CN108424686A - A kind of preparation method of the flexible highly conductive ink of low-temperature setting - Google Patents
A kind of preparation method of the flexible highly conductive ink of low-temperature setting Download PDFInfo
- Publication number
- CN108424686A CN108424686A CN201810472456.6A CN201810472456A CN108424686A CN 108424686 A CN108424686 A CN 108424686A CN 201810472456 A CN201810472456 A CN 201810472456A CN 108424686 A CN108424686 A CN 108424686A
- Authority
- CN
- China
- Prior art keywords
- conductive ink
- added
- electrically conductive
- preparation
- prepared
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A kind of preparation method of the flexible highly conductive ink of low-temperature setting, step are：(1) prepared by Nanometer Copper；(2) binding liquid is configured；(3) prepared by mixed slurry；(4) electrically conductive ink is prepared；(5) electrically conductive ink coating is prepared.The present invention is using copper nanoparticle as filler, oxidizable disadvantage during outer wrapping overcomes and prepares electrically conductive ink, with carboxylic ternary chlorine vinegar resin to Toughening Epoxy Resin, improve the flexibility of electrically conductive ink, reduce volume resistivity, and using 2 ethyl, 4 methylimidazole as curing agent, reduce the glass transition temperature of glued membrane.
Description
Technical field
The present invention relates to electrically conductive ink technical field more particularly to a kind of preparation sides of the flexible highly conductive ink of low-temperature setting
Method.
Background technology
In recent years, the forming technique by conductive ink application in polymeric film surface flexible has been known in less radio-frequency
Not, the fields such as printed wiring board, electronics panel type display, sensor, solar cell and thin film switch are widely used,
Electrically conductive ink is usually made of binding resin, conductive filler, solvent and related auxiliaries, for conductive filler, especially selects metal
When material, it is usually required mainly for consider that factors, the ideal metallic conductive inks such as volume resistivity, price and operability should have valence
Lattice are cheap, be easy to produce, preserve and ink-jet and deposited and post-processing after throw away the characteristic with high conductivity, for gold,
Silver, copper this 3 kinds of common metal materials, silver-colored volume resistivity is minimum, and copper takes second place, and gold is maximum, but in price, the price of copper
It is therefore, gold and money kind metal is obviously uneconomical for substituting common electronic circuit far below silver and gold, in contrast,
The price of copper can then meet the cost requirement of large area printing, meanwhile, utilize conducting wire made from nano-copper conductive ink
It is eager to excel made from anti-electron transfer capabilities ratio silver, but copper nanoparticle surface-active is very high, is particularly easy to aoxidize in air
At cuprous oxide and copper oxide, in addition, requirement of the electrically conductive ink for binding material is also very high, currently used epoxy resin is solid
Although having excellent adhesion strength after change, brittleness is larger, is not suitable for being used in flexible circuit, ethene-vinyl acetate copolymerization
There is excellent flexibility after object and EVA resin and urethane cures film forming, but to the poor adhesive force of base material.
Invention content
The present invention provides a kind of preparation method with good flexible highly conductive ink in order to solve the above problem.
The technical solution used in the present invention：
A kind of preparation method of the flexible highly conductive ink of low-temperature setting, step are：
(1) prepared by Nanometer Copper：With CuSO4It is point with polyvinylpyrrolidone using ascorbic acid as reducing agent for precursor
Powder reacts in ethylene glycol, prepare grain size 80~120nm Nanometer Copper, by Nanometer Copper be placed in PVP, oleic acid, lactic acid and
It heats while stirring in gelatin solution and carries out organic coating, copper nanoparticle is made in ultraviolet light sintering；
(2) binding liquid is configured：Carboxylic ternary chlorine vinegar resin E15/45M is weighed in container, then successively into container
Ethyl acetate, butyl acetate, ethylene glycol ether acetate and diethylene glycol ether acetate is added, stirring keeps E51/45M abundant
E51/45M solution is made in dissolving；
(3) prepared by mixed slurry：Wetting dispersing agent is added into E15/45M solution, copper nanoparticle is added after stirring, then
It is transferred in ultrasonic disperse machine after being stirred, carries out that epoxy resin E51 is added during ultrasonic disperse, continue after stirring evenly
Ultrasonic 15min, is made mixed slurry；
(4) electrically conductive ink is prepared：It weighs 2-ethyl-4-methylimidazole 2E4MI to be added in mixed slurry, stirring is allowed to dissolve
It is transferred in ceramic mortar and grinds after completely, electrically conductive ink is made；
(5) electrically conductive ink coating is prepared：By the electrically conductive ink of preparation by screen printer print in PET film, sample
Product are transferred to after placing 15~30min at room temperature in baking oven, and electrically conductive ink coating is made after being heating and curing.
Ethyl acetate, butyl acetate, ethylene glycol ether acetate and diethylene glycol ether vinegar are added in the step (2)
The mass ratio of acid esters is：3:4:2:1.
The mass concentration of E15/45M solution is in the step (2)：7%~12%.
The 2E4MI being added in E51 and step (4) that the E15/45M and step (3) being added in the step (2) are added
In mass ratio 3:3:4.
The temperature being heating and curing in the step (5) is 55 DEG C~60 DEG C.
Beneficial effects of the present invention：The present invention is overcome in outer wrapping using copper nanoparticle as filler and is prepared electrically conductive ink mistake
Oxidizable disadvantage in journey improves the flexibility of electrically conductive ink with carboxylic ternary chlorine vinegar resin to Toughening Epoxy Resin,
Volume resistivity is reduced, and using 2-ethyl-4-methylimidazole as curing agent, reduces the glass transition temperature of glued membrane.
Specific implementation mode
A kind of preparation method of the flexible highly conductive ink of low-temperature setting, step are：
(1) prepared by Nanometer Copper：With CuSO4It is point with polyvinylpyrrolidone using ascorbic acid as reducing agent for precursor
Powder reacts in ethylene glycol, prepare grain size 80~120nm Nanometer Copper, by Nanometer Copper be placed in PVP, oleic acid, lactic acid and
It heats while stirring in gelatin solution and carries out organic coating, copper nanoparticle is made in ultraviolet light sintering；
(2) binding liquid is configured：Carboxylic ternary chlorine vinegar resin E15/45M is weighed in container, then successively into container
Ethyl acetate, butyl acetate, ethylene glycol ether acetate and diethylene glycol ether acetate is added, stirring keeps E51/45M abundant
E51/45M solution is made in dissolving；
(3) prepared by mixed slurry：Wetting dispersing agent is added into E15/45M solution, copper nanoparticle is added after stirring, then
It is transferred in ultrasonic disperse machine after being stirred, carries out that epoxy resin E51 is added during ultrasonic disperse, continue after stirring evenly
Ultrasonic 15min, is made mixed slurry；
(4) electrically conductive ink is prepared：It weighs 2-ethyl-4-methylimidazole 2E4MI to be added in mixed slurry, stirring is allowed to dissolve
It is transferred in ceramic mortar and grinds after completely, electrically conductive ink is made；
(5) electrically conductive ink coating is prepared：By the electrically conductive ink of preparation by screen printer print in PET film, sample
Product are transferred to after placing 15~30min at room temperature in baking oven, and electrically conductive ink coating is made after being heating and curing.
Ethyl acetate, butyl acetate, ethylene glycol ether acetate and diethylene glycol ether vinegar are added in the step (2)
The mass ratio of acid esters is：3:4:2:1.
The mass concentration of E15/45M solution is in the step (2)：7%~12%.
The 2E4MI being added in E51 and step (4) that the E15/45M and step (3) being added in the step (2) are added
In mass ratio 3:3:4.
The temperature being heating and curing in the step (5) is 55 DEG C~60 DEG C.
Embodiment 1
A kind of preparation method of the flexible highly conductive ink of low-temperature setting, step are：
(1) prepared by Nanometer Copper：With CuSO4It is point with polyvinylpyrrolidone using ascorbic acid as reducing agent for precursor
Powder reacts in ethylene glycol, prepare grain size 80~120nm Nanometer Copper, by Nanometer Copper be placed in PVP, oleic acid, lactic acid and
It heats while stirring in gelatin solution and carries out organic coating, copper nanoparticle is made in ultraviolet light sintering；
(2) binding liquid is configured：The carboxylic ternary chlorine vinegar resin E15/45M of 60g are weighed in container, then successively to container
Middle addition ethyl acetate, butyl acetate, ethylene glycol ether acetate and diethylene glycol ether acetate, mass ratio are：3:4:
2:1, stirring makes E51/45M fully dissolve, and the E51/45M solution that mass concentration is 7% is made；
(3) prepared by mixed slurry：Wetting dispersing agent is added into E15/45M solution, 500g copper nanoparticles are added after stirring,
Then it is transferred in ultrasonic disperse machine after being stirred, carries out that 60g epoxy resin E51 are added during ultrasonic disperse, stirring is equal
Continue ultrasound 15min after even, mixed slurry is made；
(4) electrically conductive ink is prepared：It weighs 80g 2-ethyl-4-methylimidazoles 2E4MI to be added in mixed slurry, stirring is allowed to
It is transferred in ceramic mortar and grinds after dissolving completely, electrically conductive ink is made；
(5) electrically conductive ink coating is prepared：By the electrically conductive ink of preparation by screen printer print in PET film, sample
Product are transferred to after placing 15~30min at room temperature in baking oven, and electrically conductive ink coating is made after being heated to 55 DEG C~60 DEG C solidifications.
Embodiment 2
A kind of preparation method of the flexible highly conductive ink of low-temperature setting, step are：
(1) prepared by Nanometer Copper：With CuSO4It is point with polyvinylpyrrolidone using ascorbic acid as reducing agent for precursor
Powder reacts in ethylene glycol, prepare grain size 80~120nm Nanometer Copper, by Nanometer Copper be placed in PVP, oleic acid, lactic acid and
It heats while stirring in gelatin solution and carries out organic coating, copper nanoparticle is made in ultraviolet light sintering；
(2) binding liquid is configured：The carboxylic ternary chlorine vinegar resin E15/45M of 30g are weighed in container, then successively to container
Middle addition 81g ethyl acetate, 108g butyl acetates, 54g ethylene glycol ether acetates and 27g diethylene glycol ether acetates, are stirred
Mixing makes E51/45M fully dissolve, and the E51/45M solution that mass concentration is 10% is made；
(3) prepared by mixed slurry：Wetting dispersing agent is added into E15/45M solution, 250g copper nanoparticles are added after stirring,
Then it is transferred in ultrasonic disperse machine after being stirred, carries out that 30g epoxy resin E51 are added during ultrasonic disperse, stirring is equal
Continue ultrasound 15min after even, mixed slurry is made；
(4) electrically conductive ink is prepared：It weighs 40g 2-ethyl-4-methylimidazoles 2E4MI to be added in mixed slurry, stirring is allowed to
It is transferred in ceramic mortar and grinds after dissolving completely, electrically conductive ink is made；
(5) electrically conductive ink coating is prepared：By the electrically conductive ink of preparation by screen printer print in PET film, sample
Product are transferred to after placing 20min at room temperature in baking oven, and electrically conductive ink coating is made after being heated to 55 DEG C~60 DEG C solidifications.
Embodiment 3
A kind of preparation method of the flexible highly conductive ink of low-temperature setting, step are：
(1) prepared by Nanometer Copper：With CuSO4It is point with polyvinylpyrrolidone using ascorbic acid as reducing agent for precursor
Powder reacts in ethylene glycol, prepare grain size 80~120nm Nanometer Copper, by Nanometer Copper be placed in PVP, oleic acid, lactic acid and
It heats while stirring in gelatin solution and carries out organic coating, copper nanoparticle is made in ultraviolet light sintering；
(2) binding liquid is configured：The carboxylic ternary chlorine vinegar resin E15/45M of 60g are weighed in container, then successively to container
Middle addition ethyl acetate, butyl acetate, ethylene glycol ether acetate and diethylene glycol ether acetate, mass ratio are：3:4:
2:1, stirring makes E51/45M fully dissolve, and the E51/45M solution that mass concentration is 12% is made；
(3) prepared by mixed slurry：Wetting dispersing agent is added into E15/45M solution, 500g copper nanoparticles are added after stirring,
Then it is transferred in ultrasonic disperse machine after being stirred, carries out that 60g epoxy resin E51 are added during ultrasonic disperse, stirring is equal
Continue ultrasound 15min after even, mixed slurry is made；
(4) electrically conductive ink is prepared：It weighs 80g 2-ethyl-4-methylimidazoles 2E4MI to be added in mixed slurry, stirring is allowed to
It is transferred in ceramic mortar and grinds after dissolving completely, electrically conductive ink is made；
(5) electrically conductive ink coating is prepared：By the electrically conductive ink of preparation by screen printer print in PET film, sample
Product are transferred to after placing 20min at room temperature in baking oven, and electrically conductive ink coating is made after being heated to 55 DEG C~60 DEG C solidifications.
Claims (5)
1. a kind of preparation method of the flexible highly conductive ink of low-temperature setting, which is characterized in that its preparation process is：
(1) prepared by Nanometer Copper：With CuSO4For precursor, using ascorbic acid as reducing agent, using polyvinylpyrrolidone as dispersant,
It is reacted in ethylene glycol, prepares grain size in the Nanometer Copper of 80~120nm, Nanometer Copper is placed in PVP, oleic acid, lactic acid and gelatin
It heats while stirring in liquid and carries out organic coating, copper nanoparticle is made in ultraviolet light sintering；
(2) binding liquid is configured：Carboxylic ternary chlorine vinegar resin E15/45M is weighed in container, then be added successively into container
Ethyl acetate, butyl acetate, ethylene glycol ether acetate and diethylene glycol ether acetate, stirring make E51/45M fully dissolve,
E51/45M solution is made；
(3) prepared by mixed slurry：Wetting dispersing agent is added into E15/45M solution, copper nanoparticle is added after stirring, then stirs
It is transferred in ultrasonic disperse machine after mixing, carries out that epoxy resin E51 is added during ultrasonic disperse, continue ultrasound after stirring evenly
Mixed slurry is made in 15min；
(4) electrically conductive ink is prepared：It weighs 2-ethyl-4-methylimidazole 2E4MI to be added in mixed slurry, it is complete that stirring is allowed to dissolving
After be transferred in ceramic mortar and grind, electrically conductive ink is made；
(5) electrically conductive ink coating is prepared：By the electrically conductive ink of preparation by screen printer print in PET film, sample exists
It is transferred in baking oven after placing 15~30min at room temperature, electrically conductive ink coating is made after being heating and curing.
2. the preparation method of the flexible highly conductive ink of low-temperature setting according to claim 1, which is characterized in that the step
Suddenly (2) middle mass ratio that ethyl acetate, butyl acetate, ethylene glycol ether acetate and diethylene glycol ether acetate is added is：
3:4:2:1。
3. the preparation method of the flexible highly conductive ink of low-temperature setting according to claim 1, which is characterized in that the step
Suddenly the mass concentration of E15/45M solution is in (2)：7%~12%.
4. the preparation method of the flexible highly conductive ink of low-temperature setting according to claim 1, which is characterized in that the step
Suddenly the 2E4MI in mass ratio 3 being added in E51 and step (4) that the E15/45M and step (3) being added in (2) are added:3:4.
5. the preparation method of the flexible highly conductive ink of low-temperature setting according to claim 1, which is characterized in that the step
Suddenly the temperature being heating and curing in (5) is 55 DEG C~60 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810472456.6A CN108424686A (en) | 2018-05-17 | 2018-05-17 | A kind of preparation method of the flexible highly conductive ink of low-temperature setting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810472456.6A CN108424686A (en) | 2018-05-17 | 2018-05-17 | A kind of preparation method of the flexible highly conductive ink of low-temperature setting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108424686A true CN108424686A (en) | 2018-08-21 |
Family
ID=63163387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810472456.6A Withdrawn CN108424686A (en) | 2018-05-17 | 2018-05-17 | A kind of preparation method of the flexible highly conductive ink of low-temperature setting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108424686A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109448918A (en) * | 2018-09-19 | 2019-03-08 | 中国科学院化学研究所 | Transparent conductive substrate and its preparation method and application |
| CN113327721A (en) * | 2021-08-04 | 2021-08-31 | 西安宏星电子浆料科技股份有限公司 | Preparation method of low-temperature cured conductive copper paste |
-
2018
- 2018-05-17 CN CN201810472456.6A patent/CN108424686A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109448918A (en) * | 2018-09-19 | 2019-03-08 | 中国科学院化学研究所 | Transparent conductive substrate and its preparation method and application |
| CN113327721A (en) * | 2021-08-04 | 2021-08-31 | 西安宏星电子浆料科技股份有限公司 | Preparation method of low-temperature cured conductive copper paste |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103339685B (en) | Conductive paste and its manufacture method | |
| US8070986B2 (en) | Silver paste for forming conductive layers | |
| CN101805538B (en) | Lower-temperature sintered conductive ink | |
| CN108133768A (en) | A kind of high conductivity low temperature curing type electrocondution slurry and preparation method thereof | |
| CN104575686B (en) | A kind of inexpensive Copper-cladding Aluminum Bar conductive silver paste and preparation method thereof | |
| CN101342596B (en) | Process for preparing nm-class silver powder | |
| CN101629057A (en) | Nano conductive adhesive and preparation method thereof | |
| CN107502067A (en) | A kind of high temperature sintering heating electrically conductive ink and preparation method thereof | |
| CN108770194A (en) | The preparation method of conductive silver paste used for printed circuit | |
| CN108447587A (en) | A kind of novel fast curing low-temperature conductive silver paste and preparation method thereof | |
| CN108424686A (en) | A kind of preparation method of the flexible highly conductive ink of low-temperature setting | |
| CN108039225A (en) | Environment-friendly type low resistance graphene carbon fiber conductive carbon paste and preparation method thereof | |
| CN101935480A (en) | Conductive ink and preparation method thereof | |
| CN108912847A (en) | A kind of graphene composite Nano copper conductive ink composition and preparation method thereof | |
| CN106297950B (en) | A kind of conductive silver paste and preparation method thereof | |
| CN110217998A (en) | A kind of unleaded low temperature sintering conductive silver paste and the preparation method and application thereof | |
| CN104177925A (en) | Low-resistivity high-stability conductive ink and preparation method thereof | |
| CN117487496B (en) | Conductive silver adhesive based on modified silver powder and preparation method thereof | |
| CN114171255A (en) | Composite conductive functional silver paste and preparation method thereof | |
| CN104603218B (en) | Anisotropic conductive film, method of attachment and conjugant | |
| CN102820072A (en) | Conductive paste | |
| CN108735338A (en) | A kind of preparation method of epoxy resin silver powder composite conducting silver paste | |
| CN108257708A (en) | A kind of preparation method of ultraviolet light curing conductive silver paste | |
| CN109777202A (en) | A kind of electronic tag electrically conductive ink and preparation method thereof | |
| CN104599740B (en) | Conductive silver paste with nanocarbon |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180821 |