-shaped clamping rod 4125, the fixed table 4121 is fixed on the lower surface of the bearing plate 411 and arranged in rows, one row of two fixed tables 4121 is arranged close to the edge of the bearing plate 411, the other row is arranged close to the middle of the bearing plate 411, the rotating rod 4122 is rotatably connected in the fixed table 4121, a hydraulic cylinder 5 is arranged above the middle of the part between the two rotating rods 4122, the hydraulic rod penetrates through the bearing plate 411, a cuboid driving table 51, the two sides of the driving table 51 are respectively provided with a driving rod 511, the driving rods 511 on the two sides are arranged in tandem, the driving rod 511 is hinged with a rotating part 41221, the rotating part 41221 is fixed on a rotating rod 4122, a vertical clamping plate 4123 is fixed on the rotating rod 4122, a fixing sleeve 4124 is arranged on the vertical clamping plate 4123, the fixing sleeve 4124 is connected on the rotating rod 4122, the lower part of the vertical clamping plate 4123 is fixed with three U-shaped clamping rods 4125, the U-shaped clamping rods 4125 on the two clamping plates of each clamping part 412 are mutually corresponding to form a clamping combination, the front end and the rear end of each clamping combination are respectively provided with two pressing rods 4127, the upper ends of the two pressing rods 4127 are fixed on the bearing plate 411, an elastic component is arranged between the pressing rods 4127 and the bearing plate 411, and the lower ends of the two pressing rods 4127 are fixed.

As shown in fig. 5, when a group of silicon wafers 4126 needs to be clamped and placed in the cleaning tank 2, the supporting plate 411 is first driven to descend, when the clamping portion 412 surrounds the silicon wafers 4126 to tightly press the silicon wafers 4126 back and forth, the hydraulic cylinder 5 is started, the hydraulic rod drives the driving platform 51 to move downwards, the driving platform 51 moves downwards and simultaneously drives the rotating portion 41221 to rotate, the rotating portion 41221 rotates to drive the rotating rod 4122 to rotate, the rotating rod 4122 drives the vertical clamping plate 4123 to rotate, the vertical clamping plate 4123 rotates to drive the U-shaped clamping rod 4125 to rotate oppositely, then the supporting plate 411 is lifted, the U-shaped clamping rod 4125 is clamped in the groove arranged at the edge of the silicon wafers 4126 to drive the silicon wafers 4126 to move upwards, then the driving mechanism 43 drives the supporting plate 411 to move transversely to move the silicon wafers 4126 above different cleaning tanks 2, then drives the power mechanism 42 to descend, and places the supporting plate 4126 in the cleaning tank 2, then, the hydraulic cylinder 5 is started, the hydraulic cylinder 5 is lifted, the rotating rod 4122 and the vertical clamping plate 4123 are driven to rotate outwards, the compression on the silicon wafer 4126 is released, and the silicon wafer 4126 is cleaned in the cleaning tank 2.

As shown in fig. 2 and 4, a receiving platform 1131 is disposed at the bottom of the driving layer 113, a through groove 11311 is disposed in the receiving platform 1131, the through groove 11311 penetrates through the whole cleaning portion 11, traction mechanisms 43 for driving the clamping mechanism 41 to move are disposed on two sides of the through groove 11311, each traction mechanism 43 includes a channel 431, a sliding groove is disposed on a side wall of the channel 431, a first guide rail 4311 is fixed on an upper surface of the channel 431, a bearing platform 432 is slidably connected to the first guide rail 4311, a right-angle steel plate 4321 is fixed on one side of the bearing platform 432, a power mechanism 42 for driving the clamping mechanism 41 to ascend and descend is fixed between the two right-angle steel plates 4321, the power mechanism 42 includes a box 421, a cavity 4211 is disposed in the box 421, two parallel second guide rails 422 are disposed on a rear side wall of the cavity 4211, a rectangular steel plate 423 is slidably connected to the two second guide rails 422, a lifting rod 427 is fixed in the two fixing portions 424, the lower end of the lifting rod 427 is fixed on the upper surface of the bearing plate 411, a worm 97 is arranged between the two guide rails, the upper end of the worm 97 penetrates out of the box 421, the worm 97 penetrating out of the box 421 is fixed on a speed reducer 8 arranged on the upper surface of the box 421, the upper end of the speed reducer 8 is connected with a belt wheel 7, a first motor 6 is arranged on the upper portion of the rear side wall of the box 421, a belt wheel 7 is also arranged on the output shaft of the first motor 6, the belt wheel 7 on the output shaft of the first motor 6 is connected with the belt wheel 7 on the speed reducer 8 through a belt 71, a threaded sleeve 425 is arranged on one side, facing the worm 97, of.

When the first motor 6 rotates, the rotation speed of the first motor 6 is reduced by the speed reducer 8, the worm 97 driven by the low rotation speed of the speed reducer 8 rotates, the worm 97 rotates to drive the threaded sleeve 425 to move up and down, and then the rectangular steel plate 423 and the lifting rod 427 are driven to move up and down.

As shown in fig. 2, two supporting seats 72 are disposed on the receiving platform 1131, the two supporting seats 72 are disposed in tandem and are disposed correspondingly, the second motor 61 is fixed on the supporting seat 72 in front, the belt pulley 7 is disposed on the supporting seat 72 in rear, the belt pulley 7 is fixed on the output shaft of the second motor 61, the two belt pulleys 7 in front and rear are connected by a belt 71, a fixing plate 9 is disposed on the other side of the receiving platform 432 on the first guide rail 4311, the belt 71 is fixed on the receiving platform 432 by the fixing plate 9, the second motor 61 rotates in forward and reverse directions to drive the belt 71 to move forward and backward, and the belt 71 drives the receiving platform 432 and the whole box 421 to move.

As shown in fig. 2 and 4, when the clamping mechanism 41 needs to be translated, the second motor 61 is started, the second motor 61 drives the belt wheel 7 to rotate, and then drives the belt 71 to rotate, the belt 71 moves back and forth to drive the plummer 432 to move on the guide rail, meanwhile, the plummer 432 drives the box 421 to move, the box 421 drives the lifting rod 427 to move, the lifting rod 427 drives the whole clamping mechanism 41 to move, and then the clamping mechanism 41 can clamp and take the silicon wafer 4126 into different cleaning tanks 2 for cleaning.

As shown in fig. 9, two rectangular receiving frames 26 are arranged side by side in the upper trough 21 in the direction perpendicular to the long side of the frame body 1, a driving mechanism for driving the receiving frames 26 to move is arranged on the fixing frame 114, L-shaped lifting arms 261 are respectively fixedly connected to both ends of the receiving frames 26, the long sides of the L-shaped lifting arms 261 are arranged in the upper trough 21 and fixed to the receiving frames 26, the short sides of the L-shaped lifting arms 261 extend out of the upper trough 21, receiving plates 1141 are arranged at the positions corresponding to the long sides of the fixing frame 114, slide rails 1142 are arranged on the receiving plates 1141, slide plates 1143 are slidably connected to the slide rails 1142, the L-shaped lifting arms 261 extending out of the upper trough 21 are fixed to the upper surfaces of the slide plates 1143, the slide plates 1143 slide left and right on the slide rails 1142 to drive the receiving frames 26 in the upper trough 21 to move left and right, a rotating rod 62 is arranged at one side of the short sides, two sides of the rotating rod 62 are fixed in bearing seats 1144 arranged on the fixing frame 114, two sides of the rotating rod 62 are respectively provided with a belt wheel 7, the belt wheel 7 is provided with a convex rib, two sides of one end of the upper trough 21 far away from the rotating rod 62 are respectively provided with a fixing table 4121, the fixing table 4121 is provided with two corresponding bearing seats 1144, the bearing seats 1144 are fixedly provided with the belt wheels 7, a belt 71 is arranged between the two corresponding belt wheels 7 on two sides of the upper trough 21, the belt 71 is provided with the convex rib, the convex rib on the belt 71 can be clamped with the convex rib on the belt wheel 7, the side wall of the sliding plate 1143 is fixedly provided with a side plate 11431, the side plate 11431 is just above the belt 71, two fixing plates 9 are arranged below the belt 71, one side of the fixing plate 9 contacting with the belt 71 is provided with a groove, the groove is clamped with the convex rib on the, one end of the rotation is connected with a third motor 63, and the third motor 63 is fixed on the fixed frame 114.

When the supporting frame 26 needs to be driven to swing left and right, the third motor 63 is started, the third motor 63 drives the rotating rod 62 to move, the rotating rod 62 rotates to drive the belt wheel 7 to rotate, the belt 71 is further driven to rotate, the belt 71 moves to drive the side plate 11431 and the sliding plate 1143 to move, the supporting frame 26 is further driven to move left and right, the silicon wafer 4126 on the supporting frame 26 is further enabled to be in better contact with the cleaning liquid, and the cleaning effect of the silicon wafer 4126 is improved.

As shown in fig. 10 and 11, the remaining tanks are divided into four groups, the first group is a group of second to fourth, the fifth to eighth, the ninth to eleventh, and the twelfth group is a group, the driving mechanisms of the front three groups of in-tank receiving frames 26 are all the same, the fixing frame 114 is provided with a fixing plate 9 at a position corresponding to the side walls of the first cleaning tank 2 and the last cleaning tank 2 in each group of tanks, two guide bases 92 are provided on each fixing plate 9, the guide bases 92 are parallel to each other, guide rods 921 are provided in the guide bases 92, the upper ends of each two guide rods 921 are fixed with a first rectangular plate 9211, the lower ends of each two guide rods 921 are fixed with a second rectangular plate 9212, the first rectangular plates 9211 at the upper ends of the front and the rear are fixed with receiving members 93, and the short sides of L-shaped lifting arms 261 on the receiving frame 26 are fixed on the receiving members 93.

As shown in fig. 10 and 11, the lower end of the second fixing plate 9 is respectively provided with a hinge portion 91, the two hinge portions 91 are respectively hinged with a first special-shaped hinge plate 911, the middle portion of the first special-shaped hinge plate 911 is hinged on the hinge portion 91, the upper end of the first special-shaped hinge plate 911 is hinged with a roller 9111, the roller 9111 is respectively abutted against the second rectangular plate 9212, the lower end of the two first special-shaped hinge plates 911 is hinged with a horizontally arranged long hinge column 96, the long hinge column 96 connects the two first special-shaped hinge plates 911 together, the lower end of the first special-shaped hinge plate 911 on the first fixing plate 9 is provided with two hinge points, the two hinge points are arranged one above the other, the long hinge column 96 is hinged in the upper hinge point, the hinge point at the lower end is hinged with a first short hinge column 95, a rotating rod 62 is arranged in front of, the both ends of dwang 62 are equipped with second heterotypic articulated portion 91 respectively, the middle part of second heterotypic articulated plate 94 articulates on dwang 62, first short hinge post 95 level articulates the lower part at second heterotypic articulated plate 94, the upper portion of second heterotypic articulated plate 94 articulates there is a short hinge post 941 of second, the other end of the short hinge post 941 of second articulates on a power device, power device 42 includes fourth motor 64 and reduction gear 8 and rotates piece 81, reduction gear 8 is fixed on supporting seat 72, the output shaft of fourth motor 64 is connected with reduction gear 8, it cup joints on the output shaft of reduction gear 8 to rotate piece 81, the output shaft speed of reduction gear 8 reduces after reduction gear 8 slows down, it rotates to drive the rotation piece 81 that cup joints on reduction gear 8 output shaft, be equipped with the protruding axle on the lateral wall of rotation piece 81 tip, the short hinge post 941 of.

As shown in fig. 10 and 11, when the fourth motor 64 works, the conveying shaft of the speed reducer 8 rotates to drive the quasi-rotation component 81 to rotate, the rotation rod 62 rotates to drive the second short hinge post 941 to tilt up and down, and further drive the second special-shaped hinge plate 94 to rotate, the second special-shaped hinge plate 94 rotates back and forth to drive the rotation rod 62 to rotate back and forth, the rotation rod 62 rotates back and forth to transmit power to the other side of the fixing frame 114, so that the first special-shaped hinge plate 911 on the fixing plate 9 on both sides of the fixing frame 114 can rotate, the roller 9111 rotates back and forth to move up and down, and further push the second rectangular plate 9212 to move up and down, the first rectangular plate 9211 pushes the guide rod 921 to move up and down, and further can drive the receiving frame 26 and the 4126 on the receiving frame 26 to move up and down in the cleaning tank 2, and further make the silicon wafer, the silicon wafer 4126 is cleaned more cleanly.

As shown in fig. 12, the driving mechanism of the receiving rack 26 in the fourth group of slots, i.e. the slow pulling slot 25, is different from the other slots in the moving manner, the fixing rack 114 is also provided with fixing plates 9 at the positions corresponding to the slow pulling slot 25 on both sides, the upper parts of the two fixing plates 9 are provided with three parallel guide seats 92, the guide bar 921 is arranged in the guide seats 92 on both sides of the three guide seats 92, the worm 97 is arranged in the guide seat 92 in the middle, the upper ends of the worm 97 and the guide bar 921 are fixed with a driving plate 9211, the short side of the L-shaped lifting arm 261 fixed on the receiving rack 26 is fixed on the driving plate 9211, the middle part of the fixing plate 9 is provided with a rolling shaft, the turbine 98 is arranged at the position corresponding to the worm 97 on the rolling shaft, the side of the rolling shaft close to the slow pulling slot is sleeved with a pulley 7, the slow pulling slot 25 is provided with a pulley 62, the rotating rod 62 is, the belt wheel 7 on the rotating rod 62 is connected with the belt wheel 7 on the rolling shaft through a belt 71, the rotating rod 62 is fixed in the speed reducer 8, the speed reducer 8 is connected with the fifth motor 65, the fifth motor 65 rotates to drive the rotating rod 62 in the speed reducer 8 to rotate, the rotating rod 62 rotates to drive the belt wheel 7 to rotate, the rolling shaft rotates to drive the rolling shaft to rotate, the rolling shaft rotates to drive the worm wheel 98 to rotate, the worm wheel 98 rotates to drive the worm 97 to ascend and descend, and the worm 97 ascends and descends to drive the bearing frame 26 in the slow lifting groove 25 to ascend and descend.

After the silicon wafer 4126 is cleaned in the slow-pulling tank 25, the fifth motor 65 is started to slowly drive the lifting frame to rise, so that the water on the silicon wafer 4126 slowly flows away, and then the silicon wafer 4126 is placed on the conveying mechanism and conveyed into the drying part 12 for drying.

The working process is as follows: when groups of silicon wafers 4126 need to be cleaned, the silicon wafers 4126 are placed in the upper trough 21 for soaking, then the third motor 63 on one side of the upper trough 21 is driven, the conveying shaft of the reducer 8 rotates to drive the quasi-rotating rod 62 to rotate, the rotating rod 62 rotates to drive the second short hinge post 941 to tilt up and down, and further drive the second special-shaped hinge plate 94 to rotate, the second special-shaped hinge plate 94 rotates back and forth to drive the rotating rod 62 to rotate back and forth, the rotating rod 62 rotates back and forth to transmit power to the other side of the fixed frame 114, so that the first special-shaped hinge plate 911 on the fixed plate 9 on two sides of the fixed frame 114 can rotate, the first special-shaped hinge plate 911 rotates back and forth to drive the roller 9111 to move up and down, and further drive the first rectangular plate 9211 to move up and down, the first rectangular plate 9211 can drive the guide rod 921 to move up and down, and further drive the silicon wafers 4126, further, the silicon wafer 4126 is preferably brought into contact with the cleaning solution to clean the silicon wafer 4126.

After the silicon wafer 4126 is cleaned in the upper trough 21, the first motor 6 of the driving layer 113 is started, the first motor 6 drives the belt wheel 7 to rotate, and further drives the belt 71 to rotate, the belt 71 moves back and forth to drive the carrying table 432 to move on the sliding rail 4311, the carrying table 432 drives the box 421 to move, the box 421 drives the lifting rod 427 to move, the lifting rod 427 drives the whole clamping mechanism 41 to move, and further the clamping mechanism 41 moves above the grouped silicon wafers 4126, and then the second motor 61 on the box 421 is driven, the second motor 61 works, the rotation speed of the second motor 61 is reduced by the reducer 8, the screw 426 driven by the reducer 8 at a low rotation speed rotates, the screw 426 rotates to drive the threaded sleeve 425 to move up and down, and further the rectangular steel plate 423 and the lifting rod 427 are driven to move up and down, and until the clamping portion 412 surrounds the silicon wafer 4126 and compresses the silicon wafer 4126 back and forth, the hydraulic cylinder 5, the hydraulic stem drives the drive platform 51 downstream, drive the rotation portion 41221 rotation when the drive platform 51 downstream, rotation portion 41221 rotates and drives bull stick 4122 and rotates, and then bull stick 4122 drives vertical clamp and gets board 4213 and rotate, vertical pressure gets board 4213 and rotates and drive U type clamping rod 4125 and rotate in opposite directions, then drive second motor 61, it rises to drive lifter 427, and then promote loading board 411, U type clamping rod 4125 joint is in the recess that silicon chip 4126 border set up, drive silicon chip 4126 rebound.

Then starting the first motor 6, the first motor 6 drives the belt 71 to rotate, the belt 71 drives the box 421 to move, further drives the lifting rod 427 and the clamping mechanism 41 to move back and forth, the silicon wafer 4126 is clamped above different cleaning tanks 2 and then is placed on the bearing frame 26 in different cleaning tanks 2 to be cleaned, the bearing frame 26 moves up and down in the cleaning process, the silicon wafer 4126 can be better contacted with the cleaning solution, the silicon wafer 4126 is continuously carried after being cleaned, the silicon wafer 4126 is completely cleaned in 12 cleaning tanks 2, finally the silicon wafer 4126 is placed on the conveying belt, and the silicon wafer 4126 is conveyed to the drying box to be dried.

The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.

Claims

1. The utility model provides a full-automatic silicon chip cleaning machine, includes support body (1), characterized by: the cleaning device is characterized in that the frame body (1) is provided with a cleaning part (11), the cleaning part (11) comprises a cleaning layer (111), a fixing frame (114) is arranged in the cleaning layer (111), a plurality of cleaning tanks (2) are arranged in the fixing frame (114), a bearing frame (26) for placing silicon wafers (4126) is arranged in each cleaning tank (2), a driving mechanism for driving the bearing frame (26) to swing is arranged on the fixing frame (114), the driving mechanism comprises a third motor (63), a rotating rod (62), a bearing plate (1141), a sliding rail (1142), a sliding plate (1143) and an L-shaped lifting arm (261), the bearing plate (1141) is fixed on the fixing frame (114) at two sides of the cleaning tanks (2), the sliding rail (1142) is fixed on the bearing plate (1141), the sliding plate (1143) is slidably connected on the sliding rail (1142), the long edge of the L-shaped lifting arm (261) penetrates into the cleaning tanks (2) and is fixed on the bearing, establish in one side of washing tank (2) dwang (62), bearing frame (1144) on mount (114) are fixed in dwang (62), the one end of dwang (62) is connected on third motor (63), the both ends of dwang (62) are fixed with band pulley (7), the both sides that dwang (62) one end was kept away from in washing tank (2) are equipped with fixed station (4121), be equipped with band pulley (7) on fixed station (4121), connect through belt (71) between band pulley (7) that washing tank (2) both sides correspond, be equipped with curb plate (11431) on slide (1143) lateral wall, be equipped with fixed plate (9) on curb plate (11431), fixed plate (9) compress tightly belt (71) on the lower surface of curb plate (11431).

2. The full-automatic silicon wafer cleaning machine according to claim 1, wherein: the driving mechanism can simultaneously drive the bearing frame (26) in a group of cleaning tanks (2) to ascend and descend, the driving mechanism also comprises a guide rod (921) fixed in the guide seat (92), a first rectangular plate (9211), a second rectangular plate (9212), a hinged part (91), a first special-shaped hinged plate (911), a second special-shaped hinged plate (94), a long hinged column (96), a first short hinged column (95), a second short hinged column (941), a rotating part (81) and a speed reducer (8), the fixing frame (114) is provided with a fixing plate (9) at the position corresponding to the side wall of the first cleaning tank (2) and the last cleaning tank (2) in each group of tanks, the upper parts of the outer surfaces of the fixing plates (9) at two sides of the first cleaning tank (2) are provided with two parallel guide seats (92), the upper parts of the outer surfaces of the fixing plates (9) at two sides of the last cleaning tank (2) are provided with two parallel guide seats, the guide rod (921) is arranged in the guide seat (92), the upper end of the guide rod (921) is provided with a first rectangular plate (9211), the lower end of the guide rod (921) is provided with a second rectangular plate (9212), the upper surface of the first rectangular plate (9211) is respectively provided with a bearing piece (93), the long edge of the L-shaped lifting arm (261) is fixed on the bearing frame (26), the short edge of the L-shaped lifting arm (261) is fixed on the bearing piece (93), a hinge part (91) is arranged at the lower end of the outer surface of the fixing plate (9), a first special-shaped hinge plate (911) is hinged on the hinge part (91), the upper end of the first special-shaped hinge plate (911) is hinged with a roller (9111) which is abutted against the first rectangular plate (9211), a long hinge column (96) is hinged at the lower part of the first special-shaped hinge plate (911), the long hinge column (96) connects the first special-shaped hinge plates (911) of the two special-shaped hinge plates together, the lower end of the first, two pin joints are one on the other, long hinge post (96) hinge in last pin joint, first short hinge post (95) hinge on the pin joint of lower extreme, dwang (62) rotate connect on mount (114) in the front of first washing tank (2), second heterotypic articulated slab (94) hinge the both ends at dwang (62), first short hinge post (95) level hinge the lower part at second heterotypic articulated slab (94), second short hinge post (941) level hinge the upper portion at second heterotypic articulated slab (94), the other end of second short hinge post (941) is articulated with rotating piece (81) of cup jointing on the output shaft of reduction gear (8), reduction gear (8) are connected with third motor (63).

3. The full-automatic silicon wafer cleaning machine according to claim 1, wherein: the driving mechanism comprises a worm (97), a turbine (98), a belt wheel (7), a belt (71) and a fourth motor (64), fixing plates (9) are arranged at positions of a fixing frame (114) corresponding to two sides of the cleaning tank (2), three parallel guide bases (92) are arranged on the outer surface of each fixing plate (9), guide rods (921) are arranged in the guide bases (92) on two sides of each guide base (92), the worm (97) is arranged in the guide base (92) in the middle, driving plates (9213) are fixed at the upper ends of the worm (97) and the guide rods (921), L-shaped lifting arms (261) are fixed on the upper surfaces of two sides of the bearing frame (26), long sides of the L-shaped lifting arms (261) are fixed on the bearing frame (26), short sides of the L-shaped lifting arms (261) are fixed on the driving plates (9213), fixed bearing seats (1144) are arranged in the middle of the fixing plates (9), rolling shafts are arranged in the bearing seats (1144, turbine (98) cup joint on the rolling shaft and mesh with worm (97), band pulley (7) have been cup jointed to the rolling shaft near washing tank (2) one side, the tip of washing tank (2) is equipped with dwang (62), the both ends of dwang (62) are equipped with band pulley (7), band pulley (7) are gone up with dwang (62) of one side and are passed through belt (71) with epaxial band pulley (7) of rolling and are connected, dwang (62) are fixed in reduction gear (8), reduction gear (8) are connected with fourth motor (64).

4. The full-automatic silicon wafer cleaning machine according to claim 1, wherein: be equipped with a plurality of air exit (3) on the lateral wall of cleaning layer (111), be equipped with air door (31) on air exit (3).

5. The full-automatic silicon wafer cleaning machine as claimed in claim 4, wherein: the number of the air doors (31) is two, and the two air doors (31) are connected in a flange mode.

6. The full-automatic silicon wafer cleaning machine according to claim 1, wherein: the frame body (1) is coated with a German imported beige PVC layer (13).

7. The full-automatic silicon wafer cleaning machine according to claim 1, wherein: and a drying part (12) for drying the cleaned silicon wafer (4126) is arranged on one side of the cleaning part (11).

8. The full-automatic silicon wafer cleaning machine according to claim 1, wherein: one of the cleaning tanks (2) is an alkali tank (24), and the alkali tank (24) is formed by welding NPP materials.

9. The full-automatic silicon wafer cleaning machine according to claim 1, wherein: the other cleaning tanks (2) except the alkali tank (24) in the cleaning tank (2) are made of stainless steel.