CN105513668A - Conductive silver paste for nano-silver film low-temperature setting and preparation method thereof - Google Patents
Conductive silver paste for nano-silver film low-temperature setting and preparation method thereof Download PDFInfo
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- CN105513668A CN105513668A CN201610050079.8A CN201610050079A CN105513668A CN 105513668 A CN105513668 A CN 105513668A CN 201610050079 A CN201610050079 A CN 201610050079A CN 105513668 A CN105513668 A CN 105513668A
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- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
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Abstract
The invention discloses conductive silver paste for nano-silver film low-temperature setting and a preparation method thereof and belongs to the technical field of conductive paste. The conductive silver paste is mainly prepared from, by weight, 0.1-1 part of heat setting agent, 0.5-5 parts of heat setting resin, 0.5-10 parts of thermoplastic resin, 5-30 parts of solvent, 10-80 parts of silver powder and 0.1-5 parts of auxiliaries. The invention further provides a preparation method of the conductive silver paste for nano-silver film low-temperature setting. The prepared conductive silver paste can achieve rapid low-temperature setting, and has excellent adhesiveness and weather fastness on the surface of a nano-silver line transparent conductive film, and conductive performance and bending resistance are excellent. Meanwhile, the conductive silver paste can have excellent compatibility on the surface of an ITO.
Description
Technical field
The present invention relates to conductive silver paste field, particularly relate to a kind of nanometer silverskin low-temperature setting conductive silver paste and preparation method thereof.
Background technology
Touch technology starts develop rapidly from first generation iPhone in 2007, and technology alternates rapidly.Because ITO (tin indium oxide) has excellent conductivity, light transmission, traditional contact panel is nesa coating mainly with ITO.Along with the continuous increase of Intelligent worn device demand, the development of contact panel large scale, flexibility etc., the conductivity of ITO, the deficiency of bending resistance folding endurance more and more display, therefore, multiple ITO substitution material is created: nano-silver thread nesa coating, graphene transparent conductive film, carbon nano tube transparent conducting film, metal grill nesa coating, conducting polymer film etc.Wherein, nano-silver thread nesa coating is optimum in combination properties such as conductivity, bending resistance folding endurance, productions, Some substitute ITO conducting film.
Conductive silver paste to be undertaken the printing of to conducting film surface by screen printing mode usually, because ITO is different with nano-silver thread electrically conducting transparent membrane superficial tissue, and the tack of conductive silver paste on its surface also difference to some extent.At present, conductive silver paste is used for ITO conducting film, and the conductive silver paste compatible good at nano-silver thread conducting film is comparatively rare, constrains the application of nanometer silverskin.Based on this, the present invention is directed to nano-silver thread electrically conducting transparent membrane superficial tissue and develop a kind of conductive silver paste, this conductive silver paste can realize low-temperature fast-curing, has excellent tack and weatherability on nano-silver thread nesa coating surface, and electric conductivity and bending resistance folding endurance excellence.Meanwhile, conductive silver paste of the present invention can also have excellent compatibility on ITO surface.
Summary of the invention
The object of the invention is to for above-mentioned the deficiencies in the prior art, a kind of nanometer silverskin low-temperature setting conductive silver paste is provided, conductive silver paste of the present invention can realize low-temperature fast-curing, on nano-silver thread nesa coating surface, there is excellent tack and weatherability, and electric conductivity and bending resistance folding endurance excellence; On ITO surface, there is excellent compatibility.
Another object of invention is the preparation method providing a kind of described nanometer silverskin low-temperature setting conductive silver paste.
Technical scheme of the present invention is achieved in that
Nanometer silverskin low-temperature setting conductive silver paste, the raw material primarily of following weight parts forms: thermal curing agents 0.1-1 part, heat reactive resin 0.5-5 part, thermoplastic resin 0.5-10 part, solvent 5-30 part, silver powder 10-80 part, auxiliary agent 0.1-5 part.
Further, be made up of the raw material of following weight parts: thermal curing agents 0.2-0.5 part, thermosetting resin 1.2-3.5 part, thermoplastic resin 0.5-1 part, solvent 15-25 part, silver powder: 50-75 part, auxiliary agent 0.15-0.3 part.
Further, described thermal curing agents is a kind of in isocyanates, azodiisobutyronitrile or two kinds.
Further, described heat reactive resin is unsaturated polyester (UP), is one or more in unsaturated acrylic resin, unsaturated polyurethanes.
Further, described thermoplastic resin is saturated polyester, is one or more in polyurethane, epoxy resin, acrylic resin.
Further, described solvent is high boiling solvent, for your ketone of different fluorine, mixed dibasic acid ester, butyl acetate, diethylene glycol ether acetate, dimethyl adipate, diethylene adipate one or more.
Further, described silver powder form is the particle diameter 1-2um of flake silver powder or spherical silver powder, silver powder, apparent density 1.0-2.5g/cm3, tap density 2-5g/cm3, specific area 0.5-2 ㎡/g.
Further, described auxiliary agent is one or more in levelling agent, defoamer, resistance reducing agent, coupling agent.Levelling agent is selected from dimethyl silicone polymer or PSI or isophorone or diacetone alcohol; Defoamer can be selected from benzyl carbinol oleate or Laurate alcohol ester phenylacetate or dimethicone or OPEO; Resistance reducing agent can be selected from bentonite; Coupling agent can be selected from silane coupler or titanate coupling agent.
The preparation method of nanometer silverskin low-temperature setting conductive silver paste, comprises following method step: (1) dispersion liquid A: take heat reactive resin by the weight portion of constitutive material, solvent mixes 4h under the condition of temperature 70 C, obtains dispersion liquid A; (2) dispersion liquid B: take thermoplastic resin by the weight portion of constitutive material, solvent mixes 2-4h under the condition of temperature 70 C, obtains dispersion liquid A; (3) dispersion liquid A and dispersion liquid B is got in stirring box, 0.3-5 minute is stirred with stirring defoamer, take out, continue to add thermal curing agents, solvent, auxiliary agent in stirring box, stir 1 minute with stirring defoamer, take out, add silver powder, stir, be ground to fineness 0.5-7.0 micron with three-roll grinder, filter, obtain conductive silver paste.Condition of cure: toast 40min under baking oven 80 DEG C of conditions, its performance of conductive silver paste: adhesive force: nano-silver thread nesa coating and ITO surface 5B; Hardness: nano-silver thread nesa coating and ITO surface>=2H; Resistivity: < 7 × 10
-5Ω .cm; Bend 10 change in resistance < 30%; Printing thickness: 4-7 micron.
The mechanism of action of the present invention:
What touch technology bending property, large scale required improves constantly, and makes nanometer silverskin substitute ITO gradually, but different due to surface texture of nanometer silverskin and ITO, and the interaction force between traditional conductive silver paste is also distinguished to some extent.Design thermosetting resin and the two Component System of thermoplastic resin can solve conductive silver paste has good tack and weatherability at nanometer silverskin and ITO surface.Basic adhesive force and the pliability on conducting film surface is provided in using saturated polyester resin, polyurethane resin, epoxy resin, acrylic resin etc. as thermoplastic resin, selection thermosetting resin can strengthen the adhesive force on conducting film surface, cause through curing agent and can reach less than 80 DEG C solidifications, and the rear silver-colored starch degree of solidification and acid-proof alkaline excellence.
Beneficial effect of the present invention:
1. under meeting low-temperature setting 80 DEG C of oven conditions, 40min solidifies; For the exploitation of nanometer silverskin, excellent performance on ITO simultaneously, film material versatility is good.
2. conductive silver paste of the present invention can realize low-temperature fast-curing, has excellent tack and weatherability on nano-silver thread nesa coating surface, and electric conductivity and bending resistance folding endurance excellence.Meanwhile, conductive silver paste of the present invention can also have excellent compatibility on ITO surface.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in further detail, but do not form any limitation of the invention.
Unreceipted actual conditions person in embodiment, the condition of conveniently conditioned disjunction manufacturer suggestion is carried out.Agents useful for same or the unreceipted production firm person of instrument, be and can buy by commercially available the conventional products obtained.
Embodiment 1
Nanometer silverskin low-temperature setting conductive silver paste, is made up of the raw material of following weight parts: thermal curing agents 0.1 part, heat reactive resin 0.5 part, thermoplastic resin 9.5 parts, solvent 15 parts, 75 parts, silver powder, auxiliary agent 0.3 part.
Described thermal curing agents is isocyanates.
Described heat reactive resin is unsaturated acrylic resin.
Described thermoplastic resin is saturated polyester.
Described solvent is high boiling solvent, is butyl acetate.
Described silver powder is flake silver powder, the particle diameter 1.2um of silver powder, apparent density 1.6g/cm
3, tap density 3.2g/cm
3, specific area 0.7 ㎡/g
Described auxiliary agent is levelling agent, coupling agent, wherein levelling agent 0.1 part, coupling agent 0.2 part.
The preparation method of described nanometer silverskin low-temperature setting conductive silver paste, comprise following method step: (1) dispersion liquid A: take heat reactive resin by the weight portion of constitutive material, solvent mixes 4h under the condition of temperature 70 C, obtain dispersion liquid A; (2) dispersion liquid B: take thermoplastic resin by the weight portion of constitutive material, solvent mixes 4h under the condition of temperature 70 C, obtains dispersion liquid A; (3) dispersion liquid A and dispersion liquid B is got in stirring box, 1 minute is stirred with stirring defoamer, take out, continue to add thermal curing agents, solvent, coupling agent, levelling agent in stirring box, stir 1 minute with stirring defoamer, take out, add flake silver powder, stir, be ground to fineness 7 microns with three-roll grinder, filter, obtain conductive silver paste.
Its performance of conductive silver paste: adhesive force: nano-silver thread nesa coating and ITO surface 5B; Hardness: nano-silver thread nesa coating and ITO surface are 2H; Resistivity: be 4 × 10
-5Ω .cm; Bend 10 change in resistance < 30%; Printing thickness: 5 microns.
Embodiment 2
Nanometer silverskin low-temperature setting conductive silver paste, is made up of the raw material of following weight parts: thermal curing agents 1 part, heat reactive resin 5 parts, thermoplastic resin 10 parts, solvent 20 parts, 60 parts, silver powder, auxiliary agent 0.2 part.
Described thermal curing agents azodiisobutyronitrile and isocyanates, wherein isocyanates 0.7 part, azodiisobutyronitrile 0.3 part.
Described heat reactive resin is unsaturated acrylic resin.
Described thermoplastic resin is saturated epoxy and saturated polyester, wherein saturated polyester 5 parts, saturated epoxy 5 parts.
Described solvent is high boiling solvent, is different fluorine that ketone.
The particle diameter 1.2 of described flake silver powder, pine fills 1.6, and jolt ramming 4, than table 1.6.
Described auxiliary agent is thixotropic agent, coupling agent, wherein thixotropic agent 0.1 part, coupling agent 0.1 part.
The preparation method of described nanometer silverskin low-temperature setting conductive silver paste, comprise following method step: (1) dispersion liquid A: take heat reactive resin by the weight portion of constitutive material, solvent mixes 4h under the condition of temperature 70 C, obtain dispersion liquid A; (2) dispersion liquid B: take thermoplastic resin by the weight portion of constitutive material, solvent mixes 4h under the condition of temperature 70 C, obtains dispersion liquid A; (3) dispersion liquid A and dispersion liquid B is got in stirring box, 1 minute is stirred with stirring defoamer, take out, continue to add thermal curing agents, solvent in stirring box, stir 1 minute with stirring defoamer, take out, add flake silver powder, stir, be ground to fineness with three-roll grinder and be less than 7 microns, filter, obtain conductive silver paste.
Its performance of conductive silver paste: adhesive force: nano-silver thread nesa coating and ITO surface 5B; Hardness: nano-silver thread nesa coating and ITO surface are 3H; Resistivity: be 2.0 × 10
-5Ω .cm; Bend 10 change in resistance < 10%; Printing thickness: 6 microns.
Embodiment 3
Nanometer silverskin low-temperature setting conductive silver paste, the raw material primarily of following weight parts forms: thermal curing agents 1 part, heat reactive resin 5 parts, thermoplastic resin 10 parts, solvent 30 parts, 80 parts, silver powder, auxiliary agent 5 parts.
Described thermal curing agents is isocyanates.
Described heat reactive resin is for being unsaturated acrylic resin.
Described thermoplastic resin be polyurethane.
Described solvent is high boiling solvent, is different fluorine that ketone.
Described silver powder form is spherical silver powder, the particle diameter 1um of silver powder, apparent density 1.0g/cm3, tap density 2g/cm
3, specific area 0.5 ㎡/g.
Described auxiliary agent is levelling agent.
The preparation method of nanometer silverskin low-temperature setting conductive silver paste, comprises following method step: (1) dispersion liquid A: take heat reactive resin by the weight portion of constitutive material, solvent mixes 4h under the condition of temperature 70 C, obtains dispersion liquid A; (2) dispersion liquid B: take thermoplastic resin by the weight portion of constitutive material, solvent mixes 2.5h under the condition of temperature 70 C, obtains dispersion liquid A; (3) dispersion liquid A and dispersion liquid B is got in stirring box, 0.3 minute is stirred with stirring defoamer, take out, continue to add thermal curing agents, solvent, auxiliary agent in stirring box, stir 1 minute with stirring defoamer, take out, add silver powder, stir, be ground to fineness 0.5 micron with three-roll grinder, filter, obtain conductive silver paste.
Condition of cure: toast 40min under baking oven 80 DEG C of conditions, its performance of conductive silver paste: adhesive force: nano-silver thread nesa coating and ITO surface 5B; Hardness: nano-silver thread nesa coating and ITO surface>=2H; Resistivity: 6.5 × 10
-5Ω .cm; Bend 10 change in resistance < 20%; Printing thickness: 4.5 microns.
Embodiment 4
Nanometer silverskin low-temperature setting conductive silver paste, the raw material primarily of following weight parts forms: thermal curing agents 1 part, heat reactive resin 5 parts, thermoplastic resin 10 parts, solvent 30 parts, 80 parts, silver powder, auxiliary agent 5 parts.
Described thermal curing agents is made up of isocyanates 0.23 part, azodiisobutyronitrile 0.77 part.
Described heat reactive resin is made up of unsaturated acrylic resin 1.5 parts, unsaturated polyurethanes 3.5 parts.
Described thermoplastic resin is made up of polyurethane 3.5 parts, epoxy resin 1.5 parts, acrylic resin 5 parts.
Described solvent is high boiling solvent, is made up of different fluorine that ketone 3.5 parts, mixed dibasic acid ester 5.5 parts, butyl acetate 2.7 parts, diethylene glycol ether acetate 3.3 parts, dimethyl adipate 8 parts, diethylene adipate 8 parts.
Described silver powder form is flake silver powder, the particle diameter 1um of silver powder, apparent density 2.5g/cm3, tap density 5g/cm
3, specific area 2 ㎡/g.
Described auxiliary agent is made up of levelling agent 2 parts, defoamer 1 part, resistance reducing agent 1 part, coupling agent 1 part.
The preparation method of nanometer silverskin low-temperature setting conductive silver paste, comprises following method step: (1) dispersion liquid A: take heat reactive resin by the weight portion of constitutive material, solvent mixes 4h under the condition of temperature 70 C, obtains dispersion liquid A; (2) dispersion liquid B: take thermoplastic resin by the weight portion of constitutive material, solvent mixes 3h under the condition of temperature 70 C, obtains dispersion liquid A; (3) dispersion liquid A and dispersion liquid B is got in stirring box, 2.5 minutes are stirred with stirring defoamer, take out, continue to add thermal curing agents, solvent, auxiliary agent in stirring box, stir 1 minute with stirring defoamer, take out, add silver powder, stir, be ground to fineness 5.5 microns with three-roll grinder, filter, obtain conductive silver paste.
Condition of cure: toast 40min under baking oven 80 DEG C of conditions, its performance of conductive silver paste: adhesive force: nano-silver thread nesa coating and ITO surface 5B; Hardness: nano-silver thread nesa coating and ITO surface>=2H; Resistivity: 5 × 10
-5Ω .cm; Bend 10 change in resistance < 15%; Printing thickness: 5 microns.
Embodiment 5
Nanometer silverskin low-temperature setting conductive silver paste, the raw material primarily of following weight parts forms: thermal curing agents 0.2 part, thermosetting resin 1.2 parts, thermoplastic resin 0.5 part, solvent 15 parts, 50 parts, silver powder, auxiliary agent 0.15 part.
Described thermal curing agents is isocyanates.
Described heat reactive resin is unsaturated acrylic resin.
Described thermoplastic resin is acrylic resin.
Described solvent is high boiling solvent, is diethylene adipate.
Described silver powder form is spherical silver powder, the particle diameter 2um of silver powder, apparent density 2.5g/cm3, tap density 5g/cm3, specific area 2 ㎡/g.
Described auxiliary agent is levelling agent.
The preparation method of nanometer silverskin low-temperature setting conductive silver paste, comprises following method step: (1) dispersion liquid A: take heat reactive resin by the weight portion of constitutive material, solvent mixes 4h under the condition of temperature 70 C, obtains dispersion liquid A; (2) dispersion liquid B: take thermoplastic resin by the weight portion of constitutive material, solvent mixes 3.5h under the condition of temperature 70 C, obtains dispersion liquid A; (3) dispersion liquid A and dispersion liquid B is got in stirring box, 3 minutes are stirred with stirring defoamer, take out, continue to add thermal curing agents, solvent, auxiliary agent in stirring box, stir 1 minute with stirring defoamer, take out, add silver powder, stir, be ground to fineness 5.50 microns with three-roll grinder, filter, obtain conductive silver paste.
Condition of cure: toast 40min under baking oven 80 DEG C of conditions, its performance of conductive silver paste: adhesive force: nano-silver thread nesa coating and ITO surface 5B; Hardness: nano-silver thread nesa coating and ITO surface >=2H; Resistivity: 2 × 10-5 Ω .cm; Bend 10 change in resistance < 10%; Printing thickness: 4.5 microns.
Embodiment 6
Nanometer silverskin low-temperature setting conductive silver paste, the raw material primarily of following weight parts forms: thermal curing agents 0.5 part, thermosetting resin 3.5 parts, thermoplastic resin 1 part, solvent 25 parts, 75 parts, silver powder, auxiliary agent 0.3 part.
Described thermal curing agents is in azodiisobutyronitrile.
Described heat reactive resin is unsaturated acrylic resin.
Described thermoplastic resin is epoxy resin.
Described solvent is high boiling solvent, is diethylene glycol ether acetate.
Described silver powder form is spherical silver powder, the particle diameter 2um of silver powder, apparent density 1.5g/cm3, tap density 3.55g/cm3, specific area 1.22 ㎡/g.
Described auxiliary agent is made up of levelling agent 0.1 part, defoamer 0.12 part, resistance reducing agent 0.08 part.
The preparation method of nanometer silverskin low-temperature setting conductive silver paste, comprises following method step: (1) dispersion liquid A: take heat reactive resin by the weight portion of constitutive material, solvent mixes 4h under the condition of temperature 70 C, obtains dispersion liquid A; (2) dispersion liquid B: take thermoplastic resin by the weight portion of constitutive material, solvent mixes 3h under the condition of temperature 70 C, obtains dispersion liquid A; (3) dispersion liquid A and dispersion liquid B is got in stirring box, 4.5 minutes are stirred with stirring defoamer, take out, continue to add thermal curing agents, solvent, auxiliary agent in stirring box, stir 1 minute with stirring defoamer, take out, add silver powder, stir, be ground to fineness 2.5 microns with three-roll grinder, filter, obtain conductive silver paste.
Condition of cure: toast 40min under baking oven 80 DEG C of conditions, its performance of conductive silver paste: adhesive force: nano-silver thread nesa coating and ITO surface 5B; Hardness: nano-silver thread nesa coating and ITO surface >=2H; Resistivity: 1.5 × 10-5 Ω .cm; Bend 10 change in resistance < 8%; Printing thickness: 6.5 microns.
Comparing embodiment
Comparing embodiment 1
1. first prepare dispersion liquid, each component raw material is with embodiment 1.
Dispersion liquid 1: take 35g heat reactive resin in there-necked flask, adds 65g bis-ethanedioic acid monobutyl ether acetate, is heated to 70 DEG C of stirring and dissolving 4h, obtains dispersion liquid 1;
2. prepare conductive silver paste
Get 26.2g dispersion liquid 1 in stirring box, stir 1 minute with stirring defoamer, take out, continue to add 0.1g isocyanates, 6.1g butyl acetate is in stirring box, stir 1 minute with stirring defoamer, take out, add 70g flake silver powder, stir, be ground to fineness with three-roll grinder and be less than 7 microns, filter, obtain conductive silver paste.
Its performance of the conductive silver paste obtained according to the method described above is as follows: condition of cure: toast 40min under baking oven 80 DEG C of conditions; Adhesive force: nano-silver thread nesa coating and ITO surface 2B; Hardness: nano-silver thread nesa coating and ITO surface>=2H; Resistivity: 8 × 10
-5Ω .cm; Bending resistance folding endurance: bend 10 change in resistance < 30%; Printing thickness: 5 microns.
Comparing embodiment 2
1. first prepare dispersion liquid, each component raw material is with embodiment 2.
Dispersion liquid 2: take 35g thermoplastic resin in there-necked flask, adds 65g bis-ethanedioic acid monobutyl ether acetate, is heated to 70 DEG C of stirring and dissolving 4h, obtains dispersion liquid 2;
2 prepare conductive silver paste
Get 26.2g dispersion liquid 2 and 6.1g butyl acetate in stirring box, 1 minute is stirred with thinky (stirring defoamer), take out, stir 1 minute with stirring defoamer, take out, add 70g flake silver powder, stir, be ground to fineness with three-roll grinder and be less than 7 microns, filter, obtain conductive silver paste.
Its performance of the conductive silver paste obtained according to the method described above is as follows: condition of cure: toast 40min under baking oven 80 DEG C of conditions; Adhesive force: nano-silver thread nesa coating and ITO surface 5B; Hardness: nano-silver thread nesa coating and ITO surface are less than H; Resistivity: 5*10
-5Ω .cm; Bending resistance folding endurance: bend 10 change in resistance < 30%; Printing thickness: 6 microns.
Claims (9)
1. nanometer silverskin low-temperature setting conductive silver paste, is characterized in that: the raw material primarily of following weight parts forms: thermal curing agents 0.1-1 part, heat reactive resin 0.5-5 part, thermoplastic resin 0.5-10 part, solvent 5-30 part, silver powder 10-80 part, auxiliary agent 0.1-5 part.
2. nanometer silverskin low-temperature setting conductive silver paste according to claim 1, it is characterized in that: the raw material primarily of following weight parts forms: thermal curing agents 0.2-0.5 part, thermosetting resin 1.2-3.5 part, thermoplastic resin 0.5-1 part, solvent 15-25 part, silver powder: 50-75 part, auxiliary agent 0.15-0.3 part.
3. nanometer silverskin low-temperature setting conductive silver paste according to claim 1, is characterized in that: described thermal curing agents is a kind of in isocyanates, azodiisobutyronitrile or two kinds.
4. nanometer silverskin low-temperature setting conductive silver paste according to claim 1, is characterized in that: described heat reactive resin is one or more in unsaturated polyester (UP), unsaturated acrylic resin, unsaturated polyurethanes.
5. nanometer silverskin low-temperature setting conductive silver paste according to claim 1, is characterized in that: described thermoplastic resin is one or more in saturated polyester, polyurethane, epoxy resin, acrylic resin.
6. nanometer silverskin low-temperature setting conductive silver paste according to claim 1, it is characterized in that: described solvent is high boiling solvent, for your ketone of different fluorine, mixed dibasic acid ester, butyl acetate, diethylene glycol ether acetate, dimethyl adipate, diethylene adipate one or more.
7. nanometer silverskin low-temperature setting conductive silver paste according to claim 1, is characterized in that: described silver powder form is the particle diameter 1-2um of flake silver powder or spherical silver powder, silver powder, apparent density 1.0-2.5g/cm
3, tap density 2-5g/cm
3, specific area 0.5-2 ㎡/g.
8. nanometer silverskin low-temperature cured conductive silver slurry according to claim 1, is characterized in that: described auxiliary agent is one or more in levelling agent, defoamer, resistance reducing agent, coupling agent.
9. the preparation method of nanometer silverskin low-temperature setting conductive silver paste according to claim 1, comprise following method step: (1) dispersion liquid A: take heat reactive resin by the weight portion of constitutive material, solvent mixes 4h under the condition of temperature 70 C, obtain dispersion liquid A; (2) dispersion liquid B: take thermoplastic resin by the weight portion of constitutive material, solvent mixes 2-4h under the condition of temperature 70 C, obtains dispersion liquid A; (3) dispersion liquid A and dispersion liquid B is got in stirring box, 0.3-5 minute is stirred with stirring defoamer, take out, continue to add thermal curing agents, solvent, auxiliary agent in stirring box, stir 1 minute with stirring defoamer, take out, add silver powder, stir, be ground to fineness 0.5-7.0 micron with three-roll grinder, filter, obtain conductive silver paste; Condition of cure: toast 40min under baking oven 80 DEG C of conditions, its performance of conductive silver paste: adhesive force: nano-silver thread nesa coating and ITO surface 5B; Hardness: nano-silver thread nesa coating and ITO surface>=2H; Resistivity: < 7 × 10
-5Ω .cm; Bend 10 change in resistance < 30%; Printing thickness: 4-7 micron.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103146259A (en) * | 2013-03-20 | 2013-06-12 | 中国人民解放军国防科学技术大学 | Screen printing conductive printing ink composition and preparation method thereof |
| CN103515025A (en) * | 2013-09-30 | 2014-01-15 | 无锡晶睿光电新材料有限公司 | Low-temperature curing type light sensing conduction slurry and method for manufacturing conduction circuit with conduction slurry |
| CN104332214A (en) * | 2014-10-28 | 2015-02-04 | 深圳市思迈科新材料有限公司 | Low-temperature curing conductive silver paste and preparation method thereof |
| CN104700924A (en) * | 2013-12-10 | 2015-06-10 | 上海拓引数码技术有限公司 | Low-temperature polymer conductive paste and preparation method thereof |
| CN104916346A (en) * | 2015-01-05 | 2015-09-16 | 深圳市思迈科新材料有限公司 | Low-temperature curing photosensitive conductive silver slurry composition |
| CN104934098A (en) * | 2015-01-05 | 2015-09-23 | 深圳市思迈科新材料有限公司 | Low temperature curing laser silver paste and preparation method thereof |
-
2016
- 2016-01-25 CN CN201610050079.8A patent/CN105513668A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103146259A (en) * | 2013-03-20 | 2013-06-12 | 中国人民解放军国防科学技术大学 | Screen printing conductive printing ink composition and preparation method thereof |
| CN103515025A (en) * | 2013-09-30 | 2014-01-15 | 无锡晶睿光电新材料有限公司 | Low-temperature curing type light sensing conduction slurry and method for manufacturing conduction circuit with conduction slurry |
| CN104700924A (en) * | 2013-12-10 | 2015-06-10 | 上海拓引数码技术有限公司 | Low-temperature polymer conductive paste and preparation method thereof |
| CN104332214A (en) * | 2014-10-28 | 2015-02-04 | 深圳市思迈科新材料有限公司 | Low-temperature curing conductive silver paste and preparation method thereof |
| CN104916346A (en) * | 2015-01-05 | 2015-09-16 | 深圳市思迈科新材料有限公司 | Low-temperature curing photosensitive conductive silver slurry composition |
| CN104934098A (en) * | 2015-01-05 | 2015-09-23 | 深圳市思迈科新材料有限公司 | Low temperature curing laser silver paste and preparation method thereof |
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| CN107545944A (en) * | 2016-06-28 | 2018-01-05 | 南京丰跃纳米科技有限公司 | A kind of low-temperature setting nanometer silver paste and preparation method thereof |
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| CN108016155A (en) * | 2016-11-03 | 2018-05-11 | 北京中科纳通电子技术有限公司 | A kind of novel touch screen low temperature manufacturing process |
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| CN106782760A (en) * | 2017-01-23 | 2017-05-31 | 湖南省国银新材料有限公司 | A kind of black touch-screen silver paste of low-temperature setting and preparation method thereof |
| CN106782760B (en) * | 2017-01-23 | 2019-01-25 | 湖南省国银新材料有限公司 | A kind of black touch screen silver paste of low-temperature setting and preparation method thereof |
| CN108447587A (en) * | 2017-04-13 | 2018-08-24 | 贵研铂业股份有限公司 | A kind of novel fast curing low-temperature conductive silver paste and preparation method thereof |
| CN108735337A (en) * | 2018-04-18 | 2018-11-02 | 湖南省国银新材料有限公司 | A kind of conductive silver paste and preparation method thereof |
| CN109645986A (en) * | 2018-11-30 | 2019-04-19 | 昆明贵金属研究所 | A kind of flexible biological electrode low-temperature solidified silver/chlorination silver paste and preparation method thereof |
| CN110335699A (en) * | 2019-05-08 | 2019-10-15 | 湖北锐尔圣科技有限公司 | Quick-setting medium temperature conductive silver paste and its application |
| CN110491543A (en) * | 2019-07-30 | 2019-11-22 | 北京氦舶科技有限责任公司 | A kind of conductive silver paste for touch screens and preparation method thereof |
| CN111243779A (en) * | 2020-03-09 | 2020-06-05 | 广东四维新材料有限公司 | Preparation method for laser cutting conductive silver paste and low-temperature curing superfine spherical silver powder and preparation method for conductive silver paste and low-temperature curing superfine spherical silver powder |
| CN111341484A (en) * | 2020-03-30 | 2020-06-26 | 善仁（浙江）新材料科技有限公司 | Low-temperature curing type conductive silver paste and preparation method thereof |
| CN113891549A (en) * | 2021-11-15 | 2022-01-04 | 苏州锦艺新材料科技有限公司 | Conductive paste, method for producing conductive paste, and circuit board |
| CN114267490A (en) * | 2021-12-22 | 2022-04-01 | 广东南海启明光大科技有限公司 | Homologous nano silver mixture, preparation method and application thereof, and flexible silver paste preparation method |
| CN114267490B (en) * | 2021-12-22 | 2024-05-28 | 广东南海启明光大科技有限公司 | Homologous nano silver mixture and preparation method, application and flexible silver paste preparation method |
| CN118398274A (en) * | 2024-06-26 | 2024-07-26 | 苏州泓湃科技有限公司 | Low-temperature curing type gold paste for CGM electrode and preparation method thereof |
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