CN107993739A - A kind of thin film switch conductive silver paste and preparation method thereof - Google Patents
A kind of thin film switch conductive silver paste and preparation method thereof Download PDFInfo
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- CN107993739A CN107993739A CN201711182403.2A CN201711182403A CN107993739A CN 107993739 A CN107993739 A CN 107993739A CN 201711182403 A CN201711182403 A CN 201711182403A CN 107993739 A CN107993739 A CN 107993739A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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Abstract
The invention discloses a kind of thin film switch conductive silver paste, it is characterised in that the mass fraction of raw material and each raw material contained by the conductive silver paste is：70 80 parts of silver powder, 10 15 parts of epoxy resin, 50 60 parts of ethylene glycol, 46 parts of calgon, 35 parts of polyvinylpyrrolidone, 58 parts of diluent, 25 parts of methyl tetrahydrochysene phenol, 0.5 1 parts of active additive；The invention also discloses a kind of preparation method of thin film switch conductive silver paste, including (1) pretreatment silver powder；(2) resin mixture liquor is prepared；(3) polyvinylpyrrolidone and active additive are added in resin mixture liquor, is uniformly mixed, obtains mixed liquor；(4) other raw material ultrasonic disperses are added.Conductive silver paste produced by the present invention is functional, have can cold curing, the features such as electric conductivity of circuit is high after curing, and volatile organic matter is few, can be applied among full printed electronics technology.
Description
Technical field
The invention belongs to membrane switch technology field, and in particular, to a kind of thin film switch conductive silver paste and its preparation
Method.
Background technology
Thin film switch is the switch made on flexible makrolon or polyester film with electrocondution slurry printing contact circuit,
It is one kind of contact switch.The construction of thin film switch in itself is very simple, it be by decoration panel, upper/lower electrode film, separation layer into
Row is laminating to be formed, and whole surface is a plane.The advantages of thin film switch is that entirety is flat, the bodily form is thin, light-weight, dust-proof property
Well, have excellent water-resistance, belong to semi-closed structure.In addition, the selection free degree of panel design and color is big, its application range forward direction platform
The fields such as formula computer, duplicator, facsimile machine, toy, personal computer, word processor extend.With ergonomics and U.S.
It is more and more important in electronic product to learn design, Chinese thin film switch manufacturer is being directed to developing brightness higher, style more
Abundant product is to tackle increasing for demand.Since the design of thin film switch is full of flourishes, and can the various exquisite patterns of chromatography to help
User is helped quickly and easily to identify its function, therefore in the consumer electronics in low-power consumption, household electrical appliance and commercial Application just
Gradually substitution electric mechanical switch.In addition, thin film switch is by its shape sense of touch is good, reflection-proof and is explained added with function, toy,
The application fields such as mobile phone, PDA, calculator, remote controler, computor-keyboard and Medical Devices also receive welcome.
It is one kind critically important in electrocondution slurry species applied to the conductive silver paste on thin film switch, it is mainly by conduction
Phase, organic carrier and property-modifying additive composition.Electronic market is developed to inexpensive direction at present, domestic low-temperature solidified silver paste
Year, usage amount was more than 120 tons.Produce low cost, high performance electrocondution slurry is our technical problems in the urgent need to address.
The content of the invention
In view of the above shortcomings of the prior art, the present invention provides a kind of thin film switch conductive silver paste and its preparation side
Method.
The purpose of the present invention can be achieved through the following technical solutions：
A kind of thin film switch conductive silver paste, the parts by weight of raw material and each raw material contained by the conductive silver paste are：Silver powder
70-80 parts, it is 10-15 parts of epoxy resin, 50-60 parts of ethylene glycol, 4-6 parts of calgon, 3-5 parts of polyvinylpyrrolidone, dilute
Release 5-8 parts of agent, 2-5 parts of methyl tetrahydrochysene phenol, 0.5-1 parts of active additive；
The preparation method of the thin film switch conductive silver paste, includes the following steps：
(1) succinic acid and ethanol are mixed, configure the mixed solution of succinic acid-ethanol, silver powder is added in mixed solution,
Ultrasonic 20-30min, centrifuges, removes supernatant liquor, continue to be washed 3-5 times with ethanol, be dried in vacuo 1-1.5h at room temperature,
Silver powder must be pre-processed；
(2) epoxy resin is added in ethylene glycol, is heated to 70-80 DEG C, constant temperature stirring obtains resin and mix up to being completely dissolved
Close liquid；
(3) polyvinylpyrrolidone and active additive are added in resin mixture liquor, is uniformly mixed, must mix
Liquid；
(4) pretreatment silver powder is added in mixed liquor, while adds calgon and diluent, heating stirring is equal
It is even, after cooling, methyl tetrahydrochysene phenol and active additive are added, ultrasonic disperse 5-7min, is made conductive silver paste.
The a diameter of 40-70um of silver powder particles.
The diluent is ethylene glycol or terpinol.
The active additive is polyethylene glycol.
A kind of preparation method of thin film switch conductive silver paste, includes the following steps：
(1) succinic acid and ethanol are mixed, configure the mixed solution of succinic acid-ethanol, silver powder is added in mixed solution,
Ultrasonic 20-30min, centrifuges, removes supernatant liquor, continue to be washed 3-5 times with ethanol, be dried in vacuo 1-1.5h at room temperature,
Silver powder must be pre-processed；
(2) epoxy resin is added in ethylene glycol, is heated to 70-80 DEG C, constant temperature stirring obtains resin and mix up to being completely dissolved
Close liquid；
(3) polyvinylpyrrolidone and active additive are added in resin mixture liquor, is uniformly mixed, must mix
Liquid；
(4) pretreatment silver powder is added in mixed liquor, while adds calgon and diluent, heating stirring is equal
It is even, after cooling, methyl tetrahydrochysene phenol and active additive are added, ultrasonic disperse 5-7min, is made conductive silver paste.
The volume ratio of succinic acid and ethanol is 1 in succinic acid-alcohol mixed solution in the step (1):0.6-0.9.
Beneficial effects of the present invention：
The present invention uses ethylene glycol or terpinol as diluent, and ethylene glycol and terpinol can improve the flowing of resin well
The wetability of property and resin to silver powder particles；Using methyl tetrahydrochysene phenol as curing agent, conductive silver paste can be made in a few hours
It is interior curing and it is smaller for Conductivity；, only can be notable with addition minimal amount as the polyethylene glycol of active additive
Improve the printing of silver paste；Dispersant of the calgon as conductive silver paste, can be such that silver powder and epoxy resin uniformly divides
Dissipate in solution, improve electric conductivity；The present invention silver powder is pre-processed, can improve conductive silver paste cured film electric conductivity and
Switching performance；Conductive silver paste produced by the present invention is functional, have can cold curing, the electric conductivity of circuit after curing
The features such as height, volatile organic matter is few, it can be applied among full printed electronics technology.
Embodiment
Technical scheme is clearly and completely described below in conjunction with embodiment, it is clear that described reality
It is only part of the embodiment of the present invention to apply example, instead of all the embodiments.Based on the embodiments of the present invention, this area is general
All other embodiment that logical technical staff is obtained without creative efforts, belongs to what the present invention protected
Scope.
Embodiment 1
A kind of thin film switch conductive silver paste, the mass fraction of raw material and each raw material contained by the conductive silver paste are：Silver powder
70 parts, 10 parts of epoxy resin, 50 parts of ethylene glycol, 4 parts of calgon, 3 parts of polyvinylpyrrolidone, 5 parts of ethylene glycol, methyl four
2 parts of hydrogen phenol, 0.5 part of polyethylene glycol.
The silver powder is micron order silver powder, a diameter of 40um of silver powder particles.
A kind of preparation method of thin film switch conductive silver paste, includes the following steps：
(1) succinic acid and ethanol are mixed, configure the mixed solution of succinic acid-ethanol, silver powder is added in mixed solution,
Ultrasonic 20min, centrifuges, removes supernatant liquor, continue to be washed 3 times with ethanol, be dried in vacuo 1h at room temperature, must pre-process silver
Powder；
(2) epoxy resin is added in ethylene glycol, is heated to 70 DEG C, constant temperature stirring obtains resin mixing up to being completely dissolved
Liquid；
(3) polyvinylpyrrolidone and active additive are added in resin mixture liquor, is uniformly mixed, must mix
Liquid；
(4) pretreatment silver powder is added in mixed liquor, while adds calgon and diluent, heating stirring is equal
It is even, after cooling, methyl tetrahydrochysene phenol and polyethylene glycol are added, ultrasonic disperse 5min, is made conductive silver paste.
The volume ratio of succinic acid and ethanol is 1 in succinic acid-alcohol mixed solution in the step (1):0.6.
Embodiment 2
A kind of thin film switch conductive silver paste, the mass fraction of raw material and each raw material contained by the conductive silver paste are：Silver powder
75 parts, 13 parts of epoxy resin, 55 parts of ethylene glycol, 5 parts of calgon, 4 parts of polyvinylpyrrolidone, 7 parts of terpinol, methyl four
3 parts of hydrogen phenol, 0.8 part of polyethylene glycol.
The silver powder is micron order silver powder, a diameter of 50um of silver powder particles.
A kind of preparation method of thin film switch conductive silver paste, includes the following steps：
(1) succinic acid and ethanol are mixed, configure the mixed solution of succinic acid-ethanol, silver powder is added in mixed solution,
Ultrasonic 25min, centrifuges, removes supernatant liquor, continue to be washed 4 times with ethanol, be dried in vacuo 1.2h at room temperature, must pre-process
Silver powder；
(2) epoxy resin is added in ethylene glycol, is heated to 75 DEG C, constant temperature stirring obtains resin mixing up to being completely dissolved
Liquid；
(3) polyvinylpyrrolidone and active additive are added in resin mixture liquor, is uniformly mixed, must mix
Liquid；
(4) pretreatment silver powder is added in mixed liquor, while adds calgon and diluent, heating stirring is equal
It is even, after cooling, methyl tetrahydrochysene phenol and polyethylene glycol are added, ultrasonic disperse 6min, is made conductive silver paste.
The volume ratio of succinic acid and ethanol is 1 in succinic acid-alcohol mixed solution in the step (1):0.8.
Embodiment 3
A kind of thin film switch conductive silver paste, the mass fraction of raw material and each raw material contained by the conductive silver paste are：Silver powder
80 parts, 15 parts of epoxy resin, 60 parts of ethylene glycol, 6 parts of calgon, 5 parts of polyvinylpyrrolidone, 8 parts of ethylene glycol, methyl four
5 parts of hydrogen phenol, 1 part of polyethylene glycol.
The silver powder is micron order silver powder, a diameter of 70um of silver powder particles.
A kind of preparation method of thin film switch conductive silver paste, includes the following steps：
(1) succinic acid and ethanol are mixed, configure the mixed solution of succinic acid-ethanol, silver powder is added in mixed solution,
Ultrasonic 30min, centrifuges, removes supernatant liquor, continue to be washed 3-5 times with ethanol, be dried in vacuo 1.5h at room temperature, obtain pre- place
Manage silver powder；
(2) epoxy resin is added in ethylene glycol, is heated to 80 DEG C, constant temperature stirring obtains resin mixing up to being completely dissolved
Liquid；
(3) polyvinylpyrrolidone and active additive are added in resin mixture liquor, is uniformly mixed, must mix
Liquid；
(4) pretreatment silver powder is added in mixed liquor, while adds calgon and diluent, heating stirring is equal
It is even, after cooling, methyl tetrahydrochysene phenol and polyethylene glycol are added, ultrasonic disperse 7min, is made conductive silver paste.
The volume ratio of succinic acid and ethanol is 1 in succinic acid-alcohol mixed solution in the step (1):0.9.
Present invention disclosed above preferred embodiment is only intended to help and illustrates the present invention.Preferred embodiment is not detailed
All details are described, are not limited the invention to the specific embodiments described.Obviously, according to the content of this specification,
It can make many modifications and variations.This specification is chosen and specifically describes these embodiments, is in order to preferably explain the present invention
Principle and practical application so that skilled artisan can be best understood by and utilize the present invention.The present invention is only
Limited by claims and its four corner and equivalent.
Claims (6)
- A kind of 1. thin film switch conductive silver paste, it is characterised in that the parts by weight of raw material and each raw material contained by the conductive silver paste Number is：70-80 parts of silver powder, 10-15 parts of epoxy resin, 50-60 parts of ethylene glycol, 4-6 parts of calgon, polyvinylpyrrolidone 3-5 parts, 5-8 parts of diluent, 2-5 parts of methyl tetrahydrochysene phenol, 0.5-1 parts of active additive；The preparation method of the thin film switch conductive silver paste, includes the following steps：(1) succinic acid and ethanol are mixed, configures the mixed solution of succinic acid-ethanol, silver powder is added in mixed solution, ultrasound 20-30min, centrifuges, removes supernatant liquor, continue to be washed 3-5 times with ethanol, be dried in vacuo 1-1.5h at room temperature, obtain pre- Handle silver powder；(2) epoxy resin is added in ethylene glycol, is heated to 70-80 DEG C, constant temperature stirring obtains resin mixing up to being completely dissolved Liquid；(3) polyvinylpyrrolidone and active additive are added in resin mixture liquor, is uniformly mixed, obtains mixed liquor；(4) pretreatment silver powder is added in mixed liquor, while adds calgon and diluent, heating stirring is uniform, cold But after, methyl tetrahydrochysene phenol and active additive are added, ultrasonic disperse 5-7min, is made conductive silver paste.
- 2. a kind of thin film switch conductive silver paste according to claim 1, it is characterised in that the silver powder particles are a diameter of 40-70um。
- 3. a kind of thin film switch conductive silver paste according to claim 1, it is characterised in that the diluent is ethylene glycol Or terpinol.
- 4. a kind of thin film switch conductive silver paste according to claim 1, it is characterised in that the active additive is poly- Ethylene glycol.
- 5. the preparation method of a kind of thin film switch conductive silver paste according to claim 1, it is characterised in that including as follows Step：(1) succinic acid and ethanol are mixed, configures the mixed solution of succinic acid-ethanol, silver powder is added in mixed solution, ultrasound 20-30min, centrifuges, removes supernatant liquor, continue to be washed 3-5 times with ethanol, be dried in vacuo 1-1.5h at room temperature, obtain pre- Handle silver powder；(2) epoxy resin is added in ethylene glycol, is heated to 70-80 DEG C, constant temperature stirring obtains resin mixing up to being completely dissolved Liquid；(3) polyvinylpyrrolidone and active additive are added in resin mixture liquor, is uniformly mixed, obtains mixed liquor；(4) pretreatment silver powder is added in mixed liquor, while adds calgon and diluent, heating stirring is uniform, cold But after, methyl tetrahydrochysene phenol and active additive are added, ultrasonic disperse 5-7min, is made conductive silver paste.
- A kind of 6. preparation method of thin film switch conductive silver paste according to claim 5, it is characterised in that the step (1) volume ratio of succinic acid and ethanol is 1 in succinic acid-alcohol mixed solution in:0.6-0.9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711182403.2A CN107993739A (en) | 2017-11-23 | 2017-11-23 | A kind of thin film switch conductive silver paste and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711182403.2A CN107993739A (en) | 2017-11-23 | 2017-11-23 | A kind of thin film switch conductive silver paste and preparation method thereof |
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| CN107993739A true CN107993739A (en) | 2018-05-04 |
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| CN201711182403.2A Pending CN107993739A (en) | 2017-11-23 | 2017-11-23 | A kind of thin film switch conductive silver paste and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109448886A (en) * | 2018-10-31 | 2019-03-08 | 刘紫嫣 | The preparation method and product of conductive silver paste |
| CN111180107A (en) * | 2020-01-06 | 2020-05-19 | 青岛理工大学 | Preparation method for electric field driven injection of micro-nano 3D printing nano silver paste |
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| CN104240793A (en) * | 2013-06-08 | 2014-12-24 | 北京中科纳通电子技术有限公司 | Nanometer conductive silver paste and preparing method thereof |
| CN104900296A (en) * | 2015-06-12 | 2015-09-09 | 江苏广信感光新材料股份有限公司 | Conductive silver paste for membrane switch, and preparation method for conductive silver paste |
| CN105618734A (en) * | 2016-01-12 | 2016-06-01 | 昆明理工大学 | Method for surface modification of flaky silver powder |
| CN106281135A (en) * | 2015-06-12 | 2017-01-04 | 中国振华集团云科电子有限公司 | A kind of preparation method of the impregnated silver pulp of resistance to mold pressing |
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2017
- 2017-11-23 CN CN201711182403.2A patent/CN107993739A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104240793A (en) * | 2013-06-08 | 2014-12-24 | 北京中科纳通电子技术有限公司 | Nanometer conductive silver paste and preparing method thereof |
| CN104900296A (en) * | 2015-06-12 | 2015-09-09 | 江苏广信感光新材料股份有限公司 | Conductive silver paste for membrane switch, and preparation method for conductive silver paste |
| CN106281135A (en) * | 2015-06-12 | 2017-01-04 | 中国振华集团云科电子有限公司 | A kind of preparation method of the impregnated silver pulp of resistance to mold pressing |
| CN105618734A (en) * | 2016-01-12 | 2016-06-01 | 昆明理工大学 | Method for surface modification of flaky silver powder |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109448886A (en) * | 2018-10-31 | 2019-03-08 | 刘紫嫣 | The preparation method and product of conductive silver paste |
| CN111180107A (en) * | 2020-01-06 | 2020-05-19 | 青岛理工大学 | Preparation method for electric field driven injection of micro-nano 3D printing nano silver paste |
| CN111180107B (en) * | 2020-01-06 | 2021-09-21 | 青岛理工大学 | Preparation method for electric field driven injection of micro-nano 3D printing nano silver paste |
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Application publication date: 20180504 |