CN101699566A - Low-temperature solidification electric-conduction slurry - Google Patents
Low-temperature solidification electric-conduction slurry Download PDFInfo
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- CN101699566A CN101699566A CN200910218709A CN200910218709A CN101699566A CN 101699566 A CN101699566 A CN 101699566A CN 200910218709 A CN200910218709 A CN 200910218709A CN 200910218709 A CN200910218709 A CN 200910218709A CN 101699566 A CN101699566 A CN 101699566A
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Abstract
The invention provides a low-temperature solidification electric-conduction slurry with less than 50 percent of silver content; the electric-conduction slurry comprises the following raw materials by mass percent: 45-50 percent of electric-conduction silver powder, 40-45 percent of solvent, 7-15 percent of macromolecule resin and 0-5 percent of additives; the electric-conduction silver powder is silver strip powder and silver ball powder, the solvent is more than one or two kinds of DBE, diethylene glycol monoethyl ether acetate and butyl cellosolve acetate, the macromolecule resin adopts one or two kinds of chloride-vinyl acetate resin and polyester resin, and the additives are one or two kinds coupling agents or flatting agents; in the invention, the strict using requirements of customers on resistance can be met while reducing the cost; in addition, the low-temperature solidification electric-conduction slurry has less than 50 percent of silver content, and the square resistance can reach 13megohm/square.
Description
Technical field:
The present invention relates to a kind of low-temperature cured conductive paste, can be used for fields such as the printing of keyboard circuit, thin film switch.
Background technology:
At present, the low-temperature solidified silver paste technology reaches its maturity.In industry competition fierce more, cruel today, reducing cost becomes low-temperature solidified silver paste manufacturer and uses producer's Focal Point of Common Attention.Now, ACHESON, Du Pont, Teng Cang, the external silver slurry of prosperous magnitude production firm have all released the low-temperature cured conductive silver slurry of low silver content, and the low-temperature solidified silver paste silver content of main flow is about 51-55% on the market.Conductive silver paste that domestic manufacturers attempt to release 50% silver content is arranged at present with further cost squeeze, cause its side's resistance higher relatively because its silver content is low, general side's resistance resistance all will be more than 15m Ω/.Like this, just can't satisfy for comparatively harsh client's user demand of conductive silver paste resistance requirement.
Summary of the invention:
Deficiency at above-mentioned prior art exists the present invention proposes a kind of silver content at the low-temperature cured conductive paste below 50%, and this product can satisfy client requirement and the otherwise demand harsh more to the resistance aspect when reducing cost.
The objective of the invention is to be achieved through the following technical solutions:
A kind of low-temperature cured conductive paste is characterized in that this electrocondution slurry made by the raw material that comprises following component and mass percentage content:
Conduction silver powder: 45-50%,
Solvent: 40-45%,
Macromolecule resin: 7-15%,
Additive: 0-5%.
In the above-mentioned conduction silver powder, containing mass percentage content is the silver strip powder of 70-80% and the ping-pong ball powder that mass percentage content is 20-30%.
The particle diameter of described silver strip powder is 6-10 μ m, and tap density is 0.9-2.0g/ml; Described ping-pong ball powder directly is 0.1-8 μ m, and tap density is 1.0-4.0g/ml.
Described solvent is one or more the mixture in DBE, ethyl carbitol acetate, the butyl cellosolve acetate.
Described macromolecule resin is selected from one or both combinations in vinyl chloride-vinyl acetate resin, the mylar.
Described additive is one or both combinations in coupling agent or the levelling agent.
Described coupling agent can be organo silane coupling agent, and levelling agent can be Bi Ke chemistry BYK auxiliary agent.
The present invention compared with prior art, the beneficial effect that has is, the present invention can satisfy the user demand that the resistance aspect is required harsh more client when reducing cost, low-temperature cured conductive paste silver content provided by the invention is lower than 50%, and its side's resistance resistance can reach 13m Ω/.
Embodiment:
A kind of low-temperature cured conductive paste is characterized in that this electrocondution slurry made by the raw material that comprises following component and mass percentage content:
Conduction silver powder: 45-50%,
Solvent: 40-45%,
Macromolecule resin: 7-15%,
Additive: 0-5%.
In the above-mentioned conduction silver powder, containing mass percentage content is the silver strip powder of 70-80% and the ping-pong ball powder that mass percentage content is 20-30%.
The particle diameter of described silver strip powder is 6-10 μ m, and tap density is 0.9-2.0g/ml; Described ping-pong ball powder directly is 0.1-8 μ m, and tap density is 1.0-4.0g/ml.
Described solvent is one or more the mixture in DBE, ethyl carbitol acetate, the butyl cellosolve acetate.
Described macromolecule resin is selected from one or both combinations in vinyl chloride-vinyl acetate resin, the mylar.
Described additive is one or both combinations in coupling agent or the levelling agent.
Described coupling agent can be organo silane coupling agent, and levelling agent can be Bi Ke chemistry BYK auxiliary agent.
Below by specific embodiment content of the present invention is described further.
Embodiment 1:
Selecting particle diameter for use is 6～7 μ m, and tap density is that flake silver powder and the particle diameter of 1.6～2.0g/ml is 5～8 μ m, and tap density is that the spherical silver powder of 1.0～2.5g/ml mixes, and its ratio (mass percent) is 70: 30.
Solvent is DBE.
Selecting macromolecule resin for use is DOW Chemical VAGH type vinyl chloride-vinyl acetate resin.
Each constituent mass degree is:
Conduction silver powder: 50%,
Solvent: 40%,
Macromolecule resin: 9%,
Coupling agent 1%
At first solvent is become the organic carrier of uniform state with macromolecule resin high-speed mixing under 70 ℃ condition, solvent and macromolecule resin mass ratio are 40: 9; The silver powder that will conduct electricity again is pre-mixed, and then mixed powder is added in the organic carrier, adds the organo silane coupling agent A-1020 of Dow Corning Corporation, after mixer stirring and three-roller grinding, obtains final electrocondution slurry.This slurry can print on flexible base, board, and baking temperature is 130 ℃, and be 30 minutes drying time.
Embodiment 2:
Selecting particle diameter for use is 7～9 μ m, and tap density is that flake silver powder and the particle diameter of 1.2～1.6g/ml is 2～5 μ m, and tap density is that the spherical silver powder of 3.0～4.0g/ml mixes, and its ratio is 80: 20.
Solvent is ethyl carbitol acetate and butyl cellosolve acetate by 3: 2 mixed.
Selecting macromolecule resin for use is that DOW Chemical VAGH type vinyl chloride-vinyl acetate resin and Japan weave 270 type mylar according to 4: 1 mixed.
Each constituent content is:
Conduction silver powder: 45%,
Solvent: 40%,
Macromolecule resin: 12.5%,
Coupling agent 1.5%,
Levelling agent 1.0%,
At first solvent is become the organic carrier of uniform state with macromolecule resin high-speed mixing under 70 ℃ condition, solvent and macromolecule resin mass ratio are 40: 12.5; The silver powder that will conduct electricity again is pre-mixed, and then mixed powder is added in the organic carrier, adds Dow Corning Corporation's organo silane coupling agent and levelling agent Bi Ke chemistry BYK auxiliary agent, after mixer stirring and three-roller grinding, obtains final electrocondution slurry.This slurry can print on flexible base, board, and baking temperature is 130 ℃, and be 30 minutes drying time.
Embodiment 3:
Selecting particle diameter for use is 9～10 μ m, and tap density is that flake silver powder and the particle diameter of 0.9～1.2g/ml is 0.1～2.0 μ m, and tap density is that the spherical silver powder of 2.5～3.0g/ml mixes, and its ratio is 75: 25.
Solvent is the ethyl carbitol acetate.
Selecting macromolecule resin for use is that Japan weaves 270 types and 650 type mylar according to 7: 3 mixed.
Each constituent content is:
Conduction silver powder: 48%,
Solvent: 42%,
Macromolecule resin: 9%,
Levelling agent 1.0%,
At first solvent is become the organic carrier of uniform state with macromolecule resin high-speed mixing under 70 ℃ condition, solvent and macromolecule resin mass ratio are 42: 9; The silver powder that will conduct electricity again is pre-mixed, and then mixed powder is added in the organic carrier, adds levelling agent Bi Ke chemistry BYK auxiliary agent, after mixer stirring and three-roller grinding, obtains final electrocondution slurry.This slurry can print on flexible base, board, and baking temperature is 130 ℃, and be 30 minutes drying time.
Claims (7)
1. low-temperature cured conductive paste, it is characterized in that: this electrocondution slurry is made by the raw material that comprises following component and mass percentage content:
Conduction silver powder: 45-50%,
Solvent: 40-45%,
Macromolecule resin: 7-15%,
Additive: 0-5%.
2. low-temperature cured conductive paste according to claim 1 is characterized in that: in the described conduction silver powder, containing mass percentage content is the silver strip powder of 70-80% and the ping-pong ball powder that mass percentage content is 20-30%.
3. low-temperature cured conductive paste according to claim 2 is characterized in that: the particle diameter of described silver strip powder is 6-10 μ m, and tap density is 0.9-2.0g/ml; Described ping-pong ball powder directly is 0.1-8 μ m, and tap density is 1.0-4.0g/ml.
4. low-temperature cured conductive paste according to claim 1 is characterized in that: described solvent is one or more the mixture in DBE, ethyl carbitol acetate, the butyl cellosolve acetate.
5. low-temperature cured conductive paste according to claim 1 is characterized in that: described macromolecule resin is selected from one or both combinations in vinyl chloride-vinyl acetate resin, the mylar.
6. low-temperature cured conductive paste according to claim 1 is characterized in that: described additive is one or both combinations in coupling agent or the levelling agent.
7. low-temperature cured conductive paste according to claim 6 is characterized in that: described coupling agent can be organo silane coupling agent, and levelling agent can be Bi Ke chemistry BYK auxiliary agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN200910218709A CN101699566A (en) | 2009-10-30 | 2009-10-30 | Low-temperature solidification electric-conduction slurry |
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| CN200910218709A CN101699566A (en) | 2009-10-30 | 2009-10-30 | Low-temperature solidification electric-conduction slurry |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101866704A (en) * | 2010-06-29 | 2010-10-20 | 彩虹集团公司 | Low-cost environmental-protecting halogen-free conductive slurry |
| CN101935438A (en) * | 2010-09-27 | 2011-01-05 | 彩虹集团公司 | Resin composite for filling through hole and preparation method thereof |
| CN101937737A (en) * | 2010-09-27 | 2011-01-05 | 彩虹集团公司 | Low-temperature curing conductive slurry and preparation method thereof |
| CN102938259A (en) * | 2012-10-31 | 2013-02-20 | 彩虹集团公司 | Low-temperature cured electrical conductive paste and preparing method thereof |
| CN104752006A (en) * | 2015-02-13 | 2015-07-01 | 佛山市中彩科技有限公司 | Preparation method of conductive silver paste |
| CN104927698A (en) * | 2014-03-17 | 2015-09-23 | 北京中科纳通电子技术有限公司 | Low-temperature conductive adhesive capable of being used for high-precision circuits |
| CN105244076A (en) * | 2015-11-02 | 2016-01-13 | 云南师范大学 | Environment-friendly and low-filling conductive silver paste and preparation method thereof |
| CN105788700A (en) * | 2014-12-18 | 2016-07-20 | 上海宝银电子材料有限公司 | Quick-dry type silver paste used for PCB through hole and preparation method for quick-dry type silver paste |
| CN113077924A (en) * | 2021-04-13 | 2021-07-06 | 上海玖银电子科技有限公司 | Quick-drying silver paste for graphene heating film and preparation method thereof |
-
2009
- 2009-10-30 CN CN200910218709A patent/CN101699566A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101866704A (en) * | 2010-06-29 | 2010-10-20 | 彩虹集团公司 | Low-cost environmental-protecting halogen-free conductive slurry |
| CN101935438A (en) * | 2010-09-27 | 2011-01-05 | 彩虹集团公司 | Resin composite for filling through hole and preparation method thereof |
| CN101937737A (en) * | 2010-09-27 | 2011-01-05 | 彩虹集团公司 | Low-temperature curing conductive slurry and preparation method thereof |
| CN101937737B (en) * | 2010-09-27 | 2012-01-04 | 彩虹集团公司 | Low-temperature curing conductive slurry and preparation method thereof |
| CN101935438B (en) * | 2010-09-27 | 2012-05-09 | 彩虹集团公司 | Resin composite for filling through hole and preparation method thereof |
| CN102938259A (en) * | 2012-10-31 | 2013-02-20 | 彩虹集团公司 | Low-temperature cured electrical conductive paste and preparing method thereof |
| CN104927698A (en) * | 2014-03-17 | 2015-09-23 | 北京中科纳通电子技术有限公司 | Low-temperature conductive adhesive capable of being used for high-precision circuits |
| CN105788700A (en) * | 2014-12-18 | 2016-07-20 | 上海宝银电子材料有限公司 | Quick-dry type silver paste used for PCB through hole and preparation method for quick-dry type silver paste |
| CN105788700B (en) * | 2014-12-18 | 2017-08-11 | 上海宝银电子材料有限公司 | It is a kind of for quick-dry type silver paste of PCB perforations and preparation method thereof |
| CN104752006A (en) * | 2015-02-13 | 2015-07-01 | 佛山市中彩科技有限公司 | Preparation method of conductive silver paste |
| CN105244076A (en) * | 2015-11-02 | 2016-01-13 | 云南师范大学 | Environment-friendly and low-filling conductive silver paste and preparation method thereof |
| CN105244076B (en) * | 2015-11-02 | 2017-05-31 | 云南师范大学 | A kind of environment-friendly type, low loading conductive silver paste and preparation method thereof |
| CN113077924A (en) * | 2021-04-13 | 2021-07-06 | 上海玖银电子科技有限公司 | Quick-drying silver paste for graphene heating film and preparation method thereof |
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Open date: 20100428 |