CN108447587A - A kind of novel fast curing low-temperature conductive silver paste and preparation method thereof - Google Patents

A kind of novel fast curing low-temperature conductive silver paste and preparation method thereof Download PDF

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Publication number
CN108447587A
CN108447587A CN201710239539.6A CN201710239539A CN108447587A CN 108447587 A CN108447587 A CN 108447587A CN 201710239539 A CN201710239539 A CN 201710239539A CN 108447587 A CN108447587 A CN 108447587A
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silver paste
resin
conductive silver
temperature conductive
solvent
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CN201710239539.6A
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幸七四
李文琳
黄富春
李章炜
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Sino Platinum Metals Co Ltd
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Sino Platinum Metals Co Ltd
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Priority to CN201710239539.6A priority Critical patent/CN108447587A/en
Publication of CN108447587A publication Critical patent/CN108447587A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables

Abstract

A kind of novel fast curing low-temperature conductive silver paste of present invention offer and preparation method thereof, belongs to the electric slurry field of informational function new material.The ingredient and mass percent of rapid curing low-temperature conductive silver paste be:Silver powder 45~55%, thermoplastic resin 5~12%, thermosetting resin 0.5~1%, thermal curing agents 0.1~0.5%, auxiliary agent 1~2%, solvent 30~45%, the sum of each component weight percent are 100%.Conductive silver paste hardening time prepared by the present invention is short, and 1 2min is fully cured under the conditions of 150 DEG C;It is printed suitable for silk screen precision, resolution ratio can reach 100 × 100 μm, adhesive force 5B after solidification, hardness > 2H, 46 μm of print thickness, and 10 resistance change rates of positive reflexed are less than 280%, and resistivity is less than 3.5 × 10‑5Ω.cm。

Description

A kind of novel fast curing low-temperature conductive silver paste and preparation method thereof
Technical field
The present invention relates to a kind of novel fast curing low-temperature conductive silver pastes and preparation method thereof, and it is quick to be especially used for low temperature Cured electrocondution slurry field, belongs to electronic information function new material and technical field of electronic encapsulation.
Background technology
Conductive silver paste using silver powder as the electrically conductive ink of conducting function phase, can silk-screen printing, coating or bat printing in various base materials On, by curing or being sintered, form electrode film.According to solidification temperature, conductive silver paste can be divided into high temperature sintering type silver paste, medium temperature Slug type silver paste and low temperature curing type silver paste.Wherein low temperature curing type silver paste solidification temperature is between 100-200 DEG C, solidification temperature It is relatively low, it is small to the destructiveness damage of base material, it is widely used in the electricity such as keyboard, touch screen, smart card, radio frequency identification, thin film switch Sub- industrial circle, wherein gently, thin and flexibility circuit, play a significant role in foldable keyboard, touch screen.
Currently, flexible circuitry has been the indispensable device of the high-grade, precision and advanced development of electronic product, mainly with macromolecule flexible Material is base material, is electrode circuit after low-temperature conductive silver paste silk-screen printing solidification.Low-temperature conductive silver paste can be with by silk-screen printing Precision layout circuit, does not damage flexibility polymer base material by low-temperature setting, this requires silver paste to have good thixotroping and fast Fast curing characteristics has high-resolution, scratch-resistant, bending resistance after printing.Such as Chinese invention patent, publication number:CN 105551571A, low-temperature fast-curing conductive silver paste of denomination of invention and preparation method thereof, discloses a kind of low-temperature conductive silver paste, by The raw material of following weight parts forms:5-15 parts of thermoplastic resin, 0-0.5 parts of thermosetting resin, 0.001-0.1 parts of thermal initiator, 10-30 parts of solvent, 50-75 parts of silver powder.Although low-temperature fast-curing conductive silver paste, mainly touch screen silver paste, without resistance to Bending, and 7-15min when solidification.A kind of novel fast curing low-temperature conductive silver paste and preparation method thereof, hardening time is shorter 1-2min has excellent bending resistance.
Invention content
The technical problem to be solved in the invention is to overcome the deficiencies of the prior art and provide a kind of novel fast curing low Warm conductive silver paste meets under flexible parent metal requirement performance condition, the hardening time of electrocondution slurry is greatly shortened.
The present invention needs another each technical problem for solving to be to provide and a kind of preparing above-mentioned rapid curing low-temperature conductive silver The preparation method of slurry.
The technical problem to be solved in the invention is achieved through the following technical solutions:A kind of novel fast curing low temperature Conductive silver paste, composition and weight percent are:Silver powder 45~55%, thermoplastic resin 5~12%, thermosetting resin 0.5~ 1%, thermal curing agents 0.1~0.5%, auxiliary agent 1~2%, solvent 30~40%, the sum of each component weight percent is 100%.
Above-mentioned morphologies are sheet, and surface hydrophobic processing, radius-thickness ratio 10-60, particle size range is 0.1-5 μm, compares table Area 0.5-1.5g/m2, tap density 2.0-3.5g/cm3.The silver powder can meet has stronger compatibility with organic carrier With excellent electric conductivity, slurry density is moderate, is suitable for accurate printing.
Above-mentioned thermoplastic resin can be flexibility polyester resin, polyurethane resin, polyurethane acrylic resin, acrylic acid One or more of resin.
Above-mentioned thermosetting resin can be one or more of aldehyde ketone resin, saturated polyester resin, epoxy resin.
Above-mentioned thermal curing agents can be 2-ethyl-4-methylimidazole, hexa, one kind in isocyanates or several Kind.
Above-mentioned auxiliary agent can be one or more of organobentonite, aerosil, modified urea and modified poly ester.
Above-mentioned solvent is dimethyl succinate, dimethyl glutarate, dimethyl adipate, diethylene glycol ether acetic acid One or more of ester, isophorone.
A kind of preparation method of novel fast curing low-temperature conductive silver paste of the present invention, comprises the following steps that:By group Raw material is weighed at the mass percent of raw material, thermoplastic resin and thermosetting resin first is added in solvent, after dissolving completely, shows Micro mirror is observed without auxiliary agent is added after particle and floccule, and high speed dispersion obtains organic carrier;Silver powder is added in organic carrier, The dispersion of planetary dispersion machine, then Strong shear is dispersed to fineness and is less than 5 μm on ceramic three-roll grinder, 500 mesh steel wire net filtrations It gets product.
The mechanism of action of the present invention:A kind of novel fast curing low-temperature conductive silver paste meets resistivity, adhesive force, hardness, spy It is not bending resistance, this has higher requirement to resin, solvent, silver powder and auxiliary agent.The present invention designs rapid cure system and adopts With bicomponent system, wherein thermoplastic resin provides bending resistance, and small molecule thermosetting resin is crosslinked with curing agent, enhancing attachment Property and hardness, insoluble auxiliary agent, which is scattered in slurry, to be provided enough channels and promotes organic solvent volatilization.Low-temperature solidified silver paste needs Using flake silver powder, there are more contact points, electric conductivity more preferable in the slurry.
Beneficial effects of the present invention:Hardening time is short, and under the conditions of 150 DEG C, 1-2min is fully cured;Silk screen precision prints Brush, resolution ratio can reach 100 × 100 μm;Adhesive force 5B after solidification, hardness > 2H, 4-6 μm of print thickness;10 electricity of positive reflexed Resistive rate is less than 280%;Resistivity is less than 3.5 × 10-5Ω.cm。
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below to the specific reality of the present invention It applies mode and details is further described, but the present invention is not limited to ranges as described below, therefore the present invention is not by tool described below The limitation of body details.
Embodiment 1
A kind of novel fast curing low-temperature conductive silver paste, composition and weight percent are:Silver powder 48%, thermoplastic resin 8%, thermosetting resin 1%, thermal curing agents 0.5%, auxiliary agent 2%, solvent 40.5%.Wherein at flake silver powder surface hydrophobic Reason, radius-thickness ratio 10-40, particle size range are 0.1-4 μm, specific surface area 1.2g/m2, tap density 2.5g/cm3;Thermoplastic resin is The polyurethane of -12 DEG C of glass transition temperature;Thermosetting resin is the aldehyde ketone resin of hydroxyl value 100;Curing agent is isocyanates;Auxiliary agent is Organobentonite;Solvent is 20% dimethyl succinate, 60% dimethyl glutarate, 20% adipic acid diformazan by weight percent Ester forms.
A kind of preparation method of novel fast curing low-temperature conductive silver paste of the present invention, comprises the following steps that:By composition The mass percent of raw material weighs raw material, after solvent dissolving completely is added in thermoplastic resin and thermosetting resin first, microscope Without auxiliary agent is added after particle and floccule, high speed dispersion obtains organic carrier for observation;Silver powder, planet are added in organic carrier Formula dispersion machine disperses, and then Strong shear is dispersed to fineness less than 5 μm on ceramic three-roll grinder, and 500 mesh steel wire net filtrations to obtain the final product Finished product.
Properties of product:150 DEG C of solidification temperature, hardening time, 2min was fully cured, 100 × 100 μm of resolution ratio, attached after solidification Put forth effort 5B, hardness > 2H, prints 4-6 μm of thickness of dry film, 10 resistance change rates 60% of positive reflexed, resistivity 2.6 × 10-5Ω .cm。
Embodiment 2
A kind of novel fast curing low-temperature conductive silver paste, composition and weight percent are:Silver powder 50%, thermoplastic resin 8%, thermosetting resin 1%, thermal curing agents 0.5%, auxiliary agent 2%, solvent 38.5%.Wherein at flake silver powder surface hydrophobic Reason, radius-thickness ratio 20-50, particle size range are 0.1-5 μm, specific surface area 1.0g/m2, tap density 3.0g/cm3;Thermoplastic resin is The polyurethane that 16 DEG C of glass transition temperature;Thermosetting resin is the aldehyde ketone resin of hydroxyl value 150;Curing agent is isocyanates;Auxiliary agent is Modified urea;Solvent by weight percent be 16% dimethyl succinate, 48% dimethyl glutarate, 16% dimethyl adipate, 20% isophorone.
A kind of preparation method of novel fast curing low-temperature conductive silver paste of the present invention, comprises the following steps that:By composition The mass percent of raw material weighs raw material, and thermoplastic resin and thermosetting resin first is added in solvent after dissolving completely, micro- For sem observation without auxiliary agent is added after particle and floccule, high speed dispersion obtains organic carrier;Silver powder is added in organic carrier, row Planetary dispersion machine disperses, and then Strong shear is dispersed to fineness less than 5 μm on ceramic three-roll grinder, and 500 mesh steel wire net filtrations are Obtain finished product.
Properties of product:150 DEG C of solidification temperature, hardening time, 1min was fully cured, 100 × 100 μm of resolution ratio, attached after solidification Put forth effort 5B, hardness > 2H, prints 4-6 μm of thickness of dry film, 10 resistance change rates 40% of positive reflexed, resistivity 2.2 × 10-5Ω .cm。
Embodiment 3
A kind of novel fast curing low-temperature conductive silver paste, composition and weight percent are:Silver powder 50%, thermoplastic resin 8%, thermosetting resin 1%, thermal curing agents 0.3%, auxiliary agent 0.5%, solvent 40.2%.Wherein at flake silver powder surface hydrophobic Reason, radius-thickness ratio 10-60, particle size range are 0.1-3.5 μm, specific surface area 1.4g/m2, tap density 3.2g/cm3;Thermoplastic resin For flexibility polyester resin;Thermosetting resin is the epoxy resin of epoxide equivalent 800-1100;Curing agent is 2- ethyl -4- first Base imidazoles;Auxiliary agent is aerosil;Solvent is 16% dimethyl succinate, 48% glutaric acid diformazan by weight percent Ester, 16% dimethyl adipate, 20% diethylene glycol ether acetate composition.
A kind of preparation method of novel fast curing low-temperature conductive silver paste, comprises the following steps that:By constitutive material Mass percent weighs raw material, after solvent dissolving completely is added in thermoplastic resin and thermosetting resin first, micro- sem observation without Auxiliary agent is added after particle and floccule, high speed dispersion obtains organic carrier;Silver powder, planetary dispersion are added in organic carrier Machine disperses, and then Strong shear is dispersed to fineness less than 5 μm on ceramic three-roll grinder, and 500 mesh steel wire net filtrations are got product.
Properties of product:150 DEG C of solidification temperature, hardening time, 2min was fully cured, 100 × 100 μm of resolution ratio, attached after solidification To put forth effort 5B, hardness > 2H, prints 4-6 μm of thickness of dry film, 10 resistance change rates of positive reflexed are less than 240%, resistivity 3.5 × 10-5Ω.cm.
Embodiment 4
A kind of novel fast curing low-temperature conductive silver paste, composition and weight percent are:Silver powder 50%, thermoplastic resin 8%, thermosetting resin 1%, thermal curing agents 0.3%, auxiliary agent 2%, solvent 38.7%.Wherein at flake silver powder surface hydrophobic Reason, radius-thickness ratio 10-50, particle size range are 0.1-3.5 μm, specific surface area 1.0g/m2, tap density 3.2g/cm3;Thermoplastic resin For polyurethane acrylic resin;Thermosetting resin is the epoxy resin of epoxide equivalent 1000-1200;Curing agent is hexa-methylene four Amine;Auxiliary agent is organobentonite;Solvent is 20% dimethyl succinate, 60% dimethyl glutarate, 20% by weight percent Dimethyl adipate forms.
A kind of preparation method of novel fast curing low-temperature conductive silver paste, comprises the following steps that:By constitutive material Mass percent weighs raw material, after solvent dissolving completely is added in thermoplastic resin and thermosetting resin first, micro- sem observation without Auxiliary agent is added after particle and floccule, high speed dispersion obtains organic carrier;Silver powder, planetary dispersion are added in organic carrier Machine disperses, and then Strong shear is dispersed to fineness less than 5 μm on ceramic three-roll grinder, and 500 mesh steel wire net filtrations are got product.
Properties of product:150 DEG C of solidification temperature, hardening time, 2min was fully cured, 100 × 100 μm of resolution ratio, attached after solidification To put forth effort 5B, hardness > 2H, prints 4-6 μm of thickness of dry film, 10 resistance change rates of positive reflexed are less than 120%, resistivity 2.8 × 10-5Ω.cm。
Embodiment 5
A kind of novel fast curing low-temperature conductive silver paste, composition and weight percent are:Silver powder 50%, thermoplastic resin 8%, thermosetting resin 1%, thermal curing agents 0.5%, auxiliary agent 1%, solvent 39.5%.Wherein at flake silver powder surface hydrophobic Reason, radius-thickness ratio 10-60, particle size range are 0.1-5.0 μm, specific surface area 0.6g/m2, tap density 2.2g/cm3;Thermoplastic resin For acrylic resin;Thermosetting resin is saturated polyester resin;Curing agent is isocyanates;Auxiliary agent is modified poly ester;Solvent by Weight percent is 20% dimethyl succinate, 60% dimethyl glutarate, 20% dimethyl adipate composition.
A kind of preparation method of novel fast curing low-temperature conductive silver paste, comprises the following steps that:By constitutive material Mass percent weighs raw material, after solvent dissolving completely is added in thermoplastic resin and thermosetting resin first, micro- sem observation without Auxiliary agent is added after particle and floccule, high speed dispersion obtains organic carrier;Silver powder, planetary dispersion are added in organic carrier Machine disperses, and then Strong shear is dispersed to fineness less than 5 μm on ceramic three-roll grinder, and 500 mesh steel wire net filtrations are got product.
Properties of product:150 DEG C of solidification temperature, hardening time, 1min was fully cured, 100 × 100 μm of resolution ratio, attached after solidification To put forth effort 5B, hardness > 2H, prints 4-6 μm of thickness of dry film, 10 resistance change rates of positive reflexed are less than 280%, resistivity 3.0 × 10-5Ω.cm。
Embodiment 6
A kind of novel fast curing low-temperature conductive silver paste, composition and weight percent are:Silver powder 50%, thermoplastic resin 8%, thermosetting resin 1%, thermal curing agents 0.5%, auxiliary agent 2%, solvent 38.5%.Wherein at flake silver powder surface hydrophobic Reason, radius-thickness ratio 10-60, particle size range are 0.5-3.5 μm, specific surface area 1.4g/m2, tap density 2.9g/cm3;Thermoplastic resin For acrylic resin;Thermosetting resin is saturated polyester resin;Curing agent is isocyanates;Auxiliary agent is organobentonite;Solvent By weight percent be 20% dimethyl succinate, 60% dimethyl glutarate, 20% dimethyl adipate form.
A kind of preparation method of novel fast curing low-temperature conductive silver paste of the present invention, comprises the following steps that:By group Raw material is weighed at the mass percent of raw material, it is micro- after solvent dissolving completely is added in thermoplastic resin and thermosetting resin first For sem observation without auxiliary agent is added after particle and floccule, high speed dispersion obtains organic carrier;Silver powder is added in organic carrier, row Planetary dispersion machine disperses, and then Strong shear is dispersed to fineness less than 5 μm on ceramic three-roll grinder, and 500 mesh steel wire net filtrations are Obtain finished product.
Properties of product:150 DEG C of solidification temperature, hardening time, 2min was fully cured, 100 × 100 μm of resolution ratio, attached after solidification To put forth effort 5B, hardness > 2H, prints 4-6 μm of thickness of dry film, 10 resistance change rates of positive reflexed are less than 210%, resistivity 2.5 × 10-5Ω.cm。
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously Cannot the limitation to the scope of the claims of the present invention therefore be interpreted as.It should be pointed out that for those of ordinary skill in the art For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention Protect range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.

Claims (9)

1. a kind of rapid curing low-temperature conductive silver paste, it is characterised in that:The composition and weight percent of the electrocondution slurry be:Silver powder 45~55%, thermoplastic resin 5~12%, thermosetting resin 0.5~1%, thermal curing agents 0.1~0.5%, auxiliary agent 1~2%, Solvent 30~45%, the sum of each component weight percent are 100%.
2. a kind of rapid curing low-temperature conductive silver paste as described in claim 1, it is characterised in that:The morphologies are sheet Silver powder, surface hydrophobic processing, radius-thickness ratio 10-60, particle size range are 0.1-5 μm, specific surface area 0.5-1.5g/m2, vibration density Spend 2.0-3.5g/cm3
3. a kind of rapid curing low-temperature conductive silver paste as described in claim 1, it is characterised in that:The thermoplastic resin, can For one or more of polyester resin, polyurethane resin, polyurethane acrylic resin, acrylic resin.
4. a kind of rapid curing low-temperature conductive silver paste as described in claim 1, it is characterised in that:The thermosetting resin, can For one or more of aldehyde ketone resin, unsaturated polyester resin, epoxy resin.
5. a kind of rapid curing low-temperature conductive silver paste as described in claim 1, it is characterised in that:The thermal curing agents can be One or more of imidazoles, aliphatic ammonia, isocyanates.
6. a kind of rapid curing low-temperature conductive silver paste as described in claim 1, it is characterised in that:The auxiliary agent can be organic One or more of bentonite, aerosil, carbon black, modified urea and modified poly ester.
7. a kind of rapid curing low-temperature conductive silver paste as described in claim 1, it is characterised in that:The solvent is succinic acid two One or more of methyl esters, dimethyl glutarate, dimethyl adipate, diethylene glycol ether acetate, isophorone.
8. a kind of preparation method of rapid curing low-temperature conductive silver paste, it is characterised in that specific steps include as follows:
(1) mass percentage composition of constitutive material is pressed:Silver powder 45~55%, thermoplastic resin 5~12%, thermosetting resin 0.5~1%, thermal curing agents 0.1~0.5%, auxiliary agent 1~2%, solvent 30~45% weighs raw material, first thermoplastic resin and Thermosetting resin is added in solvent, and after dissolving completely, micro- sem observation is without being added auxiliary agent after particle and floccule, high speed dispersion, Obtain organic carrier;
(2) silver powder is added in organic carrier, planetary dispersion machine dispersion, then Strong shear is dispersed on ceramic three-roll grinder Fineness is less than 5 μm, and 500 mesh steel wire net filtrations are got product.
9. a kind of preparation method of rapid curing low-temperature conductive silver paste, it is characterised in that specific steps include as follows:
It is by composition and weight percent:Silver powder 48%, thermoplastic resin 8%, thermosetting resin 1%, thermal curing agents 0.5%, Auxiliary agent 2%, solvent 40.5%.Wherein flake silver powder surface hydrophobic is handled, radius-thickness ratio 10-40, and particle size range is 0.1-4 μm, Specific surface area 1.2g/m2, tap density 2.5g/cm3;Thermoplastic resin is the polyurethane of -12 DEG C of glass transition temperature;Thermosetting property tree Fat is the aldehyde ketone resin of hydroxyl value 100;Curing agent is isocyanates;Auxiliary agent is organobentonite;Solvent is by weight percent 20% dimethyl succinate, 60% dimethyl glutarate, 20% dimethyl adipate composition, weigh raw material, first by thermoplasticity After solvent dissolving completely is added in resin and thermosetting resin, micro- sem observation divides without auxiliary agent, high speed are added after particle and floccule It dissipates, obtains organic carrier;Silver powder is added in organic carrier, planetary dispersion machine dispersion is then strong on ceramic three-roll grinder Shearing is dispersed to fineness and is less than 5 μm, and 500 mesh steel wire net filtrations are got product.
CN201710239539.6A 2017-04-13 2017-04-13 A kind of novel fast curing low-temperature conductive silver paste and preparation method thereof Pending CN108447587A (en)

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110136863A (en) * 2019-04-29 2019-08-16 南通天盛新能源股份有限公司 A kind of low-temperature conductive silver paste and preparation method thereof for HIT solar battery
CN110491543A (en) * 2019-07-30 2019-11-22 北京氦舶科技有限责任公司 A kind of conductive silver paste for touch screens and preparation method thereof
CN111243778A (en) * 2020-01-20 2020-06-05 常州烯奇新材料有限公司 Low-temperature conductive silver adhesive for screen printing and preparation method thereof
CN111370159A (en) * 2020-03-11 2020-07-03 中国人民解放军国防科技大学 Conductive paste and preparation method and application thereof
CN112712914A (en) * 2020-12-18 2021-04-27 中国振华集团云科电子有限公司 Ultralow ESR low-temperature curing silver paste and preparation method thereof
CN112927837A (en) * 2021-03-04 2021-06-08 北京梦之墨科技有限公司 Conductive paste and electronic device
CN113012844A (en) * 2021-03-01 2021-06-22 佛山市瑞纳新材科技有限公司 HJT low-temperature silver paste capable of being rapidly cured and sintered and preparation method thereof
CN113192663A (en) * 2021-04-25 2021-07-30 北京梦之墨科技有限公司 Enhanced conductive paste and electronic device
CN113394555A (en) * 2020-03-13 2021-09-14 昆山哈勃电波电子科技有限公司 Method for preparing antenna by adopting TDP silver paste transfer printing process
CN114709007A (en) * 2022-05-07 2022-07-05 湖南省国银新材料有限公司 Low-temperature quick-drying silver paste for conductive film and preparation method thereof
CN115083657A (en) * 2022-06-23 2022-09-20 贵研铂业股份有限公司 Low-temperature curing conductive silver paste and preparation method and application thereof

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CN105513668A (en) * 2016-01-25 2016-04-20 深圳市思迈科新材料有限公司 Conductive silver paste for nano-silver film low-temperature setting and preparation method thereof
CN105551571A (en) * 2016-02-01 2016-05-04 深圳市思迈科新材料有限公司 Low-temperature fast curing conductive silver paste and preparation method thereof
CN105632587A (en) * 2016-02-22 2016-06-01 昆山海斯电子有限公司 Epoxy resin conductive silver paste and preparation method thereof

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CN105513668A (en) * 2016-01-25 2016-04-20 深圳市思迈科新材料有限公司 Conductive silver paste for nano-silver film low-temperature setting and preparation method thereof
CN105551571A (en) * 2016-02-01 2016-05-04 深圳市思迈科新材料有限公司 Low-temperature fast curing conductive silver paste and preparation method thereof
CN105632587A (en) * 2016-02-22 2016-06-01 昆山海斯电子有限公司 Epoxy resin conductive silver paste and preparation method thereof

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110136863A (en) * 2019-04-29 2019-08-16 南通天盛新能源股份有限公司 A kind of low-temperature conductive silver paste and preparation method thereof for HIT solar battery
CN110136863B (en) * 2019-04-29 2020-09-15 南通天盛新能源股份有限公司 Low-temperature conductive silver paste for HIT solar cell and preparation method thereof
CN110491543A (en) * 2019-07-30 2019-11-22 北京氦舶科技有限责任公司 A kind of conductive silver paste for touch screens and preparation method thereof
CN111243778A (en) * 2020-01-20 2020-06-05 常州烯奇新材料有限公司 Low-temperature conductive silver adhesive for screen printing and preparation method thereof
CN111243778B (en) * 2020-01-20 2021-11-09 常州烯奇新材料有限公司 Low-temperature conductive silver adhesive for screen printing and preparation method thereof
CN111370159A (en) * 2020-03-11 2020-07-03 中国人民解放军国防科技大学 Conductive paste and preparation method and application thereof
CN113394555A (en) * 2020-03-13 2021-09-14 昆山哈勃电波电子科技有限公司 Method for preparing antenna by adopting TDP silver paste transfer printing process
CN112712914A (en) * 2020-12-18 2021-04-27 中国振华集团云科电子有限公司 Ultralow ESR low-temperature curing silver paste and preparation method thereof
CN113012844A (en) * 2021-03-01 2021-06-22 佛山市瑞纳新材科技有限公司 HJT low-temperature silver paste capable of being rapidly cured and sintered and preparation method thereof
CN112927837A (en) * 2021-03-04 2021-06-08 北京梦之墨科技有限公司 Conductive paste and electronic device
CN113192663A (en) * 2021-04-25 2021-07-30 北京梦之墨科技有限公司 Enhanced conductive paste and electronic device
CN114709007A (en) * 2022-05-07 2022-07-05 湖南省国银新材料有限公司 Low-temperature quick-drying silver paste for conductive film and preparation method thereof
CN115083657A (en) * 2022-06-23 2022-09-20 贵研铂业股份有限公司 Low-temperature curing conductive silver paste and preparation method and application thereof
CN115083657B (en) * 2022-06-23 2023-03-10 贵研铂业股份有限公司 Low-temperature curing conductive silver paste and preparation method and application thereof

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