CN107995780A - 一种新型高性能散热柔性电路板 - Google Patents
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Abstract
本发明公开一种新型高性能散热柔性电路板，该电路板包括线路板或铝基板；线路板包括两个涂覆聚酰亚胺层的铜箔相对压合而成，聚酰亚胺层相对压合，每个聚酰亚胺层厚度为18~35um，每个铜箔厚度为12~75um；铝基板自下而上依次包括铝板、聚酰亚胺层和铜箔，铝板厚度为0.3~2.0mm，聚酰亚胺层厚度为35~70um，铜箔厚度为12~75um；聚酰亚胺层包括质量百分比的以下组分：20~35%的热塑性聚酰亚胺胶水，30~50%的脂肪族改性热塑性聚酰亚胺胶水，1~2%的环氧树脂溶液，30~50%的纳米氧化铝导热粉。聚酰亚胺层作为绝缘层，其耐电压及柔韧性优于环氧树脂，绝缘层的厚度在同等耐电压测试条件下可降低至35um，同时可以改善产品弯折断裂区域的电压击穿问题。
Description
技术领域
本发明涉及绝缘材料技术领域，具体地说是一种新型高性能散热柔性电路板。
背景技术
目前电子产品越来越轻薄，对产品性能要求越来越高，故电子产品的散热需求越来越严苛。现有电路板中，普通的柔性线路板由于普通PI的散热性能差，柔性线路板一直未能找到很好的散热解决方案。而在传统LED用铝基板生产工艺中，使用环氧树脂添加导热粉的方法制作铝板和铜箔中间的绝缘导热层，由于环氧树脂耐电压及弯折后容易产生断裂的问题，故目前生产的铝基板绝缘层厚度在100um以上。
因此，亟需开发一种新型高性能散热柔性电路板。
发明内容
本发明主要针对上述存在的问题，提供了一种新型高性能散热柔性电路板。
本发明为了实现上述目的，采取以下技术方案予以实现：
一种新型高性能散热柔性电路板，所述电路板包括线路板或铝基板；
所述线路板包括两个涂覆聚酰亚胺层的铜箔相对压合而成，其中，聚酰亚胺层相对贴合压合，每个聚酰亚胺层厚度为18~35um，每个铜箔厚度为12~75um；
所述铝基板自下而上依次包括铝板、聚酰亚胺层和铜箔，所述铝板厚度为0.3~2.0mm，所述聚酰亚胺层厚度为35~70um，所述铜箔厚度为12~75um；
所述聚酰亚胺层包括质量百分比的以下组分：20~35%的热塑性聚酰亚胺胶水，30~50%的脂肪族改性热塑性聚酰亚胺胶水，1~2%的环氧树脂溶液，30~50%的纳米氧化铝导热粉。
优选地，所述热塑性聚酰亚胺胶水由热塑性聚酰亚胺树脂溶解于甲苯或环己酮溶剂中制30-50%得，固含量为20~40%。
优选地，所述脂肪族改性热塑性聚酰亚胺胶水由脂肪族改性热塑性聚酰亚胺树脂溶解于甲苯或环己酮溶剂中制得，固含量为20~40%。
优选地，所述环氧树脂溶液由三官能团或四官能团环氧树脂溶解于DMF或甲苯溶液中制得，固含量为30~80%。
优选地，所述线路板或铝基板在100~180℃℃低温下压合制得。
与现有技术相比，本发明的有益效果如下：
本发明在铜箔上直接涂布聚酰亚胺层，然后两个涂布聚酰亚胺层的铜箔对压后形成线路板，或者直接用铝板压合形成铝基板。聚酰亚胺层作为绝缘层，其耐电压及柔韧性优于环氧树脂，绝缘层的厚度在同等耐电压测试条件下可降低至35um，同时可以改善产品弯折断裂区域的电压击穿问题。
本发明的聚酰亚胺层中将热塑性聚酰亚胺树脂与脂肪族改性热塑性聚酰亚胺树脂共混，并混合环氧树脂溶液和纳米氧化铝导热粉。且在脂肪族改性热塑性聚酰亚胺树脂中，通过脂肪族基团柔性分子嵌段进刚性聚酰亚胺分子链中，形成软段与硬段的混合结构，降低热塑性聚酰亚胺反应温度，使本发明的聚酰亚胺层在100~180℃℃低温下的压合得以实现。
附图说明
图1是本发明中线路板的结构示意图；
图2是本发明中铝基板的结构示意图。
具体实施方式
下面结合实施例对本发明作进一步的描述，但需要说明的是，实施例并不对本发明要求保护范围的构成限制。
一种新型高性能散热柔性电路板，该电路板包括线路板或铝基板。
其中，如图1所示，线路板包括两个涂覆聚酰亚胺层2的铜箔1相对压合而成，其中，聚酰亚胺层2相对贴合压合，每个聚酰亚胺层2厚度为18~35um，每个铜箔1厚度为12~75um。
如图2所示，铝基板自下而上依次包括铝板5、聚酰亚胺层4和铜箔3，铝板5厚度为0.3~2.0mm，聚酰亚胺层4厚度为35~70um，铜箔3厚度为12~75um。
聚酰亚胺层2、4包括质量百分比的以下组分：20~35%的热塑性聚酰亚胺胶水，30~50%的脂肪族改性热塑性聚酰亚胺胶水，1~2%的环氧树脂溶液，30~50%的纳米氧化铝导热粉。
热塑性聚酰亚胺胶水由热塑性聚酰亚胺树脂溶解于甲苯或环己酮溶剂中制30-50%得，固含量为20~40%。
脂肪族改性热塑性聚酰亚胺胶水由脂肪族改性热塑性聚酰亚胺树脂溶解于甲苯或环己酮溶剂中制得，固含量为20~40%。
环氧树脂溶液由三官能团或四官能团环氧树脂溶解于DMF或甲苯溶液中制得，固含量为30~80%。
线路板或铝基板在100~180℃℃低温下压合制得。
与现有技术相比，本发明的有益效果如下：
本发明在铜箔上直接涂布聚酰亚胺层，然后两个涂布聚酰亚胺层的铜箔对压后形成线路板，或者直接用铝板压合形成铝基板。聚酰亚胺层作为绝缘层，其耐电压及柔韧性优于环氧树脂，绝缘层的厚度在同等耐电压测试条件下可降低至35um，同时可以改善产品弯折断裂区域的电压击穿问题。
本发明的聚酰亚胺层中将热塑性聚酰亚胺树脂与脂肪族改性热塑性聚酰亚胺树脂共混，并混合环氧树脂溶液和纳米氧化铝导热粉。且在脂肪族改性热塑性聚酰亚胺树脂中，通过脂肪族基团柔性分子嵌段进刚性聚酰亚胺分子链中，形成软段与硬段的混合结构，降低热塑性聚酰亚胺反应温度，使本发明的聚酰亚胺层在100~180℃℃低温下的压合得以实现。
以上对本发明实施例所提供的技术方案进行了详细介绍，本文中应用了具体个例对本发明实施例的原理以及实施方式进行了阐述，以上实施例的说明只适用于帮助理解本发明实施例的原理；同时，对于本领域的一般技术人员，依据本发明实施例，在具体实施方式以及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。
Claims (5)
1.一种新型高性能散热柔性电路板，其特征在于，所述电路板包括线路板或铝基板；
所述线路板包括两个涂覆聚酰亚胺层的铜箔相对压合而成，其中，聚酰亚胺层相对贴合压合，每个聚酰亚胺层厚度为18~35um，每个铜箔厚度为12~75um；
所述铝基板自下而上依次包括铝板、聚酰亚胺层和铜箔，所述铝板厚度为0.3~2.0mm，所述聚酰亚胺层厚度为35~70um，所述铜箔厚度为12~75um；
所述聚酰亚胺层包括质量百分比的以下组分：20~35%的热塑性聚酰亚胺胶水，30~50%的脂肪族改性热塑性聚酰亚胺胶水，1~2%的环氧树脂溶液，30~50%的纳米氧化铝导热粉。
2.根据权利要求1所述的一种新型高性能散热柔性电路板，其特征在于，所述热塑性聚酰亚胺胶水由热塑性聚酰亚胺树脂溶解于甲苯或环己酮溶剂中制得，固含量为20~40%。
3.根据权利要求1所述的一种新型高性能散热柔性电路板，其特征在于，所述脂肪族改性热塑性聚酰亚胺胶水由脂肪族改性热塑性聚酰亚胺树脂溶解于甲苯或环己酮溶剂中制得，固含量为20~40%。
4.根据权利要求1所述的一种新型高性能散热柔性电路板，其特征在于，所述环氧树脂溶液由三官能团或四官能团环氧树脂溶解于DMF或甲苯溶液中制得，固含量为30~80%。
5.根据权利要求1所述的一种新型高性能散热柔性电路板，其特征在于，所述线路板或铝基板在100~180℃低温下压合制得。
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| CN111716773A (zh) * | 2020-06-11 | 2020-09-29 | 四川铂利明德科技有限公司 | 一种高性能改性聚酰亚胺可挠性基板的制备方法 |
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